CN219442220U - High-efficiency ultrasonic atomization scheme conforming to safety regulations - Google Patents
High-efficiency ultrasonic atomization scheme conforming to safety regulations Download PDFInfo
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- CN219442220U CN219442220U CN202320327191.7U CN202320327191U CN219442220U CN 219442220 U CN219442220 U CN 219442220U CN 202320327191 U CN202320327191 U CN 202320327191U CN 219442220 U CN219442220 U CN 219442220U
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- atomization
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high-efficiency ultrasonic atomization scheme conforming to safety regulations, which comprises a hardware heat radiation plate, an atomization sheet and an atomization circuit board; the atomizing sheet is arranged on the hardware radiating plate; a shielding bin is arranged on the hardware radiating plate; the atomization circuit board is arranged at the shielding bin; an atomizing sheet driving module and a fan control module arranged below the atomizing sheet driving module are arranged on the atomizing circuit board; the atomizing sheet driving module is arranged in the shielding bin so as to shield electromagnetic radiation; the corresponding end of the atomizing sheet driving module is electrically connected with the corresponding end of the atomizing sheet. The utility model adopts a separate excitation mode to work, has high atomization efficiency, low cost and high flexibility; the hardware heat dissipation plate can quickly dissipate heat, so that the heat generated by the circuit board can be quickly dissipated into the air, and the heat dissipation effect is good; the shielding bin arranged on the hardware radiating plate can shield electromagnetic radiation of the circuit board, shield electromagnetic signals generated by other excitation type work, and has small radiation.
Description
Technical Field
The utility model relates to the technical field of atomization, in particular to an ultrasonic atomization scheme which is high in efficiency and accords with safety regulations.
Background
In daily life, ultrasonic atomizer can be used in fields such as humidification, perfuming, sterilization, decoration, medical atomization, electron cigarette, and at present ultrasonic atomization trade has self-excitation mode work and other excitation mode work, however self-excitation type atomization efficiency is low, and is with high costs, and secondly when the atomizer is in the design, the circuit board is direct to laminate with the atomizing board to do not set up shielding storehouse, to the electromagnetic radiation of circuit board circuit, will lead to the radiation great like this.
Disclosure of Invention
Aiming at the problems existing in the prior art, the utility model provides an ultrasonic atomization scheme which is high in efficiency and accords with safety regulations.
In order to achieve the above purpose, the technical scheme of the utility model is as follows:
an ultrasonic atomization scheme with high efficiency and compliance with safety regulations comprises a hardware heat radiation plate, an atomization sheet and an atomization circuit board;
the atomizing sheet is arranged on the hardware radiating plate; a shielding bin is arranged on the hardware radiating plate; the atomization circuit board is arranged at the shielding bin;
an atomizing sheet driving module and a fan control module arranged below the atomizing sheet driving module are arranged on the atomizing circuit board; the atomizing sheet driving module is arranged in the shielding bin so as to shield electromagnetic radiation; the corresponding end of the atomizing sheet driving module is electrically connected with the corresponding end of the atomizing sheet.
Preferably, the atomizing sheet is also provided with an atomizing sheet gland.
Preferably, the hardware heat dissipation plate is provided with a round hole, an atomization piece screw hole and a hardware heat dissipation plate fixing hole; the atomizing sheet is arranged at the round hole; atomizing piece fixed screw hole, five metals heating panel fixed orifices set up around the round hole.
Preferably, the atomizing sheet driving module comprises an MCU and an atomizing sheet driving unit; the corresponding end of the MCU is electrically connected with the corresponding end of the atomizing sheet driving unit;
preferably, the model of the MCU is PX8F073.
