CN219486489U - Precise injection mold for mobile phone camera base - Google Patents
Precise injection mold for mobile phone camera base Download PDFInfo
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- CN219486489U CN219486489U CN202320859462.3U CN202320859462U CN219486489U CN 219486489 U CN219486489 U CN 219486489U CN 202320859462 U CN202320859462 U CN 202320859462U CN 219486489 U CN219486489 U CN 219486489U
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- injection mold
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model relates to the technical field of injection molds and discloses a precise injection mold for a mobile phone camera base, which comprises a lower mold base and an upper mold base, wherein a cylinder is fixedly connected to the lower mold base, a rod body is fixedly connected to the upper mold base, two ends of the cylinder are of a closed structure, an avoidance opening is formed in the top end of the cylinder, the rod body penetrates through the avoidance opening and extends to the inside of the cylinder, a cooling assembly is arranged on the lower mold base, the cylinder and the rod body together, and a cooling assembly is arranged on the cylinder. When the injection mold provided by the utility model is used, under the cooperation of the cylinder body, the rod body and the cooling component, cooling liquid flows in the cooling pipe in the injection molding process of the mold, and the cooling liquid can cool the finished product between the lower mold base and the upper mold base in the flowing process of the cooling pipe, so that the cooling and solidification of the finished product are accelerated, the follow-up demolding treatment of the finished product is facilitated, the production efficiency of the mold is improved, and the economic benefit of manufacturers is ensured.
Description
Technical Field
The utility model relates to the technical field of injection molds, in particular to a precise injection mold for a mobile phone camera base.
Background
Injection molds, also known as plastic injection molds, are a tool for producing plastic articles, typically made of steel. Injection molds are used in injection molding machines, and are commonly used to produce a wide variety of plastic articles with high precision requirements for complex shapes and details, such as various parts, containers, toys, automobile parts, and the like.
When producing cell-phone camera base, need use injection mold, injection mold among the prior art when using, has following several points not enough at least: (1) The limit and the guide are generally realized only through the guide post between the male die and the female die, but the phenomenon of insufficient precision still easily occurs between the male die and the female die in a mode of realizing the limit and the guide post only, and the limit effect of the guide post on the male die and the female die is limited, so that the injection molding effect of the die is influenced; (2) The injection mold does not have the function of cooling the finished product, and demolding can be performed only after the finished product is naturally cooled, so that the production efficiency of the mold can be limited, and the economic benefit of manufacturers is influenced.
Therefore, it is necessary to design a precise injection mold for the mobile phone camera base to solve the above problems.
Disclosure of Invention
The utility model aims to solve the defects in the prior art, and provides a precise injection mold for a mobile phone camera base.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
the utility model provides a precise injection mold of cell-phone camera base, includes die holder and upper die base, fixedly connected with barrel on the die holder, fixedly connected with body of rod on the upper die base, the both ends of barrel are closed form structure, and the top of barrel has been seted up and has been dodged the mouth, the body of rod passes dodges the mouth and extends to the inside of barrel, be provided with cooling module jointly on die holder, barrel and the body of rod, be provided with cooling module on the barrel.
As a preferable technical scheme of the utility model, the cooling assembly comprises a sealing slide plate, a spring, cooling liquid, a communicating pipe, a mounting groove and a cooling pipe, wherein the sealing slide plate is connected to the inner face of the cylinder in a sealing sliding manner, the sealing slide plate is fixedly connected with one end of the rod body, which is positioned in the cylinder, one end of the spring is connected with the inner bottom face of the cylinder, the other end of the spring is connected with the sealing slide plate, the cooling liquid is filled in the cylinder, the mounting groove is formed in a lower die holder, the cooling pipe is fixedly connected in the mounting groove, one end of the communicating pipe is communicated with the cylinder, and the other end of the communicating pipe is communicated with the cooling pipe.
As a preferable technical scheme of the utility model, the cooling component comprises a slot, a semiconductor refrigerating sheet, a first conductive block, a second conductive block and a plurality of ventilation ports, wherein the slot is formed in the bottom surface of the cylinder and is communicated with the inside of the cylinder, the semiconductor refrigerating sheet is fixedly connected to the slot wall of the slot, the first conductive block is fixedly connected to the semiconductor refrigerating sheet, the second conductive block is fixedly connected to the sealing slide plate, the plurality of ventilation ports are formed in the cylinder, and the plurality of ventilation ports are communicated with the slot.
