CN219419056U - Edge covering mechanism and edge covering device - Google Patents

Abstract

An edge covering mechanism and an edge covering device belong to the technical field of photovoltaics. The edge covering mechanism comprises an edge covering wheel and a scraper. The inside of bordure wheel is provided with the first cavity that is used for holding the rubber coating, and the bordure wheel has peripheral edge portion. The edge is provided with a plurality of glue outlet holes along circumference interval, and every glue outlet hole all communicates with first cavity for the rubber coating in the first cavity can overflow edge through glue outlet hole. The scraper and the edge part are arranged along the radial direction of the edge wrapping wheel at a first preset distance, and redundant rubber coating outside the overflow edge part can be scraped by the scraper, so that the rubber coating with the first preset distance thickness is attached to the edge part, the silicon wafer is wrapped by the rubber coating with the first preset distance thickness, and the uniformity of wrapping is improved.

Description

Edge covering mechanism and edge covering device

Technical Field

The application relates to the technical field of photovoltaics, in particular to an edge covering mechanism and an edge covering device.

Background

Currently, to produce RESH (Rear Emitter Si Heterojunction) cells with copper grids, a copper seed layer is prepared on a silicon wafer for growing the electrodes. Generally, an electrode pattern is prepared on a copper seed layer by using a photolithography technique, and the pattern is developed and then is displayed, so that copper grid lines can only grow in a formulated pattern area during subsequent electroplating.

In the electroplating process, the side surface (about 0.12-0.14mm thick) of the silicon wafer is exposed in electroplating liquid, and grid lines close to the edge part of the silicon wafer are easy to fall off under the action of current and copper ions, so that the yield and the efficiency of a battery are affected. Therefore, in order to reduce the probability of falling off of the grid line at the edge of the battery due to penetration of the copper seed layer at the edge of the battery by the electroplating solution in the electroplating process, protective glue needs to be wrapped at the edge of the silicon wafer to form a wrapping before the copper seed layer is prepared.

By using the existing edge covering equipment, the silicon wafer can be contacted with different glue solution amounts when being covered due to uneven glue outlet, and the phenomenon of uneven edge covering width or glue breakage is easy to occur.

Disclosure of Invention

An object of the present application is to provide an edge covering mechanism and an edge covering device to partially or entirely improve the problem of uneven edge covering in the related art.

In a first aspect, examples of the present application provide an edge-wrapping mechanism comprising an edge-wrapping wheel and a doctor blade. The inside of bordure wheel is provided with the first cavity that is used for holding the rubber coating. The edge covering wheel is provided with a circumferential edge part, a plurality of glue outlet holes are formed in the edge part along the circumferential direction at intervals, and each glue outlet hole is communicated with the first cavity. The scraper and the edge part are spaced by a first preset distance along the radial direction of the edge wrapping wheel so as to be used for scraping off redundant encapsulation of the edge part.

The edge part of the circumference of the edge wrapping wheel is provided with a plurality of glue outlet holes along the circumferential interval of the edge wrapping wheel, each glue outlet hole is communicated with a cavity for containing the glue coating inside the edge wrapping wheel, then the glue coating stored in the cavity overflows from the glue outlet holes under the action of centrifugal force in the rotation process of the edge wrapping wheel, a circle of glue coating is formed outside the edge part along the circumferential direction of the edge part, and then when the edge of the silicon wafer is close to the edge part, the glue coating outside the edge part can be attached to the edge of the silicon wafer to wrap the edge of the silicon wafer.

And, set up scraper and edge portion along the radial interval first of bordure wheel and predetermine the distance, can utilize the scraper to spill over unnecessary rubber coating of edge portion outside to strike off for edge portion department adheres to the rubber coating of first predetermine distance thickness, bordures the silicon chip with the rubber coating that utilizes first predetermine distance thickness.

With reference to the first aspect, in an alternative embodiment of the present application, the taping wheel has a first side and a second side disposed along an axial direction thereof. The first side is connected with first gyro wheel, and first gyro wheel and the coaxial setting of wheel of borduring and synchronous motion, first gyro wheel are equipped with and are connected with the motor.

