CN219497336U

CN219497336U - Storage module for VNX equipment

Info

Publication number: CN219497336U
Application number: CN202320143522.1U
Authority: CN
Inventors: 祖安; 叶操; 冯永生; 谢英; 唐彦夫; 陈丛笑; 袁媛
Original assignee: Beijing Navistar Cloud Technology Co ltd
Current assignee: Beijing Navistar Cloud Technology Co ltd
Priority date: 2023-02-07
Filing date: 2023-02-07
Publication date: 2023-08-08
Anticipated expiration: 2033-02-07

Abstract

The utility model relates to the technical field of storage equipment, in particular to a storage module for VNX equipment, which comprises a module top cover, a module bottom cover, a module front cover, a solid-state disk gland, a module handle, a module main board and a solid-state disk, wherein the module top cover is arranged on the module top cover; the module top cover is arranged on the module bottom cover, and the module front cover is arranged between the module top cover and the module bottom cover; the solid-state disk is arranged on the module main board and is positioned in a space surrounded by the module top cover, the module bottom cover and the module front cover; the solid-state disc gland is arranged on the module top cover and is abutted with the solid-state disc; and the solid-state disk is an M.2 solid-state disk. The M.2 solid-state disk is detachably mounted, and when data is read or processed, the storage module is inserted into the VNX equipment body for operation, the M.2 card solid-state disk on the storage module can be removed and inserted into any one computer equipment with an M.2 interface for operation, so that the applicability is high.

Description

Storage module for VNX equipment

Technical Field

The utility model relates to the technical field of storage equipment, in particular to a storage module for VNX equipment.

Background

VNX is a new type of device based on the VITA74.0 specification, and is also a compact, rugged computer device with a small volume. The standard specification constrains the size of the module to be only 89mm by 78mm, eliminating the space that the connector and structural members must occupy, leaving the PCB panel layout with an effective size of only 84mm by 60 mm. Currently, solid state disk forms commonly found in the computer field are U.2, XMC, m.2, etc., wherein U.2, XMC solid state disks are bulky and cannot be used as storage carriers for VNX devices at all.

Disclosure of Invention

The utility model provides a storage module for VNX equipment, which solves the technical problem that the traditional VNX equipment in the prior art is inconvenient to install a solid-state disk.

In order to achieve the above purpose, the technical scheme of the utility model is realized as follows:

the utility model provides a storage module for VNX equipment, which comprises a module top cover, a module bottom cover, a module front cover, a solid-state disk gland, a module handle, a module main board and a solid-state disk, wherein the module top cover is arranged on the module front cover;

the module top cover is arranged on the module bottom cover, and the module front cover is arranged between the module top cover and the module bottom cover; the solid-state disk is arranged on the module main board and is positioned in a space enclosed by the module top cover, the module bottom cover and the module front cover; the solid-state disc gland is arranged on the module top cover and is abutted with the solid-state disc.

Further, a first through hole is formed in the middle of the module front cover, and the module handle is slidably connected in the first through hole.

Further, a plurality of supporting bosses are arranged on the inner wall of the module bottom cover, a plurality of pressing bosses are arranged on the inner wall of the solid-state disc gland, and the supporting bosses and the pressing bosses are equal in number and correspond to each other in position; the solid-state disc is abutted between the supporting bosses and the pressing bosses.

Further, the number of the supporting bosses and the number of the pressing bosses are two, and the two supporting bosses and the pressing bosses are semicircular.

Further, the wall thickness of the left side and the right side of the module top cover and the module bottom cover is 1-2 mm.

Further, the wall thickness of the left side and the right side of the module top cover and the module bottom cover is 1.2mm.

Further, the solid-state disk is an M.2 solid-state disk.

Further, the number of the M.2 solid-state discs is two, the two M.2 solid-state discs are all installed on the module main board, and the two M.2 solid-state discs are all located in the space surrounded by the module top cover, the module bottom cover and the module front cover.

Further, the memory module further includes an m.2 connector mounted on the module motherboard and electrically connected to the m.2 solid state disk.