As a preferable technical scheme of the utility model, the first conductive block and the second conductive block are arranged vertically opposite to each other.
As a preferable technical scheme of the utility model, the refrigerating surface of the semiconductor refrigerating sheet is positioned in the cylinder.
As a preferable technical scheme of the utility model, the cooling pipe is in a spiral structure, and is made of aluminum alloy materials.
As a preferable technical scheme of the utility model, the outer edge of the rod body is mutually attached to the inner face of the avoidance port.
The utility model has the following beneficial effects:
1. by arranging the cylinder body, the rod body and the cooling component, under the cooperation of the cylinder body, the rod body and the cooling component, cooling liquid flows in the cooling pipe in the injection molding process of the mold, and the cooling liquid can cool the finished product between the lower mold seat and the upper mold seat in the flowing process of the cooling pipe, so that the cooling and solidification of the finished product are accelerated, the follow-up demolding treatment of the finished product is facilitated, the production efficiency of the mold is improved, and the economic benefit of manufacturers is ensured;
2. through setting up the cooling subassembly, under the effect of cooling subassembly, can cool down the effect to the coolant liquid in the barrel when the semiconductor refrigeration piece circular telegram to guarantee the coolant liquid to the cooling effect of finished product.
Drawings
Fig. 1 is a schematic structural diagram of a precise injection mold for a mobile phone camera base;
fig. 2 is a schematic cross-sectional structure diagram of a precise injection mold for a mobile phone camera base provided by the utility model;
FIG. 3 is a schematic cross-sectional view of a barrel and a rod;
fig. 4 is an enlarged view of the structure at a of fig. 2.
In the figure: the cooling device comprises a lower die holder 1, an upper die holder 2, a cylinder 3, a rod body 4, a cooling component 5, a sealing slide plate 51, a spring 52, cooling liquid 53, a communicating pipe 54, a mounting groove 55, a cooling pipe 56, a cooling component 6, a slot 61, a semiconductor cooling sheet 62, a conducting block 63, a conducting block 64 and a ventilation port 65.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, a precise injection mold for a mobile phone camera base comprises a lower mold base 1 and an upper mold base 2, wherein a cylinder 3 is fixedly connected to the lower mold base 1, a rod body 4 is fixedly connected to the upper mold base 2, two ends of the cylinder 3 are of a closed structure, an avoidance opening is formed in the top end of the cylinder 3, the rod body 4 penetrates through the avoidance opening and extends to the inside of the cylinder 3, the cylinder 3 and the rod body 4 can play a further limiting role on movement of the lower mold base 1 and the upper mold base 2, matching precision between the lower mold base 1 and the upper mold base 2 is guaranteed, further injection molding effect of the mold is guaranteed, a cooling assembly 5 is jointly arranged on the lower mold base 1, the cylinder 3 and the rod body 4, and a cooling assembly 6 is arranged on the cylinder 3.
Referring to fig. 3 to 4, the cooling assembly 5 includes a sealing slide plate 51, a spring 52, a cooling liquid 53, a communicating pipe 54, a mounting groove 55 and a cooling pipe 56, the sealing slide plate 51 is in sealing sliding connection with the inner face of the cylinder 3, the sealing slide plate 51 is fixedly connected with one end of the rod body 4, which is located inside the cylinder 3, one end of the spring 52 is connected with the inner bottom face of the cylinder 3, the other end of the spring 52 is connected with the sealing slide plate 51, the cooling liquid 53 is filled inside the cylinder 3, the mounting groove 55 is opened on the lower die holder 1, the cooling pipe 56 is fixedly connected in the mounting groove 55, one end of the communicating pipe 54 is communicated with the cylinder 3, the other end of the communicating pipe 54 is communicated with the cooling pipe 56, and by setting the cooling assembly 5, the cooling liquid 53 can cool down the finished product between the lower die holder 1 and the upper die holder 2 in the flowing process of the cooling pipe 56, thereby accelerating cooling and solidification of the finished product, and facilitating the subsequent demoulding treatment of the finished product.
