CN219457604U - Pressing plate for electronic component - Google Patents

Abstract

The utility model discloses a pressing plate for an electronic element, which comprises an insulating body and a pressing plate embedded in the insulating body, wherein the pressing plate comprises a pressing plate body and a pressing plate body: a through hole is longitudinally formed in the middle part of the insulating body, a through hole is correspondingly formed in the pressurizing sheet, the through hole and the through hole are used for a joint piece to pass through and are locked and connected with a fixing piece, and two ends of the pressurizing sheet respectively form a pressing end extending downwards and obliquely; the bottom surface of the insulating body forms a containing groove for sleeving an electronic element between the middle part and a pair of side walls and corresponding to the lower positions of the pair of pressing ends respectively: and the inner surface of each side wall transversely extends out of at least one elastic clamping piece towards the accommodating groove, so that each electronic element is elastically clamped between the inner surface of the middle part and the at least one elastic clamping piece.

Description

Pressing plate for electronic component

Technical Field

The present utility model relates to a platen, and more particularly, to a platen for an electronic component, which secures an electronic component, such as a power crystal, to a fixture, such as a heat sink, and maintains the electronic component in contact with the fixture.

Background

In order to solve the heat dissipation requirement, electronic devices, such as power crystals, typically attach the power crystal to a fixing member, such as a heat sink, so that the heat generated by the power crystal is cooled by the heat sink. In addition, the power crystal and the heat sink often have poor bonding contact, so that the heat dissipation effect is greatly reduced.

Based on the foregoing drawbacks, a pressure plate is proposed by those skilled in the art to apply a pressure to the power crystal and the heat sink to obtain a fixed function. Please refer to fig. 1 and 2, which show an exploded perspective view of the electronic component, the fixing member and the pressing plate, and an assembled perspective view, respectively. As shown in fig. 1, a fixing member 20, such as a heat sink, has two or more electronic components 20, such as power crystals, disposed on a top surface thereof. The pressing plate 30 is an elongated sheet body, and is provided with at least one through hole 301 in a longitudinal direction, and the heat sink 20 is provided with a connecting hole 201 corresponding to each through hole 301;

when assembled, two power crystals 10 are arranged on the top surface of the heat sink 20 at intervals: next, the pressing plate 30 is placed on the top surfaces of the two power crystals 10; finally, a joint member 302, such as a bolt, passes through the through hole 301 and is fixedly connected to the connecting hole 201, so that the pressing plate 30 presses the power crystals 10 below to enable the adjacent surfaces of the power crystals 10 and the heat sink 20 to form a close contact state as shown in fig. 2, thereby overcoming the defect of poor heat dissipation caused by poor contact. However, this platen 30 also has potential drawbacks in operation as follows:

(1) The pressing plate 30 is formed by stamping a metal sheet, and is not suitable for being used as a pressurizing and fixing element because of the conduction function of the material of the pressing plate;

(2) The structural strength of the pressing plate 30 is higher than that of the power crystal 10, so that the pressing plate 30 is easy to break and damage the power crystal 10 if excessively locked;

(3) The pressing plate 30 does not provide a corresponding positioning structure for the power crystals 10, so that the power crystals 10 are easy to skew after the locking operation;

(4) In particular, when the pressing plate 30 is assembled to the heat sink 20, the components are easily scattered and dropped into an electronic device, such as a server, which is difficult to pick up due to limited internal space.

Accordingly, based on the foregoing drawbacks of the platen 30, improvement of the related art professionals is needed.

Disclosure of Invention

The main object of the present utility model is to provide a pressure plate for electronic components, which has an insulation for electronic components such as power crystals; in addition, the buffer can be provided when the electronic component is combined with the fixing piece, such as the radiating fin, so as to avoid the risk of cracking and damage of the electronic component, and the electronic component is provided with a pre-positioning function, so that the electronic component is prevented from being skewed after being assembled, the trouble of being scattered and falling into the electronic equipment is avoided, and the convenience of assembly is improved.

In order to achieve the above-mentioned object, the present utility model provides a pressing plate for electronic devices, which comprises an insulating body and a pressing plate embedded in the insulating body: a through hole is longitudinally formed in the middle part of the insulating body, a through hole is correspondingly formed in the pressurizing sheet, the through hole and the through hole are used for a joint piece to pass through and are locked and connected with a fixing piece, and two ends of the pressurizing sheet respectively form a pressing end extending downwards and obliquely; the bottom surface of the insulating body forms a containing groove for sleeving an electronic element between the middle part and a pair of side walls and corresponding to the lower positions of the pair of pressing ends respectively: and the inner surface of each side wall transversely extends out of at least one elastic clamping piece towards the accommodating groove, so that each electronic element is elastically clamped between the inner surface of the middle part and the at least one elastic clamping piece.

In one embodiment, the electronic device is a power crystal and the fixing member is a heat sink.

In one embodiment, the through hole forms a flange at the top periphery of the insulating body, the flange is used for sleeving in a plate hole of a plate and can accommodate a head of a joint piece.

