CN219428764U

CN219428764U - Semiconductor carrier tape convenient for taking materials

Info

Publication number: CN219428764U
Application number: CN202320537744.1U
Authority: CN
Inventors: 余四珍
Original assignee: And Industries Shanghai Co ltd
Current assignee: And Industries Shanghai Co ltd
Priority date: 2023-03-16
Filing date: 2023-03-16
Publication date: 2023-07-28
Anticipated expiration: 2033-03-16

Abstract

The utility model relates to the technical field of carrier tapes, in particular to a semiconductor carrier tape convenient for taking materials, which comprises a main body, a placing groove and semiconductor materials, wherein a sliding groove is formed in the placing groove, a limiting groove is formed in the placing groove, a wear-resistant layer is arranged in the limiting groove, a foam-rubber cushion is arranged below the semiconductor materials, a fixed block is arranged at the bottom of the foam-rubber cushion, a connecting block is arranged in the placing groove, a damping spring matched with the fixed block is arranged on one side of the connecting block, a sliding groove is formed in the inner wall of the placing groove, when the semiconductor materials are required to be taken out from the placing groove, a user breaks the main body and the placing groove towards two sides by hand, then slides the inner wall of the sliding groove into the inner wall of the placing groove to hold the semiconductor materials, and finally takes out the semiconductor materials.

Description

Semiconductor carrier tape convenient for taking materials

Technical Field

The utility model relates to the technical field of carrier tapes, in particular to a semiconductor carrier tape convenient for taking materials.

Background

Carrier Tape (Carrier Tape), which is a Tape-shaped product used in the field of electronic packaging, is mainly used in the electronic component mounting industry, and has a specific thickness, and holes (also called pockets) for holding electronic components and positioning holes for indexing and positioning are equidistantly distributed in the length direction of the Carrier Tape; the existing semiconductor needs to be used for carrying when being stored, and most of the existing carrier placing grooves are smooth planes, so that when a user takes the semiconductor material out of the placing grooves, no space for taking the semiconductor material out of the placing grooves is reserved for fingers, and therefore the fingers cannot easily take the semiconductor material out of the placing grooves.

Disclosure of Invention

In order to solve the above problems in the prior art, a semiconductor carrier tape that is convenient for taking materials is provided.

The specific technical scheme is as follows:

the utility model provides a semiconductor carrier tape of conveniently getting material, includes main part, standing groove and semiconductor material, the spout has been seted up to the inside of standing groove, the spacing groove has been seted up to the inside of standing groove, the inside of spacing groove is equipped with the wearing layer, the below of semiconductor material is equipped with the foam-rubber cushion, the bottom of foam-rubber cushion is equipped with the fixed block, the inside of standing groove is equipped with the connecting block, one side of connecting block be equipped with fixed block matched with damping spring.

Preferably, the outer wall of the placing groove is fixedly connected with the inner wall of the main body, and the sliding grooves are symmetrically distributed in the placing groove.

Preferably, the wear-resistant layer is fixedly connected to the inner wall of the limiting groove, and the semiconductor material is connected to the inner wall of the placing groove in an embedded manner through the limiting groove.

Preferably, the wear-resistant layer is attached to the outer wall of the semiconductor material, and the limiting groove and the wear-resistant layer are in mirror image distribution on the inner wall of the placing groove.

Preferably, the bottom of the semiconductor material is attached to the top of the foam-rubber cushion, and one end of the foam-rubber cushion, which is far away from the semiconductor material, is fixedly connected to the top of the fixing block.

Preferably, one end of the damping spring is fixedly connected to the inner wall of the connecting block, and one end of the damping spring, which is far away from the connecting block, is fixedly connected to the inner wall of the fixing block, which is far away from the sponge cushion.

Preferably, one end of the connecting block, which is far away from the damping spring, is fixedly connected to the inner wall of the placing groove, and the connecting block, the damping spring and the fixing block are in equidistant distribution in the placing groove.

The technical scheme has the following advantages or beneficial effects:

1. when the device is used, the sliding groove is formed in the inner wall of the placing groove, when the semiconductor material needs to be taken out of the placing groove, a user breaks the main body and the placing groove towards two sides by hands, then slides the inner wall of the sliding groove into the inner wall of the placing groove by hands to hold the semiconductor material, and finally, the semiconductor material is taken out.

