CN219490160U - Chemical copper deposition device for circuit board production - Google Patents
Chemical copper deposition device for circuit board production Download PDFInfo
- Publication number
- CN219490160U CN219490160U CN202320970090.1U CN202320970090U CN219490160U CN 219490160 U CN219490160 U CN 219490160U CN 202320970090 U CN202320970090 U CN 202320970090U CN 219490160 U CN219490160 U CN 219490160U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- copper deposition
- threaded rod
- motor
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 66
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 66
- 239000010949 copper Substances 0.000 title claims abstract description 66
- 230000008021 deposition Effects 0.000 title claims abstract description 45
- 239000000126 substance Substances 0.000 title claims abstract description 25
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 18
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 18
- 241001330002 Bambuseae Species 0.000 claims description 18
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 18
- 239000011425 bamboo Substances 0.000 claims description 18
- 230000002457 bidirectional effect Effects 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 12
- 238000001556 precipitation Methods 0.000 description 7
- 238000007747 plating Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Chemically Coating (AREA)
Abstract
The utility model discloses a chemical copper deposition device for circuit board production, which relates to the technical field of chemical copper deposition, and aims to solve the technical problem that the automatic material taking and copper deposition treatment on a circuit board is inconvenient in the prior art; the chemical copper deposition device comprises a copper deposition tank; the copper deposition pool comprises a copper deposition pool, a bottom plate, a rotating motor, a supporting plate, a lifting assembly, a top plate, a clamping assembly, clamping plates and two groups of clamping plates, wherein the bottom plate is fixedly arranged on the outer side of the copper deposition pool; this chemistry copper deposit device is used in circuit board production drives two sets of splint subtend through clamping assembly and removes, gets material through two sets of splint to the circuit board in the circuit board tray and handles, drives the roof through lifting assembly and moves down, realizes being convenient for carry out automatic material to the circuit board and deposit copper and handle.
Description
Technical Field
The utility model belongs to the technical field of electroless copper plating, and particularly relates to an electroless copper plating device for circuit board production.
Background
Nowadays, the application of electroless copper plating technology is common in the production and processing process of circuit boards, and in the production and processing process of circuit boards, copper plating treatment is required to be carried out on the circuit boards, and in order to facilitate copper plating on the circuit boards, an electroless copper plating device is usually used for assistance.
At present, the utility model patent with the patent number of CN20222183606. X discloses a chemical copper deposition device for circuit board production, the utility model adopts a timer and an electric telescopic rod, in the actual use process, when a person carries out copper deposition operation on the circuit board, the timer can be started to count down, when the reading of the timer reaches a preset range, the electric telescopic rod is triggered to extend out to lift the whole connecting plate, the fixed plate and the circuit board in the fixed plate are separated from copper deposition liquid, the subsequent use is prevented from being excessively influenced by copper deposition, frequent monitoring on a plurality of groups of equipment is not needed, the labor intensity of the person is reduced, the operation efficiency is improved, and the device has the advantage of timing lifting; the chemical copper deposition device is characterized in that the chemical copper deposition device is used for avoiding excessive influence on subsequent use, but in the use process, the chemical copper deposition device is used for manually carrying out material taking and copper deposition treatment on the circuit board, so that the automatic material taking and copper deposition treatment on the circuit board is inconvenient.
Disclosure of Invention
(1) Technical problem to be solved
Aiming at the defects of the prior art, the utility model aims to provide a chemical copper deposition device for circuit board production, which aims to solve the technical problem that the circuit board is inconvenient to automatically take materials and deposit copper in the prior art.
(2) Technical proposal
In order to solve the technical problems, the utility model provides a chemical copper deposition device for producing a circuit board, which comprises a copper deposition tank; the copper deposition tank comprises a bottom plate, wherein a rotating motor is arranged at the upper end of the bottom plate, a supporting plate is arranged at the output end of the rotating motor, a lifting assembly is arranged at the upper end of the supporting plate, a top plate is arranged at the upper end of the lifting assembly, a mounting plate is fixedly arranged at one end of the top plate, a clamping assembly is arranged at the inner side of the mounting plate, clamping plates are arranged at the bottom end of the mounting plate, two groups of clamping plates are arranged, and a circuit board tray is arranged at the upper end of the bottom plate.