The first side of the edge covering wheel is provided with a first roller which rotates synchronously, the first roller is connected with a motor to drive the glue covering wheel to rotate, and the glue coating in the edge covering wheel overflows from the glue outlet hole, so that the silicon wafer is covered. And, utilize first gyro wheel to be connected with the motor, avoid the rubber coating wheel to be directly connected with the motor, can avoid overflowing the rubber coating outside the wheel of borduring and adhere to the motor, can also conveniently dismantle the wheel of borduring, clear up the rubber coating that the wheel overflowed of borduring.

With reference to the first aspect, in an optional embodiment of the present application, the edge covering mechanism further includes a second roller. The second roller is internally provided with a second chamber and a glue injection hole communicated with the second chamber. The second roller is connected with the second side in a sealing way, and the second chamber is communicated with the first chamber; the second roller and the edge covering wheel are coaxially arranged and synchronously move.

The second side is in sealing connection with the second roller, a second cavity inside the second roller is communicated with a first cavity inside the edge covering wheel, and rubber coating pre-stored in the second cavity flows to the first cavity in the synchronous movement process of the second roller and the edge covering wheel and then overflows from the first cavity to the edge part through the rubber outlet. And the second cavity is provided with a glue injection hole, so that new glue can be injected into the second cavity or the first cavity through glue injection Kong Xiangdi under the condition that the glue in the second cavity or the first cavity is used up or insufficient.

With reference to the first aspect, in an alternative embodiment of the present application, the outer diameter of the first roller and the outer diameter of the second roller are both greater than the outer diameter of the taping wheel.

The external diameter of the first roller and the external diameter of the second roller are both larger than the external diameter of the edge wrapping wheel, and a three-layer roller structure with a small middle and two large ends is formed, so that the edge of the silicon wafer can be conveniently stretched into a groove in the three-layer roller structure to be wrapped.

In combination with the first aspect, in an alternative embodiment of the present application, the outer diameter of the first roller and the outer diameter of the second roller are equal, and the doctor is simultaneously spaced from the circumferential edges of the first roller and the second roller by a second predetermined distance for scraping off the encapsulation overflowing the first roller and the second roller.

The external diameters of the first roller and the second roller are equal, and the scraper can be used for simultaneously approaching to the first roller and the second roller to scrape off the redundant rubber coating attached to the edges of the first roller and the second roller.

In combination with the first aspect, in an optional embodiment of the present application, the edge covering mechanism includes an adjusting member, where the adjusting member is connected with the scraper, so as to adjust the size of the first preset distance.

The scraper is connected with the adjusting piece, and the position of the scraper can be adjusted by the adjusting piece, so that the first preset distance between the scraper and the edge part is adjusted. Through adjusting the first preset distance, the thickness of the rubber coating attached to the edge part can be adjusted, so that the thickness and the width of the wrapping edge of the silicon wafer can be adjusted when the silicon wafer is wrapped.

With reference to the first aspect, in an alternative embodiment of the present application, the adjusting member includes a support frame, and the scraper is rotatably connected with the support frame.

The scraper is rotatably connected with the support frame, and the distance between the edge of the scraper and the edge part along the radial direction of the rubber coating wheel can be changed by adjusting the rotation angle of the scraper, so that the size of the first preset distance can be adjusted.

In combination with the first aspect, in an alternative embodiment of the present application, the scraper is provided with a first connecting hole, and the support frame is provided with a second connecting hole. The connecting piece passes through the first connecting hole and the second connecting hole simultaneously so that the support frame and the scraper rotate around the connecting piece relatively.

Utilize the connecting piece, pass simultaneously the first connecting hole in the support frame and the second connecting hole in the scraper, can make the scraper rotate around the connecting piece, and then change the distance between the radial of scraper edge and edge portion along the rubber coating wheel, and then adjust the size of first default distance.

In a second aspect, examples of the present application provide an edge covering device comprising the edge covering mechanism and the moving mechanism provided in the first aspect. The moving mechanism includes: a fixture configured to hold the silicon wafer, and a driver to drive the fixture in tangential motion along the taping wheel to bring the edge of the silicon wafer into contact with the encapsulation of the overflow edge portion.

