CN219476097U

CN219476097U - High-integration display card circuit

Info

Publication number: CN219476097U
Application number: CN202223550900.2U
Authority: CN
Inventors: 欧阳旭阳; 石璐; 任衍坤
Original assignee: Suzhou Changfeng Aviation Electronics Co Ltd
Current assignee: Suzhou Changfeng Aviation Electronics Co Ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-08-04
Anticipated expiration: 2032-12-28

Abstract

The utility model relates to the field of rail transit, and provides a high-integration display card circuit, which comprises: a core board having a processor circuit; the display card circuit is connected with the core board, and the core board outputs PCIe signals to the display card circuit; and the decoding chip is connected with the display card circuit, and the display card circuit outputs RGB signals to the decoding chip. The circuit designed by the utility model has the characteristics of low cost, low power consumption, high integration level and only needs the shell to dissipate heat, and solves the problem that the display screen of the motor train unit has higher requirements on the process and the power consumption in the prior art.

Description

High-integration display card circuit

Technical Field

The utility model relates to the field of rail transit, in particular to a high-integration display card circuit.

Background

Along with the rapid development of communication technology, the display screen requirements of the motor train unit are continuously improved, so that the display effect is required to be improved, and the power consumption and the process are also required to be improved. At present, many motor train units still adopt an X86 system, wherein a display card circuit is not integrated in a main chip, PCIe signals are required to be converted into video signals, but fans are required to be used for fan heating due to large power consumption of the designed independent display card circuit, and a low-temperature application range of 0-70 ℃ is not supported.

Disclosure of Invention

The utility model provides a high-integration display card circuit which is used for solving the problem that a display screen of a motor train unit in the prior art has higher requirements on technology and power consumption.

The technical scheme for realizing the aim of the utility model is as follows: a highly integrated graphics card circuit, comprising: a core board having a processor circuit; the display card circuit is connected with the core board, and the core board outputs PCIe signals to the display card circuit; the decoding chip is connected with the display card circuit, and the display card circuit outputs PGB signals to the decoding chip.

Further, the display card circuit is an SM700 chip.

Furthermore, the SM700 chip has 265 pins in total and is packaged into BGA.

Further, the SM700 chip supports analog RGB interfaces, LCD panel interfaces, scaled video interfaces, and pulse width modulation interfaces.

Further, the SM700 chip also has an interface for external devices.

Further, the SM700 chip has a 2D engine that includes front-end color space conversion and scaling support.

Further, the SM700 chip is connected with an isolation capacitor.

Compared with the prior art, the utility model has the beneficial effects that: by providing the high-integration display card circuit and adopting the SM750 chip as the display card circuit for signal conversion, the performance, the function and the technical indexes of the circuit are the same as those of a motor train unit prototype product, the equipotential substitution can be realized, the related technical indexes of the high-speed motor train unit are met, the technical level reaches the similar products at home and abroad, and meanwhile, good economic and social benefits are generated in the rail transit industry.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a circuit design of a highly integrated graphics card according to an embodiment of the present utility model;

FIG. 2 is a schematic diagram of a PCIe connection portion in SM750 of an embodiment of the utility model;

FIG. 3 is a schematic diagram of an LDO implementation of an embodiment of the present utility model from 3.3V to 1.2V;

FIG. 4 is a schematic diagram of an LDO implementation of an embodiment of the present utility model from 3.3V to 2.5V;

FIG. 5 is a schematic diagram of an LDO implementation of an embodiment of the present utility model from 12V to 5V;

FIG. 6 is a schematic diagram of a DC/DC implementation of an embodiment of the utility model from 12V to 3.3V;

fig. 7 is a schematic diagram of an AX99100 chip to PC/104 interface of an embodiment of the utility model.

Detailed Description

Embodiments of the present application are described in detail below with reference to the accompanying drawings.

Other advantages and effects of the present application will become apparent to those skilled in the art from the present disclosure, when the following description of the embodiments is taken in conjunction with the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. The present application may be embodied or carried out in other specific embodiments, and the details of the present application may be modified or changed from various points of view and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments may be combined with each other without conflict. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

The high-integration display card circuit provided by the embodiment of the utility model, as shown in fig. 1, comprises: a core board having a processor circuit; the display card circuit is connected with the core board, and the core board outputs PCIe signals to the display card circuit; the decoding chip is connected with the display card circuit, the display card circuit outputs RGB signals to the decoding chip, and preferably, the decoding chip adopts a DS90C387A decoding chip.