When using the chemical copper precipitation device for circuit board production of this technical scheme, drive two sets of splint subtend through the clamping component and remove, get material the processing through the circuit board in two sets of splint to the circuit board tray, start rotating electrical machines and drive the circuit board and rotate to the top in heavy copper pond, drive the roof through lifting unit and remove downwards, the roof passes through the mounting panel and drives the circuit board and fall into heavy copper pond inside and carry out heavy copper processing, realize being convenient for carry out automatic material heavy copper processing to the circuit board.
Further, the inside of lifting assembly is including first motor, first motor set up in the upper end of roof, the output of first motor is provided with one-way threaded rod, one-way threaded rod with the roof rotates to be connected, starts first motor drive one-way threaded rod and rotates, carries out drive processing to one-way threaded rod.
Further, the inside of lifting unit is including a screw thread section of thick bamboo, a screw thread section of thick bamboo set up in the outside of one-way threaded rod, the bottom of a screw thread section of thick bamboo with the upper end interconnect of layer board, a screw thread section of thick bamboo with one-way threaded rod lead screw is connected, drives the roof and moves downwards through the lead screw connection of one-way threaded rod and screw thread section of thick bamboo.
Further, the inside of lifting assembly is including the gag lever post, the gag lever post set up in the bottom of roof, the upper end of layer board is provided with a spacing section of thick bamboo, the gag lever post with a spacing section of thick bamboo sliding connection moves spacing processing through the sliding connection of gag lever post and a spacing section of thick bamboo to the roof.
Further, the inside of clamping assembly is including the second motor, the second motor set up in the outside of mounting panel, the output of second motor is provided with two-way threaded rod, two-way threaded rod with the mounting panel rotates to be connected, starts the second motor and drives two-way threaded rod and rotate, carries out drive processing to two-way threaded rod.
Further, the inside of clamping assembly is including the screwed ring, the screwed ring set up in the outside of two-way threaded rod, the screwed ring is provided with two sets of, the screwed ring with two-way threaded rod lead screw is connected, drives two sets of splint opposite direction removal through the lead screw connection of two-way threaded rod and screwed ring.
Further, the inside of clamping assembly is including the spout, the spout set up in the bottom of mounting panel, the bottom of screwed ring is provided with the slider, the bottom of slider with splint interconnect, the slider with spout sliding connection removes spacing processing to splint through the sliding connection of spout and slider.
(3) Advantageous effects
Compared with the prior art, the utility model has the beneficial effects that:
1. the chemical copper deposition device for producing the circuit board provided by the utility model has the advantages that the second motor is started to drive the bidirectional threaded rod to rotate, the two groups of clamping plates are driven to move oppositely through the connection of the bidirectional threaded rod and the screw rod of the threaded ring, the clamping plates are subjected to movement limiting treatment through the sliding connection of the sliding grooves and the sliding blocks, the circuit boards in the circuit board tray are subjected to material taking treatment through the two groups of clamping plates, and the automatic material taking treatment on the circuit boards is realized conveniently;
2. according to the chemical copper precipitation device for circuit board production, the circuit board is driven to rotate to the upper side of the copper precipitation tank by the starting rotary motor, the first motor is started to drive the unidirectional threaded rod to rotate, the top plate is driven to move downwards by the connection of the unidirectional threaded rod and the screw rod of the threaded cylinder, the top plate is subjected to movement limiting treatment by the sliding connection of the limiting rod and the limiting cylinder, and the top plate drives the circuit board to fall into the copper precipitation tank through the mounting plate to perform copper precipitation treatment, so that automatic copper precipitation treatment on the circuit board is facilitated.
Drawings
FIG. 1 is a schematic view of a three-dimensional structure of an embodiment of the present utility model;
FIG. 2 is a schematic view of an expanded structure of an embodiment of the present utility model;
fig. 3 is a schematic view of a cross-section of an embodiment of the present utility model.
The marks in the drawings are: 1. a copper precipitation pool; 2. a bottom plate; 3. a rotating electric machine; 4. a supporting plate; 5. a lifting assembly; 6. a top plate; 7. a mounting plate; 8. a clamping assembly; 9. a clamping plate; 10. a circuit board tray; 11. a first motor; 12. a one-way threaded rod; 13. a thread cylinder; 14. a limit rod; 15. a limiting cylinder; 16. a second motor; 17. a two-way threaded rod; 18. a threaded ring; 19. a chute; 20. a sliding block.
