CN219483698U - Pre-cleaning device for chemical mechanical polishing equipment - Google Patents

Abstract

The utility model relates to the field of semiconductor manufacturing, and provides a pre-cleaning device for chemical mechanical polishing equipment, which comprises a carrier assembly, a hairbrush assembly and a cleaning assembly, wherein the carrier assembly is arranged on the carrier assembly; the carrier assembly is used for placing a wafer to be pre-cleaned; the brush assembly is arranged above the carrier assembly and is used for brushing the wafer; the cleaning assembly comprises a spray head and a water supply pipe, the spray head is connected with the water supply pipe, the spray head faces the carrier assembly, and the water supply pipe is used for providing running water for the surface of the wafer so as to flush the surface of the wafer after brushing. The pre-cleaning device for the chemical mechanical polishing equipment can effectively prevent the scratch defect caused by the film damage and peeling of the edge area of the wafer in the subsequent grinding part, reduce the defect of the chemical mechanical polishing process and further effectively improve the product yield.

Description

Pre-cleaning device for chemical mechanical polishing equipment

Technical Field

The utility model relates to the field of semiconductor manufacturing, in particular to a pre-cleaning device for chemical mechanical polishing equipment.

Background

At present, with the continuous development of advanced processes for manufacturing integrated circuits, chemical mechanical polishing is increasingly used as a method for global planarization of a wafer surface, and meanwhile, higher requirements are also put forward on defect control in a polishing process, and in the current chemical mechanical polishing equipment, the process comprises the following steps: the wafer is conveyed to a grinding head through a mechanical arm, the grinding head sucks the back surface of the wafer to enable the back surface of the wafer to be downward contacted with a grinding pad, and then redundant materials are removed under the action of grinding liquid through certain pressure and rotating speed. Among them, scratch defect is one of the most major defects in the chemical mechanical polishing process, and as the line width of the integrated circuit is continuously reduced, the impact of scratch on the wafer yield is also increasing.

The sources of the scratch defects mainly include the following two aspects: on the one hand, the polishing equipment itself comprises large particles in the polishing liquid, crystallization of polishing byproducts on the polishing pad, diamond falling in the diamond conditioner and the like, and on the other hand, the source of particles brought by the wafer itself. In integrated circuit manufacturing processes, wafers are typically subjected to multiple photolithography, etching, thin film deposition, annealing, etc. processes prior to performing the cmp equipment process, and defects are easily generated in the edge regions of the wafer during these processes. These defects include film damage, peeling, etc., which are easily dropped on the polishing pad under mechanical action in the subsequent chemical mechanical polishing process, thus becoming large particle sources in the polishing process, generating serious scratch defects, and thus affecting the product yield.

How to reduce scratch defects of chemical mechanical polishing is one of the most main targets pursued by those skilled in the art, and based on this starting point, the utility model provides a novel pre-cleaning device for chemical mechanical polishing equipment, which is used for reducing scratch defects and improving the product yield.

Disclosure of Invention

Based on the above description, the utility model provides a pre-cleaning device for chemical mechanical polishing equipment, so as to solve the technical problem that the wafer scratch defect in the prior art is larger, and the product yield is further affected.

The technical scheme for solving the technical problems is as follows:

the present utility model provides a pre-cleaning apparatus for a chemical mechanical polishing device, comprising: the brush comprises a carrier assembly, a brush assembly and a cleaning assembly;

the carrier assembly is used for placing a wafer to be pre-cleaned;

the brush assembly is arranged above the carrier assembly and is used for brushing the wafer;

the cleaning assembly comprises a spray head and a water supply pipe, the spray head is connected with the water supply pipe, the spray head faces the carrier assembly, and the water supply pipe is used for providing running water for the surface of the wafer so as to flush the surface of the wafer after brushing.

On the basis of the technical scheme, the utility model can be improved as follows.

Further, the carrier assembly comprises a chuck, a support member and a first driving member;

the chuck is arranged on the supporting piece, the first driving piece is in driving connection with the supporting piece, and under the action of the first driving piece, the supporting piece can drive the chuck to rotate around the axis of the chuck.

Further, the chuck is a microporous ceramic body, and the chuck can absorb the wafer through a microporous structure to form vacuum.

Further, the brush assembly comprises a brush, a connecting arm and a second driving piece;

the brush detachable connect in the one end of linking arm, the second driving piece with the linking arm is connected, under the effect of second driving piece, the linking arm can drive the brush is rotatory and follow vertical direction and reciprocate.

Further, the number of the brush assemblies is two, the two brush assemblies are symmetrically arranged on the axis of the carrying platform assembly, the two brush assemblies are arranged corresponding to the edges of the wafer, and the two brushes can sweep the edges of the wafer.

