CN219497742U - Wafer transfer device with variable distance - Google Patents
Wafer transfer device with variable distance Download PDFInfo
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- CN219497742U CN219497742U CN202320184620.XU CN202320184620U CN219497742U CN 219497742 U CN219497742 U CN 219497742U CN 202320184620 U CN202320184620 U CN 202320184620U CN 219497742 U CN219497742 U CN 219497742U
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- 235000012431 wafers Nutrition 0.000 claims abstract description 138
- 239000000463 material Substances 0.000 claims abstract description 104
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 230000009471 action Effects 0.000 claims abstract description 7
- 238000000429 assembly Methods 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 8
- 230000008859 change Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 10
- 238000000034 method Methods 0.000 abstract description 10
- 230000008569 process Effects 0.000 abstract description 8
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 238000000427 thin-film deposition Methods 0.000 description 2
- 238000000137 annealing Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004518 low pressure chemical vapour deposition Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to the technical field of semiconductor process equipment, and provides a wafer transfer device with variable distance, which comprises a box body, a loading mechanism and a driving mechanism, wherein the box body is provided with a plurality of support plates; the material loading mechanism is arranged in the accommodating space of the box body and comprises a first material loading assembly and a second material loading assembly which are oppositely arranged, the first material loading assembly is provided with a plurality of first material loading spaces, the second material loading assembly is provided with a plurality of second material loading spaces, and the first material loading spaces and the second material loading spaces are used for loading wafers; the drive mechanism is arranged on the box body, the first material carrying assembly and the second material carrying assembly are connected with the drive mechanism, and under the action of the drive mechanism, the distance between two adjacent first material carrying spaces and the distance between two adjacent second material carrying spaces are adjustable so as to adjust the distance between a plurality of wafers, so that the positions of the wafers are matched with the wafer boat. The wafer transfer device can realize the function of transferring a plurality of wafers at the same time after the distance between the wafers is adjusted, shortens the wafer transfer time, reduces the manual operation error and improves the production efficiency of chips.
Description
Technical Field
The utility model relates to the technical field of semiconductor process equipment, in particular to a wafer transfer device with variable distance.
Background
With the rapid development of the semiconductor industry, the sizes of semiconductor devices and integrated circuit chips are shrinking year by year, so that the requirements on the chip manufacturing process are more severe, and meanwhile, the requirements on the chips in the market are increasing year by year, so that the requirements on the chip production efficiency and the chip production quality are higher.
Based on the goal of improving the production efficiency, tens or hundreds of wafers need to be processed simultaneously in the chip production process to meet the requirements. At present, when preparing a thin film deposition module, related thin film deposition equipment, such as low-pressure chemical vapor deposition, a high-temperature annealing furnace, a high-temperature oxidation furnace and other process equipment are all single-process multi-wafer, particularly such as a horizontal furnace tube, because the spacing between wafers placed on a wafer boat in a reaction chamber of the equipment is different from the spacing between wafers on a wafer box, in the prior art, the wafers are transferred to the wafer boat of the equipment usually manually or by using a mechanical arm in a single-wafer transfer mode to realize one-by-one transfer of the plurality of wafers, in the process, the probability of pollution of the wafers is increased, the number of the wafers is more, the transfer time of the wafers is increased, the transfer efficiency is low, the subsequent production operation is affected, and therefore, the production efficiency and the chip yield are lower.
Therefore, in order to solve the above-mentioned problems, the present utility model provides a novel wafer transfer device with variable pitch.
Disclosure of Invention
Based on the above description, the utility model provides a wafer transfer device with variable distance, so as to solve the technical problem of low wafer transfer efficiency caused by the single wafer transfer of a plurality of wafers in the prior art.
The technical scheme for solving the technical problems is as follows:
the utility model provides a wafer transfer device with variable distance, comprising: the device comprises a box body, a material loading mechanism and a driving mechanism;
the material loading mechanism is arranged in the accommodating space of the box body and comprises a first material loading assembly and a second material loading assembly which are oppositely arranged, wherein the first material loading assembly is provided with a plurality of first material loading spaces, the second material loading assembly is provided with a plurality of second material loading spaces which are matched with the first material loading spaces, and the first material loading spaces and the second material loading spaces are used for loading wafers;
the driving mechanism is arranged on the box body, the first material carrying assembly and the second material carrying assembly are connected with the driving mechanism, and under the action of the driving mechanism, the distance between two adjacent first material carrying spaces and the distance between two adjacent second material carrying spaces are adjustable so as to adjust the distance between a plurality of wafers, so that the positions of the wafers are matched with the wafer placing positions of the wafer boat.
