CN219516354U - Medical ultrasonic equipment and heat dissipation system thereof - Google Patents
Medical ultrasonic equipment and heat dissipation system thereof Download PDFInfo
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- CN219516354U CN219516354U CN202320921119.7U CN202320921119U CN219516354U CN 219516354 U CN219516354 U CN 219516354U CN 202320921119 U CN202320921119 U CN 202320921119U CN 219516354 U CN219516354 U CN 219516354U
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Abstract
The utility model discloses a heat radiation system of medical ultrasonic equipment and the medical ultrasonic equipment, and relates to the technical field of ultrasound, wherein the system comprises an air pressure acquisition device, a heat radiation control device and a heat radiation device; the heat dissipation control device is respectively in communication connection with an existing control circuit, an air pressure acquisition device and a heat dissipation device of the medical ultrasonic equipment; the heat dissipation control device is used for carrying out heat dissipation adjustment on the heat dissipation device by combining the air pressure data acquired by the air pressure acquisition device when receiving the trigger signal sent by the control circuit; according to the utility model, the heat dissipation control device is in communication connection with the existing control circuit, the air pressure acquisition device and the heat dissipation device of the medical ultrasonic equipment, so that the control circuit can trigger the heat dissipation control device to timely adjust the heat dissipation efficiency of the heat dissipation device by combining actual air pressure data, the problem of poor heat dissipation effect of the medical ultrasonic equipment when the medical ultrasonic equipment is used in a high-altitude area is solved, the heat accumulation condition of the medical ultrasonic equipment is reduced, and the stability of the medical ultrasonic equipment is improved.
Description
Technical Field
The utility model relates to the technical field of ultrasound, in particular to a heat dissipation system of medical ultrasound equipment and the medical ultrasound equipment.
Background
With the development of modern society technology, ultrasonic technology has been widely used. Compared with the desk type medical ultrasonic equipment, the portable medical ultrasonic equipment has stronger flexibility, can be used in hospitals and clinics, can also be used in outdoor scenes and various mobile scenes, and still can be normally used in harsh external environments.
The heat dissipation control of the current medical ultrasonic equipment adopts a fan adjusting scheme, an initial fan rotating speed value is given at first, temperature data acquired by temperature acquisition devices at different positions are read and analyzed during working, and if the temperatures at certain positions are higher, the rotating speed of the fan is increased, so that the purpose of cooling is realized. That is, in the fan adjusting scheme of the prior art, the fan adjusting scheme is only related to the set initial rotation speed value and the feedback value after the temperature data is acquired; when the temperature of the single board of the medical ultrasonic equipment rises to a certain set value, the rotating speed of the fan is passively increased. In the table medical ultrasonic equipment, in order to avoid the problem of heat accumulation caused by temperature delay monitoring, a fan with a larger model and a radiator with a larger volume are used, so that the temperature threshold is increased, but the temperature threshold becomes a bottleneck in the heat dissipation of the portable medical ultrasonic equipment; the principle of cooling the fan is to improve the air convection between the interior and the exterior of the machine, and exchange the heat in the machine with the exterior in an air exchange mode, so that the cooling effect of the fan is strongly related to the density of the air, and in a high-altitude area, the density of the air is smaller than that of an earth-altitude area, and the conventional portable medical ultrasonic equipment is used in the high-altitude area, and has the same temperature control strategy as that of a common low-altitude area, so that when the ultrasonic continuous high-power emission is carried out, the heat in the machine is continuously accumulated and cannot be discharged quickly, and the stable use of the machine is influenced.
Therefore, how to solve the problem of poor heat dissipation effect of the medical ultrasonic equipment when the medical ultrasonic equipment is used in high-altitude areas, reduce the heat accumulation condition in the medical ultrasonic equipment, and improve the stability of the medical ultrasonic equipment is a problem which needs to be solved rapidly nowadays.
Disclosure of Invention
The utility model aims to provide a heat dissipation system of medical ultrasonic equipment and the medical ultrasonic equipment, so as to solve the problem of poor heat dissipation effect of the medical ultrasonic equipment when the medical ultrasonic equipment is used in a high-altitude area, reduce heat accumulation in the medical ultrasonic equipment and improve the stability of the medical ultrasonic equipment.
In order to solve the above technical problems, the present utility model provides a heat dissipation system of medical ultrasonic equipment, including: the device comprises an air pressure acquisition device, a heat dissipation control device and a heat dissipation device; the heat dissipation control device is respectively in communication connection with an existing control circuit of the medical ultrasonic equipment, the air pressure acquisition device and the heat dissipation device;
the air pressure acquisition device is used for acquiring air pressure data and sending the air pressure data to the heat dissipation control device;
and the heat dissipation control device is used for carrying out heat dissipation adjustment on the heat dissipation device by combining the air pressure data acquired by the air pressure acquisition device when receiving the trigger signal sent by the control circuit.
Optionally, the heat dissipation control device is in communication connection with the control circuit through an interrupt signal line, a data signal line and a trigger signal line;
when the heat dissipation control device receives the interrupt signal on the interrupt signal line, the data signal line is utilized to receive heat dissipation control data; when the heat dissipation control device receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to conduct heat dissipation adjustment on the heat dissipation device.
Optionally, the interrupt signal line is connected to a preset power supply through a pull-up resistor;
and when the heat dissipation control device receives a low level on the interrupt signal line, the heat dissipation control data is received by using the data signal line.
Optionally, the heat dissipation control device is in communication connection with the control circuit through a data signal line and a trigger signal line;
the heat dissipation control device is specifically configured to receive heat dissipation control data by using the data signal line; when the heat dissipation control device receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to conduct heat dissipation adjustment on the heat dissipation device.