Further, the spray head is arranged between the two brush assemblies and is used for spraying water to the upper surface of the wafer.

Further, the brush assembly is one, the brush is arranged towards the carrier assembly, and the brush can cover the upper surface of the wafer.

Further, the brush is cylindrical, the brush comprises a cylinder body and brush heads, and the brush heads are uniformly distributed on the cylinder body.

Further, the cleaning components are arranged on two sides of the wafer and are used for spraying water to the upper edge of the wafer.

Further, the material of the hairbrush is flexible material.

Compared with the prior art, the technical scheme of the application has the following beneficial technical effects:

the pre-cleaning device for the chemical mechanical polishing equipment provided by the utility model is characterized in that the carrier assembly, the brush assembly and the cleaning assembly are arranged, the wafer to be pre-cleaned is placed on the carrier assembly, and then the brush assembly and the cleaning assembly are utilized to finish brushing and flushing of large particles on the edge of the wafer so as to remove particle sources on the edge of the wafer. The pre-cleaning device for the chemical mechanical polishing equipment can effectively prevent the scratch defect caused by film damage and peeling of the edge area of the wafer in the subsequent grinding part by efficiently cleaning the particle source of the wafer, reduce the defect of the chemical mechanical polishing process, and further effectively improve the product yield.

Drawings

FIG. 1 is a schematic diagram of a pre-cleaning apparatus for a chemical mechanical polishing device according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of the pre-cleaning apparatus for the chemical mechanical polishing apparatus shown in FIG. 1;

FIG. 3 is a schematic diagram showing a second configuration of a pre-cleaning apparatus for a chemical mechanical polishing device according to an embodiment of the present utility model;

in the drawings, the list of components represented by the various numbers is as follows:

1. a stage assembly; 11. a chuck; 12. a support;

2. a brush assembly; 21. a brush; 22. a connecting arm;

3. cleaning the assembly; 31. a spray head; 32. and a water supply pipe.

Detailed Description

In order to facilitate an understanding of the present application, a more complete description of the present application will now be provided with reference to the relevant figures. Examples of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present utility model will be understood in detail by those of ordinary skill in the art.

In the description of the present specification, the description with reference to the term "particular example" or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

How to reduce scratch defects of chemical mechanical polishing is a problem that the field continuously solves, in the prior art, the following two ways mainly exist, but all have certain defects:

mode one: in the existing chemical mechanical polishing equipment, the polishing process is that a wafer is directly conveyed to a polishing head through a conveying arm to start a polishing process, and the polishing process is completed through a cleaning and drying system after the polishing is completed. The control of scratch defects is mainly achieved by improving the state of the device itself, such as: the number of large particles in the grinding liquid is reduced by a secondary filtering mode, the crystallization of grinding byproducts is reduced by adding a grinding pad cleaning device, the frequency of scratch defects caused by diamond detachment is reduced by adding a detection device of a diamond trimmer, and the like. The defect is that the method for reducing the scratch defect is concentrated on solving the problem of large particle sources caused by equipment, and a device for removing particles caused by the wafer edge before grinding is not available, so that the film damage and the peeling of the wafer edge and other pollutants cannot be effectively removed, and the scratch defect cannot be avoided in the subsequent grinding process.

Mode two: the film damage and peeling at the edge of the wafer are cleaned by an etching method, or the film layer is etched by a reactive plasma etching method to achieve the aim of cleaning, or the residual film is removed by a wet etching method through chemical reaction on the inclined surface of the wafer. The defect and abnormality of the wafer edge can be removed by the two etching modes, however, the method for cleaning the wafer edge needs to add extra process steps, and the addition of the extra process steps for the semiconductor process manufacturing increases the process cost on one hand and the production period of the product on the other hand; in addition, for the chemical mechanical polishing process, the previous process increases the etching of the wafer edge, which is beneficial to reducing the scratch defect, but the wafer may still gather particles to cause scratch in the subsequent transmission process after etching and cleaning.

Accordingly, the prior art fails to provide a desirable solution, and the present utility model provides a new pre-cleaning apparatus for chemical mechanical polishing equipment that is superior to the solutions provided by the prior art.

Embodiments of the present utility model will be described in further detail with reference to the accompanying drawings and examples, which are provided to illustrate the present utility model, but are not intended to limit the scope of the present utility model.

As shown in fig. 1 to 3, an embodiment of the present utility model provides a pre-cleaning apparatus for a chemical mechanical polishing apparatus, comprising: stage assembly 1, brush assembly 2 and cleaning assembly 3.

The carrier assembly 1 is used for placing wafers to be pre-cleaned.

The brush assembly 2 is arranged above the carrier assembly 1, and the brush assembly 2 is used for brushing wafers.