Preferably, the atomizing sheet driving unit comprises an atomizing sheet driving circuit, and the atomizing sheet driving circuit comprises a resistor R5, a resistor R7, a resistor R9, a resistor R10, a capacitor C5, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C15, magnetic beads L1, an inductor L2, a field effect transistor Q1 and a crystal oscillator FOG; one end of the magnetic bead L1 is electrically connected with one end of the capacitor C5, and the other end of the magnetic bead L1 is electrically connected with one end of the capacitor C7, one end of the inductor L2 and the drain electrode of the field effect transistor Q1 respectively; the other end of the capacitor C5 is grounded; the other end of the capacitor C7 is grounded through a resistor R7; the other end of the inductor L2 is electrically connected with a capacitor C15 and one end of the crystal oscillator FOG through a capacitor C8 respectively; the other end of the crystal oscillator FOG is electrically connected with the other end of the capacitor C15 and grounded; the source electrode of the field effect tube Q1 is respectively and electrically connected with one end of a capacitor C9 and one end of a resistor R10, and the other end of the resistor R10 is electrically connected with the other end of the capacitor C9 and grounded; the grid electrode of the field effect transistor Q1 is respectively and electrically connected with one end of a resistor R9 and the corresponding end of the MCU through a resistor R5; the other end of the resistor R9 is grounded.
Preferably, the fan control module comprises a fan control circuit, and the corresponding end of the fan control circuit is electrically connected with the corresponding end of the MCU; the FAN control circuit comprises a FAN interface, a resistor R4, a resistor R6, a resistor R8, a resistor R16, a resistor R19, a triode Q2 and a triode Q3; the first end of the triode Q3 is electrically connected with the 1 st end of the FAN interface, and the second end of the triode Q3 is electrically connected with one end of the resistor R16 and one end of the resistor R19 respectively; the third end of the triode Q3 is respectively and electrically connected with the first end of the triode Q2 and one end of the resistor R8 through the resistor R4; the other end of the resistor R16 is electrically connected with the 2 nd end of the FAN interface; the other end of the resistor R19 is electrically connected with the second end of the triode Q2; the third end of the triode Q2 is electrically connected with the corresponding end of the MCU through a resistor R6.
Preferably, the atomization circuit board is also provided with a power interface, an atomization sheet interface and a control interface; the atomizing piece interface sets up in atomizing circuit board upper end, and this atomizing piece interface is other to be equipped with atomizing piece drive unit, this atomizing piece drive unit below be equipped with MCU, this MCU both sides are equipped with power source, fan interface, are equipped with control interface under.
Preferably, the material of five metals heating panel is aluminum alloy, is convenient for dispel the heat and electromagnetic radiation shields, the atomizing piece is ceramic atomizing piece.
The technical scheme of the utility model has the following beneficial effects: the utility model adopts a separate excitation mode to work, has high atomization efficiency, low cost and high flexibility; the hardware heat dissipation plate can quickly dissipate heat, so that the heat generated by the circuit board can be quickly dissipated into the air, and the heat dissipation effect is good; the shielding bin arranged on the hardware radiating plate can shield electromagnetic radiation of the circuit board, electromagnetic signals generated by other excitation type work are shielded, and the radiation is small, so that the whole scheme can meet the safety certification.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of a hardware heat dissipation plate according to the present utility model;
FIG. 3 is a schematic diagram of a hardware heat dissipation plate according to the present utility model;
FIG. 4 is a schematic diagram of an atomization circuit board structure according to the present utility model;
FIG. 5 is a schematic diagram of a second embodiment of an atomization circuit board structure;
FIG. 6 is a schematic circuit diagram of the MCU of the present utility model;
FIG. 7 is a schematic diagram of an atomizer plate drive circuit according to the present utility model;
FIG. 8 is a schematic diagram of a fan control circuit according to the present utility model;
FIG. 9 is a second schematic diagram of the structure of the present utility model;
FIG. 10 is a schematic diagram of a second embodiment of an atomization circuit board according to the present utility model;
FIG. 11 is a schematic diagram II of a second embodiment of an atomization circuit board;