Optionally, the heat dissipation control device includes a first memory, which is used for storing air pressure data collected by the air pressure collecting device after the medical ultrasonic equipment is started each time.
Optionally, the heat dissipation system further includes: a temperature acquisition device for acquiring temperature data;
the temperature acquisition device is in communication connection with the heat dissipation control device; the heat dissipation control device is specifically used for performing conventional temperature heat dissipation control on the heat dissipation device according to the temperature data; and on the basis of the conventional temperature heat dissipation control, when the trigger signal is received, the heat dissipation device is subjected to heat dissipation adjustment by combining the air pressure data acquired by the air pressure acquisition device.
Optionally, the heat dissipation control device includes a second memory, configured to store a preset two-dimensional matrix; the preset two-dimensional matrix comprises the corresponding relation between air pressure and temperature and the power of the heat dissipation device;
the heat dissipation control device is specifically configured to determine, when the trigger signal is received, an adjustment power of the heat dissipation device according to the temperature data, the air pressure data and the preset two-dimensional matrix; and according to the adjustment power, carrying out heat dissipation adjustment on the heat dissipation device.
Optionally, the heat dissipation device includes a fan;
wherein the heat dissipation control device is connected with the fan; the heat dissipation control device is specifically used for adjusting the rotating speed of the fan by combining the air pressure data acquired by the air pressure acquisition device when the trigger signal is received.
Optionally, the heat dissipation device comprises a liquid cooling heat dissipation water pump;
the heat dissipation control device is connected with the liquid cooling heat dissipation water pump; the heat dissipation control device is specifically used for adjusting the flow of the liquid cooling heat dissipation water pump by combining the air pressure data acquired by the air pressure acquisition device when the trigger signal is received.
In addition, the utility model also provides medical ultrasonic equipment, which comprises: the heat dissipation system of the medical ultrasonic device as described above.
The utility model provides a heat radiation system of medical ultrasonic equipment, which comprises: the device comprises an air pressure acquisition device, a heat dissipation control device and a heat dissipation device; the heat dissipation control device is respectively in communication connection with an existing control circuit, an air pressure acquisition device and a heat dissipation device of the medical ultrasonic equipment; the air pressure acquisition device is used for acquiring air pressure data and sending the air pressure data to the heat dissipation control device; the heat dissipation control device is used for carrying out heat dissipation adjustment on the heat dissipation device by combining the air pressure data acquired by the air pressure acquisition device when receiving the trigger signal sent by the control circuit;
therefore, the heat dissipation control device is in communication connection with the existing control circuit of the medical ultrasonic equipment, so that the control circuit can trigger the heat dissipation control device to timely adjust the heat dissipation efficiency of the heat dissipation device when controlling the transmission and the reception of ultrasonic sound waves; and through the communication connection of the added air pressure acquisition device and the heat dissipation control device, the heat dissipation control device can adjust the heat dissipation efficiency of the heat dissipation device by combining actual air pressure data, so that the problem that the heat dissipation effect of medical ultrasonic equipment is poor when the medical ultrasonic equipment is used in a high-altitude area is solved, the heat accumulation condition in the medical ultrasonic equipment is reduced, and the stability of the medical ultrasonic equipment is improved. In addition, the utility model also provides medical ultrasonic equipment which also has the beneficial effects.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a block diagram of a heat dissipation system of a medical ultrasound device according to an embodiment of the present utility model;
fig. 2 is a block diagram of a heat dissipation system of another medical ultrasound apparatus according to an embodiment of the present utility model.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1, fig. 1 is a block diagram of a heat dissipation system of a medical ultrasound device according to an embodiment of the present utility model. The system may include: an air pressure acquisition device 10, a heat dissipation control device 20 and a heat dissipation device 30; the heat dissipation control device 20 is respectively in communication connection with an existing control circuit of the medical ultrasonic equipment, the air pressure acquisition device 10 and the heat dissipation device 30;
the air pressure acquisition device 10 is used for acquiring air pressure data and sending the air pressure data to the heat dissipation control device 20;
and the heat dissipation control device 20 is used for carrying out heat dissipation adjustment on the heat dissipation device 30 by combining the air pressure data acquired by the air pressure acquisition device 10 when receiving the trigger signal sent by the control circuit.
Specifically, the existing control circuit of the medical ultrasonic device in this embodiment may be a circuit that is set in the existing medical ultrasonic device and used for controlling to transmit corresponding ultrasonic sound waves according to an ultrasonic control instruction of the upper computer, and receiving corresponding echo signals to perform digital signal processing, that is, a control circuit necessary for implementing a conventional ultrasonic function. That is, the existing control circuitry of the medical ultrasound device may include a logic module, a transmit module, and a receive module; the logic module is respectively connected with the control circuit, the transmitting module and the receiving module; the logic module can be used for determining ultrasonic emission control information according to an ultrasonic control instruction of the upper computer; and controlling the transmitting module to transmit ultrasonic sound waves according to the ultrasonic transmission control information, and performing digital signal processing on the echo signals acquired by the receiving module.
Correspondingly, the existing control circuit of the medical ultrasonic equipment can also comprise a power supply module connected with the logic module, the transmitting module and the receiving module, and the power supply module is used for supplying power to the logic module, the transmitting module and the receiving module.
