CN219420988U

CN219420988U - Ear-clamping Bluetooth earphone

Info

Publication number: CN219420988U
Application number: CN202320248894.0U
Authority: CN
Inventors: 吴世历; 吴奎; 公玺
Original assignee: Guangdong Genius Technology Co Ltd
Current assignee: Guangdong Genius Technology Co Ltd
Priority date: 2023-02-15
Filing date: 2023-02-15
Publication date: 2023-07-25
Anticipated expiration: 2033-02-15

Abstract

The application discloses insert ear formula bluetooth headset includes: the circuit board assembly and the battery are both arranged in the cover body, and the circuit board assembly is respectively connected with the memory metal and the battery; at least one avoidance hole is formed in the outer cover, the avoidance hole enables the memory metal embedded in the outer cover to be exposed, and the exposed memory metal part can be used as a connector contact feed point of the earphone charging bin. This application reducible or replacement PIN needle that charges for the equipment is more convenient, has also not charged the sealed waterproof risk of PIN needle.

Description

Ear-clamping Bluetooth earphone

Technical Field

The application relates to the technical field of Bluetooth headset, in particular to an ear-clamping Bluetooth headset.

Background

The Bluetooth headset is to apply the Bluetooth technology to the hands-free headset, so that a user can avoid the trouble of annoying wires and can easily talk in various modes. The ear-clip type bluetooth headset is a novel and popular bluetooth headset, but in order to pursue more extreme wearing experience and aesthetic effect, the size of the headset is as small as possible, so that the available space inside the ear-clip type bluetooth headset is very limited. In order to realize bluetooth headset's effect of charging, bluetooth headset needs two PIN needles that charge, and the PIN needle that charges not only can occupy earphone inside size space also can increase earphone equipment degree of difficulty and sealed waterproof risk.

Disclosure of Invention

The aim of the embodiment of the application is that: the utility model provides a press from both sides ear formula bluetooth headset, it can solve the above-mentioned problem that exists among the prior art, reducible or the replacement PIN needle that charges for the equipment is more convenient, has also not charged the sealed waterproof risk of PIN needle.

In order to achieve the above purpose, the present application adopts the following technical scheme:

in one aspect, there is provided a clip-on bluetooth headset, comprising: the circuit board assembly and the battery are both arranged in the cover body, and the circuit board assembly is respectively connected with the memory metal and the battery; at least one avoidance hole is formed in the outer cover, the avoidance hole enables the memory metal embedded in the outer cover to be exposed, and the exposed memory metal part can be used as a connector contact feed point of the earphone charging bin.

In some embodiments, two of the memory metals are provided, both of the memory metals being connected to the circuit board assembly.

In some embodiments, the outer cover is provided with two avoidance holes, and the two avoidance holes respectively correspond to the two memory metals.

In some embodiments, the two memory metals are in the same plane within the outer cover, and the two memory metals do not interfere with each other.

In some embodiments, the relief Kong Kaishe is on a side of the outer cap remote from the clip locations.

In some embodiments, the battery pack further comprises a charging connector, one end of the charging connector is connected with the circuit board assembly, the other end of the charging connector is arranged at the bottom of the cover body, and a charging hole corresponding to the charging connector is formed in the bottom of the cover body.

In some embodiments, the cover body comprises an upper cover and a lower cover, and the upper cover and the lower cover are connected in a sealing way to form a mounting cavity.

In some embodiments, the circuit board assembly further comprises a first bracket mounted within the cover, the first bracket for supporting the circuit board assembly.

In some embodiments, the speaker further comprises a second bracket mounted within the cover, the speaker mounted on the second bracket.

In some embodiments, a magnet is also included, the magnet mounted under an interior of the cover.

The beneficial effects of this application are: the memory metal is adopted to replace the charging PIN needle, so that the charging PIN needle is prevented from occupying excessive space inside the earphone, meanwhile, the limitation of structure, die realization and assembly brought by the existence of the charging PIN needle is avoided, the internal stacking optimization and earphone miniaturization design are facilitated, the assembling procedure of the charging PIN needle is reduced, and the earphone assembly is more convenient; the charging PIN needle is a waterproof sealing risk point, and the scheme reduces the difficulty of sealing and protecting water and failure risk of the earphone; in addition, the memory metal also has the function of bending the outer cover to form the ear-clamping type wearing, so that the application of the memory metal in the ear-clamping type Bluetooth headset is fully embodied.

Drawings

The present application is described in further detail below with reference to the drawings and examples.

Fig. 1 is a schematic diagram of the overall structure of a clip-on bluetooth headset according to an embodiment of the present application;

fig. 2 is a schematic diagram of the overall structure of a clip-ear bluetooth headset according to an embodiment of the present application;

fig. 3 is a schematic top view of a bluetooth headset with ear clip according to an embodiment of the present application;

FIG. 4 is a cross-sectional view I at A-A in FIG. 3 in accordance with an embodiment of the present application;

FIG. 5 is a second cross-sectional view at A-A in FIG. 3 in accordance with an embodiment of the present application;

FIG. 6 is a schematic diagram of an installation mode of two memory metals according to an embodiment of the present application.