In one embodiment, the board is a printed circuit board; the middle part of the pressing plate longitudinally protrudes at least two elastic hooks at intervals around the peripheral surface of the flange so as to be fastened in the plate hole, wherein a communicated fastening groove is arranged at the position of the plate hole corresponding to each elastic hook, and each fastening groove is used for fastening a corresponding elastic hook so as to form the connection between the pressing plate and the printed circuit board.

In an embodiment, at least two pins of each electronic component are respectively inserted into a pin hole correspondingly arranged in the board.

In one embodiment, one end of each of the accommodating grooves is open and the inner surface adjacent to the middle part and/or the side wall transversely extends out of a baffle plate towards the accommodating groove.

In an embodiment, a bottom edge of the electronic component located in the accommodating groove protrudes from a bottom edge of the middle portion.

Drawings

FIG. 1 is an exploded perspective view of a prior art platen, electronic component and fixture;

FIG. 2 is a perspective view of the pressure plate, electronic component and fixture of FIG. 1 assembled;

FIG. 3 is a perspective view of a platen for electronic components of the present utility model;

FIG. 4 is a perspective view of another view of the platen for electronic components of the present utility model;

FIG. 5 is a cross-sectional view of FIG. 3 taken along line A-A;

FIG. 6 is a cross-sectional view taken along line B-B of FIG. 3;

FIGS. 7-10 are schematic views of the operational flow of the assembly of the platen, electronic component and fixture of the present utility model;

fig. 11 is a cross-sectional view of fig. 10 taken along line C-C.

Detailed Description

The present utility model will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present utility model more apparent.

As shown in fig. 3 to 6, basically, the pressing plate 3 for electronic components of the present utility model includes an insulating body 31, and a pressing plate 32 (shown in fig. 5) embedded in the insulating body 31.

The pressing plate 3 is made of plastic, such as nylon, and the pressing plate 32 is embedded in the insulating body 31 by an embedded injection molding technology. As shown in fig. 3 to fig. 6, a through hole 312 is longitudinally formed in a middle portion 311 of the insulating body 31, and the pressing plate 32 is preferably formed by punching a metal sheet, such as an iron sheet, in which a through hole 321 is correspondingly formed in the through hole 312, and the through hole 312 and the through hole 321 are provided for a joint member 33 (as shown in fig. 7 and fig. 9), such as a bolt, to pass through and be used for locking a fixing member 20, such as a joint hole 201 formed at a position of the heat sink 20 corresponding to the through hole 321, so that the pressing plate 3 is fixed on the heat sink 20. Wherein, the pressing plate 32 is formed with pressing ends 322 extending obliquely downward at both ends thereof.

The through hole 312 forms a flange 313 at the top periphery of the insulating body 31, and the flange 313 can accommodate a head 331 of the connector 33 to prevent the head 311 from touching other electronic components, thereby preventing the risk of short circuit, and the flange 313 can be further sleeved in a plate 40 (shown in fig. 7), such as a plate hole 401 preset in the printed circuit board 40.

Furthermore, referring to fig. 4 and 5, the bottom surface of the insulating body 31 forms a receiving groove 314 between the middle portion 311 and the pair of side walls 315 and at a position corresponding to the lower positions of the pair of pressing ends 322. Each of the accommodating grooves 314 is configured for accommodating and positioning an electronic device 10, for example, a power crystal 10, wherein one end of each of the accommodating grooves 314 is open and is adjacent to the middle portion 311 and/or the inner surface of the sidewall 315, and a blocking piece 316 laterally extends towards the accommodating groove 314, and each of the blocking pieces 316 is configured for being sleeved in the accommodating groove 314 and abutted against the power crystal 10, so as to provide a limiting effect.

In addition, the inner surface of each side wall 315 extends laterally toward the accommodating groove 314 to form at least one elastic clip 317. As shown in fig. 4, the at least one elastic clamping piece 317 is two pieces, and is disposed at intervals. Therefore, when a power crystal 10 is sleeved in the accommodating groove 314, one end of the power crystal 10 abuts against the at least one baffle 316 and is elastically clamped between the inner surface of the middle portion 311 and the at least one elastic clamping piece 317, so as to prevent the power crystal 10 from falling out of the accommodating groove 314 and provide a predetermined function for the power crystal 10, thereby preventing the power crystal 10 from being skewed after assembly and preventing the power crystal 10 from falling into an electronic device.

Further, the bottom edge of the power crystal 10 located in the accommodating groove 314 protrudes from the bottom edge of the middle portion 311 (as shown in fig. 8). This allows the bonding member 33 to be locked, and the bonding member 33 cannot be rotated when the bottom edge of the middle portion 311 contacts the heat sink 20, so as to provide a buffering effect, and avoid the risk of cracking and damaging the power crystal 10 due to excessive compression.

Referring to fig. 3 and 6, the middle portion 311 longitudinally protrudes at least two elastic hooks 318, such as a pair of elastic hooks 318 disposed opposite to each other, around the outer peripheral surface of the flange 313, so as to fasten the platen 3 in the plate hole 401, wherein the plate hole 401 is provided with a communicating fastening slot 402 corresponding to each elastic hook 318, and each fastening slot 402 is used for fastening a corresponding elastic hook 318 to form a connection between the platen 3 and the printed circuit board 40.