It can be appreciated that the main heating location of a medical ultrasound device (e.g., a portable medical ultrasound device) is the control circuit; for example, the transmitting module of the medical ultrasonic device may be configured to receive the low-voltage control signal of the logic module and convert the low-voltage control signal into a high-voltage pulse signal, and then convert the high-voltage pulse signal into ultrasonic sound waves through the piezoelectric effect of the piezoelectric ceramic; the parasitic internal resistance is arranged in the chip of the transmitting module, the energy loss of the load current on the parasitic internal resistance is dissipated on the surface of the chip in a thermal mode, and the longer the high-voltage pulse signal is transmitted, the larger the transmitting current is, and the larger the heat dissipation is. The echo signal (namely, the ultrasonic echo signal) is converted into a weak voltage signal through the inverse piezoelectric effect of the piezoelectric ceramic, and the receiving module can be used for amplifying and analog-to-digital converting the weak voltage signal and transmitting the weak voltage signal to the logic module; the power operational amplification circuit is arranged in the receiving module, and the larger the input voltage is, the larger the amplified power is, and the more heat is dissipated. The logic module can be used for receiving the ultrasonic control instruction of the upper computer to control the transmitting voltage and the timing sequence of the transmitting waveform, and can also be used for receiving the echo data transmitted from the receiving module and performing digital signal processing; the more the logic module simultaneously controls the timing of the transmission and the echo data, the more the internal gates flip, and the more heat is dissipated.
Also, since the control circuit requires a low supply ripple, the power supply module may include a low dropout linear regulator (low dropout regulator, LDO); the LDO is characterized in that the input and output currents are unchanged, part of the voltage difference is completely dissipated in the internal circuit, and the larger the load current is, the more energy is dissipated in a thermal form on the LDO. In this embodiment, through the communication connection between the control circuit and the heat dissipation control device 20, the control circuit can send a corresponding trigger signal to the heat dissipation control device 20 according to the ultrasonic emission control information, so that the heat dissipation control device 20 can perform heat dissipation adjustment on the heat dissipation device 30 by combining the air pressure data acquired by the air pressure acquisition device 10 in the process of transmitting ultrasonic sound waves and/or receiving echo signals by the control circuit, and the heat dissipation efficiency of the heat dissipation device 30 is improved.
Correspondingly, the trigger signal in this embodiment may be a signal that the control circuit triggers the heat dissipation control device 20 to perform heat dissipation adjustment on the heat dissipation device 30, for example, the control circuit may send a corresponding trigger signal to the heat dissipation control device 20 according to the ultrasonic emission control information corresponding to the ultrasonic sound wave to be emitted, so that the heat dissipation control device 20 performs heat dissipation adjustment on the heat dissipation device 30 in combination with the air pressure data acquired by the air pressure acquisition device 10 in the process of the control circuit emitting the ultrasonic sound wave and/or receiving the echo signal, thereby improving the heat dissipation efficiency of the heat dissipation device 30. For example, the heat dissipation control device 20 may perform heat dissipation adjustment on the heat dissipation device 30 by combining the air pressure data and the heat dissipation control data when receiving the trigger signal on the trigger signal line; the heat dissipation control data may be data corresponding to ultrasonic emission control information, for example, the heat dissipation control data may include ultrasonic emission control information corresponding to ultrasonic sound waves to be emitted by the control circuit, that is, the logic module in the control circuit controls the emission module to emit ultrasonic emission control information corresponding to the ultrasonic sound waves, for example, information such as a voltage value of an adopted ultrasonic emission mode, the number of emitted pulses in unit time, and the like; the heat dissipation control data may also include heat dissipation adjustment information corresponding to the ultrasonic sound wave to be emitted by the control circuit, such as fan rotation speed information of the fan (i.e., the heat dissipation device 30) to be adjusted. In this embodiment, the control circuit may send the heat dissipation control data and the trigger signal to the heat dissipation control device 20, so that the heat dissipation control device 20 may perform heat dissipation adjustment on the heat dissipation device 30 according to the trigger signal in the process of sending the ultrasonic sound wave and/or receiving the echo signal by the control circuit, and in combination with the air pressure data and the heat dissipation control data acquired by the air pressure acquisition device 10, so as to improve the heat dissipation efficiency of the heat dissipation device 30 in the process of sending the ultrasonic sound wave and/or receiving the echo signal by the control circuit. The heat dissipation adjustment of the heat dissipation device by combining the air pressure data and the heat dissipation control data can be realized based on a conventional technology, and the embodiments of the present utility model are not described in detail.
It should be noted that, for the specific communication connection manner between the heat dissipation control device 20 and the control circuit in this embodiment, the designer may set the connection manner according to the practical scenario and the user requirement, for example, the heat dissipation control device 20 may be connected to the control circuit through three data lines, for example, the heat dissipation control device 20 may be connected to the control circuit through an interrupt signal line, a data signal line and a trigger signal line; when the heat dissipation control device 20 receives the interrupt signal on the interrupt signal line, heat dissipation control data is received by the data signal line; when the heat dissipation control device 20 receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to perform heat dissipation adjustment on the heat dissipation device 30; the heat dissipation control device 20 may also be in data communication with the control circuit via more or fewer data lines, e.g., the heat dissipation control device 20 may be communicatively coupled to the control circuit via a data signal line and a trigger signal line; the heat dissipation control device 20 may be specifically configured to receive heat dissipation control data using a data signal line; when the heat dissipation control device 20 receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to perform heat dissipation adjustment on the heat dissipation device 30; the heat sink control device 20 may also use a synchronous mode for data transfer with the control circuit. The present embodiment does not impose any limitation on this.