Referring to fig. 3, the cooling component 6 includes a slot 61, a semiconductor cooling plate 62, a first conductive block 63, a second conductive block 64 and a plurality of ventilation ports 65, the slot 61 is formed in the bottom surface of the cylinder 3, the slot 61 is communicated with the inside of the cylinder 3, the semiconductor cooling plate 62 is fixedly connected to the wall of the slot 61, the first conductive block 63 is fixedly connected to the semiconductor cooling plate 62, the second conductive block 64 is fixedly connected to the sealing slide plate 51, the plurality of ventilation ports 65 are formed in the cylinder 3, the plurality of ventilation ports 65 are communicated with the slot 61, and the cooling component 6 can cool the cooling liquid 53 by arranging the cooling component 6, so that the cooling effect of the cooling liquid 53 on a finished product is ensured.
Referring to fig. 3, the first conductive block 63 and the second conductive block 64 are disposed vertically opposite to each other, so that the first conductive block 63 and the second conductive block 64 are in contact with each other.
Referring to fig. 3, the cooling surface of the semiconductor cooling fin 62 is located inside the cylinder 3, so that the semiconductor cooling fin 62 is convenient for cooling the cooling liquid 53.
Referring to fig. 4, the cooling tube 56 is in a spiral structure, so that the flowing time of the cooling liquid 53 in the cooling tube 56 can be prolonged, the cooling effect of the cooling liquid 53 on a finished product is guaranteed, the cooling tube 56 is made of an aluminum alloy material, the aluminum alloy material has strong heat conducting performance, and the cooling effect of the cooling liquid 53 on the finished product can be further guaranteed.
Referring to fig. 3, the outer edge of the rod body 4 and the inner surface of the avoiding opening are mutually attached, so that the connection stability between the cylinder body 3 and the rod body 4 can be ensured.
The specific working principle of the utility model is as follows:
when the precise injection mold for the mobile phone camera base is used, the upper mold base 2 can drive the sealing slide plate 51 to move in the cylinder 3 in the process of moving towards the lower mold base 1, and the cylinder 3 and the rod 4 can play a role in further limiting the movement of the lower mold base 1 and the upper mold base 2 because the outer edge of the rod 4 is mutually attached to the inner surface of the avoidance port, so that the matching precision between the lower mold base 1 and the upper mold base 2 is ensured, and the injection molding effect of the mold is further ensured;
the sealing slide plate 51 can push the cooling liquid 53 in the cylinder 3 in the process of moving the inside of the cylinder 3, so that the cooling liquid 53 enters the cooling pipe 56 through the connecting pipe 54, the cooling liquid 53 flows in the cooling pipe 56, the cooling liquid 53 can cool the finished product between the lower die holder 1 and the upper die holder 2 in the process of flowing in the cooling pipe 56, thereby accelerating the cooling and solidification of the finished product, facilitating the subsequent demoulding treatment of the finished product, after injection molding is finished, the lower die holder 1 and the upper die holder 2 are separated from each other, at the moment, the rod body 4 can drive the sealing slide plate 51 to reset, the cooling liquid 53 in the cooling pipe 56 can be extracted in the resetting process of the sealing slide plate 51, so that the cooling liquid 53 flows back into the cylinder 3, and the subsequent use of the cooling assembly 5 is facilitated;
when the lower die holder 1 and the upper die holder 2 are mutually attached, the sealing slide plate 51 moves to a limit position, at the moment, the first conductive block 63 and the second conductive block 64 are mutually contacted, part of cooling liquid 53 is still in the cylinder 3, when the first conductive block 63 and the second conductive block 64 are mutually contacted, a closed circuit formed by the first conductive block 63, the second conductive block 64 and the semiconductor refrigerating piece 62 is in a passage state, at the moment, the semiconductor refrigerating piece 62 can be electrified and operated, the cooling liquid 53 in the cylinder 3 can be cooled when the semiconductor refrigerating piece 62 is electrified, and when the cooling liquid 53 in the cooling pipe 56 flows back into the cylinder 3, the cooling liquid 53 in the cooling pipe 56 can be mutually mixed with the low-temperature cooling liquid 53 in the cylinder 3, so that the cooling liquid 53 can be cooled, and the cooling effect of the cooling liquid 53 on a finished product is ensured;
it should be noted that, the circuit in the cylinder 3 is waterproof to avoid the damage of the cooling liquid 53 to the circuit in the cylinder 3, and the specific structure and working principle of the semiconductor refrigeration sheet 62 are not used as innovative parts of the technical scheme, not shown in the drawings, and not described in detail herein.
