CN219462300U

CN219462300U - Mounting structure of high-density nano-wafer suite

Info

Publication number: CN219462300U
Application number: CN202222373847.7U
Authority: CN
Inventors: 朱红飞
Original assignee: Suzhou Hengzhiqing Biotechnology Co ltd
Current assignee: Suzhou Hengzhiqing Biotechnology Co ltd
Priority date: 2022-09-07
Filing date: 2022-09-07
Publication date: 2023-08-04
Anticipated expiration: 2032-09-07

Abstract

The utility model relates to the technical field of nano-wafers and discloses a mounting structure of a high-density nano-wafer kit, which comprises a tube body, wherein a pressing block is arranged in the tube body, a push rod is connected in the middle of the pressing block in a penetrating manner, the upper end of the push rod penetrates through the top of the tube body and is connected with a pressing push block on the outer side, the other end of the tube body is connected with a mounting seat, a high-density nano-wafer is embedded and bonded in the middle of the bottom of the mounting seat, a fixing block is arranged on the inner side wall of the tube body, the upper end of the fixing block is connected with a limiting block through a telescopic rod, and a spring is sleeved on the outer side of the telescopic rod. According to the utility model, the plurality of fixing blocks, the telescopic rods, the limiting blocks, the springs, the pressing blocks, the limiting circular rings and the connecting rods are arranged, and the mutual coordination effect among the fixing blocks, the telescopic rods, the limiting blocks, the springs, the pressing blocks, the limiting circular rings and the connecting rods is utilized, so that the high-density nano-wafer can be repeatedly contacted with the skin, the skin channel is opened through vibration, the effective components of the imported product are conveyed to the required position, and the product absorption effect is improved.

Description

Mounting structure of high-density nano-wafer suite

Technical Field

The utility model relates to the technical field of nano-wafers, in particular to a mounting structure of a high-density nano-wafer kit.

Background

The surface of the nano-wafer is a series of microneedle arrays which can open the outermost stratum corneum of the skin, and can not damage the dermis layer, so that the nutrient permeability is greatly improved. The biocompatibility of the monocrystalline silicon ensures the safety of the nanocrystalline in the use process, and the high-density nanocrystalline chip kit can be used independently or matched with other nanocrystalline chip instrument tools.

The existing mounting structure of the high-density nano-wafer kit cannot repeatedly contact the skin when in use, and cannot open a skin channel through vibration to convey the effective components of the introduced product to a required position, so that the product has poor absorption effect, and therefore, the mounting structure of the high-density nano-wafer kit is urgently needed to solve the defects.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides the mounting structure of the high-density nano-wafer kit, which solves the problems that the prior mounting structure of the high-density nano-wafer kit can not repeatedly contact the skin with the high-density nano-wafer and can not open the skin channel through vibration to convey the effective components of the introduced product to the required position, so that the product has poor absorption effect.

The utility model provides the following technical scheme: the utility model provides a mounting structure of high density nanometer wafer external member, includes the body, the inside of body is provided with the briquetting, the centre department through connection of briquetting has the push rod, the top of body is passed to the upper end of push rod and is connected with the push block of pressing in the outside, the other end of body is connected with the mount pad, the department inlays in the middle of the bottom of mount pad and establishes the bonding has high density nanometer wafer, be provided with the fixed block on the inside wall of body, the upper end of fixed block is connected with the stopper through the telescopic link, the outside cover of telescopic link is equipped with the spring, be provided with spacing ring on the push rod and be located between push block and the body of pressing, the left lower extreme of spacing ring is connected with the connecting rod.

Preferably, the number of the fixed blocks, the telescopic rods, the springs and the limiting blocks is two, and the fixed blocks, the telescopic rods, the springs and the limiting blocks are symmetrically arranged on the left and right sides of the push rod.

Preferably, the number of the connecting rods is two, and the two connecting rods are arranged in a bilateral axisymmetric manner relative to the limiting circular ring.

Preferably, the periphery of the pressing block is in contact with the inner side wall of the pipe body but is not connected with the inner side wall of the pipe body.

Preferably, the mounting seat is located below the fixed block, and the pressing block is located above the limiting block.

Preferably, the periphery of the mounting seat is contacted with the inner side wall of the pipe body but is not connected with the inner side wall of the pipe body.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the plurality of fixing blocks, the telescopic rods, the limiting blocks, the springs, the pressing blocks, the limiting circular rings and the connecting rods are arranged, and the mutual coordination effect among the fixing blocks, the telescopic rods, the limiting blocks, the springs, the pressing blocks, the limiting circular rings and the connecting rods is utilized, so that the high-density nano-wafer can be repeatedly contacted with the skin, the skin channel is opened through vibration, the effective components of the imported product are conveyed to the required position, and the product absorption effect is improved.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings, in which:

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of the overall structure of the present utility model;

FIG. 3 is an enlarged schematic cross-sectional view of a portion of the structure of the present utility model.