Furthermore, the utility model converts PCIe signals into RGB signals and VGA signals through the SM750 chip, and converts RGB signals into other signals through the decoding chip, and the specific topological structure is shown in figure 1. Specifically, the core board card of the FT2000/4 processor outputs PCIe signals to the SM750 chip, converts the PCIe signals into 24-bit RGB signals, realizes LVDS signal conversion through the DS90C387A decoding chip, and can directly output VGA signals. Preferably, the SM750 chip is mainly a display card chip of Huilong science and technology company, and the SM750 is a PCIE 2D multimedia mobile display controller device, and is packaged as a BGA (ball-point grid array package technology) with 265 pins. It does not complement the needs of the embedded industry and provides video and 2D capabilities. To help reduce system cost, it supports a variety of I/os including analog RGB and digital LCD panel interfaces, two scaled video interfaces, and Pulse Width Modulation (PWM). There are other GPIO bits that can also be used for interfacing with external devices. The 2D engine includes a front-end color space conversion and 4:1 and 1: 8. The core board of the FT2000/4 processor is connected with the chip SM750 mainly through PCIe receiving, sending and control signals, so that communication between the FT2000/4 processor and the SM750 is realized, a blocking capacitor is needed for RX signals near the SM750 to prevent inconsistent PCIE signal level standards, and a blocking capacitor is already arranged on a TX signal on the core board of the FT2000/4 processor, as shown in fig. 2, a schematic diagram of a PCIe connection part in the SM750 is shown.

Further, SM750 requires 5V, 3.3V, 2.5V, 1.2V power supply, and the power supply is realized by LDO chips LP38501TS-ADJ, LP3965-ADJ and LM1086CT-5.0 and a DC/DC chip TPS54A24RTW, as shown in FIG. 3, 3V to 1.2V is realized by LDO chip LP38501TS-ADJ, as shown in FIG. 4, 3.3V to 2.5V is realized by LDO chip LP3965-ADJ, as shown in FIG. 5, 12V to 5V is realized by LDO chip LM1086CT-5.0, as shown in FIG. 6, 12V to 3.3V is realized by DC/DC chip TPS54A24 RTW. In addition, the SM750 processes the PCIe signal and then converts the PCIe signal to a VGA for direct output, but the converted RGB signal needs to be converted into an LVDS signal for output through an LVDS decoding chip DS90C387A, and a specific circuit is shown in fig. 7. VGA display in a TX 2107.4 inch display can be normally output, while LVDS requires software to configure resolution before it can be normally output. The assembled whole machine meets the index requirements through the high-low temperature test and the pressure test results.

The beneficial effects realized by the utility model include:

the utility model provides a high-integration display card circuit, which adopts an SM750 chip as a display card circuit to perform signal conversion. The performance, the function and the technical indexes of the circuit are the same as those of a motor train unit prototype product, so that the equipotential substitution can be realized, the related technical indexes of the high-speed motor train unit are met, the technical level of the circuit reaches the similar products at home and abroad, and good economic and social benefits are generated in the rail transit industry.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, alternatives, and improvements that fall within the spirit and scope of the utility model.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims

1. A highly integrated graphics card circuit, comprising:

a core board having a processor circuit;

the display card circuit is connected with the core board, the core board outputs PCIe signals to the display card circuit, and the display card circuit comprises an SM700 chip;

and the decoding chip is connected with the display card circuit, and the display card circuit outputs RGB signals to the decoding chip.

2. The high-integration graphics card circuit of claim 1, wherein the SM700 chip has 265 pins, and is packaged as a BGA.

3. The highly integrated graphics card circuit of claim 1 wherein the SM700 chip supports analog RGB interfaces, LCD panel interfaces, scaled video interfaces, and pulse width modulation interfaces.

4. The highly integrated graphics card circuit of claim 1 wherein the SM700 chip also has an interface to external devices.

5. The high integration graphics card circuit of claim 1, wherein the SM700 chip has a 2D engine, the 2D engine including front end color space conversion and scaling support.

6. The high-integration graphics card circuit of claim 1, wherein the SM700 chip is connected with an isolation capacitor.