On the basis of the technical scheme, the utility model can be improved as follows.
Further, the wafer transfer device with variable distance further comprises an opening and closing mechanism;
the opening and closing mechanism is arranged at the opening of the box body;
the opening and closing mechanism is used for fixing the wafer when the wafer is transferred; the opening and closing mechanism is used for releasing the wafer when the wafer is placed on the wafer boat.
Further, the opening and closing mechanism comprises a first baffle, a second baffle, a first rotating piece and a second rotating piece;
the first baffle is arranged on one side of the box body through the first rotating piece, and the first rotating piece is used for driving the first baffle to rotate; the second baffle is arranged on the other side of the box body through the second rotating piece, and the second rotating piece is used for driving the second baffle to rotate.
Further, the first baffle plate and/or the second baffle plate is/are provided with a plurality of first grooves; the plurality of first grooves are distributed along the arrangement direction of the wafers.
Further, the first loading assembly comprises a plurality of first loading side plates; the plurality of first material carrying side plates are arranged along the first direction, and the first material carrying side plates are provided with first clamping grooves so as to construct and form the first material carrying space.
Further, the second loading assembly comprises a plurality of second loading side plates; the second carrying side plates are arranged in one-to-one correspondence with the first carrying side plates, and second clamping grooves are formed in the second carrying side plates so as to construct and form the second carrying space.
Further, the driving mechanism comprises two driving components which are oppositely arranged;
the first material carrying assembly and the second material carrying assembly are respectively connected with the two driving assemblies; the driving assembly is used for driving the first material carrying side plate and the second material carrying side plate to move along the first direction so as to adjust the distance between the first clamping grooves and the distance between the second clamping grooves.
Further, the driving mechanism further comprises a distance adjusting knob; the distance adjusting knob is arranged on one side of the box body, and the two driving assemblies are connected with the distance adjusting knob.
Further, the driving component comprises a connecting rod, a sliding rod, a connecting shaft and a chain rod;
the two ends of the connecting rod are respectively connected with the distance adjusting knob and the sliding rod, and the extending direction of the sliding rod is the same as the first direction; the connecting shaft is arranged on the sliding rod along the first direction, one end of the chain rod is rotatably connected with the connecting shaft, and the other end of the chain rod is connected with the first material carrying side plate or the second material carrying side plate;
under the action of the distance adjusting knob, the connecting rod can drive the sliding rod to move along the second direction, and the sliding rod drives the distance between two adjacent chain rods to be increased or smaller through the connecting shaft so as to change the distance between two adjacent first material carrying side plates or two adjacent second material carrying side plates.
Further, the inner wall surface of the box body is provided with a sliding rail along the first direction, one side of the first material carrying side plate and/or the second material carrying side plate is provided with a second groove, and the second groove is matched with the sliding rail.
Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:
according to the distance-variable wafer transfer device, the box body, the material loading mechanism and the driving mechanism are arranged, the material loading mechanism consists of the first material loading component and the second material loading component, the first material loading component and the second material loading component are provided with the first material loading spaces and the second material loading spaces for bearing wafers to be transferred, and further, the driving mechanism can drive the first material loading component and the second material loading component to move, so that the distance between the adjacent first material loading spaces and the distance between the adjacent second material loading spaces can be changed to increase or decrease, the distance between the wafers to be transferred placed on the material loading mechanism can be adjusted, the positions of the wafers are matched with the structure of the wafer boat, and the wafers can be transferred onto the wafer boat at the same time. Compared with the prior art, the wafer transfer device with the variable distance can correspondingly adjust the distance between the wafers according to the distance between the mounting positions on the wafer boat, so that the distance between the wafer transfer device and the wafer boat is the same, the function of transferring a plurality of wafers at the same time after the distance between the wafers is adjusted can be realized, the wafer transfer time is shortened, the wafer transfer efficiency is improved, the manual operation error is reduced, and the production efficiency of chips is effectively improved.