The cleaning assembly 3 includes a spray head 31 and a water supply pipe 32, the spray head 31 is connected with the water supply pipe 32, the spray head 31 is arranged towards the stage assembly 1, and the water supply pipe 32 is used for supplying flowing water to the surface of the wafer so as to flush the brushed surface of the wafer.

Specifically, as shown in fig. 1, the carrier assembly 1 is disposed at the bottommost portion, the upper surface of the carrier assembly is used for placing a wafer to be cleaned, and the wafer can be driven to rotate, the brush assembly 2 is disposed above the carrier assembly 1, and can be close to or far away from the wafer, i.e. can move up and down, contact with the wafer or lift away from the wafer, the contact torque between the brush assembly and the wafer can be adjusted, that is, the force of brushing the wafer can be adjusted, and a sensor can be built in the brush 21 for detecting the downward pressure between the brush 21 and the wafer during brushing.

The cleaning component 3 is also arranged above the carrying platform, the spray head 31 is arranged towards the wafer, and under the water supply effect of the water supply pipe 32, the spray head 31 can spray water to the surface of the wafer so as to flush the wafer, and the particle source is obtained by removing the brush and dropping.

The water supply can be deionized water, the flow rate and the water outlet time of the water outlet can be adaptively adjusted according to actual needs, for example, the spraying flow rate of the deionized water can be set to be 500-1000 ml/min.

The pre-cleaning device for the chemical mechanical polishing equipment provided by the embodiment of the utility model is characterized in that the carrier assembly 1, the brush assembly 2 and the cleaning assembly 3 are arranged, a wafer to be pre-cleaned is placed on the carrier assembly 1, and then the brush assembly 2 and the cleaning assembly 3 are utilized to finish brushing and flushing of large particles on the edge of the wafer so as to remove particle sources on the edge of the wafer.

The pre-cleaning device for the chemical mechanical polishing equipment provided by the embodiment of the utility model can effectively prevent the scratch defect caused by the film damage and peeling of the edge area of the wafer in the subsequent grinding part by efficiently cleaning the particle source of the wafer, reduce the defect of the chemical mechanical polishing process, and further effectively improve the product yield.

In an alternative embodiment, as shown in fig. 1, the stage assembly 1 includes a chuck 11, a support 12, and a first drive member.

The chuck 11 is arranged on the supporting member 12, the first driving member is in driving connection with the supporting member 12, and under the action of the first driving member, the supporting member 12 can drive the chuck 11 to rotate around the axis thereof.

Wherein, chuck 11 is a microporous ceramic body, chuck 11 can pass through the micropore structure in order to form vacuum chuck wafer.

Specifically, the wafer is placed on the chuck 11 through the conveying arm, the chuck 11 is of a microporous ceramic structure, the whole back surface of the wafer is sucked through vacuum, and meanwhile, the chuck 11 can drive the wafer to rotate at a certain rotating speed under the action of the first driving piece, so that the hairbrush 21 can brush the edge part of the whole wafer in the brushing process, and the brushing efficiency and quality are ensured.

In an alternative embodiment, the brush assembly 2 comprises a brush 21, a connecting arm 22 and a second driving member.

The brush 21 is detachably connected to one end of the connecting arm 22, the second driving member is connected to the connecting arm 22, and under the action of the second driving member, the connecting arm 22 can drive the brush 21 to rotate and move up and down along the vertical direction.

Specifically, the connecting arm 22 is a movable device, and when in operation, the connecting arm 22 rotates to a specific position to ensure that the brush 21 can contact the edge of the wafer, and meanwhile, the connecting arm can also move up and down to drive the brush 21 to adjust the torque between the brush and the wafer.

The brush 21 may be made of a flexible material, such as PVA.

The brush head is detachably connected with the connecting arm 22, and when the abrasion of the brush 21 reaches a certain degree, the brush head can be replaced to ensure the cleaning effect of the brush 21.

With respect to the arrangement of the brush assembly 2 and the cleaning assembly 3, the present embodiment provides two implementations.

Embodiment one:

as shown in fig. 1 and 2, the number of the brush assemblies 2 is two, the two brush assemblies 2 are symmetrically arranged with respect to the axis of the carrier assembly 1, the two brush assemblies 2 are arranged corresponding to the edge of the wafer, the two brushes 21 can sweep the edge of the wafer, and the diameter of the brushes 21 can be 5-8 cm.

Correspondingly, the spray head 31 in the cleaning assembly 3 is arranged between the two brush assemblies 2 for spraying water to the upper surface of the wafer.