FIG. 12 is a schematic diagram of a hardware heat sink and an atomization circuit board according to the present utility model;
fig. 13 is a second schematic diagram of the installation of the hardware heat dissipation plate and the atomization circuit board of the present utility model.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, a first feature is "on" or "to a second feature unless explicitly specified and defined otherwise
"under" may include the first and second features being in direct contact, or may include the first and second features not being in direct contact but being in contact by another feature therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
Example 1:
referring to fig. 1 to 12, the utility model provides a high-efficiency and safety-compliant ultrasonic atomization scheme, which comprises a hardware heat radiation plate 1, an atomization sheet 2 and an atomization circuit board 3;
the atomizing sheet 2 is arranged on the hardware radiating plate 1; a shielding bin 104 is arranged on the hardware radiating plate 1; the atomization circuit board 3 is arranged at the shielding bin 104; the hardware radiating plate 1 is made of aluminum alloy, so that radiating and electromagnetic radiation shielding are facilitated, and the atomizing sheet 2 is a ceramic atomizing sheet; the atomizing circuit board 3 is provided with an atomizing sheet driving module 100 and a fan control module 200 arranged below the atomizing sheet driving module 100; the atomizing sheet driving module 100 is arranged in the shielding bin and is used for shielding electromagnetic radiation to make the electromagnetic radiation small; the corresponding end of the atomizing sheet driving module 100 is electrically connected with the corresponding end of the atomizing sheet 2.
An atomizing sheet pressing cover (not shown in the figure) is further mounted on the atomizing sheet 2 and used for pressing the atomizing sheet, and a round hole 101, an atomizing sheet screw hole 103 and a hardware heat dissipation plate fixing hole 102 are formed in the hardware heat dissipation plate 1; the atomizing sheet 2 is arranged at the round hole 101; the atomizing piece fixed screw hole 103, the setting of five metals heating panel fixed orifices 102 around round hole 101, atomizing piece 2 passes atomizing piece fixed screw hole through the screw and fixes on five metals heating panel 1, and installation screw is fixed on the finished product machine on five metals heating panel 1 passes through five metals heating panel fixed orifices 102.
Referring to fig. 5-6, the atomizing sheet driving module 100 includes an MCU, an atomizing sheet driving unit; the corresponding end of the MCU is electrically connected with the corresponding end of the atomizing sheet driving unit; the atomizing circuit board 1 is also provided with a power interface, an atomizing sheet interface and a control interface; the atomizing piece interface sets up in atomizing circuit board 1 upper end, and this atomizing piece interface is other to be equipped with atomizing piece drive unit, this atomizing piece drive unit below be equipped with MCU, this MCU both sides are equipped with power source, fan interface, are equipped with control interface under. The model of the MCU is PX8F073.
Referring to fig. 7, the atomizing sheet driving unit in the embodiment is used to control the operation of the atomizing sheet; the atomizing sheet driving unit comprises an atomizing sheet driving circuit 110, wherein the atomizing sheet driving circuit 110 comprises a resistor R5, a resistor R7, a resistor R9, a resistor R10, a capacitor C5, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C15, magnetic beads L1, an inductor L2, a field effect transistor Q1 and a crystal oscillator FOG; one end of the magnetic bead L1 is electrically connected with one end of the capacitor C5, and the other end of the magnetic bead L1 is electrically connected with one end of the capacitor C7, one end of the inductor L2 and the drain electrode of the field effect transistor Q1 respectively; the other end of the capacitor C5 is grounded; the other end of the capacitor C7 is grounded through a resistor R7; the other end of the inductor L2 is electrically connected with a capacitor C15 and one end of the crystal oscillator FOG through a capacitor C8 respectively; the other end of the crystal oscillator FOG is electrically connected with the other end of the capacitor C15 and grounded; the source electrode of the field effect tube Q1 is respectively and electrically connected with one end of a capacitor C9 and one end of a resistor R10, and the other end of the resistor R10 is electrically connected with the other end of the capacitor C9 and grounded; the grid electrode of the field effect transistor Q1 is respectively and electrically connected with one end of a resistor R9 and the corresponding end of the MCU through a resistor R5; the other end of the resistor R9 is grounded.