Drawings
Fig. 1 is a schematic diagram of an overall structure of a wafer transferring apparatus with variable pitch according to an embodiment of the present utility model;
fig. 2 is a schematic structural diagram of a case according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a first loading side plate according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a first baffle according to an embodiment of the present utility model;
FIG. 5 is a schematic diagram of a part of a wafer transfer apparatus with variable pitch according to an embodiment of the present utility model;
in the drawings, the list of components represented by the various numbers is as follows:
1. a case body; 11. a slide rail;
2. a loading mechanism; 21. a first loading side plate; 22. a first clamping groove; 23. the second material loading side plate; 24. a second clamping groove; 25. a first groove;
3. a driving mechanism; 31. a drive assembly; 311. a connecting rod; 312. a slide bar; 313. a connecting shaft; 314. a chain bar; 32. a distance adjusting knob;
4. an opening and closing mechanism; 41. a first baffle; 411. a second groove; 42. a second baffle; 43. a first rotating member; 44. and a second rotating member.
Detailed Description
In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Examples of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.
Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Embodiments of the present utility model will be described in further detail with reference to the accompanying drawings and examples, which are provided to illustrate the present utility model, but are not intended to limit the scope of the present utility model.
As shown in fig. 1 to 5, an embodiment of the present utility model provides a wafer transfer apparatus with variable pitch, including: the box body 1, the loading mechanism 2 and the driving mechanism 3.
The material loading mechanism 2 is arranged in the accommodating space of the box body 1, the material loading mechanism 2 comprises a first material loading assembly and a second material loading assembly which are oppositely arranged, the first material loading assembly is provided with a plurality of first material loading spaces, the second material loading assembly is provided with a plurality of second material loading spaces which are matched with the first material loading spaces, and the first material loading spaces and the second material loading spaces are used for loading wafers;
the driving mechanism 3 is arranged on the box body 1, the first material carrying assembly and the second material carrying assembly are connected with the driving mechanism 3, and under the action of the driving mechanism 3, the distance between two adjacent first material carrying spaces and the distance between two adjacent second material carrying spaces are adjustable so as to adjust the distance between a plurality of wafers, so that the positions of the wafers are matched with the wafer placing positions of the wafer boat.
Specifically, as shown in fig. 1, the distance-variable wafer transfer device provided in the embodiment of the present utility model is composed of a box body 1, a loading mechanism 2 and a driving mechanism 3, wherein the box body 1 has a shape similar to a conventional wafer box for storing wafers in the prior art, and the width and the height of the box body can be the same as those of the conventional wafer box, but the length of the box body is determined according to the size after the distance adjustment.
A plurality of positioning holes are arranged on the box body 1 so as to realize the positioning among different box bodies 1 when the wafer is transferred.
As shown in fig. 1, the loading mechanism 2 is composed of a first loading assembly and a second loading assembly, and a plurality of first loading spaces and a plurality of second loading spaces for loading wafers to be transferred are arranged on the first loading assembly and the second loading assembly.
Further, the driving mechanism 3 can drive the first material carrying assembly and the second material carrying assembly to move, so that the distance between the adjacent first material carrying spaces and the distance between the adjacent second material carrying spaces can be changed to increase or decrease, the distance between wafers to be transferred placed on the material carrying mechanism 2 can be adjusted, the positions of the wafers are matched with the structure of the wafer boat, and a plurality of wafers can be transferred onto the wafer boat at the same time.
Compared with the prior art, the wafer transfer device with the variable distance provided by the embodiment of the utility model can correspondingly adjust the distance between the wafers according to the distance between the mounting positions on the wafer boat, so that the distance between the wafer transfer device and the wafer boat is the same, the function of transferring a plurality of wafers at the same time after the distance between the wafers is adjusted can be realized, the wafer transfer time is shortened, the wafer transfer efficiency is improved, the manual operation error is reduced, and the production efficiency of chips is effectively improved.
In an alternative embodiment, in order to prevent the wafer from falling off during the transferring process, and ensure the stability of the wafer, as shown in fig. 1, the wafer transferring apparatus with variable pitch further includes an opening and closing mechanism 4.
The opening and closing mechanism 4 is arranged at the opening of the box body 1.
The opening and closing mechanism 4 is used for fixing the wafer when the wafer is transferred; the opening and closing mechanism 4 is used to release the wafers when they are placed in the wafer boat.