Specifically, in an ultrasound medical apparatus (such as a portable ultrasound medical apparatus), the heat sink 30 is not required to operate at full load in an initial state in order to reduce power consumption as much as possible. In this embodiment, the heat dissipation control device 20 performs heat dissipation adjustment by controlling the heat dissipation device 30, so that the heat dissipation efficiency of the heat dissipation device 30 can be correspondingly improved in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit, but the heat dissipation efficiency is improved when the heat dissipation device 30 does not reach the maximum heat dissipation efficiency (such as rated power), and if the heat dissipation device 30 is already at the rated power, the heat dissipation control device 20 can maintain the heat dissipation efficiency of the heat dissipation device 30 in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit. For example, when the heat sink 30 is a fan, if the rotational speed of the fan before adjustment has reached the maximum rotational speed supported by the fan, the rotational speed of the fan is not controlled to exceed the maximum rotational speed.
It can be understood that, according to the received trigger signal, the heat dissipation control device 20 in this embodiment can perform heat dissipation adjustment on the heat dissipation device 30 in combination with the air pressure data collected by the air pressure collecting device 10, so as to correspondingly improve the heat dissipation efficiency of the heat dissipation device 30 in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit; correspondingly, the heat dissipation control device 20 can control the heat dissipation efficiency of the heat dissipation device 30 to be restored to the heat dissipation efficiency before the control circuit transmits the ultrasonic sound wave or receives the echo signal.
Furthermore, the heat dissipation control device 20 in this embodiment may also be configured to perform heat dissipation adjustment on the heat dissipation device 30 according to the trigger signal in combination with the air pressure data collected by the air pressure collecting device 10, so as to improve the heat dissipation efficiency of the heat dissipation device 30 in the process of transmitting the ultrasonic sound wave, receiving the echo signal and performing digital signal processing on the echo signal by the control circuit; correspondingly, the heat dissipation control device 20 can control the heat dissipation efficiency of the heat dissipation device 30 to be restored to the heat dissipation efficiency before the improvement after the control circuit completes the digital signal processing of the echo signal.
Specifically, the heat dissipation system of the medical ultrasonic device provided in this embodiment may further include a temperature acquisition device (such as a temperature sensor) for acquiring temperature data; wherein the temperature acquisition device is in communication connection with the heat dissipation control device 20; the heat dissipation control device 20 may be specifically configured to perform conventional temperature heat dissipation control on the heat dissipation device 30 according to the temperature data; on the basis of conventional temperature heat dissipation control, when a trigger signal is received, heat dissipation adjustment is performed on the heat dissipation device 30 by combining air pressure data acquired by the air pressure acquisition device 10; therefore, according to the trigger signal, the heat dissipation efficiency of the heat dissipation device 30 can be improved in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit. That is, the heat dissipation control device 20 in this embodiment may perform heat dissipation control (i.e. temperature heat dissipation control) on the heat dissipation device 30 according to a heat dissipation control scheme based on temperature according to the temperature data collected by the temperature collecting device; on the basis, according to the trigger signal sent by the control circuit, the air pressure data acquired by the air pressure acquisition device 10 are combined to perform heat dissipation adjustment on the heat dissipation device 30, so that in the process of transmitting ultrasonic sound waves and/or receiving echo signals by the control circuit, the heat dissipation efficiency of the heat dissipation device 30 can be correspondingly improved according to the trigger signal and the air pressure data, and the heat dissipation adjustment of the heat dissipation device 30 is realized.
For example, when the heat dissipating device 30 includes a fan, the fan is not required to operate at full load in an initial state in order to reduce power consumption of the medical ultrasound apparatus as much as possible; control of the fan speed may be achieved by the duty cycle transmitted to the fan drive module by the heat dissipation control device 20; the higher the duty ratio is, the faster the rotation speed of the fan is, and the better the heat dissipation effect is under the condition of a certain air density. According to the earth atmosphere model, in the troposphere below 11km, the conversion formula of temperature, air density and air pressure is as follows:
T=15.04-0.00649h
in the formula, T is the temperature, P is the pressure, ρ is the density, and h is the altitude. In the conventional use occasion, the condition below 11km already meets the requirement, and the actual effective heat dissipation power of the fan is:
in the above formula, Δp is the heat dissipation power variation, f is the friction factor, x is the correction factor, V is the fluid velocity, N L Representing parameters associated with the heat sink 30. According to the above formula, according to the air pressure and temperature data, a two-dimensional matrix corresponding relation between the air pressure and the fan power can be fitted to obtain a preset two-dimensional matrix, so that the heat dissipation control device 20 is specifically used for determining the adjustment power of the heat dissipation device 30 according to the trigger signal, the temperature data, the air pressure data and the preset two-dimensional matrix; and according to the adjustment power, the heat dissipation adjustment is performed on the heat dissipation device 30, so that the heat dissipation efficiency of the heat dissipation device 30 is improved in the process of transmitting ultrasonic sound waves and/or receiving echo signals by the control circuit. For example, the heat dissipation control device 20 may determine the actual effective heat dissipation power of the heat dissipation device 30 according to the temperature data, the air pressure data and the preset two-dimensional matrix; and then determines the adjustment power of the heat sink device 30 based on the heat dissipation power and the ultrasonic emission control information.
Specifically, the heat dissipation control device 20 (such as a control chip) in this embodiment may control the air pressure acquisition device 10 to acquire air pressure data once after the medical ultrasound apparatus is started up each time, and store the air pressure data, so that the heat dissipation control process after the current startup can directly use the stored air pressure data, reduce the acquisition times of the air pressure acquisition device 10, and reduce the power consumption; for example, the heat dissipation control device 20 may store the air pressure data into a memory inside the heat dissipation control device 20, that is, the heat dissipation control device 20 may include a first memory for storing the air pressure data collected by the air pressure collecting device 10 after each power-on of the medical ultrasound apparatus; the heat dissipation control device 20 may also store the air pressure data in an external memory, such as a small-capacity EEPROM (Electrically Erasable Programmable Read Only Memory, charged EEPROM) chip, a larger-capacity EMMC (Embedded Multi Media Card, an embedded memory standard specification) chip, or a FLASH (FLASH) chip. The present embodiment does not impose any limitation on this.