Detailed Description
The embodiment is a chemical copper deposition device for circuit board production, the schematic diagram of the three-dimensional structure is shown in figure 1, the schematic diagram of the unfolding structure is shown in figure 2, and the chemical copper deposition device comprises a copper deposition tank 1; the outside fixed mounting of heavy copper pond 1 has bottom plate 2, and the upper end of bottom plate 2 is provided with rotating electrical machines 3, and rotating electrical machines 3's output is provided with layer board 4, and layer board 4's upper end is provided with lifting unit 5, and lifting unit 5's upper end is provided with roof 6, and the one end fixed mounting of roof 6 has mounting panel 7, and mounting panel 7's inboard is provided with clamping unit 8, and mounting panel 7's bottom is provided with splint 9, and splint 9 are provided with two sets of, and bottom plate 2's upper end is provided with circuit board tray 10.
For the present embodiment, the shape structure of the copper deposition tank 1 is set according to practical application, for example, the copper deposition tank 1 may be a rectangular structure, an arc structure, a polygonal structure, etc.
Wherein, lifting unit 5's inside is including first motor 11, first motor 11 sets up in the upper end of roof 6, first motor 11's output is provided with one-way threaded rod 12, one-way threaded rod 12 rotates with roof 6 to be connected, start first motor 11 and drive one-way threaded rod 12 and rotate, drive the processing to one-way threaded rod 12, lifting unit 5's inside is including screw thread section of thick bamboo 13, screw thread section of thick bamboo 13 sets up in one-way threaded rod 12's outside, screw thread section of thick bamboo 13's bottom and the upper end interconnect of layer board 4, screw thread section of thick bamboo 13 is connected with one-way threaded rod 12 lead screw, drive roof 6 downwardly moving through the lead screw connection of one-way threaded rod 12 and screw thread section of thick bamboo 13.
This embodiment is a chemical copper deposition device for circuit board production, its section structure schematic diagram is as shown in fig. 3, the inside of lifting unit 5 is including gag lever post 14, gag lever post 14 sets up in the bottom of roof 6, the upper end of layer board 4 is provided with a spacing section of thick bamboo 15, gag lever post 14 and a spacing section of thick bamboo 15 sliding connection, carry out the removal spacing processing to roof 6 through the sliding connection of gag lever post 14 and spacing section of thick bamboo 15, the inside of clamping unit 8 is including second motor 16, second motor 16 sets up in the outside of mounting panel 7, the output of second motor 16 is provided with two-way threaded rod 17, two-way threaded rod 17 rotates with mounting panel 7 to be connected, start second motor 16 and drive two-way threaded rod 17 rotation, drive the processing to two-way threaded rod 17.
Simultaneously, the inside of clamping assembly 8 is including the screwed ring 18, the screwed ring 18 sets up in the outside of two-way threaded rod 17, the screwed ring 18 is provided with two sets of, screwed ring 18 and two-way threaded rod 17 lead screw connection, lead screw connection through two-way threaded rod 17 and screwed ring 18 drives two sets of splint 9 opposite directions and removes, the inside of clamping assembly 8 is including spout 19, spout 19 is seted up in the bottom of mounting panel 7, the bottom of screwed ring 18 is provided with slider 20, slider 20's bottom and splint 9 interconnect, slider 20 and spout 19 sliding connection, carry out the spacing processing that removes to splint 9 through spout 19 and slider 20's sliding connection.
When the chemical copper deposition device for circuit board production is used, the second motor 16 is started to drive the bidirectional threaded rod 17 to rotate, the two groups of clamping plates 9 are driven to move oppositely through the connection of the bidirectional threaded rod 17 and the screw rod of the threaded ring 18, the clamping plates 9 are subjected to movement limiting treatment through sliding connection of the sliding grooves 19 and the sliding blocks 20, the circuit boards in the circuit board tray 10 are subjected to material taking treatment through the two groups of clamping plates 9, the rotating motor 3 is started to drive the circuit boards to rotate to the upper part of the copper deposition tank 1, the first motor 11 is started to drive the unidirectional threaded rod 12 to rotate, the top plate 6 is driven to move downwards through the connection of the unidirectional threaded rod 12 and the screw rod of the threaded cylinder 13, the top plate 6 drives the circuit boards to fall into the copper deposition tank 1 through the installation plate 7 to perform copper deposition treatment, and automatic material taking copper deposition treatment on the circuit boards is realized.