Further, as shown in fig. 1, the opening and closing mechanism 4 includes a first shutter 41, a second shutter 42, a first rotating member 43, and a second rotating member 44. The first baffle 41 and the second baffle 42 are arranged oppositely, and can well seal and fix the wafer when in a closed state, and can not influence the falling off and the transfer of the wafer when in an open state.
The first baffle 41 is arranged on one side of the box body 1 through a first rotating piece 43, and the first rotating piece 43 is used for driving the first baffle 41 to rotate; the second baffle 42 is disposed on the other side of the box 1 through a second rotating member 44, and the second rotating member 44 is used for driving the second baffle 42 to rotate. Wherein, the first rotating member 43 and the second rotating member 44 can both rotate 100-150 degrees to drive the first baffle 41 and the second baffle 42 to rotate, and in some embodiments, the baffles are rotatably connected with the rotating member, i.e. the baffles can freely rotate, and have a rotation function of 90 degrees.
On the basis of the above embodiment, as shown in fig. 2, the first baffle 41 and/or the second baffle 42 is provided with a plurality of first grooves 25; the plurality of first grooves 25 are arranged along the arrangement direction of the wafers. The size of the first groove 25 is matched with that of the wafer, and the first groove 25 is used for being clamped with the wafer, so that the wafer is prevented from being damaged due to shaking in the transferring process.
Three settings are included here: first, only the first grooves 25 are provided on the first shutter 41; the second, only the second baffle 42 is provided with the first groove 25; the third, set up the first recess 25 on the first baffle 41 and second baffle 42, set up according to actual need, do not limit further. In the embodiment of the present utility model, the third arrangement is preferable.
The wafer transfer is realized by the following steps: the method comprises the steps of adjusting the distance between first carrying spaces and the distance between second carrying spaces in a wafer transferring device to be the same as the distance between wafers in an original wafer box, opening a first baffle plate 41 and a second baffle plate 42 to enable a plurality of wafers in the original wafer box to fall into the wafer transferring device at the same time, adjusting the distance between the first carrying spaces and the distance between the second carrying spaces to be the same as the distance between mounting positions on a wafer boat, closing the first baffle plate 41 and the second baffle plate 42, turning over the wafer transferring device by 90 degrees, and opening the first baffle plate 41 and the second baffle plate 42 again to enable the plurality of wafers to fall into the wafer boat at the same time, so that the simultaneous transfer of the plurality of wafers is completed.
In an alternative embodiment, as shown in fig. 1, the first loading assembly comprises a plurality of first loading side plates 21. The plurality of first loading side plates 21 are arranged along the first direction, and the first loading side plates 21 are provided with first clamping grooves 22 to construct and form a first loading space. The first direction is defined herein as the direction of arrangement of the wafers.
The second loading assembly comprises a plurality of second loading side plates 23; the second loading side plates 23 are arranged in one-to-one correspondence with the first loading side plates 21, and the second loading side plates 23 are provided with second clamping grooves 24 to construct and form a second loading space.
The number of the first loading side plates 21 and the second loading side plates 23 is not specifically limited, and the number of the wafers to be transferred may be set according to the actual number of the wafers to be transferred, for example, the number of the wafers to be transferred is 25, and then the number of the first loading side plates 21 and the second loading side plates 23 is not less than 25, which is only an example and does not limit the protection scope of the present utility model.
In an alternative embodiment, as shown in fig. 1, the drive mechanism 3 comprises two oppositely disposed drive assemblies 31.
The first carrying component and the second carrying component are respectively connected with the two driving components 31; the driving assembly 31 is used for driving the first loading side plate 21 and the second loading side plate 23 to move along the first direction so as to adjust the spacing between the first clamping grooves 22 and the spacing between the second clamping grooves 24, thereby adjusting the spacing between the wafers in the clamping grooves.
Further, as shown in fig. 1, the driving mechanism 3 further includes a distance adjusting knob 32; the distance adjusting knob 32 is arranged on one side of the box body 1, and the two driving assemblies 31 are connected with the distance adjusting knob 32.
The two driving assemblies 31 have the same structure and each comprises a connecting rod 311, a sliding rod 312, a connecting shaft 313 and a chain rod 314.
The two ends of the connecting rod 311 are respectively connected with the distance adjusting knob 32 and the sliding rod 312, and the extending direction of the sliding rod 312 is the same as the first direction; the connecting shaft 313 is disposed on the slide bar 312 along the first direction, one end of the chain rod 314 is rotatably connected to the connecting shaft 313, and the other end of the chain rod 314 is connected to the first loading side plate 21 or the second loading side plate 23.