The heat dissipation control device 20 controls the air pressure acquisition device 10 to acquire the air pressure data for one time after each start, and can acquire the air pressure data for multiple times and perform data jitter elimination in an average mode, so that abnormal data interference of the air pressure acquisition device 10 for a single time is eliminated. The flow of the heat dissipation control device 20 for controlling the air pressure acquisition device 10 to acquire data can be repeated every time the machine is started, and the stored air pressure data can be updated and covered.
Likewise, in this embodiment, the heat dissipation control device 20 may store the preset two-dimensional matrix into the memory inside the heat dissipation control device 20, that is, the heat dissipation control device 20 includes a second memory for storing the preset two-dimensional matrix; wherein, the preset two-dimensional matrix comprises the corresponding relation between the air pressure and the temperature and the power of the heat dissipation device 30; the heat dissipation control device 20 is specifically configured to determine, when receiving the trigger signal, an adjustment power of the heat dissipation device 30 according to the temperature data, the air pressure data, and a preset two-dimensional matrix; and adjusts the heat dissipation of the heat sink device 30 according to the adjustment power. For example, when the trigger signal is received, the heat dissipation control device 20 may read a preset two-dimensional matrix in the second memory, and determine the adjustment power of the heat dissipation device 30 according to the heat dissipation control data, the temperature data, the air pressure data, and the preset two-dimensional matrix; according to the adjustment power, the heat dissipation device 30 is subjected to heat dissipation adjustment, so that the heat dissipation efficiency of the heat dissipation device 30 is improved in the process of transmitting ultrasonic sound waves and/or receiving echo signals by the control circuit; for example, before the portable medical ultrasound device leaves the factory, a two-dimensional matrix (i.e., a preset two-dimensional matrix) of fan powers for different temperature and air pressure value confirmations has been completed, and the preset two-dimensional matrix is recorded in the second memory of the heat dissipation control device 20. The heat dissipation control device 20 may also store the air pressure data in an external memory, which is not limited in this embodiment.
Note that, in this embodiment, the heat dissipating device 30 may be a device for dissipating heat from the medical ultrasound apparatus according to the control of the heat dissipating control device 20. For a specific number and type of heat sinks 30, it may be set by the designer, e.g., heat sinks 30 may include fans; wherein the heat dissipation control device 20 is connected with a fan; the heat dissipation control device 20 is specifically configured to adjust a rotation speed of the fan in combination with the air pressure data acquired by the air pressure acquisition device 10 when the trigger signal is received, so as to increase the rotation speed of the fan in a process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit; if the fan does not reach the rated power, the rotating speed of the fan is increased by increasing the power of the fan. The heat sink 30 may also include a liquid-cooled heat sink water pump; wherein, the heat dissipation control device 20 is connected with a liquid cooling heat dissipation water pump; the heat dissipation control device 20 is specifically configured to adjust a flow rate of the liquid cooling heat dissipation water pump by combining the air pressure data collected by the air pressure collecting device 10 when receiving the trigger signal, so as to increase the flow rate of the liquid cooling heat dissipation water pump in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit.
In this embodiment, the heat dissipation control device 20 is in communication connection with the existing control circuit of the medical ultrasonic device, so that the control circuit can trigger the heat dissipation control device 20 to timely adjust the heat dissipation efficiency of the heat dissipation device 30 when controlling the transmission and the reception of ultrasonic sound waves; and through the communication connection of the added air pressure acquisition device 10 and the heat dissipation control device 20, the heat dissipation control device 20 can adjust the heat dissipation efficiency of the heat dissipation device 30 by combining actual air pressure data, so that the problem that the heat dissipation effect of medical ultrasonic equipment is poor when the medical ultrasonic equipment is used in a high-altitude area is solved, the heat accumulation condition in the medical ultrasonic equipment is reduced, and the stability of the medical ultrasonic equipment is improved.
Based on the above embodiments, the embodiments of the present utility model provide another heat dissipation system for medical ultrasound equipment. Specifically, referring to fig. 2, fig. 2 is a block diagram illustrating a heat dissipation system of another medical ultrasound apparatus according to an embodiment of the present utility model. The system may include: a heat radiation control device 20, a heat radiation device 30, an air pressure acquisition device 10 and a temperature acquisition device 40; the heat dissipation control device 20 is respectively in communication connection with an existing control circuit 50, a heat dissipation device 30, an air pressure acquisition device 10 and a temperature acquisition device 40 of the medical ultrasonic equipment;
a heat dissipation control device 20 for performing conventional temperature heat dissipation control on the heat dissipation device 30 according to the temperature data; and on the basis of conventional temperature heat dissipation control, when a trigger signal is received, heat dissipation adjustment is performed on the heat dissipation device 30 by combining air pressure data acquired by the air pressure acquisition device 10.