Further, the module top cover, the module bottom cover, the module front cover and the solid-state disk gland are connected in a detachable installation mode.

The utility model has the beneficial effects that:

1. the storage module in the utility model supports the replacement and upgrading of the storage space;

because the storage space of the storage module in the VNX equipment is in the form of an externally inserted standard M.2 solid-state disk, the storage module in the utility model only needs to take down the standard M.2 solid-state disk for replacement or upgrade of the storage space, and the operation is simple, convenient and practical.

2. The data of the storage module is more convenient to read and control;

because the storage space of the storage module in the VNX device is in the form of an externally inserted M.2 solid-state disk with standard specification, when data reading or control is needed, the storage module can be operated on a VNX device body, the M.2 solid-state disk in the storage module can be taken down and installed on any computer device with an M.2 interface for operation, and the data reading is more convenient.

Drawings

FIG. 1 is a schematic view of the rear side of the present utility model;

FIG. 2 is a schematic three-dimensional structure of the present utility model;

FIG. 3 is a schematic view of the internal structure of the present utility model;

FIG. 4 is a schematic view of a three-dimensional structure of a module bottom cover;

FIG. 5 is a schematic three-dimensional structure of a solid state disk gland;

fig. 6 is a schematic three-dimensional structure of a module motherboard.

Reference numerals illustrate:

1. a module top cover; 2. a module bottom cover; 21. a support boss; 3. a module front cover; 4. a solid state disk gland; 41. compressing the boss; 5. a module handle; 6. a module motherboard; 61. and a second through hole.

Detailed Description

The utility model will be described in further detail with reference to the accompanying drawings and specific examples. In the description of the present utility model, the relative orientation or positional relationship is based on the orientation or positional relationship shown in fig. 1, where "up" and "down" refer to the up-down direction of fig. 1, and take fig. 1 as an example, the vertical paper surface is up, the vertical paper surface is down, the vertical paper surface is left, the vertical paper surface is right, the vertical paper surface is inward and front, the vertical paper surface is outward and rear, the left-right direction is transverse, and the up-down direction is vertical. It is to be understood that such directional terms are merely used to facilitate the description of the utility model and to simplify the description, and are not intended to indicate or imply that the devices or elements so referred to must have a particular orientation, be constructed and operate in a particular orientation, and thus are not to be construed as limiting the utility model.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art in a specific case.

Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implying that the number or order of features is indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

Referring to fig. 1, 2, 3 and 6, a storage module for VNX devices includes a module top cover 1, a module bottom cover 2, a module front cover 3, a solid state disk cover 4, a module handle 5, a module main board 6 and a solid state disk;

the module top cover 1 is mounted on the module bottom cover 2, and the module front cover 3 is mounted between the module top cover 1 and the module bottom cover 2; the solid-state disk is arranged on the module main board 6 and is positioned in a space enclosed by the module top cover 1, the module bottom cover 2 and the module front cover 3; the solid-state disc gland 4 is arranged on the module top cover 1, and the solid-state disc gland 4 is abutted with the solid-state disc; the module main board 6 is installed in the space enclosed by the module top cover 1, the module bottom cover 2 and the module front cover 3, and the module main board 6 is electrically connected with the solid-state disk.

In this embodiment, a first through hole is formed in the middle of the module front cover 3, and the module handle 5 is slidably connected in the first through hole.

Referring to fig. 4 and 5, in the present embodiment, a plurality of supporting bosses 21 are provided on the inner wall of the module bottom cover 2, a plurality of pressing bosses 41 are provided on the inner wall of the solid-state disk pressing cover 4, and the number of the supporting bosses 21 and the number of the pressing bosses 41 are equal and the positions thereof correspond to each other; the solid-state disk is abutted between the supporting bosses 21 and the compacting bosses 41, and the module main board 6 is provided with a second through hole 61, and the position of the second through hole 61 corresponds to the supporting bosses 21 and the compacting bosses 41, so that the supporting bosses 21 can compact the solid-state disk through the second through hole 61.

In this embodiment, the number of the supporting bosses 21 and the pressing bosses 41 is two, and both the shapes are semicircular.

