CN219437246U - Integrated chip for maintaining mobile phone face-holding assembly - Google Patents
Integrated chip for maintaining mobile phone face-holding assembly Download PDFInfo
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- CN219437246U CN219437246U CN202223304748.XU CN202223304748U CN219437246U CN 219437246 U CN219437246 U CN 219437246U CN 202223304748 U CN202223304748 U CN 202223304748U CN 219437246 U CN219437246 U CN 219437246U
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Abstract
The utility model provides an integrated chip for maintaining a mobile phone face component, which comprises a face component flat cable board. The utility model has the advantages that: the traditional market material replacement is that the size of the chip is smaller, the marked 1-pin position can be well subjected to one-pin distinguishing corresponding welding maintenance by means of a microscope, the 1-pin position is not needed to be considered excessively, the 1-pin is a fixed position, the one-pin installation position can be distinguished by naked eyes according to the appearance, and the installation is more convenient and simpler; the traditional material is welded twice, and because the height of a welded tin ball is not easy to control, the installation material is easy to be thicker after multiple times of welding, so that the assembled material is easy to crush the surface glass of the chip, and the functional disorder is caused. And the integrated chip reduces the welding times, so that the height is close to the original height, the interference problem is avoided, the maintenance risk is effectively reduced, and the maintenance yield is greatly improved.
Description
Technical Field
The utility model relates to the technical field of integrated chips, in particular to an integrated chip for maintaining a mobile phone face-holding component.
Background
With the advent of the digital age, cell phones became an indispensable communication tool for everyone. In order to make the mobile phone safer and more efficient, the mobile phone face recognition technology comes to make the mobile phone safer and more efficient, and the mobile phone face recognition technology is more and more important, so that the mobile phone face recognition technology becomes an indispensable function in the use of the mobile phone. However, the problem that the face recognition technology of the mobile phone is easy to break down, so that the face recognition technology cannot be used, for example, a mobile phone of a certain brand can cause the face recognition to fail if the mobile phone enters water when being wet.
Most of the problems are that a chip in a face component in a mobile phone is problematic, and the chip needs to be replaced and maintained to achieve the repairing purpose. At present, maintenance materials provided in the market need to be welded twice, a conversion gasket needs to be welded for the first time, and then a chip is welded to the conversion gasket through the secondary welding. Because the welding and packaging precision of the chip is very high, and the pin position of the chip 1 needs to be identified, the whole operation can be performed only by a microscope, and the twice welding is troublesome in maintenance operation and low in yield, so that a maintenance master is very headache. However, the presence of an integrated chip can solve the above problems well.
The utility model belongs to accessory materials for mobile phone maintenance and replacement, which are used for maintaining a mobile phone face component, solving the problem that the face does not identify faults, replacing damaged materials and achieving the purpose of repairing.
Disclosure of Invention
The object of the present utility model is to solve at least one of the technical drawbacks.
Therefore, an objective of the present utility model is to provide an integrated chip for repairing a mobile phone face component, so as to solve the problems mentioned in the background art and overcome the shortcomings in the prior art.
In order to achieve the above objective, an embodiment of an aspect of the present utility model provides an integrated chip for repairing a mobile phone face component, which includes a face component cable board, wherein the face component cable board is fastened on a mobile phone motherboard through a seat of a cable to form closed-loop communication, a top surface of the face component cable board is fixedly connected with a conversion gasket, and a plurality of connection pins are fixedly connected with a surface of the conversion gasket;
and the top surface of the conversion gasket is welded with an FA02 integrated chip.
It is preferable in any of the above aspects that the length of the face component flat cable plate is twice the length of the conversion pad, and the conversion pad is welded with the face component flat cable plate.
The technical scheme is adopted: when the mobile phone face-pack assembly is damaged, traditional market replacement materials comprise a conversion gasket and a chip, the two materials are welded on the welding position of the original face-pack assembly flat cable plate in sequence, two times of welding are needed, and the two times of welding operation is troublesome. And the integrated chip is not required to be welded secondarily, and maintenance can be completed by simply welding once, so that maintenance time is saved, the maintenance yield is improved, and the method is convenient and quick.
It is preferable in any of the above aspects that the thickness of the conversion pad is smaller than the thickness of the face component flat cable.
The technical scheme is adopted: traditional market replacement material, because the chip volume is less, the 1 foot position of marking need just can be fine with the help of the microscope carry out a foot and distinguish corresponding welding maintenance, and this integrative chip then need not too much to consider 1 foot position, and 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, and the installation is more convenient simple.
In any of the above embodiments, it is preferable that the connection pins are arranged in a dot matrix, and the connection pins have a fixed shape.