By utilizing the moving mechanism, the silicon wafer can move along the tangential direction of the wrapping wheel, so that the edge of the silicon wafer contacts the wrapping of the edge part of the overflow wrapping wheel, and the edge of the silicon wafer is wrapped. And, the mechanism of borduring that this application provided still is provided with the scraper, and the scraper is along the radial interval first of borduring wheel with the edge portion to be used for striking off the unnecessary rubber coating of edge portion, make edge portion department adhere to the rubber coating layer of first preset distance thickness, bordure the silicon chip with the rubber coating that utilizes first preset distance thickness, improve the uniformity of borduring of silicon chip.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic cross-sectional view of a wrapping of a battery sheet;

FIG. 2 is a schematic illustration of prior art battery plate edge wrapping non-uniformity;

FIG. 3 is a schematic plan view of an edge covering device according to an example of the present application;

FIG. 4 is a schematic cross-sectional view of an edge-wrapping mechanism provided by examples of the present application;

fig. 5 is a partially enlarged schematic view of a.

Icon:

1-an edge covering device; 10-an edge covering mechanism; 11-edge wrapping wheels; 111-a first chamber; 112-edge portion; 113-a glue outlet hole; 114-a first side; 115-a second side; 12-scraping knife; 121-a first connection hole; 13-a first roller; 14-a second roller; 141-a second chamber; 142-injecting glue holes; 15-an adjusting member; 151-supporting frames; 1511-a second connection hole; 1512-connectors; 20-a moving mechanism; 21-a fixing piece; 22-drives;

101-a silicon wafer; 102-an edge covering layer; d1-a first preset distance; d2-a second preset distance.

Detailed Description

Embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical solutions of the present application, and thus are only examples, and are not intended to limit the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the present application and in the description of the drawings above are intended to cover non-exclusive inclusions.

In the description of the embodiments of the present application, the technical terms "first," "second," etc. are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In the description of the embodiments of the present application, the azimuth or positional relationship indicated by the technical terms "width", "thickness", "upper", "lower", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the embodiments of the present application and simplifying the description, and are not indicative or implying that the apparatus or element in question must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the embodiments of the present application.

Currently, to produce RESH (Rear Emitter Si Heterojunction) cells with copper grids, a copper seed layer is prepared on a silicon wafer for growing the electrodes. Generally, a layer of photoresist is arranged on the copper seed layer, then a partial region of the photoresist is exposed, the exposed photoresist is removed to form a groove, the copper seed layer is exposed, and electroplating is performed on the copper seed layer in the groove to form a copper grid line.

During the electroplating process, the copper seed layer (about 0.12-0.14mm thick) at the side of the silicon wafer is exposed to the electroplating solution, so that the grid line close to the edge of the silicon wafer is easily partially separated under the action of current and copper ions, and the yield and the efficiency of the battery are affected. Therefore, in order to prevent the grid line at the edge of the silicon wafer from falling off due to the penetration of the electroplating solution into the copper seed layer at the edge of the silicon wafer in the electroplating process, protective glue needs to be wrapped at the edge of the silicon wafer to form a wrapping before the copper seed layer is prepared.

The schematic cross-section of the wrapping is shown in fig. 1, the wrapping layer 102 is in a concave structure, a certain width and thickness are formed at the front and back sides of the silicon wafer 101 in the thickness direction, and the wrapping layer 102 with a certain width and thickness is formed at the side edge of the silicon wafer 101, so that the copper seed layer at the edge of the silicon wafer 101 is prevented from being contacted with electroplating liquid in the electroplating process.

When the edge-covering equipment is used for edge-covering, the edge of the silicon wafer is tangent to the outer side of the roller, the edge of the silicon wafer is contacted with glue on the outer side of the overflow groove, the silicon wafer moves forwards at a constant speed along the same tangential direction, the glue overflowed from the outer side of the glue wheel in the working state can be taken away by the silicon wafer, and the edge of the silicon wafer is covered with the glue to form the edge-covering.

However, the inventors found that when the silicon wafer 101 is hemmed using the conventional hemming apparatus, a hemming unevenness is liable to occur.