Specifically, as shown in fig. 2, the existing control circuit 50 of the medical ultrasound apparatus in the present embodiment may include a logic module 51, a transmitting module 52, and a receiving module 53; wherein the logic module 51 is respectively connected with the control circuit 50, the transmitting module 52 and the receiving module 53; the logic module 51 may be configured to determine ultrasound emission control information according to an ultrasound control instruction of the upper computer; if the heat dissipation control scene corresponding to the ultrasonic emission control information is a heat dissipation scene, a trigger signal is sent to the heat dissipation control device 20, the emission module 52 is controlled to emit ultrasonic sound waves according to the ultrasonic emission control information, and digital signal processing is performed on echo signals collected by the receiving module 53. Accordingly, the control circuit 50 may further include a power module 54 connected to the logic module 51, the transmitting module 52, and the receiving module 53, for supplying power to the logic module 51, the transmitting module 52, and the receiving module 53.
The heat dissipation control device 20 in this embodiment may include a first memory, configured to store air pressure data collected by the air pressure collecting device 10 after each power-on of the medical ultrasound apparatus; accordingly, the heat dissipation control device 20 may acquire the air pressure data from the first memory.
Correspondingly, the heat dissipation control device 20 in this embodiment may include a second memory, configured to store a preset two-dimensional matrix; wherein, the preset two-dimensional matrix comprises the corresponding relation between the air pressure and the temperature and the power of the heat dissipation device 30; the heat dissipation control device 20 is specifically configured to perform temperature heat dissipation control on the heat dissipation device 30 according to the temperature data; on the basis of temperature heat dissipation control, when a trigger signal is received, the adjustment power of the heat dissipation device 30 is determined according to temperature data, air pressure data and a preset two-dimensional matrix; and according to the adjustment power, the heat dissipation adjustment is performed on the heat dissipation device 30, so as to improve the heat dissipation efficiency of the heat dissipation device 30 in the process of transmitting the ultrasonic sound wave and/or receiving the echo signal by the control circuit 50.
Specifically, the heat dissipating device 30 in the present embodiment may include a fan; wherein, the heat dissipation control device 20 may be connected with a fan, as shown in fig. 2, the heat dissipation control device 20 may be connected with the fan through a fan driving module; the heat dissipation control device 20 is specifically configured to perform temperature heat dissipation control (i.e. rotational speed control) on the fan according to the temperature data; on the basis of temperature heat dissipation control, when a trigger signal is received, the rotation speed of the fan is adjusted by combining air pressure data and temperature data acquired by the air pressure acquisition device 10; for example, the heat dissipation control device 20 may determine the adjustment power of the fan according to the heat dissipation control data, the temperature data, the air pressure data, and the preset two-dimensional matrix; and adjusts the rotational speed of the fan according to the adjustment power to increase the rotational speed of the fan during the process of transmitting ultrasonic sound waves and/or receiving echo signals by the control circuit 50.
Correspondingly, the heat dissipation control device 20 in this embodiment controls the control signal of each fan to be transmitted by 1 byte. Of the 8 bits of 1 byte, bit7 and bit6 are used to transmit the number of the control fans, and can control up to 4 fans; bit5 and bit4 are used for transmitting the time for controlling the fan, for example, 00 represents that the fan lifting rotating speed time is 500us,01 represents 1ms and the like; bit3, bit2 and bit1 are used for transmitting and controlling the rotation speed of the fan, for example, 000 represents that the rotation speed is increased by 12.5%,111 represents that the rotation speed is increased by 100%, and the like; bit0 is used to determine whether the transmission is a transmission termination signal, e.g., 0 indicates that the data transmission has not ended, and 1 indicates that the data transmission has ended. Through the coding mode, the content transmission of the control fan is realized.
It should be noted that, for the specific communication connection mode between the heat dissipation control device 20 and the control circuit 50 in this embodiment, that is, the specific communication connection mode between the heat dissipation control device 20 and the logic module 51 in the control circuit 50 may be set by a designer according to a practical scenario and user requirements, for example, the heat dissipation control device 20 may be connected to the logic module 51 through three data lines, the heat dissipation control device 20 may also perform data communication through more or fewer data lines, and may also perform data transmission in a synchronous mode. The present embodiment does not impose any limitation on this.
For example, the control circuit 50 may be communicatively connected to the heat dissipation control device 20 through interrupt signal lines, data signal lines, and trigger signal lines; when the heat dissipation control device 20 receives the interrupt signal on the interrupt signal line, heat dissipation control data is received by the data signal line; when the heat dissipation control device 20 receives the trigger signal on the trigger signal line, the heat dissipation adjustment is performed on the heat dissipation device 30 in combination with the air pressure data, the temperature data, and the heat dissipation control data. That is, when the heat dissipation control scenario corresponding to the ultrasonic emission control information is a heat dissipation scenario, the control circuit 50 transmits a prompting interrupt signal to the heat dissipation control device 20 through the interrupt signal line to prompt the heat dissipation control device 20 to receive heat dissipation control data; transmitting heat dissipation control data to the heat dissipation control device 20 through the data signal line; when transmitting ultrasonic sound waves, a trigger signal is sent to the heat dissipation control device 20 through a trigger signal line to trigger the heat dissipation control device 20 to conduct heat dissipation adjustment.