Specifically, the brush assembly 2 and the cleaning assembly 3 according to the present embodiment are configured in such a manner that the cleaning range of the brush 21 is mainly concentrated in the boundary range of the outermost edge of the wafer during the pre-cleaning process. The main technological process is as follows: the wafer is transferred to a pre-cleaning system through a transfer system after entering the chemical mechanical polishing equipment, the back of the wafer is adsorbed on the chuck 11, then the connecting arm 22 rotates to drive the brush 21 to the position above the edge of the wafer and moves downwards to contact the wafer, and meanwhile, the wafer starts to rotate at a certain rotating speed under the drive of the chuck 11, and running water starts to flow downwards to start the pre-cleaning process. After the brushing process is completed, the water supply to the shower head 31 is stopped, and at this time, the wafer is still rotated at a certain rotation speed to achieve the purpose of removing a large amount of water on the surface of the wafer, and then the whole pre-cleaning process is completed, and the wafer is transferred from the chuck 11 to the polishing head via the transfer system to start the chemical mechanical polishing process.

Embodiment two:

as shown in fig. 3, the brush assembly 2 is one, and the brush 21 is disposed toward the stage assembly 1, and the brush 21 can cover the upper surface of the wafer.

Wherein, brush 21 is cylindric, and brush 21 includes barrel and brush head, and a plurality of brush heads evenly distributed are on the barrel.

Correspondingly, the cleaning components 3 are arranged on two sides of the wafer and are used for spraying water to the upper edge of the wafer.

Specifically, as shown in fig. 3, the brush 21 may be horizontally placed, and the brushing process can be completed to cover the entire wafer surface. Both ends of the brush 21 are connected with the connecting arms 22 and can move up and down, and meanwhile, the brush 21 can also rotate at a certain rotating speed in the cleaning process. The cleaning components 3 are disposed on both sides of the wafer, and can spray deionized water onto the wafer during the cleaning process.

The brush 21 is made of PVA, is cylindrical, and is provided with small round brush heads uniformly distributed on the surface, and the whole wafer surface can be covered by the cylinder and the brush heads.

In addition, the brush 21 is also a detachable device, and can be replaced when reaching a certain abrasion degree, so that the cleaning effect is ensured.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims (10)

1. A pre-cleaning apparatus for a chemical mechanical polishing device, comprising: the brush comprises a carrier assembly, a brush assembly and a cleaning assembly;

the carrier assembly is used for placing a wafer to be pre-cleaned;

the brush assembly is arranged above the carrier assembly and is used for brushing the wafer;

the cleaning assembly comprises a spray head and a water supply pipe, the spray head is connected with the water supply pipe, the spray head faces the carrier assembly, and the water supply pipe is used for providing running water for the surface of the wafer so as to flush the surface of the wafer after brushing.

2. The pre-cleaning apparatus for a chemical mechanical polishing tool according to claim 1, wherein the carrier assembly comprises a chuck, a support member, and a first drive member;

the chuck is arranged on the supporting piece, the first driving piece is in driving connection with the supporting piece, and under the action of the first driving piece, the supporting piece can drive the chuck to rotate around the axis of the chuck.

3. The pre-cleaning apparatus for a chemical mechanical polishing tool according to claim 2, wherein the chuck is a microporous ceramic body, the chuck being capable of vacuum-adsorbing the wafer through a microporous structure.

4. The pre-cleaning apparatus for a chemical mechanical polishing tool according to claim 1, wherein the brush assembly comprises a brush, a connecting arm, and a second driving member;

the brush detachable connect in the one end of linking arm, the second driving piece with the linking arm is connected, under the effect of second driving piece, the linking arm can drive the brush is rotatory and follow vertical direction and reciprocate.

5. The pre-cleaning apparatus for a chemical mechanical polishing tool according to claim 4, wherein the number of brush assemblies is two, the two brush assemblies are symmetrically arranged about an axis of the carrier assembly, the two brush assemblies are disposed corresponding to the edge of the wafer, and the two brushes are capable of brushing the edge of the wafer.

6. The pre-cleaning apparatus for a chemical mechanical polishing tool as recited in claim 5, wherein said shower head is disposed between two of said brush assemblies for spraying water onto an upper surface of said wafer.

7. The pre-cleaning apparatus for a chemical mechanical polishing tool as recited in claim 4, wherein said brush assembly is one, said brush being disposed toward said carrier assembly, said brush being capable of covering an upper surface of said wafer.

8. The pre-cleaning apparatus for a chemical mechanical polishing tool according to claim 7, wherein the brush has a cylindrical shape, the brush comprises a cylindrical body and brush heads, and a plurality of the brush heads are uniformly distributed on the cylindrical body.

9. The pre-cleaning apparatus for a chemical mechanical polishing tool as recited in claim 7, wherein the cleaning assembly is disposed on both sides of the wafer for spraying water onto the upper edge of the wafer.

10. The pre-cleaning apparatus for a chemical mechanical polishing tool as recited in claim 4, wherein the material of the brush is a flexible material.