CN219494222U - Semiconductor heating body - Google Patents
Semiconductor heating body Download PDFInfo
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- CN219494222U CN219494222U CN202223066508.0U CN202223066508U CN219494222U CN 219494222 U CN219494222 U CN 219494222U CN 202223066508 U CN202223066508 U CN 202223066508U CN 219494222 U CN219494222 U CN 219494222U
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- heating
- heating box
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- water pipe
- box
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
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- Instantaneous Water Boilers, Portable Hot-Water Supply Apparatuses, And Control Of Portable Hot-Water Supply Apparatuses (AREA)
Abstract
The utility model relates to the technical field of semiconductors and discloses a semiconductor heating body, which comprises a heating box, wherein a heating mechanism is fixedly arranged in the heating box, and a heat dissipation mechanism is fixedly arranged on the front surface of the heating box; the heating mechanism comprises a heating part and a dismounting part, the heating part comprises a heating device, the bottom surface of the heating device is fixedly connected with the bottom surface inside the heating box, the left end surface of the heating device is fixedly provided with a connector, the left side surface of the heating device is fixedly provided with a through hole, and the inside of the connector is in through connection with the inside of the through hole of the heating device; the heat dissipation mechanism includes a heat dissipation portion and a dust prevention portion. This semiconductor heating body cooperates through being provided with semiconductor heating strip and heating device for rivers are when flowing into domestic device through the water pipe, heat through heating device and semiconductor heating strip, and rate piece, it is efficient, the intensification satisfies artificial demand rapidly, and safe and convenient can not appear unexpected, and is cold-proof effectual.
Description
Technical Field
The utility model relates to the technical field of semiconductors, in particular to a semiconductor heating body.
Background
In the north, the heating modes commonly used in winter are the following modes, namely central heating, wherein the central heating is a heating group which transmits municipal heating to a user's home through a pipeline, and the central heating is a clean and guaranteed heating mode, has relatively high safety performance and is large in overall energy consumption. The floor radiates the heating, this mode can be by the various different modes such as family-splitting gas heating stove, municipal heating power pipe network, district boiler room, etc. provide the heat source. The heating mode has uniform temperature and is energy-saving, but the requirement on the pipe is high, and the furniture can be deformed due to long time. The Chinese patent discloses a high-power semiconductor heating body, and publication number is CN211011886U, including stainless steel casing installs in base upper portion, and installs the outlet pipe on the upper portion lateral wall of stainless steel casing, is equipped with the inlet tube on the lateral wall of base, is equipped with evenly distributed's baffle in stainless steel casing inner chamber, installs the semiconductor heating strip respectively between the baffle, the front of stainless steel casing is equipped with multiunit terminal row, is equipped with the electrode line on every semiconductor heating strip, and the electrode line is connected to the terminal row respectively. But still suffer from the following drawbacks: this high-power semiconductor heating member carries out rapid heating through the water hole that passes to be equipped with above the baffle through getting into stainless steel casing with cold water from the inlet tube in, but it can't often change semiconductor heat conduction strip, leads to the heating effect to worsen for a long time. So that a semiconductor heating body is designed.
Disclosure of Invention
The present utility model is directed to a semiconductor heating body to solve the above-mentioned problems of the related art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the semiconductor heating body comprises a heating box, a heating mechanism is fixedly arranged in the heating box, and a heat dissipation mechanism is fixedly arranged on the front surface of the heating box;
the heating mechanism comprises a heating part and a dismounting part, the heating part comprises a heating device, the bottom surface of the heating device is fixedly connected with the bottom surface inside the heating box, the left end surface of the heating device is fixedly provided with a connector, the left side surface of the heating device is fixedly provided with a through hole, and the inside of the connector is in through connection with the inside of the through hole of the heating device;
the heat dissipation mechanism comprises a heat dissipation part and a dust prevention part, the heat dissipation part comprises a heat dissipation machine, the back of the heat dissipation machine penetrates through the front of the heating box and extends to the inside of the heating box, and the surface of the heat dissipation machine is fixedly connected with the inner wall of the heating box.
Preferably, the left side face of the heating box is provided with a water pipe, the right end face of the water pipe sequentially penetrates through the left side face of the heating box and the left side face of the heating device to extend to the right side of the heating box, the surface of the water pipe is fixedly connected with the inner wall of the heating box and the inner wall of the heating device respectively, the surface of the water pipe is in threaded connection with the inner wall of the connector, and tap water can be introduced into domestic water by the water pipe.