Referring to fig. 8, the fan control module 200 includes a fan control circuit 210, and a corresponding end of the fan control circuit 210 is electrically connected to a corresponding end of the MCU; the FAN control circuit comprises a FAN interface, a resistor R4, a resistor R6, a resistor R8, a resistor R16, a resistor R19, a triode Q2 and a triode Q3; the first end of the triode Q3 is electrically connected with the 1 st end of the FAN interface, and the second end of the triode Q3 is electrically connected with one end of the resistor R16 and one end of the resistor R19 respectively; the third end of the triode Q3 is respectively and electrically connected with the first end of the triode Q2 and one end of the resistor R8 through the resistor R4; the other end of the resistor R16 is electrically connected with the 2 nd end of the FAN interface; the other end of the resistor R19 is electrically connected with the second end of the triode Q2; the third end of the triode Q2 is electrically connected with the corresponding end of the MCU through a resistor R6.
Example 2:
referring to fig. 9 to 11, the utility model provides an ultrasonic atomization scheme which is high in efficiency and accords with safety regulations, wherein an atomization circuit board II S3 is arranged at a shielding bin of a hardware heat dissipation plate II S1, and the atomization circuit board II S3 comprises an atomization driving circuit, an atomization interface and a power interface which are arranged at two sides of the atomization driving circuit, a MCU II arranged below the atomization driving circuit and an anhydrous detection interface which is arranged at the right side of the MCU II; the specific circuit of the atomization driving circuit and the specific circuit of the MCU II are identical with the specific circuit disclosed in the embodiment 1, and the difference point of the specific circuit is that the whole atomization circuit board II S3 is placed at the shielding bin of the hardware heat dissipation board II S1 in the embodiment 2, and the size of the atomization circuit board II S3 is reduced and improved.
Referring to fig. 12, the high-efficiency and safety-compliant ultrasonic atomization scheme disclosed in fig. 12 is different from embodiment 1 in that the morphology of the atomization circuit board three is changed, and referring to fig. 13, the high-efficiency and safety-compliant ultrasonic atomization scheme disclosed in fig. 13 is different from embodiment 2 in that the morphology of the atomization circuit board three is changed.
According to the embodiment, the utility model works in a separate excitation mode, so that the atomization efficiency is high, the cost is low, and the flexibility is high; the hardware heat dissipation plate can quickly dissipate heat, so that the heat generated by the circuit board can be quickly dissipated into the air, and the heat dissipation effect is good; the shielding bin arranged on the hardware radiating plate can shield electromagnetic radiation of the circuit board, electromagnetic signals generated by other excitation type work are shielded, and the radiation is small, so that the whole scheme can meet the safety certification.
The foregoing description is only of the preferred embodiments of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structural changes made by the description of the present utility model and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (8)
1. The ultrasonic atomization scheme is characterized by comprising a hardware heat radiation plate, an atomization sheet and an atomization circuit board;
the atomizing sheet is arranged on the hardware radiating plate; a shielding bin is arranged on the hardware radiating plate; the atomization circuit board is arranged at the shielding bin;
an atomizing sheet driving module and a fan control module arranged below the atomizing sheet driving module are arranged on the atomizing circuit board; the atomizing sheet driving module is arranged in the shielding bin so as to shield electromagnetic radiation; the corresponding end of the atomizing sheet driving module is electrically connected with the corresponding end of the atomizing sheet.
2. The high-efficiency and safety-compliant ultrasonic atomization scheme as claimed in claim 1, wherein the hardware heat dissipation plate is provided with a round hole, an atomization piece screw hole and a hardware heat dissipation plate fixing hole; the atomizing sheet is arranged at the round hole; atomizing piece fixed screw hole, five metals heating panel fixed orifices set up around the round hole.
3. The high-efficiency and safety-compliant ultrasonic atomization scheme of claim 1 wherein said atomizing sheet drive module comprises an MCU, an atomizing sheet drive unit; the MCU corresponding end is electrically connected with the atomizing sheet driving unit corresponding end.