The inventors analyzed the cause of the phenomenon of uneven hemming, and considered that:

in the actual production process, the edge wrapping work of the silicon wafer 101 cannot be performed continuously, and after the upper silicon wafer 101 moves forward at a constant speed along the tangential direction to contact the encapsulation for edge wrapping, the next silicon wafer 101 cannot contact the encapsulation for edge wrapping immediately, so that the rubber wheel can idle for a certain time. However, during this period of time when the wheel is idling, the glue that adheres to the outside of the wheel will be too much relative to the glue that adheres to the outside of the wheel during operation. Therefore, when the next new silicon wafer 101 is encapsulated, referring to fig. 2, the glue amount contacted by the front end portion of the silicon wafer 101 along the moving direction will be much greater than that of the middle and rear end portions, so that the abnormal phenomenon of uneven edge covering thickness and width occurs in different areas of the silicon wafer 101.

The inventors tried to adjust for such encapsulation anomalies by reducing the amount of injected glue, but tail break was likely to occur. If the movement speed of the silicon wafer 101 during encapsulation is reduced or the linear speed of the glue wheel is increased to influence the glue output, the situation that the glue output is excessive cannot be ensured to be generated again later cannot be ensured stably.

Alternatively, the inventor tries to selectively adjust the distance between the silicon wafer 101 and the rubber wheel (for example, widen the distance between the front end of the movement direction of the silicon wafer 101 and the edge of the rubber wheel and reduce the distance between the rear end of the silicon wafer 101 and the edge of the rubber wheel) at part of time, so that the operation is complicated, and the situation that the glue is broken or the silicon wafer 101 is damaged is easily caused by improper distance adjustment. For example, the distance between the two is far, the encapsulation is easy to be too narrow, even the encapsulation is broken, the two are too close to each other because the silicon wafer 101 contacts the side surface of the rubber wheel, the two are contacted with each other in motion, the silicon wafer 101 can generate fragments due to the fact that the two are beyond the deformation limit, and if the fragments are not cleaned up outside the rubber wheel, continuous edge breakage and fragments can be caused due to the influence on the contact of the silicon wafer 101 after the encapsulation.

Therefore, the edge covering equipment is further improved, so that the problems of uneven edge covering and edge breakage or fragments of the silicon wafer 101 can be avoided to a certain extent. In order to make the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application.

The application provides an edge covering device 1, which comprises an edge covering mechanism 10 and a moving mechanism 20.

Referring to fig. 3 and 4, the taping mechanism 10 includes a taping wheel 11 and a doctor blade 12. The inside of the taping wheel 11 is provided with a first chamber 111 for accommodating the encapsulation. The taping wheel has a circumferential edge 112, and the edge is provided with a plurality of glue outlets 113 along the circumferential direction at intervals, and each glue outlet 113 is communicated with the first chamber 111. The scraper 12 is spaced from the edge portion 112 by a first predetermined distance D1 in the radial direction of the taping wheel 11 for scraping off the excess encapsulation of the edge portion 112.

With continued reference to fig. 3, the movement mechanism 20 includes: a fixing member 21 configured to fix the silicon wafer 101, and a driver 22 to drive the fixing member 21 to move tangentially to the taping wheel 11 so that the edge of the silicon wafer 101 contacts the encapsulation of the overflow edge portion 112.

The hemming device 1 provided in the embodiment of the present application is described in further detail below with reference to the accompanying drawings.

The edge covering wheel 11 is used for discharging glue, so that when the edge of the silicon wafer 101 is close to the edge portion 112 of the edge covering wheel 11, the edge covering of the overflow edge portion 112 can be contacted, and the edge covering is formed on the edge of the silicon wafer 101.

The application does not limit the concrete setting form of the edge covering wheel 11, and related personnel can perform corresponding adjustment according to the needs under the condition that the edge part 112 of the edge covering wheel 11 can be ensured to be evenly discharged.

Illustratively, the related personnel can adjust the number and the aperture of the glue outlet 113 according to the amount of glue.

Illustratively, in order to facilitate the encapsulation within the first chamber 111 to uniformly overflow the glue outlet holes 113 under the rotation of the taping wheel 11, the first chamber 111 may be configured in a cylindrical shape, so as to ensure the glue outlet uniformity of each glue outlet hole 113.