Preferably, the upper part of the left end of the water pipe is provided with a rotating rod, the bottom end surface of the rotating rod penetrates through the top surface of the water pipe and extends into the water pipe, the bottom end surface of the rotating rod is fixedly provided with a control valve plate, the surface of the control valve plate is in sealed rotating connection with the inner wall of the water pipe, and the top end surface of the rotating rod is fixedly provided with a rotating handle, so that the control valve plate can control the output of water flow.
Preferably, the upper surface is fixed respectively and has been seted up two draw-in grooves around the heating device, and two semiconductor heating strips have been placed respectively to two draw-in groove inside bottom surfaces, two semiconductor heating strip surfaces respectively with two draw-in groove inner wall sealing contact, two semiconductor heating strip top face is all fixed to be provided with the connecting plate, two the equal fixed handle that is provided with of connecting plate top face, two the equal fixed cover of connecting plate bottom face is equipped with heat preservation cotton, two heat preservation cotton surfaces respectively with two draw-in groove inner wall sealing contact, the semiconductor heating member can make the faster heating of rivers.
Preferably, the heating box top is controlled the side back and is fixedly provided with two articulated bars respectively, the heating box top is provided with the apron, apron bottom surface and heating box bottom surface sealing contact, apron bottom back and heating box top back are articulated by the articulated bar, and the apron makes things convenient for the staff to open the inside maintenance of heating box.
Preferably, the front surface of the radiator is fixedly provided with an air inlet pipe, the inside of the air inlet pipe is in through connection with the outside of the heating box, the back surface of the radiator is fixedly provided with an air conveying pipe, the inside of the air conveying pipe is in through connection with the inside of the heating box, and the radiator dissipates heat inside the heating box.
Preferably, the back of the heating box is fixedly provided with a radiating hole, the inside of the radiating hole is in through connection with the inside of the heating box, and a filter screen is fixedly arranged in the radiating hole and used for preventing external dust from entering the inside of the heating box.
Compared with the prior art, the utility model has the beneficial effects that: the semiconductor heating body is provided with the semiconductor heating strip and the heating device to work in a matched mode, so that when water flows into the household device through the water pipe, the water flows are heated through the heating device and the semiconductor heating strip, the speed block is high in efficiency, the temperature rise is rapid, the artificial requirement is met, safety and convenience are achieved, accidents do not occur, and the heat preservation effect is good; the semiconductor heating strip is convenient to take and replace by being provided with the handle and the connecting plate to work in a matched mode, and is convenient and quick to install inside the heating device, simple and convenient to operate, high in heating efficiency and long in service life; the radiator and the radiating holes are matched to work, so that when the internal temperature of the heating box is too high and the water heating function is not needed at the moment, accidents caused by the fact that the internal temperature of the heating box is too high are prevented, and the internal pressure of the heating box can be relieved in time; through being provided with control valve plate and changeing the cooperation for personnel can control the heating and the play water of the inside water of water pipe, control is convenient, simple swift.
Drawings
FIG. 1 is a schematic perspective cross-sectional view of a front structure of the present utility model;
FIG. 2 is a schematic perspective view of the front structure of the present utility model;
FIG. 3 is a schematic perspective cross-sectional view of the right-side view structure of the present utility model;
fig. 4 is an enlarged schematic perspective view of the structure of the semiconductor heating strip according to the present utility model.