In the figure:

1. a cover body; 101. an upper cover; 102. a lower cover; 2. an outer cover; 3. a memory metal; 4. a circuit board assembly; 5. a battery; 6. avoidance holes; 7. a charging connector; 8. a first bracket; 9. a speaker; 10. a second bracket; 11. and (3) a magnet.

Detailed Description

In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present application more clear, the technical solutions of the embodiments of the present application are described in further detail below, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, unless explicitly stated and limited otherwise, the terms "connected," "secured" and "fixed" are to be construed broadly, as for example, they may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

As shown in fig. 1-5, this embodiment provides a bluetooth headset with ear clip, including: the novel portable electronic device comprises a cover body 1, an outer cover 2, a memory metal 3, a circuit board assembly 4 and a battery 5, wherein the outer cover 2 is arranged at one end of the cover body 1, the memory metal 3 is embedded in the outer cover 2, the memory metal 3 drives the outer cover 2 to bend relative to the cover body 1 so as to limit a clamping lug position for clamping ears with the cover body 1, the circuit board assembly 4 and the battery 5 are arranged in the cover body 1, and the circuit board assembly 4 is respectively connected with the memory metal 3 and the battery 5; the outer cover 2 is provided with at least one avoidance hole 6, the avoidance hole 6 enables the memory metal 3 embedded in the outer cover 2 to be exposed, and the exposed part of the memory metal 3 can be used as a connector contact feed point of the earphone charging bin.

Based on the above scheme, the memory metal 3 has two main functions, one is that the memory metal 3 has the property that the memory metal 3 can always have the trend of being in the original state, the original state can be a bending state, and the memory metal 3 in the bending state can drive the outer cover 2 to bend relative to the cover body 1, so that the function of clamping the lug is realized; the other is that one or two charging PIN needles are replaced by the memory metal 3, and the charging PIN needles occupy the stacking space, so that the assembly is complicated, the charging PIN needles are required to be connected and fixed with a main board, manual welding wires and manual gluing and fixing are involved, meanwhile, the structural limit of the charging PIN needles is also required to be considered during design, so that a lot of limits are brought to stacking realization, the charging PIN needles are reduced or replaced, on one hand, the space for installing PIN inside the earphone can be reduced, and meanwhile, the limits of structure, die realization and assembly brought by the existence of the charging PIN needles are not considered, so that the internal stacking optimization and earphone miniaturization design are facilitated; on the other hand, the assembling procedure of the earphone charging PIN needle can be reduced, and the earphone assembling is simplified; meanwhile, because the charging PIN needle is a waterproof sealing risk point, the scheme reduces the difficulty of sealing and protecting the earphone from water and the failure risk. The avoidance hole 6 formed in the outer cover 2 can enable the memory metal 3 to be partially exposed, and can be used as a connector contact feed point to be in contact with the earphone charging bin for conveying current, and the conveyed current can charge the battery 5 through the circuit board assembly 4.

It should be noted that the memory metal 3 may preferably be beryllium copper, which has good flexibility and excellent conductivity, so that the memory metal 3 can realize the function of a clip and can also be used as a charging connection by utilizing the conductivity thereof. The memory metal 3 is limited and fixed by the cover 1, and the memory metal 3 extends into the cover 1 to contact with the spring plate of the circuit board assembly 4.

Preferably, the outer cover 2 may be made of soft rubber, and the cover 1 is made of hard rubber, so that the cover 1 can effectively limit and fix the memory metal 3, and meanwhile, the outer cover 2 can be effectively changed in state by the memory metal 3.

As a preferred implementation of this example, as shown in fig. 2 and 4, two memory metals 3 are provided, and both the memory metals 3 are connected to the circuit board assembly 4. Correspondingly, two avoidance holes 6 are formed in the outer cover 2, and the two avoidance holes 6 correspond to the two memory metals 3 respectively. The two memory metals 3 are positioned on the same plane in the outer cover 2, and the two memory metals 3 do not interfere with each other.

In this scheme, as shown in fig. 6, two memory metals 3 can be understood to be arranged side by side, but there is a gap between two memory metals 3 and can not contact, and there is a gap between two avoidance holes 6 that are opened for the part that two memory metals 3 expose does not influence each other, has replaced the PIN needle that charges completely through setting up two memory metals 3, has optimized bluetooth headset's inner space to the maximum extent.

Different from the above scheme, as shown in fig. 1 and 5, the charging connector 7 is further included, one end of the charging connector 7 is connected with the circuit board assembly 4, the other end of the charging connector is arranged at the bottom of the cover body 1, a charging hole corresponding to the charging connector 7 is formed at the bottom of the cover body 1, and the charging connector 7 is a charging PIN. Since the memory metal 3 is disposed in the outer cover 2, the memory metal 3 as a contact point can only be within the range of the outer cover 2, so that a charging PIN can be reserved for different practical requirements, and conventionally disposed at the bottom of the bluetooth headset.