2. When the device is used, the inner wall of the limiting groove, which is in contact with the semiconductor material, is provided with the wear-resistant layer, so that the surface of the semiconductor material is prevented from being scratched, the semiconductor material is protected, when the semiconductor material is placed in the placing groove, a foam-rubber cushion is arranged in the semiconductor material and is in contact with the semiconductor material, and a damping spring is arranged below the foam-rubber cushion, so that the semiconductor material can be protected when being transported, and the semiconductor material is prevented from being damaged when being collided when being transported.

Drawings

Embodiments of the present utility model will now be described more fully with reference to the accompanying drawings. The drawings, however, are for illustration and description only and are not intended as a definition of the limits of the utility model.

Fig. 1 is a schematic diagram of a semiconductor carrier tape structure for facilitating material taking according to the present utility model;

FIG. 2 is a schematic cross-sectional view of a semiconductor carrier tape with convenient material pick-up according to the present utility model;

fig. 3 is a schematic diagram showing the positions of chips and a main body of a semiconductor carrier tape with convenience in material taking according to the present utility model;

fig. 4 is a schematic view illustrating the disassembly of the inside of a placement groove of a semiconductor carrier tape with material taking convenience according to the present utility model.

The above reference numerals denote: the device comprises a main body 1, a placing groove 2, a sliding groove 21, a limiting groove 22, a wear-resistant layer 23, a semiconductor material 3, a foam cushion 4, a connecting block 5, a damping spring 51 and a fixing block 52.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other.

The utility model is further described below with reference to the drawings and specific examples, which are not intended to be limiting.

Referring to fig. 1-4, a semiconductor carrier tape convenient for taking materials comprises a main body 1, a placing groove 2 and a semiconductor material 3, wherein a chute 21 is formed in the placing groove 2, a limit groove 22 is formed in the placing groove 2, a wear-resistant layer 23 is arranged in the limit groove 22, a foam-rubber cushion 4 is arranged below the semiconductor material 3, a fixed block 52 is arranged at the bottom of the foam-rubber cushion 4, a connecting block 5 is arranged in the placing groove 2, a damping spring 51 matched with the fixed block 52 is arranged on one side of the connecting block 5, when the semiconductor material 3 is required to be taken out from the placing groove 2, a user breaks the main body 1 and the placing groove 2 towards two sides by hand, and then slides the inner wall of the chute 21 into the inner wall of the placing groove 2 to hold the semiconductor material 3 by hand, and finally, the semiconductor material 3 is taken out.

Further, the outer wall fixed connection of standing groove 2 is at the inner wall of main part 1, and spout 21 is symmetrical distribution form in the inside of standing groove 2, is provided with spout 21 simultaneously in the both sides of standing groove 2, and the user of being convenient for takes out semiconductor material 3 from the inside of standing groove 2 through spout 21.

Further, the wear-resisting layer 23 is fixedly connected to the inner wall of the limiting groove 22, the semiconductor material 3 is connected to the inner wall of the placing groove 2 in an embedded mode through the limiting groove 22, the limiting groove 22 is arranged in the placing groove 2, and when the semiconductor material 3 is located in the placing groove 2, the semiconductor material is limited.

Further, the wearing layer 23 is attached and connected to the outer wall of the semiconductor material 3, the limiting groove 22 and the wearing layer 23 are in mirror image distribution on the inner wall of the placing groove 2, the wearing layer 23 is arranged on the inner wall of the limiting groove 22, which is in contact with the semiconductor material 3, so that the surface of the semiconductor material 3 is prevented from being scratched, and the semiconductor material 3 is protected.

Further, the bottom of the semiconductor material 3 is attached to the top of the foam-rubber cushion 4, one end of the foam-rubber cushion 4 far away from the semiconductor material 3 is fixedly connected to the top of the fixing block 52, and the foam-rubber cushion 4 is arranged to be beneficial to protecting the semiconductor material 3.