As shown in fig. 2, the control circuit 50 may be communicatively connected to the heat dissipation control device 20 through an interrupt signal line, a data signal line and a trigger signal line, wherein pins of the heat dissipation control device 20 and the logic module 51 on the interrupt signal line are OD (Open Drain) gate type, such pins support output in a low level or high resistance state, a pull-up resistor is connected to the power supply on the interrupt signal line, so that the signal line in a high level state when the interrupt signal line defaults to the high resistance state, i.e. the interrupt signal line is connected to a preset power supply through the pull-up resistor, and when the heat dissipation control device 20 receives a low level (i.e. an interrupt signal) on the interrupt signal line, heat dissipation control data is received by the data signal line; pins on the data signal line and the trigger signal line are of a push-pull gate type, and such pins support output of high level or low level. That is, in an initial state or when no fan speed adjustment (i.e., normal scenario) is required, no data is transmitted on the interrupt, data, and trigger signal lines, and by default, the interrupt signal line remains at a high level and the data signal line and trigger signal line remain at a low level. When the fan rotation speed adjustment is required, the logic module 51 first detects the level state on the interrupt signal line; if the level is low, the control is ignored; if the power is high, the logic module 51 sets the pin on the interrupt signal line to low, so that the interrupt signal line is low, and at this time, the heat dissipation control device 20 receives the interrupt signal of low, sets the level on the IO pin (i.e., the data signal line pin) to low, and prepares to receive data on the data signal line. Next, the logic module 51 will transmit the data for controlling the rotation speed of the fan (i.e. the heat dissipation control data) to the heat dissipation control device 20 through the data signal line, and after the transmission is completed, the logic module 51 will configure the IO on the interrupt line to be in a high-resistance state, and at this time, since the pins of the heat dissipation control device 20 are configured to be in a low level, the interrupt signal line is kept in a low level. Next, after the heat dissipation control device 20 completes receiving data on the data signal line, it waits for the logic module 51 to send a trigger pulse (i.e. trigger signal) on the trigger signal line. After that, when the trigger pulse sent by the logic module 51 is received, the fan is correspondingly controlled, and the rotation speed of the fan is increased. Finally, after the fan is controlled, IO on the interrupt signal line is configured to be in a high-resistance state, and the level of the interrupt signal line is restored to a default high-level state. Through the above flow, the control and adjustment of the fan rotating speed are completed. Wherein the trigger signal is a pulse signal, and the edge is effective. When the logic module 51 controls the transmitting module 52 to perform voltage transmission (such as PUSH voltage transmission), the trigger signal is used to inform the heat dissipation control device 20 to increase the rotation speed of the fan.
In terms of data transmission, no synchronous clock is introduced to save pin resources of the logic module 51 and the heat dissipation control device 20. In this embodiment, the serial port transmission mode may be adopted, where the heat dissipation control device 20 and the logic module 51 set a predetermined baud rate, byte length, check code, and the like initially, and the logic module 51 performs data transmission to the heat dissipation control device 20 in a serial port protocol, and the heat dissipation control device 20 also performs data reception in this mode. The communication transmission protocol between the heat dissipation control device 20 and the logic module 51 may also be other types of transmission protocols, such as IIC (Inter-Integrated Circuit, a multi-directional control bus), which is not limited in this embodiment.
Specifically, as shown in fig. 2, when the heat dissipating device 30 includes a fan, after the ultrasound system enters the diagnostic item, the ultrasound system combines the ultrasound mode selection and the internal parameters of the ultrasound system, the logic module 51 internally needs to perform confirmation of the waveform and the transmission timing requirements of the detailed transmission, and then the ultrasound system starts the cyclic operation of the transmission and the reception. At the start of a new transmission, the logic module 51 confirms whether or not the fan speed and the degree of increase are required based on the transmitted voltage and the number of transmitted waveforms per unit time. Taking shear wave elastography as an example, waveforms emitted by shear wave elastography include 2 types, 1 type is PUSH voltage emission, and the other 1 type is detection pulse emission, i.e. a single waveform of 5MHz is emitted with a longer period of time. The fan control logic then distinguishes between the presence and absence of PUSH voltage: when the PUSH voltage is not available, the emission module 52 is controlled to emit according to the logic module 51 and the normal logic, namely, the heat dissipation control scene is determined to be a normal scene; for the case of the PUSH voltage, the logic module 51 may enter a scenario of increasing the fan speed, i.e., a heat dissipation scenario, in addition to controlling the emission. At this time, the logic module 51 transmits data of the fan configuration (i.e., heat dissipation control data) based on the emission waveform and the control timing to the heat dissipation control device 20. When the emission module 52 emits the PUSH voltage normally, the trigger pulses are emitted synchronously, and after the heat dissipation control device 20 finishes acquiring data and receives the trigger pulses of the logic module 51, the fan also accelerates according to the trigger pulses (i.e. trigger signals). After a preset designated time (such as the time period of sending the ultrasonic sound wave or the time period when the ultrasonic sound wave is sent to the echo signal receiving is completed), the rotating speed of the fan is restored to the set rotating speed value before the change. Finally the logic module 51 starts to control the transmitting module 52 to transmit the detection pulse. So far, one transmission ends. The next new transmission may then be started, depending on the configuration.
Correspondingly, the receiving module 53 receives the echo waveform and converts it and transmits it to the logic module 51 in the whole transmitting process, but only the echo signal of the detection pulse is processed by the logic module 51, and the echo waveform data at the PUSH voltage moment is discarded. The pulse width of the trigger pulse may be a different time, which may depend on a set value between the logic module 51 and the heat dissipation control device 20. The emission time sequence of the fan control is not limited to the scene of shear wave elastography, and when more continuous pulse emission is needed to be used for the scene, the fan control can be performed by referring to the mode; that is, the heat dissipation scenario in this embodiment may be a scenario in which the control circuit 50 needs to maintain the transmission and reception for a long period of time, so that for the problem that the heat productivity of the transmission module 52 is high when the transmission module 52 transmits for a long period of time at a high voltage, the heat productivity of the reception module 53 receives a large echo signal is high, the heat generated in excess can be removed in time, and the abnormality caused by heat accumulation is avoided.