In the figure: 1 heating box, 2 heating mechanism, 21 heating part, 22 detaching part, 201 heating device, 202 water pipe, 203 control valve plate, 204 rotating rod, 205 rotating handle, 206 cover plate, 207 connector, 208 hinging rod, 209 semiconductor heating strip, 210 connecting plate, 211 heat preservation cotton, 212 handle, 3 heat dissipation mechanism, 31 heat dissipation part, 32 dustproof part, 301 heat dissipation machine, 302 air inlet pipe, 303 air delivery pipe, 304 heat dissipation hole, 305 filter screen.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model provides a technical solution: the semiconductor heating body comprises a heating box 1, two hinging rods 208 are fixedly arranged on the back of the left side and the right side of the top end of the heating box 1 respectively, a cover plate 206 is arranged above the heating box 1, the bottom surface of the cover plate 206 is in sealing contact with the bottom surface of the heating box 1, the back of the bottom end of the cover plate 206 and the back of the top end of the heating box 1 are hinged by the hinging rods 208, a water through pipe 202 is arranged on the left side surface of the heating box 1, the right end surface of the water through pipe 202 sequentially penetrates through the left side surface of the heating box 1 and the left side surface of a heating device 201 to extend to the right side of the heating box 1, the surface of the water through pipe 202 is fixedly connected with the inner wall of the heating box 1 and the inner wall of the heating device 201 respectively, the surface of the water through pipe 202 is in threaded connection with the inner wall of a connector 207, a rotating rod 204 is arranged above the left end of the water through pipe 202, the bottom end surface of the rotating rod 204 penetrates through the top surface of the water through pipe 202 to extend into the water through pipe 202, a control valve plate 203 is fixedly arranged on the bottom end surface of the rotating rod 204, and the control valve plate 203 is matched with a rotating handle 205 is arranged, so that personnel can control the heating and water in the water inside the water through pipe 202 can be controlled conveniently, simply and quickly; the surface of the control valve plate 203 is in sealed rotary connection with the inner wall of the water pipe 202, a rotary handle 205 is fixedly arranged on the top end surface of the rotary rod 204, two clamping grooves are respectively fixedly formed in the upper surfaces of the front end and the rear end of the heating device 201, two semiconductor heating strips 209 are respectively arranged on the inner bottom surfaces of the two clamping grooves, and the semiconductor heating strips 209 and the heating device 201 are matched for working, so that when water flows into a household device through the water pipe 202, the water flows into the household device through the heating device 201 and the semiconductor heating strips 209 for heating, the speed block is high, the efficiency is high, the temperature rise rapidly meets the human demand, the safety and convenience are realized, accidents do not occur, and the heat preservation effect is good; the surfaces of the two semiconductor heating strips 209 are respectively in sealing contact with the inner walls of the two clamping grooves, the top end surfaces of the two semiconductor heating strips 209 are fixedly provided with connecting plates 210, the top end surfaces of the two connecting plates 210 are fixedly provided with handles 212, and the handles 212 and the connecting plates 210 are matched for working, so that the semiconductor heating strips 209 are convenient to take and replace, and are convenient and quick to install inside the heating device 201, the operation is simple and convenient, the heating efficiency is high, and the service life is long; the bottom end surfaces of the two connecting plates 210 are fixedly sleeved with heat-insulating cotton 211, the surfaces of the two heat-insulating cotton 211 are respectively in sealing contact with the inner walls of the two clamping grooves, a heating mechanism 2 is fixedly arranged in the heating box 1, and a heat dissipation mechanism 3 is fixedly arranged on the front surface of the heating box 1; the heating mechanism 2 comprises a heating part 21 and a dismounting part 22, the heating part 21 comprises a heating device 201, the bottom surface of the heating device 201 is fixedly connected with the inner bottom surface of the heating box 1, a connector 207 is fixedly arranged on the left end surface of the heating device 201, a through hole is fixedly formed in the left side surface of the heating device 201, and the inside of the connector 207 is in through connection with the inside of the through hole of the heating device 201; the heat dissipation mechanism 3 comprises a heat dissipation part 31 and a dust prevention part 32, the heat dissipation part 31 comprises a heat dissipation machine 301, an air inlet pipe 302 is fixedly arranged on the front surface of the heat dissipation machine 301, the inside of the air inlet pipe 302 is in through connection with the outside of the heating box 1, an air conveying pipe 303 is fixedly arranged on the back surface of the heat dissipation machine 301, the inside of the air conveying pipe 303 is in through connection with the inside of the heating box 1, a heat dissipation hole 304 is fixedly formed in the back surface of the heating box 1, and the heat dissipation machine 301 and the heat dissipation hole 304 are matched for working, so that when the internal temperature of the heating box 1 is too high and a water heating function is not needed at the moment, accidents caused by the too high internal temperature of the heating box 1 are prevented, and the internal pressure of the heating box 1 can be relieved in time; the inside of the heat dissipation hole 304 is in through connection with the inside of the heating box 1, a filter screen 305 is fixedly arranged in the heat dissipation hole 304, the back surface of the heat dissipation machine 301 penetrates through the front surface of the heating box 1 and extends into the inside of the heating box 1, and the surface of the heat dissipation machine 301 is fixedly connected with the inner wall of the heating box 1.