In some possible embodiments, in order to facilitate the rotation of the taping wheel 11 when using a motor or the like, and thus a uniform glue discharge, a first roller 13 may be provided on the first side 114 of the taping wheel 11.

The first roller 13 is arranged coaxially with the taping wheel 11 and moves synchronously, the first roller 13 being equipped to be connected with a motor.

For example, a connecting hole with a blind hole structure may be provided at the axial center of one side of the first roller 13, and fixedly connected with the output shaft of the motor through the connecting hole. A second blind hole is formed in the axis of the other side of the first roller 13, a protruding structure is arranged in the axis of the first side 114 of the taping wheel 11, and coaxial and synchronous movement of the taping wheel 11 and the first roller 13 is achieved by means of clamping of the protruding structure and the second blind hole.

Alternatively, a through hole may be provided at the axis of the first roller 13 and the hemming wheel 11, wherein the first chamber 111 has a double-layered cylindrical structure. Utilize the output shaft of through-hole and motor, and first gyro wheel 13 is located between bordure wheel 11 and the motor to stop the rubber coating contact motor that bordure wheel 11 overflowed.

Further, a second roller 14 may be provided on the second side 115 of the taping wheel 11.

The second roller 14 is sealingly connected to the second side 115 and a second chamber 141 inside the second roller 14 communicates with the first chamber 111 to enable the encapsulation pre-stored in the second chamber 141 to flow into the first chamber 111. The second roller 14 is further provided with an injection hole 142 communicating with the second chamber 141 so as to facilitate injection of a new encapsulation into the second chamber 141 through the injection hole 142.

The specific arrangement of the second roller 14 is not limited in this application, and in some possible embodiments, the outer diameters of the first roller 13 and the second roller 14 are equal and are both larger than the outer diameter of the taping wheel 11, so as to form a three-layer roller structure with a small middle and two large ends, so that the edge of the silicon wafer 101 can be stretched into the groove in the three-layer roller structure for taping.

Further, the groove may take a horn shape so that the edge of the first roller 13 and the edge portion 112 of the taping wheel 11 smoothly transition, and the edge of the second roller 14 and the edge portion 112 of the taping wheel 11 smoothly transition.

In addition, referring to fig. 4 and 5, the first roller 13 and the second roller 14 with the same outer diameter are provided, and the doctor 12 can be used to simultaneously approach the first roller 13 and the second roller 14, and is spaced from the first roller 13 and the second roller 14 by a second preset distance D2, so as to scrape off the excessive encapsulation adhered to the edges of the first roller 13 and the second roller 14.

In some possible embodiments, through holes may be provided at the axes of the first roller 13, the second roller 14, and the taping wheel 11, wherein the first chamber 111 and the second chamber 141 are each of a double-layered cylindrical structure. The through holes are simultaneously connected with the output shaft of the motor, and the edge covering wheel 11 is positioned between the first roller 13 and the second roller 14, so that the first roller 13, the edge covering wheel 11 and the second roller 14 are coaxially arranged and synchronously move.

The scraper 12 is used for scraping off redundant encapsulation of the edge part 112 of the edge covering wheel 11, so that encapsulation with the same thickness is attached to the edge part 112 when different silicon wafers 101 are processed, and the probability of uneven edge covering of the silicon wafers 101 is reduced.

The specific arrangement form of the doctor blade 12 is not limited, and the relevant personnel can make corresponding adjustments as required under the condition that the doctor blade 12 can scrape the excessive encapsulation with the thickness exceeding the first preset distance D1.

Illustratively, the edge of the scraper blade 12 is used to scrape off the encapsulation, and the position adjacent to the edge may be set to be a slope so that the scraped off excess encapsulation can flow along the slope at the edge of the scraper blade 12, avoiding reattachment of the scraped off encapsulation to the edge portion 112.

Further, in order to facilitate adjusting the thickness of the encapsulation at the edge portion 112, that is, adjusting the first preset distance D1 to adapt to the requirements of different silicon wafers 101 on the thickness and the width of the edge, in one possible embodiment, an adjusting member 15 may be provided, and the doctor blade 12 may be connected to the adjusting member 15, so as to adjust the distance between the doctor blade 12 and the edge portion 112.