Under the action of the distance adjusting knob 32, the connecting rod 311 can drive the sliding rod 312 to move along the second direction, and the sliding rod 312 drives the spacing between two adjacent chain rods 314 to be increased or smaller through the connecting shaft 313 so as to change the spacing between two adjacent first carrying side plates 21 or two adjacent second carrying side plates 23. The second direction is perpendicular to the first direction; the two links 311 can be moved in opposite directions at the same time at equal intervals.
In a specific example, as shown in fig. 1, the connecting rod 311 is a gear rod, that is, one end connected to the distance adjusting knob 32 is in a gear structure, and can be meshed with a gear on the distance adjusting knob 32, and the distance adjusting knob 32 can rotate 360 degrees. In the process of rotating the knob, the two connecting rods 311 connected with the distance adjusting knob 32 can move along the second direction, so that the two sliding rods 312 connected with the connecting rods 311 are driven to move along the first direction, for example, when the distance adjusting knob 32 rotates clockwise, the two connecting rods 311 move distally (one end far away from the knob) and the sliding rods 312 are driven to move distally, the connecting shaft 313 on the sliding rods 312 also moves distally, as shown in fig. 4, the chain rods 314 rotate in the process, the included angle between the two adjacent chain rods 314 is increased, so that the distance between the material loading side plates connected with the chain rods 314 is increased, and correspondingly, the distance between the clamping grooves is increased, so that the distance between wafers in the clamping grooves is also increased.
In addition, in order to facilitate the operation, the distance adjusting knob 32 is arranged in the middle area of the box body 1, and the box body 1 is provided with a mounting position for mounting the distance adjusting knob 32; the box body 1 is further provided with a through hole, the extending direction of the through hole is consistent with the second direction, the sliding rod 312 can penetrate through the through hole to be connected with the connecting rod 311, and the sliding rod 312 can be effectively prevented from falling off.
It should be noted that, the two ends of the slide bar 312 may be provided with the connecting rod 311 and the knob, and the knob on either side rotates to drive the material loading side plate to rotate, so as to realize the distance adjustment of the wafer; the connecting rod 311 and the knob may be arranged at one end of the slide rod 312, and the other end is a free end or connected with the two slide rods 312 through a telescopic rod, so that the function of adjusting the wafer spacing can be realized. Accordingly, various arrangements may fall within the scope of the present utility model.
In an alternative embodiment, as shown in fig. 5, in order to better guide the loading side plate, the inner wall surface of the box body 1 is provided with a sliding rail 11 along the first direction, one side of the first loading side plate 21 and/or the second loading side plate 23 is provided with a second groove 411, the second groove 411 is adapted to the sliding rail 11, and the loading side plate can move along the sliding rail 11.
Three settings are included here: first, only the first loading side plate 21 is provided with a second groove 411; second, only the second loading side plate 23 is provided with a second groove 411; third, the second grooves 411 are disposed on the first loading side plate 21 and the second loading side plate 23, and the number and the arrangement manner of the second grooves 411 are not particularly limited, and may be set according to actual needs. In the embodiment of the present utility model, the third arrangement mode is preferable, two sliding rails 11 are arranged on two sides of the box body 1, and the two sliding rails 11 are respectively arranged on the upper side and the lower side of the sliding rod 312; two second grooves 411 are formed in each of the first loading side plate 21 and the second loading side plate 23.
In the description of the present specification, the description with reference to the term "particular example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (10)
1. A variable pitch wafer transfer apparatus, comprising: the device comprises a box body, a material loading mechanism and a driving mechanism;
the material loading mechanism is arranged in the accommodating space of the box body and comprises a first material loading assembly and a second material loading assembly which are oppositely arranged, wherein the first material loading assembly is provided with a plurality of first material loading spaces, the second material loading assembly is provided with a plurality of second material loading spaces which are matched with the first material loading spaces, and the first material loading spaces and the second material loading spaces are used for loading wafers;
the driving mechanism is arranged on the box body, the first material carrying assembly and the second material carrying assembly are connected with the driving mechanism, and under the action of the driving mechanism, the distance between two adjacent first material carrying spaces and the distance between two adjacent second material carrying spaces are adjustable so as to adjust the distance between a plurality of wafers, so that the positions of the wafers are matched with the wafer placing positions of the wafer boat.