In this embodiment, the wall thickness of the left and right sides of the module top cover 1 and the module bottom cover 2 is 1-2 mm. Preferably, the wall thickness of the left side and the right side of the module top cover 1 and the module bottom cover 2 is 1.2mm; secondly, gaps between two sides of the module main board 6 and the module top cover 1 and the module bottom cover 2 are respectively adjusted to 0.3mm by the traditional 0.5mm, so that the available size of the module main board 6 of the storage module is increased by 2mm in width on the premise of not changing the overall size and the universality of the storage module, and the accommodating space of the module top cover 1 and the module bottom cover 2 is increased.

In this embodiment, the solid state disk is an m.2 solid state disk.

In this embodiment, the number of the m.2 solid-state discs is two, and the two m.2 solid-state discs are both installed on the module motherboard 6, and the two m.2 solid-state discs are both located in a space enclosed by the module top cover 1, the module bottom cover 2, and the module front cover 3; because the storage space of the storage module in the VNX device is in the form of an externally inserted M.2 solid-state disk with standard specification, when data reading or control is needed, the storage module can be operated on a VNX device body, the M.2 solid-state disk in the storage module can be taken down and installed on any computer device with an M.2 interface for operation, and the data reading is more convenient.

In this embodiment, the memory module further includes an m.2 connector, and the m.2 connector is mounted on the module motherboard 6 and electrically connected to the m.2 solid state disk.

In this embodiment, the module top cover 1, the module bottom cover 2, the module front cover 3 and the solid-state disk cover 4 are detachably connected with each other.

The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Moreover, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the embodiments, and when the technical solutions are contradictory or cannot be implemented, it should be considered that the combination of the technical solutions does not exist, and is not within the scope of protection claimed by the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.

Claims

1. A memory module for a VNX device, comprising: the device comprises a module top cover (1), a module bottom cover (2), a module front cover (3), a solid-state disk gland (4), a module handle (5), a module main board (6) and a solid-state disk;

the module top cover (1) is arranged on the module bottom cover (2), and the module front cover (3) is arranged between the module top cover (1) and the module bottom cover (2); the solid-state disk is arranged on the module main board (6) and is positioned in a space enclosed by the module top cover (1), the module bottom cover (2) and the module front cover (3); the solid-state disc gland (4) is arranged on the module top cover (1), and the solid-state disc gland (4) is abutted with the solid-state disc.

2. The storage module according to claim 1, characterized in that a first through hole is provided in the middle of the module front cover (3), in which first through hole the module handle (5) is slidingly connected.

3. The storage module according to claim 1, wherein a plurality of supporting bosses (21) are provided on the inner wall of the module bottom cover (2), a plurality of pressing bosses (41) are provided on the inner wall of the solid-state disk pressing cover (4), and the number of the supporting bosses (21) and the number of the pressing bosses (41) are equal and correspond to each other in position; the solid state disk is abutted between a plurality of the supporting bosses (21) and a plurality of the pressing bosses (41).

4. A storage module according to claim 3, characterized in that the number of support bosses (21) and compression bosses (41) is two and both are semi-circular in shape.

5. The storage module according to claim 1, wherein the wall thickness of the left and right sides of the module top cover (1) and the module bottom cover (2) is 1-2 mm.

6. The storage module according to claim 5, wherein the wall thickness of the left and right sides of the module top cover (1) and the module bottom cover (2) is 1.2mm.

7. The memory module of claim 1, wherein the solid state disk is an m.2 solid state disk.

8. The storage module according to claim 7, wherein the number of the m.2 solid-state discs is two, and the m.2 solid-state discs are both mounted on the module main board (6), and the two m.2 solid-state discs are both located in a space enclosed by the module top cover (1), the module bottom cover (2) and the module front cover (3).

9. The memory module of claim 7, further comprising an m.2 connector mounted on the module motherboard (6) and electrically connected to the m.2 solid state disk.

10. The storage module according to any one of claims 1 to 9, characterized in that the module top cover (1), the module bottom cover (2), the module front cover (3) and the solid state disk cover (4) are detachably connected.