The specific setting form of the adjusting member 15 is not limited in this application, and the related personnel can carry out corresponding adjustment as required under the condition that the adjusting member 15 can adjust the size of the first preset distance D1.

In some possible embodiments, the adjustment member 15 includes a support bracket 151. The scraper 12 is rotatably connected with the supporting frame 151, and the relative distance between the scraper 12 and the edge portion 112 is changed by adjusting the rotation angle of the scraper 12, so as to adjust the first preset distance D1.

By rotating the doctor blade 12 by the first predetermined distance D1, it will be appreciated that the center of rotation of the doctor blade 12 is not located at its center of symmetry, such as the center of the circle of the wafer, so that the distance between the doctor blade 12 and the edge portion 112 varies before and after rotation.

Further, the present application does not limit how the doctor blade 12 is rotatably connected to the supporting frame 151, in one possible embodiment, the second connecting hole 1511 may be disposed at the supporting frame 151, the first connecting hole 121 may be disposed at the doctor blade 12, and the connecting piece 1512 may be used to pass through the second connecting hole 1511 and the first connecting hole 121 at the same time, so that the doctor blade 12 may rotate relative to the supporting frame 151, and further adjust the size of the first preset distance D1.

Illustratively, the connector 1512 may be a threaded rod, and the second and first connection holes 1511, 121 may be threaded holes that mate with threaded rods. In the case that the first preset distance D1 needs to be adjusted, the screw may be unscrewed, then the scraper 12 is rotated to a desired angle, and then the screw is screwed again, so that the scraper 12 may be fixed to the support frame at the desired angle.

Or, the supporting frame 151 may be fixedly connected with the scraper 12, and then the supporting frame 151 is connected with a motor, and the motor is used to drive the supporting frame 151 to rotate, so as to drive the scraper 12 to rotate.

Alternatively, the regulating member 15 may include a support rod, and the doctor blade 12 may be moved in the extending direction of the support rod to be close to or away from the edge portion 112. The movement of the doctor blade 12 in the extension direction of the support bar can be realized by a reciprocating movement of a cylinder, for example.

The particular arrangement of the movement mechanism 20 is not limited in this application, and the relevant personnel may make corresponding adjustments as desired.

In one possible embodiment, the fixing member 21 is a suction cup, and the silicon wafer 101 is sucked by the suction cup and is driven by the driver 22 to perform edge wrapping on the silicon wafer 101 along the tangential movement of the edge wrapping wheel 11.

Illustratively, the chuck may be a Bernoulli chuck that avoids direct contact with the silicon wafer 101 when the chuck re-sucks the silicon wafer 101.

In one possible embodiment, the driver 22 may be a screw-nut structure, that is, a threaded hole and a through hole are respectively provided at the connection portion of the suction cup, the threaded hole is screwed with the screw, and the through hole is sleeved on the guide rod. Wherein the extending direction of the guide rod and the screw rod is tangential to the edge covering wheel 11. By rotating the screw, the suction cup is caused to move in the extending direction of the screw to contact the encapsulation at the edge portion 112 of the taping wheel 11.

Alternatively, the actuator 22 may be a cylinder structure, the moving end of the cylinder moving tangentially to the taping wheel 11.

The provision of the scraper 12 to scrape off the excess encapsulation outside the edge portion 112 of the taping wheel 11 can improve the taping quality. Referring to table 1 and table 2, table 1 is a statistical table of the edge covering width and thickness of the obtained silicon wafer 101, and the edge covering device 1 provided in this example and the edge covering device in the prior art which is not provided with a scraper to scrape the edge covering wheel; table 2 is a table comparing statistics of bad tablets generated during the production process of the present application and the prior art.

TABLE 1

TABLE 2

As can be seen from tables 1 and 2, the hemming device 1 provided in the embodiments of the present application can greatly reduce the occurrence of defective sheets.

The working principle of the edge covering device 1 provided by the embodiment of the application is as follows:

by using the moving mechanism 20, the silicon wafer 101 can move along the tangential direction of the edge covering wheel 11, so that the edge of the silicon wafer 101 contacts the encapsulation overflowing the edge part 112 of the edge covering wheel 11, and the edge of the silicon wafer 101 is covered.