4. The efficient and safety-compliant ultrasonic atomization scheme of claim 3 wherein the MCU is model number PX8F073.
5. The efficient and safety-compliant ultrasonic atomizing scheme according to claim 4, wherein the atomizing sheet driving unit comprises an atomizing sheet driving circuit comprising a resistor R5, a resistor R7, a resistor R9, a resistor R10, a capacitor C5, a capacitor C7, a capacitor C8, a capacitor C9, a capacitor C15, a magnetic bead L1, an inductor L2, a field effect transistor Q1, and a crystal oscillator FOG; one end of the magnetic bead L1 is electrically connected with one end of the capacitor C5, and the other end of the magnetic bead L1 is electrically connected with one end of the capacitor C7, one end of the inductor L2 and the drain electrode of the field effect transistor Q1 respectively; the other end of the capacitor C5 is grounded; the other end of the capacitor C7 is grounded through a resistor R7; the other end of the inductor L2 is electrically connected with a capacitor C15 and one end of the crystal oscillator FOG through a capacitor C8 respectively; the other end of the crystal oscillator FOG is electrically connected with the other end of the capacitor C15 and grounded; the source electrode of the field effect tube Q1 is respectively and electrically connected with one end of a capacitor C9 and one end of a resistor R10, and the other end of the resistor R10 is electrically connected with the other end of the capacitor C9 and grounded; the grid electrode of the field effect transistor Q1 is respectively and electrically connected with one end of a resistor R9 and the corresponding end of the MCU through a resistor R5; the other end of the resistor R9 is grounded.
6. The efficient and safety-compliant ultrasonic atomizing scheme of claim 5, wherein the fan control module comprises a fan control circuit having a corresponding end electrically connected to a corresponding end of the MCU; the FAN control circuit comprises a FAN interface, a resistor R4, a resistor R6, a resistor R8, a resistor R16, a resistor R19, a triode Q2 and a triode Q3; the first end of the triode Q3 is electrically connected with the 1 st end of the FAN interface, and the second end of the triode Q3 is electrically connected with one end of the resistor R16 and one end of the resistor R19 respectively; the third end of the triode Q3 is respectively and electrically connected with the first end of the triode Q2 and one end of the resistor R8 through the resistor R4; the other end of the resistor R16 is electrically connected with the 2 nd end of the FAN interface; the other end of the resistor R19 is electrically connected with the second end of the triode Q2; the third end of the triode Q2 is electrically connected with the corresponding end of the MCU through a resistor R6.
7. The high-efficiency and safety-compliant ultrasonic atomization scheme as claimed in claim 6, wherein the atomization circuit board is further provided with a power interface, an atomization sheet interface and a control interface; the atomizing piece interface sets up in atomizing circuit board upper end, and this atomizing piece interface is other to be equipped with atomizing piece drive unit, this atomizing piece drive unit below be equipped with MCU, this MCU both sides are equipped with power source, fan interface, are equipped with control interface under.
8. The efficient and safety-compliant ultrasonic atomizing scheme as recited in claim 2, wherein said hardware heat dissipating plate is made of aluminum alloy for heat dissipation and electromagnetic radiation shielding, and said atomizing plate is a ceramic atomizing plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320327191.7U CN219442220U (en) | 2023-02-27 | 2023-02-27 | High-efficiency ultrasonic atomization scheme conforming to safety regulations |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320327191.7U CN219442220U (en) | 2023-02-27 | 2023-02-27 | High-efficiency ultrasonic atomization scheme conforming to safety regulations |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219442220U true CN219442220U (en) | 2023-08-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320327191.7U Active CN219442220U (en) | 2023-02-27 | 2023-02-27 | High-efficiency ultrasonic atomization scheme conforming to safety regulations |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219442220U (en) |
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- 2023-02-27 CN CN202320327191.7U patent/CN219442220U/en active Active
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