CN219418111U

CN219418111U - CPU heat dissipation system

Info

Publication number: CN219418111U
Application number: CN202320578413.2U
Authority: CN
Inventors: 刘庆丰; 孙伟; 王德壮
Original assignee: Nanjing Tech University
Current assignee: Nanjing Tech University
Priority date: 2023-03-22
Filing date: 2023-03-22
Publication date: 2023-07-25
Anticipated expiration: 2033-03-22

Abstract

The utility model provides a CPU heat dissipation system, in particular to an internal and external two-stage circulation CPU heat dissipation system. The system comprises a CPU element body, an inner refrigerating unit and an outer refrigerating unit, wherein the inner refrigerating unit comprises a first refrigerating element, and the CPU element body is arranged inside the inner refrigerating unit and is adjacent to the first refrigerating element; the outer refrigeration unit comprises a refrigeration device and a cooling medium circulation loop, and the inner refrigeration unit and the refrigeration device are connected in series on the cooling medium circulation loop. The internal refrigeration unit has high response speed, can create a low-temperature environment on the surface of the CPU, and realizes rapid cooling; the thermoelectric cooling piece has small volume and light weight, and can avoid causing large weight load to the CPU; through setting up outer refrigeration unit, can be with the conduction of quick-witted case internal heat to external environment, ensure that quick-witted case internal element is in normal operating temperature to can maintain normal cooling rate for a long time.

Description

CPU heat dissipation system

Technical Field

The utility model relates to a CPU heat dissipation system, in particular to an internal and external two-stage circulation CPU heat dissipation system.

Background

With the development of semiconductor industry and microchip, the transistor density of Central Processing Unit (CPU) has been tens of times in the pastThe temperature of the CPU is greatly increased by exponentially increasing the time of year. The most advanced CPU can be accessed>100W cm ^-2 Is at a working temperature of>110 ℃, wherein the heat flux density of some hot spots can even exceed 104W cm ^-2 . Excessive operating temperatures and heat flux densities can severely impact the reliability and operating life of the CPU, with over 55% of CPU failures being caused thereby. The problem of CPU heat dissipation has become a "neck" problem that restricts the CPU industry and even the semiconductor industry. Therefore, the development of CPU heat dissipation systems has become a major issue in the semiconductor industry today.

At present, the traditional CPU heat dissipation strategy mainly comprises air cooling and liquid cooling heat dissipation. The combination of the heat dissipation fin group, the heat pipe group, the heat conduction seat and the fans in the patent CN202220814502.8 is used for meeting the heat dissipation requirement of the CPU with strong performance, so that the CPU performance is exerted more strongly and stably. In the CN202221492078.6, the cooling and heat dissipation of the device is achieved by the circulating liquid cooling, so that the CPU can maintain a lower working temperature. Although the air cooling and liquid cooling heat dissipation can achieve a certain heat dissipation effect, certain disadvantages still exist.

Air used for air cooling heat dissipation is used as a coolant for heat dissipation of the CPU, and the heat conductivity coefficient is low (0.023 Wm ^-1 K ^-1 ) Resulting in a heat flux density of such systems typically below 100W cm ^-2 It is difficult to meet the heat dissipation requirement of the CPU. The liquid cooling heat dissipation liquid replaces air as a coolant to cool the CPU, so that the CPU can be cooled to 40 ℃ in a full-load state, but the liquid cooling heat dissipation response time is longer, and the CPU can be effectively cooled only after a longer time.

In view of this, the present utility model has been made.

Disclosure of Invention

In order to solve the above technical problems, the present utility model provides a CPU heat dissipation system to solve the above problems.

In order to achieve the above purpose, the technical scheme of the utility model is as follows:

a CPU heat dissipation system comprises a CPU element body, an inner refrigeration unit and an outer refrigeration unit. The inner refrigeration unit comprises a first refrigeration element, and the CPU element body is arranged inside the inner refrigeration unit and is adjacent to the first refrigeration element. The outer refrigeration unit comprises a refrigeration device and a cooling medium circulation loop, and the inner refrigeration unit and the refrigeration device are connected in series on the cooling medium circulation loop.

Preferably, the cooling medium may be nanofluid or deionized water, etc.

Preferably, the first refrigeration element is a thermoelectric refrigeration piece, and a cold end of the thermoelectric refrigeration piece is adjacent to the surface of the CPU element body and is used for cooling the CPU element body.