2. The variable pitch wafer transfer device of claim 1, further comprising an opening and closing mechanism;
the opening and closing mechanism is arranged at the opening of the box body;
the opening and closing mechanism is used for fixing the wafer when the wafer is transferred; the opening and closing mechanism is used for releasing the wafer when the wafer is placed on the wafer boat.
3. The variable pitch wafer transfer device of claim 2, wherein the opening and closing mechanism comprises a first shutter, a second shutter, a first rotating member, and a second rotating member;
the first baffle is arranged on one side of the box body through the first rotating piece, and the first rotating piece is used for driving the first baffle to rotate; the second baffle is arranged on the other side of the box body through the second rotating piece, and the second rotating piece is used for driving the second baffle to rotate.
4. A variable pitch wafer transfer device according to claim 3, wherein the first baffle and/or the second baffle is provided with a plurality of first grooves; the plurality of first grooves are distributed along the arrangement direction of the wafers.
5. The variable pitch wafer transfer device of claim 1, wherein the first carrier assembly comprises a plurality of first carrier side plates; the plurality of first material carrying side plates are distributed along the first direction, and the first material carrying side plates are provided with first clamping grooves so as to construct and form the first material carrying space.
6. The variable pitch wafer transfer device of claim 5, wherein the second carrier assembly comprises a plurality of second carrier side plates; the second carrying side plates are arranged in one-to-one correspondence with the first carrying side plates, and second clamping grooves are formed in the second carrying side plates so as to construct and form the second carrying space.
7. The variable pitch wafer transfer device of claim 6, wherein the drive mechanism comprises two oppositely disposed drive assemblies;
the first material carrying assembly and the second material carrying assembly are respectively connected with the two driving assemblies; the driving assembly is used for driving the first material carrying side plate and the second material carrying side plate to move along the first direction so as to adjust the distance between the first clamping grooves and the distance between the second clamping grooves.
8. The variable pitch wafer transfer device of claim 7, wherein the drive mechanism further comprises a pitch knob; the distance adjusting knob is arranged on one side of the box body, and the two driving assemblies are connected with the distance adjusting knob.
9. The variable pitch wafer transfer device of claim 8, wherein the drive assembly comprises a linkage, a slide bar, a connecting shaft, and a chain bar;
the two ends of the connecting rod are respectively connected with the distance adjusting knob and the sliding rod, and the extending direction of the sliding rod is the same as the first direction; the connecting shaft is arranged on the sliding rod along the first direction, one end of the chain rod is rotatably connected with the connecting shaft, and the other end of the chain rod is connected with the first material carrying side plate or the second material carrying side plate;
under the action of the distance adjusting knob, the connecting rod can drive the sliding rod to move along the second direction, and the sliding rod drives the distance between two adjacent chain rods to be increased or smaller through the connecting shaft so as to change the distance between two adjacent first material carrying side plates or two adjacent second material carrying side plates.
10. The wafer transfer device according to claim 6, wherein the inner wall surface of the box body is provided with a sliding rail along the first direction, and one side of the first loading side plate and/or the second loading side plate is provided with a second groove, and the second groove is matched with the sliding rail.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320184620.XU CN219497742U (en) | 2023-01-29 | 2023-01-29 | Wafer transfer device with variable distance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320184620.XU CN219497742U (en) | 2023-01-29 | 2023-01-29 | Wafer transfer device with variable distance |
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| Publication Number | Publication Date |
|---|---|
| CN219497742U true CN219497742U (en) | 2023-08-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320184620.XU Active CN219497742U (en) | 2023-01-29 | 2023-01-29 | Wafer transfer device with variable distance |
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| CN (1) | CN219497742U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117276162A (en) * | 2023-11-22 | 2023-12-22 | 深圳市恒运昌真空技术有限公司 | Plasma processing equipment |
-
2023
- 2023-01-29 CN CN202320184620.XU patent/CN219497742U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117276162A (en) * | 2023-11-22 | 2023-12-22 | 深圳市恒运昌真空技术有限公司 | Plasma processing equipment |
| CN117276162B (en) * | 2023-11-22 | 2024-03-22 | 深圳市恒运昌真空技术股份有限公司 | Plasma processing equipment |
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