Referring to fig. 7 to 10, a schematic operation flow of assembling the plate 40, the pressing plate 3, the electronic component 10 and the fixing member 20 is shown. As shown in fig. 7 and 8, the flange 313 of the pressing plate 3 is first inserted into the plate hole 401 of the plate 40, and during the insertion process, the at least two elastic hooks 318 are respectively fastened in the fastening slots 402 correspondingly disposed in the plate hole 401. The platen 3 is attached to a bottom surface of the plate 40 (shown in fig. 8). Then, two electronic devices 10, such as power transistors 10, are assembled in the above-mentioned manner, and each power transistor 10 is sleeved in one of the above-mentioned accommodating grooves 314, and one end of each power transistor 10 is abutted against the at least one baffle 316 and elastically clamped between the inner surface of the middle portion 311 and the at least one elastic clamping piece 317, so as to provide a pre-positioning function for the power transistor 10. In the foregoing plugging process, at least two pins 101 of each power crystal 10 are plugged into a pin hole 403 correspondingly disposed in the board 40. As is apparent from fig. 8, the bottom edge of the power crystal 10 protrudes from the bottom edge of the middle portion 311.

Subsequently, as shown in fig. 9 and 10, a joint member 33, such as a bolt, is inserted through the through hole 312 of the insulating body 31 and the through hole 321 of the pressing plate 32, and is locked to a fixing member 20, such as a connecting hole 201 of the heat sink 20, so that the pressing plate 3 is fixed to the heat sink 20. As can be clearly seen in fig. 10, the head 331 of the connector 33 is accommodated in the flange 313 to avoid contact with other electronic components.

As shown in fig. 11, which shows a cross-sectional view of fig. 10 taken along line C-C, it can be clearly seen that each of the pressing ends 322 at both ends of the pressing plate 32 can indirectly apply an appropriate pressure to the power crystal 10, so that each of the power crystals 10 and the heat sink 20 can provide buffering when combined, so as to avoid the risk of cracking and damaging each of the power crystals 10.

Therefore, the utility model achieves the effect that the insulating body and the pressurizing sheet are integrally formed by plastic through the embedded injection molding technology, so that the insulating body has the insulating effect on electronic elements such as power crystals. Furthermore, when the pressing plate is combined with the fixing piece, such as the radiating fin, the buffer can be provided by the height difference design of the middle part of the insulating body and the power chip, so that the risk of cracking and damage of the electronic element is avoided. Furthermore, by additionally arranging the elastic clamping piece on one side in each accommodating groove, each power crystal forms a preset function in an elastic clamping mode, so that the electronic element is prevented from being skewed after being assembled, and the electronic element is not scattered and falls into the electronic equipment, and is a preferable structure which is not seen before like articles.

The foregoing description of the embodiments has been provided for the purpose of illustrating the general principles of the utility model, and is not meant to limit the utility model thereto, but to limit the utility model thereto, and any modifications, equivalents, improvements and equivalents thereof may be made without departing from the spirit and principles of the utility model.

Claims (7)

1. The pressing plate for the electronic element is characterized by comprising an insulating body and a pressing plate embedded in the insulating body: a through hole is longitudinally formed in the middle part of the insulating body, a through hole is correspondingly formed in the pressurizing sheet, the through hole and the through hole are used for a joint piece to pass through and are locked and connected with a fixing piece, and two ends of the pressurizing sheet respectively form a pressing end extending downwards and obliquely; the bottom surface of the insulating body forms a containing groove for sleeving an electronic element between the middle part and a pair of side walls and corresponding to the lower positions of the pair of pressing ends respectively: and the inner surface of each side wall transversely extends out of at least one elastic clamping piece towards the accommodating groove, so that each electronic element is elastically clamped between the inner surface of the middle part and the at least one elastic clamping piece.

2. The platen of claim 1, wherein the electronic component is a power crystal and the fixture is a heat sink.

3. The platen for electronic components as recited in claim 1, wherein the through hole forms a flange at a top periphery of the insulating body, the flange being adapted to fit into a plate hole of a plate material and to receive a head of a joint member.

4. A platen for electronic components as recited in claim 3, wherein the sheet is a printed circuit board; the middle part of the pressing plate longitudinally protrudes at least two elastic hooks at intervals around the peripheral surface of the flange so as to be fastened in the plate hole, wherein a communicated fastening groove is arranged at the position of the plate hole corresponding to each elastic hook, and each fastening groove is used for fastening a corresponding elastic hook so as to form the connection between the pressing plate and the printed circuit board.

5. The board of claim 3, wherein at least two pins of each electronic component are inserted into corresponding pin holes of the board.

6. The platen for electronic components as recited in claim 1, wherein one end of each of the receiving grooves is opened and an inner surface adjacent to the middle portion and/or the side wall extends laterally toward the receiving groove for a blocking piece.

7. The platen for electronic components as recited in claim 1, wherein bottom edges of the electronic components located in the receiving groove protrude from bottom edges of the intermediate portion.