Further, the inner refrigeration unit also includes a heat pipe adjacent to the hot end of the thermoelectric refrigeration fin. Preferably, the heat conducting pipe comprises a plurality of metal pipes which are connected in parallel and are welded in parallel.

Preferably, the heat conducting pipe is adjacent to the hot end of the thermoelectric cooling sheet through a heat conducting interface material so as to reduce interface thermal resistance; the cold end of the thermoelectric cooling piece is adjacent to the surface of the CPU element body through a heat-conducting interface material so as to reduce interface thermal resistance.

More preferably, the thermally conductive interface material is a thermally conductive silicone grease.

Since the thermoelectric cooling fin itself can only generate a stable temperature difference between the cold side and the hot side, and as the thermoelectric cooling fin operates, additional heat is accumulated at the hot side, which increases the load of the thermoelectric cooling fin and the temperature inside the cabinet, and eventually reduces the cooling performance and the lifetime of the thermoelectric cooling fin. Thus, the present utility model also provides the external refrigeration unit comprising a refrigeration device and a cooling medium circulation circuit.

Further, the refrigerating device comprises a second refrigerating element and a cooling medium storage tank adjacent to the second refrigerating element, and the heat-conducting pipe and the cooling medium storage tank are connected in series on the cooling medium circulation loop.

Preferably, the second refrigeration element is a thermoelectric refrigeration sheet, and a cold end of the thermoelectric refrigeration sheet is adjacent to the cooling medium storage tank; preferably, the cold side of the thermoelectric cooling fin is abutted with the cooling medium reservoir by a thermally conductive interface material to reduce interface thermal resistance. More preferably, the thermally conductive interface material is a thermally conductive silicone grease.

Further, the cooling medium circulation loop includes a cooling medium line and a heating medium line. The cold medium pipeline is communicated with the outlet of the cooling medium storage box and the inlet of the heat conducting pipe; the heat medium pipeline is communicated with the outlet of the heat conduction pipe and the inlet of the cooling medium storage box.

Further, a circulating pump and a flowmeter are sequentially arranged on the cooling medium pipeline along the direction from the outlet of the cooling medium storage box to the inlet of the heat conducting pipe. The circulating pump is connected with a power supply to supply power.

Preferably, the thermoelectric cooling fin comprises a plurality of standard cooling fin arrays and can be matched with a heat dissipation device.

Compared with the prior art, the internal refrigeration unit has high response speed, can create a low-temperature environment on the surface of the CPU, and realizes rapid cooling; the thermoelectric cooling piece has small volume and light weight, and can avoid causing large weight load to the CPU. The utility model is also provided with an external refrigeration unit, which can conduct the heat in the case to the external environment, ensure that the internal elements of the case are at normal working temperature and maintain normal cooling speed for a long time.

Drawings

In order to more clearly illustrate the technical solutions of the background and embodiments of the present utility model, the following description will briefly explain the drawings required in the background and embodiments, it being understood that the following drawings may only illustrate certain embodiments of the present utility model and should not be considered as limiting the scope, since it is possible for a person skilled in the art to obtain other relevant drawings from these drawings without inventive effort.

Fig. 1 is a schematic structural diagram of a CPU heat dissipation system in embodiment 1;

fig. 2 is an enlarged schematic diagram of the internal refrigeration unit of the CPU heat dissipation system in embodiment 1;

FIG. 3 is a schematic view ofCPU surface temperatures (T) of example 1 and comparative examples 1-2 _C ) A comparison plot of time variation;

FIG. 4 shows the hot side temperature (T) of thermoelectric cooling fins of example 1 and comparative example 1 _H ) Comparison graph over time.

Description of main reference numerals:

1-a CPU element body; 2-a first refrigeration element; 3-a heat conduction pipe; 4-a second refrigeration element; 5-a cooling medium storage tank; 6-a circulating pump; 7-a power supply; 8-a flow meter; 9-a cold medium pipeline.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, "a plurality of" a number "means two or more, unless specifically defined otherwise.

Example 1

A CPU heat dissipation system, as shown in FIG. 1, comprises a CPU element body 1, and further comprises an inner refrigeration unit and an outer refrigeration unit. The inner refrigeration unit comprises a first refrigeration element 2, and a CPU element body 1 is arranged inside the inner refrigeration unit and is adjacent to the first refrigeration element 2. The outer refrigeration unit comprises a refrigeration device and a cooling medium circulation loop, and the inner refrigeration unit and the refrigeration device are connected in series on the cooling medium circulation loop.