Further, one end fixed connection at connecting block 5 of damping spring 51, damping spring 51 is kept away from the inner wall that connecting block 5's one end fixed connection kept away from foam-rubber cushion 4 at fixed block 52, when semiconductor material 3 is placed in the inside of standing groove 2, its inside is equipped with foam-rubber cushion 4 and contacts with semiconductor material 3, the below of foam-rubber cushion 4 is equipped with damping spring 51, can be used for protecting semiconductor material 3 when semiconductor material 3 is transported, avoid semiconductor material 3 to bump when transporting and damage.

Further, the one end fixed connection at the inner wall of standing groove 2 that the damping spring 51 was kept away from to connecting block 5, damping spring 51 and fixed block 52 are equidistant distributed form in the inside of standing groove 2, and this kind of setting can be favorable to strengthening the protection of semiconductor material 3.

Working principle: when the device is used, the semiconductor material 3 is put into the inner wall of the placing groove 2 from the top of the placing groove 2 until the outer wall of the semiconductor material 3 is completely matched with the limiting groove 22, at the moment, the placing work of the semiconductor material 3 is completed, the inner wall of the limiting groove 22, which is contacted with the semiconductor material 3, is provided with the wear-resistant layer 23, the surface of the semiconductor material 3 is prevented from being scratched, the semiconductor material 3 is protected, when the semiconductor material 3 is placed in the placing groove 2, the sponge cushion 4 is arranged in the semiconductor material 3 and is contacted with the semiconductor material 3, the damping spring 51 is arranged below the sponge cushion 4, and the semiconductor material 3 can be used for protecting the semiconductor material 3 when being transported, so that the semiconductor material 3 is prevented from being damaged by collision when being transported; when the semiconductor material 3 is required to be taken out of the placement groove 2, the user breaks the main body 1 and the placement groove 2 to two sides by hand, slides the hand into the inner wall of the placement groove 2 from the inner wall of the chute 21 to hold the semiconductor material 3, and finally takes out the semiconductor material 3.

The foregoing description is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the scope of the utility model, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present utility model, and are intended to be included within the scope of the present utility model.

Claims

1. The utility model provides a semiconductor carrier tape of conveniently getting material which characterized in that: including main part (1), standing groove (2) and semiconductor material (3), spout (21) have been seted up to the inside of standing groove (2), spacing groove (22) have been seted up to the inside of standing groove (2), the inside of spacing groove (22) is equipped with wearing layer (23), the below of semiconductor material (3) is equipped with foam-rubber cushion (4), the bottom of foam-rubber cushion (4) is equipped with fixed block (52), the inside of standing groove (2) is equipped with connecting block (5), one side of connecting block (5) be equipped with fixed block (52) matched with damping spring (51).

2. The semiconductor carrier tape of claim 1, wherein: the outer wall of the placing groove (2) is fixedly connected with the inner wall of the main body (1), and the sliding grooves (21) are symmetrically distributed in the placing groove (2).

3. The semiconductor carrier tape of claim 1, wherein: the wear-resistant layer (23) is fixedly connected to the inner wall of the limiting groove (22), and the semiconductor material (3) is connected to the inner wall of the placing groove (2) in an embedded mode through the limiting groove (22).

4. The semiconductor carrier tape of claim 1, wherein: the wear-resistant layer (23) is connected to the outer wall of the semiconductor material (3) in a fitting mode, and the limiting grooves (22) and the wear-resistant layer (23) are in mirror image distribution on the inner wall of the placing groove (2).

5. The semiconductor carrier tape of claim 1, wherein: the bottom of the semiconductor material (3) is attached to the top of the foam-rubber cushion (4), and one end, far away from the semiconductor material (3), of the foam-rubber cushion (4) is fixedly connected to the top of the fixing block (52).

6. The semiconductor carrier tape of claim 1, wherein: one end of the damping spring (51) is fixedly connected to the inner wall of the connecting block (5), and one end, far away from the connecting block (5), of the damping spring (51) is fixedly connected to the inner wall, far away from the sponge cushion (4), of the fixing block (52).

7. The semiconductor carrier tape of claim 1, wherein: one end of the connecting block (5) far away from the damping spring (51) is fixedly connected to the inner wall of the placing groove (2), and the connecting block (5), the damping spring (51) and the fixing block (52) are in an equidistant distribution mode in the placing groove (2).