When the semiconductor heating device is used, firstly, the cover plate 206 is rotated and opened along the hinging rod 208, two semiconductor heating strips 209 which are packaged in a brand-new mode are inserted into the clamping groove above the heating device 201, after clamping, the temperature loss inside the semiconductor heating strips 209 is prevented through the heat preservation cotton 211, the cover plate 206 is closed, the rotating handle 205 is rotated, the rotating rod 204 starts to rotate, water flows from one end of the water pipe 202, the water flows through the heating device 201 for rapid heating, other household appliances are flown into for use, and when the semiconductor heating strips 209 need to be replaced, only the cover plate 206 is required to be opened, the handle 212 is needed to be taken, and the new semiconductor heating strips 209 need to be replaced.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. Semiconductor heating member, including heating box (1), its characterized in that: a heating mechanism (2) is fixedly arranged in the heating box (1), and a heat dissipation mechanism (3) is fixedly arranged on the front surface of the heating box (1);
the heating mechanism (2) comprises a heating part (21) and a dismounting part (22), the heating part (21) comprises a heating device (201), the bottom surface of the heating device (201) is fixedly connected with the inner bottom surface of the heating box (1), a connector (207) is fixedly arranged on the left end surface of the heating device (201), a through hole is fixedly formed in the left side surface of the heating device (201), and the inside of the connector (207) is in through connection with the inside of the through hole of the heating device (201);
the heat dissipation mechanism (3) comprises a heat dissipation part (31) and a dust prevention part (32), the heat dissipation part (31) comprises a heat dissipation machine (301), the back of the heat dissipation machine (301) penetrates through the front of the heating box (1) to extend into the heating box (1), and the surface of the heat dissipation machine (301) is fixedly connected with the inner wall of the heating box (1).
2. A semiconductor heating body according to claim 1, characterized in that: the heating box (1) left surface is provided with water pipe (202), water pipe (202) right-hand member face runs through heating box (1) left surface and heating device (201) left surface in proper order and extends to heating box (1) right side, water pipe (202) surface respectively with heating box (1) inner wall and heating device (201) inner wall fixed connection, water pipe (202) surface and connector (207) inner wall threaded connection.
3. A semiconductor heating body according to claim 2, characterized in that: the utility model discloses a water pipe, including water pipe (202) and handle, water pipe (202) are connected, water pipe (202) left end top is provided with dwang (204), dwang (204) bottom surface runs through water pipe (202) top surface and extends to inside water pipe (202), dwang (204) bottom surface is fixed to be provided with control valve plate (203), control valve plate (203) surface and water pipe (202) inner wall seal rotate to be connected, dwang (204) top surface is fixed to be provided with twist grip (205).
4. A semiconductor heating body according to claim 1, characterized in that: two draw-in grooves have been fixedly seted up respectively to heating device (201) front and back end upper surface, and two semiconductor heating strips (209) have been placed respectively to two draw-in groove inside bottom surfaces, two semiconductor heating strip (209) surface respectively with two draw-in groove inner wall sealing contact, two semiconductor heating strip (209) terminal surface is all fixed be provided with connecting plate (210), two connecting plate (210) terminal surface is all fixed be provided with handle (212), two connecting plate (210) terminal surface is all fixed the cover and is equipped with heat preservation cotton (211), two heat preservation cotton (211) surface respectively with two draw-in groove inner wall sealing contact.
5. A semiconductor heating body according to claim 1, characterized in that: the heating box (1) top is controlled the side back and is fixedly provided with two articulated bars (208) respectively, heating box (1) top is provided with apron (206), apron (206) bottom surface and heating box (1) bottom surface sealing contact, apron (206) bottom back and heating box (1) top back are articulated by articulated bar (208).
6. A semiconductor heating body according to claim 1, characterized in that: the front of the heat radiator (301) is fixedly provided with an air inlet pipe (302), the inside of the air inlet pipe (302) is in through connection with the outside of the heating box (1), the back of the heat radiator (301) is fixedly provided with an air conveying pipe (303), and the inside of the air conveying pipe (303) is in through connection with the inside of the heating box (1).
7. A semiconductor heating body according to claim 1, characterized in that: the back of the heating box (1) is fixedly provided with a radiating hole (304), the inside of the radiating hole (304) is in through connection with the inside of the heating box (1), and a filter screen (305) is fixedly arranged in the radiating hole (304).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066508.0U CN219494222U (en) | 2022-11-18 | 2022-11-18 | Semiconductor heating body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223066508.0U CN219494222U (en) | 2022-11-18 | 2022-11-18 | Semiconductor heating body |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219494222U true CN219494222U (en) | 2023-08-08 |
Family
ID=87506418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223066508.0U Active CN219494222U (en) | 2022-11-18 | 2022-11-18 | Semiconductor heating body |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219494222U (en) |
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2022
- 2022-11-18 CN CN202223066508.0U patent/CN219494222U/en active Active
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