The cooling medium in this embodiment may be deionized water.

The first cooling element 2 is a thermoelectric cooling fin, and as shown in fig. 2, a cold end of the thermoelectric cooling fin is adjacent to the surface of the CPU element body 1, so as to cool the CPU element body 1.

The inner refrigeration unit further comprises a heat conducting pipe 3, and the heat conducting pipe 3 is adjacent to the hot end of the thermoelectric refrigeration piece. The heat conduction pipe 3 in this embodiment includes six metal pipes connected in parallel, and the six metal pipes are welded in parallel.

In a preferred implementation manner of this embodiment, the heat conducting tube 3 is buckled with the hot end of the thermoelectric cooling fin through a heat conducting interface material so as to reduce interface thermal resistance; the cold end of the thermoelectric cooling piece is buckled with the surface of the CPU element body 1 through a heat-conducting interface material so as to reduce the interface thermal resistance.

In a more preferred embodiment, the thermally conductive interface material is a thermally conductive silicone grease.

Based on Peltier effect, the thermoelectric cooling fin forming the first cooling element 2 directly converts external power supply energy into heat energy, and the cold end temperature of the thermoelectric cooling fin is rapidly reduced so as to offset part of Joule heat generated by part of the CPU element body 1 in the operation process; part of the joule heat generated by the CPU element body 1 during operation is conducted to the hot end thereof via the thermoelectric cooling fin constituting the first cooling element 2 based on the heat conduction manner; the heat of the hot end is conducted to the heat conducting pipe 3 based on a heat conduction manner.

The refrigerating device comprises a second refrigerating element 4 and a cooling medium storage tank 5 adjacent to the second refrigerating element 4, and the heat conducting pipe 3 and the cooling medium storage tank 5 are connected in series on the cooling medium circulation loop.

The second cooling element 4 is also a thermoelectric cooling fin, the cold end of which adjoins the cooling medium storage tank 5; in the preferred implementation of this embodiment, the cold end of the thermoelectric cooler is also abutted to the cooling medium reservoir 5 by a thermally conductive interface material to reduce the interface thermal resistance. In a more preferred embodiment, the thermally conductive interface material is a thermally conductive silicone grease.

The cooling medium circulation circuit comprises a cooling medium line 9 and a heating medium line. The cold medium pipeline 9 is communicated with the outlet of the cold medium storage tank 5 and the inlet of the heat conducting pipe 3; the heat medium pipeline is communicated with the outlet of the heat conduction pipe 3 and the inlet of the cooling medium storage tank 5.

The cooling medium pipeline 9 is provided with a circulating pump 6 and a flowmeter 8 in sequence along the direction from the outlet of the cooling medium storage tank 5 to the inlet of the heat conducting pipe 3. The circulation pump 7 is connected to a power supply 7 to supply power.

The thermoelectric cooling fins forming the first cooling element 2 and the second cooling element 4 each comprise a plurality of standard cooling fin arrays and can be matched with a heat dissipation device, and the model number of the thermoelectric cooling fins in the embodiment is TEC-19906.

Based on the peltier effect, the thermoelectric cooling fin constituting the second cooling element 4 converts the electric energy of the power source 7 directly into heat energy, and the cold end temperature thereof is rapidly lowered to lower the fluid temperature in the cooling medium storage tank 5; driving fluid in the cooling medium storage tank 5 to flow through the circulating pump 6 to form circulating fluid, and recording the flow rate of the circulating fluid by the flowmeter 7; the circulating fluid flows through the heat conducting pipe 3 and the heat medium pipeline, and heat concentrated by the inner refrigerating unit is conducted out by heat conduction.

In this embodiment, taking a computer CPU (Intel Core 2Quad Q8200) as an example, the heat source is operated at 1995MHz to generate heat, and a multichannel temperature tester is used to carry high-precision thermocouples to measure time-temperature parameters to obtain the CPU surface temperature (T) _C ) A time-dependent curve, see fig. 3. The time-temperature parameter was measured by a multichannel temperature tester equipped with a high-precision thermocouple to obtain the temperature (T) of the hot end of the thermoelectric cooling fin constituting the first cooling element 2 _H ) A time-dependent curve, see fig. 4.