The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.
Claims (7)
1. The utility model provides a precision injection mold of cell-phone camera base, includes die holder (1) and upper die base (2), its characterized in that, fixedly connected with barrel (3) on die holder (1), fixedly connected with body of rod (4) on upper die base (2), the both ends of barrel (3) are closed form structure, and the top of barrel (3) has been seted up and has been dodged the mouth, body of rod (4) pass dodges the mouth and extend to the inside of barrel (3), be provided with cooling module (5) on die holder (1), barrel (3) and the body of rod (4) jointly, be provided with cooling module (6) on barrel (3).
2. The precise injection mold for the mobile phone camera base according to claim 1, wherein the cooling assembly (5) comprises a sealing slide plate (51), a spring (52), cooling liquid (53), a communicating pipe (54), a mounting groove (55) and a cooling pipe (56), the sealing slide plate (51) is in sealing sliding connection with the inner face of the cylinder body (3), the sealing slide plate (51) is fixedly connected with one end of the rod body (4) positioned in the cylinder body (3), one end of the spring (52) is connected with the inner bottom face of the cylinder body (3), the other end of the spring (52) is connected with the sealing slide plate (51), the cooling liquid (53) is filled in the cylinder body (3), the mounting groove (55) is formed in the lower die holder (1), the cooling pipe (56) is fixedly connected in the mounting groove (55), one end of the communicating pipe (54) is communicated with the cylinder body (3), and the other end of the communicating pipe (54) is communicated with the cooling pipe (56).
3. The precise injection mold for the mobile phone camera base according to claim 2, wherein the cooling component (6) comprises a slot (61), a semiconductor refrigerating sheet (62), a first conductive block (63), a second conductive block (64) and a plurality of ventilation ports (65), the slot (61) is formed in the bottom surface of the cylinder (3), the slot (61) is communicated with the inside of the cylinder (3), the semiconductor refrigerating sheet (62) is fixedly connected to the slot wall of the slot (61), the first conductive block (63) is fixedly connected to the semiconductor refrigerating sheet (62), the second conductive block (64) is fixedly connected to the sealing sliding plate (51), a plurality of ventilation ports (65) are formed in the cylinder (3), and a plurality of ventilation ports (65) are communicated with the slot (61).
4. The precise injection mold for the mobile phone camera base according to claim 3, wherein the first conductive block (63) and the second conductive block (64) are arranged in a vertically opposite manner.
5. A precision injection mold for a mobile phone camera base according to claim 3, wherein the refrigerating surface of the semiconductor refrigerating piece (62) is located in the cylinder (3).
6. The precise injection mold for the mobile phone camera base according to claim 2, wherein the cooling tube (56) is in a spiral structure, and the cooling tube (56) is made of an aluminum alloy material.
7. The precise injection mold for the mobile phone camera base according to claim 1, wherein the outer edge of the rod body (4) is mutually attached to the inner face of the avoidance port.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320859462.3U CN219486489U (en) | 2023-04-18 | 2023-04-18 | Precise injection mold for mobile phone camera base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320859462.3U CN219486489U (en) | 2023-04-18 | 2023-04-18 | Precise injection mold for mobile phone camera base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219486489U true CN219486489U (en) | 2023-08-08 |
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ID=87481148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320859462.3U Active CN219486489U (en) | 2023-04-18 | 2023-04-18 | Precise injection mold for mobile phone camera base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219486489U (en) |
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2023
- 2023-04-18 CN CN202320859462.3U patent/CN219486489U/en active Active
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