In the figure: 1. a tube body; 2. a push rod; 3. briquetting; 4. pressing the push block; 5. a mounting base; 6. a high density nano-wafer; 7. a fixed block; 8. a telescopic rod; 9. a spring; 10. a limiting block; 11. a limit circular ring; 12. and (5) connecting a rod.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. The drawings are for illustrative purposes only, are schematic representations and are not intended to be limiting of the present patent, and in order to better illustrate the embodiments of the present utility model, certain elements of the drawings may be omitted, enlarged or reduced, and not represent the actual product size, it will be understood by those skilled in the art that certain well-known structures, elements and descriptions thereof may be omitted, and that all other embodiments obtained by those skilled in the art without making inventive efforts are within the scope of protection of the present utility model based on the embodiments of the present utility model.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed" and "connected" are to be construed broadly, and may be, for example, fixedly connected, movably connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediate medium, or communicating between two members. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Referring to fig. 1-3, the mounting structure of the high-density nano-wafer kit comprises a tube body 1, wherein a pressing block 3 is arranged in the tube body 1, a push rod 2 is connected in the middle of the pressing block 3 in a penetrating manner, the upper end of the push rod 2 passes through the top of the tube body 1 and is connected with a pressing push block 4 on the outer side, the other end of the tube body 1 is connected with a mounting seat 5, a high-density nano-wafer 6 is embedded and bonded in the middle of the bottom of the mounting seat 5, a fixing block 7 is arranged on the inner side wall of the tube body 1, a limiting block 10 is connected with the upper end of the fixing block 7 through a telescopic rod 8, a spring 9 is sleeved on the outer side of the telescopic rod 8, a limiting ring 11 is arranged on the push rod 2 and between the pressing push block 4 and the tube body 1, the left lower end of the limiting ring 11 is connected with a connecting rod 12, the quantity of fixed block 7, telescopic link 8, spring 9 and stopper 10 all sets up to two, and all be left and right axisymmetric setting about push rod 2, the quantity of connecting rod 12 sets up to two, two connecting rods 12 are left and right axisymmetric setting about spacing ring 11, briquetting 3 all around with the inside wall of body 1 contact, but do not link to each other, mount pad 5 is located the below of fixed block 7, briquetting 3 is located the top of stopper 10, mount pad 5 all around with the inside wall of body 1 contact, but do not link to each other, utilize the interaction between them, thereby can realize contacting skin repeatedly high density nanometer wafer 6, and open skin passageway through the vibration, carry the active ingredient of leading in the product to the required position, the product absorption effect has been improved.

The working principle and the using flow of the utility model are as follows: when the device is used, the pressing block 4 is manually pushed to drive the pressing block 3 on the push rod 2 to move downwards along the inner wall of the pipe body 1, the high-density nano wafer 6 on the mounting seat 5 moves downwards to extend out of the pipe body 1 and contact with human skin, meanwhile, the bottom of the pressing block 3 presses the limiting block 10 and drives the telescopic rod 8 to move downwards to shrink, the spring 9 is compressed while the telescopic rod 8 moves downwards, when hands are released from the pressing block 4, the push rod 2 and the mounting seat 5 are reset through the compressed spring 9, the skin contacting action is repeated back and forth, the skin channel is opened through vibration, the effective components of the introduced product are conveyed to a required position, the product absorbing effect is improved, and the content which is not described in detail in the specification belongs to the prior art known by a person skilled in the art.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a mounting structure of high density nanometer wafer external member, includes body (1), its characterized in that: the inside of body (1) is provided with briquetting (3), the centre department through-connection of briquetting (3) has push rod (2), the top of body (1) is passed to the upper end of push rod (2) and is connected with push block (4) in the outside, the other end of body (1) is connected with mount pad (5), inlay in the middle of the bottom of mount pad (5) and establish bonding have high density nanometer wafer (6), be provided with fixed block (7) on the inside wall of body (1), the upper end of fixed block (7) is connected with stopper (10) through telescopic link (8), the outside cover of telescopic link (8) is equipped with spring (9), be provided with spacing ring (11) on push rod (2) and between push block (4) and body (1) are pressed to be located, the left lower extreme of spacing ring (11) is connected with connecting rod (12).

2. The mounting structure of a high-density nano-wafer kit according to claim 1, wherein: the number of the fixing blocks (7), the telescopic rods (8), the springs (9) and the limiting blocks (10) is two, and the fixing blocks, the telescopic rods, the springs (9) and the limiting blocks are symmetrically arranged on the push rod (2) in a left-right axis mode.

3. The mounting structure of a high-density nano-wafer kit according to claim 1, wherein: the number of the connecting rods (12) is two, and the two connecting rods (12) are arranged in a bilateral axisymmetric mode relative to the limiting circular ring (11).

4. The mounting structure of a high-density nano-wafer kit according to claim 1, wherein: the periphery of the pressing block (3) is in contact with the inner side wall of the pipe body (1) but is not connected with the inner side wall.

5. The mounting structure of a high-density nano-wafer kit according to claim 1, wherein: the mounting seat (5) is located below the fixed block (7), and the pressing block (3) is located above the limiting block (10).

6. The mounting structure of a high-density nano-wafer kit according to claim 1, wherein: the periphery of the mounting seat (5) is contacted with the inner side wall of the pipe body (1) but is not connected with the inner side wall.