Comparative example 1

The same computer CPU (Intel Core 2 head q 8200) and the same heat source as in example 1 were employed, and the difference from example 1 was that no heat dissipation system was mounted.

The time-temperature parameter is measured by a multichannel temperature tester carrying high-precision thermocouple to obtain the CPU surface temperature (T) _C ) A time-dependent curve, see fig. 3.

Comparative example 2

The same computer CPU (Intel Core 2 head q 8200) and the same heat source as in example 1 were employed, except that the external refrigeration unit in example 1 was not provided as in example 1.

The time-temperature parameter is measured by a multichannel temperature tester carrying high-precision thermocouple, and the temperature (T) of the hot end of the thermoelectric cooling sheet in the internal cooling unit is obtained _H ) A time-dependent curve, see fig. 4.

As can be seen from fig. 3, in comparative example 1, the CPU rapidly increased in temperature without any heat dissipation system, reaching about 110 ℃ in about 200 seconds, and the CPU protection mechanism was triggered, resulting in CPU failure. When the external refrigeration unit is not provided in comparative example 2, the CPU heats up faster, triggering the protection mechanism (110 ℃) at about 100s, mainly due to the additional joule heat generated by the internal refrigeration unit when operating. In the case of the embodiment 1, the inner refrigeration unit and the outer refrigeration unit are provided, and the CPU is operated at a stable temperature, and can be in an optimum operating temperature range for a long time.

As can be seen from fig. 4, when the external refrigeration unit is not provided in comparative example 2, the temperature of the hot end of the thermoelectric refrigeration fin in the internal refrigeration unit is rapidly increased to about 165 degrees at about 100s, and the internal refrigeration unit is very damaged due to low operating efficiency. When the inner refrigeration unit and the outer refrigeration unit are provided in embodiment 1, the temperature of the hot end of the thermoelectric refrigeration piece in the inner refrigeration unit is stable and is in the optimal working temperature area for a long time.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "preferred embodiments," "particular embodiments," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

While embodiments of the present utility model have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the utility model.

Claims

1. A CPU heat dissipation system comprising a CPU component body, further comprising:

an inner refrigeration unit comprising a first refrigeration element, the CPU element body being disposed inside the inner refrigeration unit and adjacent to the first refrigeration element;

the outer refrigeration unit comprises a refrigeration device and a cooling medium circulation loop, and the inner refrigeration unit and the refrigeration device are connected in series on the cooling medium circulation loop.

2. The CPU heat dissipation system of claim 1, wherein the first cooling element is a thermoelectric cooling fin, and wherein a cold side of the thermoelectric cooling fin is contiguous with the CPU element body surface.

3. The CPU heat dissipation system of claim 2 wherein the internal refrigeration unit further comprises a heat pipe, the heat pipe being contiguous with the hot end of the thermoelectric refrigeration fin.

4. The CPU heat dissipation system of claim 3 wherein the heat pipe is contiguous with the hot end of the thermoelectric cooling fin through a thermally conductive interface material to reduce interface thermal resistance; the cold end of the thermoelectric cooling piece is adjacent to the surface of the CPU element body through a heat-conducting interface material so as to reduce interface thermal resistance.

5. A CPU cooling system according to claim 3, wherein the cooling device comprises a second cooling element and a cooling medium reservoir adjacent to the second cooling element, the heat pipe and cooling medium reservoir being connected in series on the cooling medium circulation circuit.

6. The CPU heat dissipation system of claim 5 wherein the cooling medium circulation loop includes a cooling medium line and a heating medium line;

the cold medium pipeline is communicated with the outlet of the cooling medium storage box and the inlet of the heat conducting pipe; the heat medium pipeline is communicated with the outlet of the heat conduction pipe and the inlet of the cooling medium storage box.

7. The CPU heat sink system of claim 6 wherein the coolant line is provided with a circulation pump and a flow meter in sequence along the direction from the outlet of the coolant reservoir to the inlet of the heat pipe.

8. The CPU heat dissipation system of claim 5 wherein the second cooling element is a thermoelectric cooling fin and wherein the cold side of the thermoelectric cooling fin is adjacent to the cooling medium reservoir.

9. The CPU heat dissipation system of claim 8 wherein the thermoelectric cooling fin comprises a plurality of standard cooling fin arrays.

10. The CPU heat dissipation system of claim 3 wherein the heat pipe comprises a plurality of metal pipes connected in parallel.