In any of the above embodiments, it is preferable that the bottom surface of the FA02 integrated chip is bonded to the connection pin.
The technical scheme is adopted: the traditional material is welded twice, and because the height of a welded tin ball is not easy to control, the installation material is easy to be thicker after multiple times of welding, so that the assembled material is easy to crush the surface glass of the chip, and the functional disorder is caused. And the integrated chip reduces the welding times, so that the height is close to the original height, the interference problem is avoided, the maintenance risk is effectively reduced, and the maintenance yield is greatly improved.
Compared with the prior art, the utility model has the following advantages and beneficial effects:
1. this integrative chip is used for maintaining the cell-phone face and holds the subassembly, hold the cooperation setting of subassembly winding displacement board, conversion gasket, connecting foot and the integrative chip 4 of FA02 through the face, face and hold the integrative chip architecture of subassembly winding displacement board, conversion gasket, connecting foot and the integrative chip of FA02, traditional market replacement material, because the chip volume is less, 1 foot position that marks need just can be fine with the help of the microscope carry out a foot distinguish corresponding welding maintenance, and this integrative chip then need not too much to consider 1 foot position, 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, it is more convenient and simple to install.
2. This integrative chip is used for maintaining the cell-phone face and holds the subassembly, holds the cooperation setting of subassembly winding displacement board, conversion gasket, connecting leg and the integrative chip of FA02 through the face, holds the integrative chip structure of subassembly winding displacement board, conversion gasket, connecting leg and the integrative chip of FA02, and traditional material carries out twice welding, because the welding tin ball highly is difficult for controlling, causes the installation material to be thick partially easily after many times welding, leads to the cooperation material to be crushed chip surface glass easily after the equipment, causes the dysfunction. And the integrated chip reduces the welding times, so that the height is close to the original height, the interference problem is avoided, the maintenance risk is effectively reduced, and the maintenance yield is greatly improved.
3. This integrative chip is used for maintaining the cell-phone face and holds the subassembly, hold the cooperation setting of subassembly winding displacement board, conversion gasket, connecting foot and the integrative chip 4 of FA02 through the face, face and hold the integrative chip architecture of subassembly winding displacement board, conversion gasket, connecting foot and the integrative chip 4 of FA02, traditional market replacement material, because the chip volume is less, 1 foot position that marks need just can be fine with the help of the microscope carry out a foot distinguish corresponding welding maintenance, and this integrative chip then need not to take into account 1 foot position excessively, 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, it is more convenient and simple to install.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model without the FA02 integrated chip;
FIG. 3 is a schematic diagram of a first view angle of an integrated FA02 chip according to the present utility model;
fig. 4 is a schematic structural diagram of a FA02 integrated chip according to a second view angle of the present utility model.
In the figure: 1-face subassembly winding displacement board, 2-conversion gasket, 3-connecting pin, 4-FA02 integrative chip.
Detailed Description
Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
As shown in fig. 1-4, the integrated chip is used for maintaining a mobile phone face component and comprises a face component wire arrangement plate 1, wherein the face component wire arrangement plate 1 is buckled on a mobile phone main board through a seat of a wire arrangement to form closed-loop communication, the top surface of the face component wire arrangement plate 1 is fixedly connected with a conversion gasket 2, and the surface of the conversion gasket 2 is fixedly connected with a plurality of connecting pins 3;
the top surface of the conversion gasket 2 is welded with an FA02 integrated chip 4.
Example 1: the length of the face component flat cable board 1 is twice that of the conversion gasket 2, and the conversion gasket 2 is welded with the face component flat cable board 1. When the mobile phone face-pack assembly is damaged, the traditional market replacement materials comprise a conversion gasket 2 and a chip, and the two materials are sequentially welded on the welding position of the original face-pack assembly flat cable plate 1, so that two times of welding are needed, and the secondary welding operation is troublesome. And the integrated chip is not required to be welded secondarily, and maintenance can be completed by simply welding once, so that maintenance time is saved, the maintenance yield is improved, and the method is convenient and quick.
Example 2: the thickness of the conversion gasket 2 is smaller than that of the face component flat cable 1. Traditional market replacement material, because the chip volume is less, the 1 foot position of marking need just can be fine with the help of the microscope carry out a foot and distinguish corresponding welding maintenance, and this integrative chip then need not too much to consider 1 foot position, and 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, and the installation is more convenient simple.