In this embodiment, by setting the temperature acquisition device 40 and the air pressure acquisition device 10, the embodiment of the utility model can determine the air convection efficiency by combining different air pressure values of the environment where the medical ultrasonic equipment is located on the basis of conventional temperature heat dissipation control, so as to adjust the heat dissipation efficiency of the heat dissipation device 30, solve the problem of poor heat dissipation effect of the medical ultrasonic equipment when the medical ultrasonic equipment is used in high altitude areas, prevent the situation that the heat dissipation device 30 is only forced to improve the heat dissipation efficiency after built-in heat accumulation, and enable the medical ultrasonic equipment to have better stability.
Corresponding to the above embodiment of the heat dissipation system, the embodiment of the present utility model further provides a medical ultrasound device, and a medical ultrasound device described below and a heat dissipation system of a medical ultrasound device described above may be referred to correspondingly.
A medical ultrasound device, comprising: the heat dissipation system of the medical ultrasonic device provided by the embodiment.
Specifically, the medical ultrasound device provided in the present embodiment may be a portable medical ultrasound device.
Further, the medical ultrasound device may also include control circuitry in the conventional ultrasound device that is communicatively coupled to a heat dissipation control device in the heat dissipation system of the medical ultrasound device.
The heat radiation system of the medical ultrasonic equipment and the medical ultrasonic equipment provided by the utility model are described in detail. The principles and embodiments of the present utility model have been described herein with reference to specific examples, the description of which is intended only to facilitate an understanding of the method of the present utility model and its core ideas. It should be noted that it will be apparent to those skilled in the art that various modifications and adaptations of the utility model can be made without departing from the principles of the utility model and these modifications and adaptations are intended to be within the scope of the utility model as defined in the following claims.
Claims (10)
1. A heat dissipation system for medical ultrasound equipment, comprising: the device comprises an air pressure acquisition device, a heat dissipation control device and a heat dissipation device; the heat dissipation control device is respectively in communication connection with an existing control circuit of the medical ultrasonic equipment, the air pressure acquisition device and the heat dissipation device;
the air pressure acquisition device is used for acquiring air pressure data and sending the air pressure data to the heat dissipation control device;
and the heat dissipation control device is used for carrying out heat dissipation adjustment on the heat dissipation device by combining the air pressure data acquired by the air pressure acquisition device when receiving the trigger signal sent by the control circuit.
2. The heat dissipation system of medical ultrasound equipment of claim 1, wherein the heat dissipation control device is communicatively connected to the control circuit via an interrupt signal line, a data signal line, and a trigger signal line;
when the heat dissipation control device receives the interrupt signal on the interrupt signal line, the data signal line is utilized to receive heat dissipation control data; when the heat dissipation control device receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to conduct heat dissipation adjustment on the heat dissipation device.
3. The heat dissipating system of the medical ultrasound device according to claim 2, wherein the interrupt signal line is connected to a preset power supply through a pull-up resistor;
and when the heat dissipation control device receives a low level on the interrupt signal line, the heat dissipation control data is received by using the data signal line.
4. The heat dissipation system of medical ultrasound equipment of claim 1, wherein the heat dissipation control device is communicatively connected to the control circuit via a data signal line and a trigger signal line;
the heat dissipation control device is specifically configured to receive heat dissipation control data by using the data signal line; when the heat dissipation control device receives the trigger signal on the trigger signal line, the air pressure data and the heat dissipation control data are combined to conduct heat dissipation adjustment on the heat dissipation device.
5. The heat dissipating system of the medical ultrasound device of claim 1, wherein the heat dissipating control means comprises a first memory for storing air pressure data acquired by the air pressure acquisition means after each power-on of the medical ultrasound device.
6. The heat dissipation system of medical ultrasound equipment of any one of claims 1 to 5, further comprising: a temperature acquisition device for acquiring temperature data;
the temperature acquisition device is in communication connection with the heat dissipation control device; the heat dissipation control device is specifically used for performing conventional temperature heat dissipation control on the heat dissipation device according to the temperature data; and on the basis of the conventional temperature heat dissipation control, when the trigger signal is received, the heat dissipation device is subjected to heat dissipation adjustment by combining the air pressure data acquired by the air pressure acquisition device.
7. The heat dissipation system of medical ultrasound equipment according to claim 6, wherein the heat dissipation control means comprises a second memory for storing a preset two-dimensional matrix; the preset two-dimensional matrix comprises the corresponding relation between air pressure and temperature and the power of the heat dissipation device;
the heat dissipation control device is specifically configured to determine, when the trigger signal is received, an adjustment power of the heat dissipation device according to the temperature data, the air pressure data and the preset two-dimensional matrix; and according to the adjustment power, carrying out heat dissipation adjustment on the heat dissipation device.
8. The heat dissipation system of medical ultrasound equipment of any one of claims 1 to 5, wherein the heat dissipation device comprises a fan;
wherein the heat dissipation control device is connected with the fan; the heat dissipation control device is specifically used for adjusting the rotating speed of the fan by combining the air pressure data acquired by the air pressure acquisition device when the trigger signal is received.
9. The heat dissipation system of medical ultrasound equipment of any one of claims 1 to 5, wherein the heat dissipation device comprises a liquid cooled heat dissipation water pump;
the heat dissipation control device is connected with the liquid cooling heat dissipation water pump; the heat dissipation control device is specifically used for adjusting the flow of the liquid cooling heat dissipation water pump by combining the air pressure data acquired by the air pressure acquisition device when the trigger signal is received.
10. A medical ultrasound device, comprising: a heat dissipation system for medical ultrasound equipment as defined in any one of claims 1 to 9.
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