In some embodiments, the avoidance hole 6 is formed on a side of the outer cover 2 away from the ear clamping position. The position of dodging the hole 6 and need make things convenient for memory metal 3 to contact with the storehouse that charges of earphone, consequently can not set up in the one side that is close to the clamp ear position, dodge the position of hole 6 and can be in the place of enclosing cover 2 off-set simultaneously, or dodge hole 6 as far as down, can not influence bluetooth headset's whole outward appearance like this, can also guarantee the validity that the contact charges.

Specifically, the bluetooth headset further comprises a first bracket 8, a speaker 9, a second bracket 10 and a magnet 11, wherein the cover body 1 comprises an upper cover 101 and a lower cover 102, the upper cover 101 and the lower cover 102 are in sealing connection to form a mounting cavity, the first bracket 8 is mounted in the mounting cavity, and the first bracket 8 is used for supporting the circuit board assembly 4 to ensure the stability of the circuit board assembly 4; the second bracket 10 is installed in the installation cavity, the loudspeaker 9 is installed on the second bracket 10, and the second bracket 10 is used for ensuring the stability of the loudspeaker 9 and avoiding sound interference caused by shaking of the loudspeaker 9; the magnet 11 is installed in the bottom of installation cavity, mainly used is through the magnetism with earphone storehouse that charges to inhale the absorption completion location.

In summary, the memory metal 3 has conductivity and elasticity, so that the memory metal 3 can be used as charging connection while realizing the function of clamping the ear, and the built-in memory metal 3 replaces a charging PIN needle, and has the following functions: firstly, a space for charging PIN needles is vacated for the inside of the earphone, and meanwhile, the limitations of structure, die realization and assembly brought by the existence of the charging PIN needles are not considered, so that the inside stacking optimization and the earphone miniaturization design are facilitated; secondly, the assembling procedure of the earphone charging PIN needle is reduced, and the earphone assembling is simplified; thirdly, the PIN needle department that charges of earphone is waterproof seal risk point, and this scheme has reduced the sealed protection water degree of difficulty of earphone and inefficacy risk.

In the description herein, it should be understood that the terms "upper," "lower," "left," "right," and the like are merely for convenience of description and to simplify the operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for providing a special meaning.

In the description of the present specification, reference to the terms "one embodiment," "example," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples.

Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in the foregoing embodiments, and that the embodiments described in the foregoing embodiments may be combined appropriately to form other embodiments that will be understood by those skilled in the art.

The technical principles of the present application are described above in connection with specific embodiments. These descriptions are provided only for the purpose of illustrating the principles of the present application and should not be construed as limiting the scope of the present application in any way. Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification without undue burden from the present disclosure.

Claims

1. A clip-on bluetooth headset, comprising: the novel ear-holding circuit comprises a cover body (1), an outer cover (2), a memory metal (3), a circuit board assembly (4) and a battery (5), wherein the outer cover (2) is installed at one end of the cover body (1), the memory metal (3) is embedded in the outer cover (2), the memory metal (3) drives the outer cover (2) to bend relative to the cover body (1) so as to limit a clamping position for clamping ears with the cover body (1), the circuit board assembly (4) and the battery (5) are installed in the cover body (1), and the circuit board assembly (4) is connected with the memory metal (3) and the battery (5) respectively; at least one avoidance hole (6) is formed in the outer cover (2), the avoidance hole (6) enables the memory metal (3) embedded in the outer cover (2) to be exposed, and the exposed part of the memory metal (3) can be used as a connector contact feed point of the earphone charging bin.

2. The ear-clip bluetooth headset according to claim 1, characterized in that two memory metals (3) are provided, both memory metals (3) being connected to the circuit board assembly (4).

3. The ear-clamping type Bluetooth headset according to claim 2, wherein the outer cover (2) is provided with two avoidance holes (6), and the two avoidance holes (6) respectively correspond to the two memory metals (3).

4. The ear-clip bluetooth headset according to claim 2, characterized in that the two memory metals (3) are in the same plane in the outer cover (2), and that the two memory metals (3) do not interfere with each other.

5. The ear-clamping Bluetooth headset according to claim 1, wherein the avoidance hole (6) is formed on one side of the outer cover (2) away from the ear-clamping position.

6. The ear-clamping Bluetooth headset of claim 1, further comprising a charging connector (7), wherein one end of the charging connector (7) is connected with the circuit board assembly (4), the other end of the charging connector is arranged at the bottom of the cover body (1), and a charging hole corresponding to the charging connector (7) is formed in the bottom of the cover body (1).

7. The ear-clip type Bluetooth headset according to claim 1, wherein the cover body (1) comprises an upper cover (101) and a lower cover (102), and the upper cover (101) and the lower cover (102) are in sealing connection to form an installation cavity.

8. The ear-clip bluetooth headset of claim 1, further comprising a first bracket (8), the first bracket (8) being mounted within the cover (1), the first bracket (8) being configured to support the circuit board assembly (4).

9. The ear-clip bluetooth headset according to claim 1, further comprising a speaker (9) and a second bracket (10), the second bracket (10) being mounted in the cover (1), the speaker (9) being mounted on the second bracket (10).

10. The ear-clip bluetooth headset according to claim 1, further comprising a magnet (11), the magnet (11) being mounted under the inside of the cover (1).