Example 3: the connecting pins 3 are arranged in a dot matrix, and the connecting pins 3 are in a fixed shape. The bottom surface of the FA02 integrated chip 4 is attached to the connecting pin 3. The traditional material is welded twice, and because the height of a welded tin ball is not easy to control, the installation material is easy to be thicker after multiple times of welding, so that the assembled material is easy to crush the surface glass of the chip, and the functional disorder is caused. And the integrated chip reduces the welding times, so that the height is close to the original height, the interference problem is avoided, the maintenance risk is effectively reduced, and the maintenance yield is greatly improved.
The working principle of the utility model is as follows:
s1, when a mobile phone face component is damaged;
s2, tilting the original chip, and maintaining the connecting pins 3 on the conversion gasket 2;
and S3, mounting the FA02 integrated chip 2 according to the positions of the connecting pins 3 on the conversion gasket 2, and welding the FA02 integrated chip 2.
Compared with the prior art, the utility model has the following beneficial effects compared with the prior art:
1. this integrative chip is used for maintaining the cell-phone face and holds the subassembly, through face hold subassembly winding displacement board 1, conversion gasket 2, connect foot 3 and the cooperation setting of the integrative chip 4 of FA02, face hold subassembly winding displacement board 1, conversion gasket 2, connect foot 3 and the integrative chip 4 of FA02 and constitute integrative chip architecture, traditional market replacement material, because the chip volume is less, 1 foot position that marks need be with the help of the microscope just can be fine carry out a foot and distinguish corresponding welding maintenance, and this integrative chip then need not too much to consider 1 foot position, 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, it is more convenient and simple to install.
2. This integrative chip is used for maintaining cell-phone face and holds the subassembly, through face hold subassembly winding displacement board 1, conversion gasket 2, connecting leg 3 and the cooperation setting of the integrative chip 4 of FA02, face hold subassembly winding displacement board 1, conversion gasket 2, connecting leg 3 and the integrative chip 4 of FA02 and constitute integrative chip structure, and traditional material carries out twice welding, because the high difficult control of welding tin ball, causes the installation material to be thick partially easily after many times welding, leads to the cooperation material to chip surface glass crushing easily after the equipment, causes the dysfunction. And the integrated chip reduces the welding times, so that the height is close to the original height, the interference problem is avoided, the maintenance risk is effectively reduced, and the maintenance yield is greatly improved.
3. This integrative chip is used for maintaining the cell-phone face and holds the subassembly, through face hold subassembly winding displacement board 1, conversion gasket 2, connect foot 3 and the cooperation setting of the integrative chip 4 of FA02, face hold subassembly winding displacement board 1, conversion gasket 2, connect foot 3 and the integrative chip 4 of FA02 and constitute integrative chip architecture, traditional market replacement material, because the chip volume is less, 1 foot position that marks need be with the help of the microscope just can be fine carry out a foot and distinguish corresponding welding maintenance, and this integrative chip then need not too much to consider 1 foot position, 1 foot is fixed position, can discern a foot mounted position according to the appearance naked eye, it is more convenient and simple to install.
Claims (5)
1. The integrated chip is used for maintaining a mobile phone face component and is characterized by comprising a face component wire arrangement plate (1), wherein the top surface of the face component wire arrangement plate (1) is fixedly connected with a conversion gasket (2), and the surface of the conversion gasket (2) is fixedly connected with a plurality of connecting pins (3);
the top surface of the conversion gasket (2) is welded with an FA02 integrated chip (4).
2. The integrated chip for servicing a mobile phone face pack of claim 1, wherein: the length of the face component wire arranging plate (1) is twice that of the conversion gasket (2), and the conversion gasket (2) is welded with the face component wire arranging plate (1).
3. The integrated chip for servicing a mobile phone face pack of claim 2, wherein: the thickness of the conversion gasket (2) is smaller than that of the face component flat cable plate (1).
4. A unitary chip for servicing a cell phone face pack as claimed in claim 3, wherein: the connecting pins (3) are arranged in a dot matrix, and the connecting pins (3) are in a fixed shape.
5. The integrated chip of claim 4 for servicing a mobile phone face pack, wherein: and the bottom surface of the FA02 integrated chip (4) is attached with the connecting pin (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223304748.XU CN219437246U (en) | 2022-12-10 | 2022-12-10 | Integrated chip for maintaining mobile phone face-holding assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223304748.XU CN219437246U (en) | 2022-12-10 | 2022-12-10 | Integrated chip for maintaining mobile phone face-holding assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219437246U true CN219437246U (en) | 2023-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223304748.XU Active CN219437246U (en) | 2022-12-10 | 2022-12-10 | Integrated chip for maintaining mobile phone face-holding assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219437246U (en) |
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2022
- 2022-12-10 CN CN202223304748.XU patent/CN219437246U/en active Active
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