Claims (7)
1. A chemical copper deposition device for circuit board production comprises a copper deposition tank (1); the copper deposition tank is characterized in that a bottom plate (2) is fixedly arranged on the outer side of the copper deposition tank (1), a rotating motor (3) is arranged at the upper end of the bottom plate (2), a supporting plate (4) is arranged at the output end of the rotating motor (3), a lifting assembly (5) is arranged at the upper end of the supporting plate (4), a top plate (6) is arranged at the upper end of the lifting assembly (5), a mounting plate (7) is fixedly arranged at one end of the top plate (6), a clamping assembly (8) is arranged on the inner side of the mounting plate (7), clamping plates (9) are arranged at the bottom end of the mounting plate (7), two groups of clamping plates (9) are arranged, and a circuit board tray (10) is arranged at the upper end of the bottom plate (2).
2. The chemical copper deposition device for circuit board production according to claim 1, wherein the lifting assembly (5) comprises a first motor (11), the first motor (11) is arranged at the upper end of the top plate (6), a unidirectional threaded rod (12) is arranged at the output end of the first motor (11), and the unidirectional threaded rod (12) is rotationally connected with the top plate (6).
3. The chemical copper deposition device for circuit board production according to claim 2, wherein the lifting assembly (5) comprises a threaded cylinder (13), the threaded cylinder (13) is arranged on the outer side of the unidirectional threaded rod (12), the bottom end of the threaded cylinder (13) is connected with the upper end of the supporting plate (4), and the threaded cylinder (13) is connected with the unidirectional threaded rod (12) through a screw rod.
4. A circuit board production is with chemical copper deposition device according to claim 3, characterized in that, the inside of lifting assembly (5) is including gag lever post (14), gag lever post (14) set up in the bottom of roof (6), the upper end of layer board (4) is provided with spacing section of thick bamboo (15), gag lever post (14) with spacing section of thick bamboo (15) sliding connection.
5. The chemical copper deposition device for circuit board production according to claim 1, wherein the interior of the clamping assembly (8) comprises a second motor (16), the second motor (16) is arranged on the outer side of the mounting plate (7), a bidirectional threaded rod (17) is arranged at the output end of the second motor (16), and the bidirectional threaded rod (17) is rotationally connected with the mounting plate (7).
6. The chemical copper deposition device for circuit board production according to claim 5, wherein the clamping assembly (8) comprises a threaded ring (18), the threaded ring (18) is arranged on the outer side of the bidirectional threaded rod (17), the threaded ring (18) is provided with two groups, and the threaded ring (18) is in screw connection with the bidirectional threaded rod (17).
7. The chemical copper deposition device for circuit board production according to claim 6, wherein the inside of the clamping assembly (8) comprises a chute (19), the chute (19) is arranged at the bottom end of the mounting plate (7), a sliding block (20) is arranged at the bottom end of the threaded ring (18), the bottom end of the sliding block (20) is mutually connected with the clamping plate (9), and the sliding block (20) is in sliding connection with the chute (19).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320970090.1U CN219490160U (en) | 2023-04-25 | 2023-04-25 | Chemical copper deposition device for circuit board production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320970090.1U CN219490160U (en) | 2023-04-25 | 2023-04-25 | Chemical copper deposition device for circuit board production |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219490160U true CN219490160U (en) | 2023-08-08 |
Family
ID=87480966
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320970090.1U Active CN219490160U (en) | 2023-04-25 | 2023-04-25 | Chemical copper deposition device for circuit board production |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219490160U (en) |
-
2023
- 2023-04-25 CN CN202320970090.1U patent/CN219490160U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A Chemical Copper Deposition Device for Circuit Board Production Effective date of registration: 20230921 Granted publication date: 20230808 Pledgee: Jiangsu Lianshui Rural Commercial Bank Co.,Ltd. Pledgor: Jiangsu Yaoshu Intelligent Technology Co.,Ltd. Registration number: Y2023980057688 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20230808 Pledgee: Jiangsu Lianshui Rural Commercial Bank Co.,Ltd. Pledgor: Jiangsu Yaoshu Intelligent Technology Co.,Ltd. Registration number: Y2023980057688 |