The edge portion 112 in the circumference of the edge wrapping wheel 11 is provided with a plurality of glue outlet holes 113 along the circumference of the edge wrapping wheel at intervals, each glue outlet hole 113 is communicated with the first cavity 111 inside the edge wrapping wheel 11 for containing the glue coating, then the glue coating stored in the first cavity 111 overflows the edge portion 112 from the glue outlet holes 113 under the action of centrifugal force in the rotation process of the edge wrapping wheel 11, a circle of glue coating is formed outside the edge portion 112 along the circumference of the edge portion, and when the edge of the silicon wafer 101 is close to the edge portion 112, the glue coating at the edge portion 112 can be attached to the edge of the silicon wafer 101 to wrap the edge of the silicon wafer 101.

And, the scraper 12 and the edge portion 112 are arranged along the radial direction of the edge covering wheel 11 at a first preset distance D1, so that the scraper 12 can be used for scraping off the excessive encapsulation beyond the edge portion 112, so that the encapsulation with the thickness of the first preset distance D1 is attached to the edge portion 112, and the encapsulation with the thickness of the first preset distance D1 is used for covering the silicon wafer 101.

Therefore, when the edge covering mechanism 10 provided by the present example is used for edge covering of the silicon wafer 101, the encapsulation amount of the front end contact of the next silicon wafer 101 along the movement direction is far greater than the encapsulation amount of the rear end contact of the silicon wafer 101 due to the idle rotation of the edge covering wheel 11, so that the edge covering uniformity of the silicon wafer 101 can be improved.

The foregoing description is only of the preferred embodiments of the present application and is not intended to limit the same, but rather, various modifications and variations may be made by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims (10)

1. An edge covering mechanism, comprising:

the edge covering wheel is internally provided with a first cavity for accommodating encapsulation; the edge covering wheel is provided with a circumferential edge part, a plurality of glue outlet holes are formed in the edge part at intervals along the circumferential direction, and each glue outlet hole is communicated with the first cavity;

and the scraper is spaced from the edge part by a first preset distance along the radial direction of the edge wrapping wheel so as to scrape off the excessive rubber coating on the edge part.

2. The taping mechanism of claim 1, wherein the taping wheel has a first side and a second side disposed along an axial direction thereof;

the first side is connected with a first roller, the first roller and the edge wrapping wheel are coaxially arranged and synchronously move, and the first roller is equipped to be connected with a motor.

3. The taping mechanism of claim 2, further comprising a second roller, a second chamber being provided inside the second roller, and a glue injection hole in communication with the second chamber;

the second roller is in sealing connection with the second side, and the second chamber is communicated with the first chamber; the second roller and the edge wrapping wheel are coaxially arranged and synchronously move.

4. The taping mechanism of claim 3, wherein an outer diameter of the first roller and an outer diameter of the second roller are both greater than an outer diameter of the taping wheel.

5. The taping mechanism of claim 3, wherein an outer diameter of the first roller and an outer diameter of the second roller are equal, the doctor blade being spaced a second predetermined distance from a peripheral edge of the first roller and the second roller simultaneously for doctoring the encapsulation overflowing the first roller and the second roller.

6. The taping mechanism according to any one of claims 1-5, comprising an adjusting member connected to the doctor blade to adjust the first predetermined distance.

7. The taping mechanism of claim 6, wherein the adjustment member comprises a support bracket, the doctor blade being rotatably connected to the support bracket.

8. The taping mechanism of claim 7, wherein the doctor blade is provided with a first connection hole and the support frame is provided with a second connection hole; the connecting piece passes through the first connecting hole and the second connecting hole simultaneously, so that the support frame and the scraper rotate around the connecting piece relatively.

9. An edge covering apparatus, comprising:

the taping mechanism of any one of claims 1-8;

and the moving mechanism comprises a fixing piece for fixing the silicon wafer and a driver for driving the fixing piece to move along the tangential direction of the edge covering wheel so as to enable the edge of the silicon wafer to contact the encapsulation of the edge part.

10. The taping device of claim 9, wherein the fixture includes a suction cup to suck the silicon wafer.