CN219417665U - Pressing device for IC test - Google Patents

Abstract

The application provides a pushing device for IC test, which comprises a first substrate, a first driving mechanism, a guiding mechanism and a second driving mechanism. The first driving mechanism is fixedly connected with the first substrate. The guiding mechanism is fixedly connected to the first substrate, a first guiding structure extending along the vertical direction is formed, the second driving mechanism is slidably connected in the first guiding structure and is in transmission connection with the first driving mechanism, and the second driving mechanism moves along the vertical direction under the driving of the first driving mechanism, so that the second driving mechanism moves along the vertical direction to drive the testing assembly, and the travel of the second driving mechanism in the vertical direction is shortened by the first guiding structure extending along the vertical direction arranged on the guiding mechanism, so that the testing efficiency of the testing assembly is improved.

Description

Pressing device for IC test

Technical Field

The application belongs to the technical field of IC chip testing, and particularly relates to a pressing device for IC testing.

Background

When testing an IC chip (integrated circuit chip), the IC chip needs to be placed on a platform to be tested, and a test assembly is used to test the IC chip. At present, a test assembly in the existing IC chip test device is driven by a servo screw rod structure, so that the generated technical problems are as follows: the servo screw rod structure is heavy, and the stroke of the test assembly on the servo screw rod structure is longer, so that the test running time of a single IC chip is long, and the test efficiency is low.

Disclosure of Invention

An objective of the present embodiment is to provide a pressing device for testing an IC, so as to solve the technical problem of low testing efficiency of the IC testing device in the prior art.

In order to achieve the above purpose, the technical scheme adopted in the application is as follows: provided is a hold-down device for IC test, comprising:

a first substrate;

the first driving mechanism is fixedly connected with the first substrate;

the guide mechanism is fixedly connected to the first substrate and is provided with a first guide structure extending along a first direction;

the second driving mechanism is used for fixing the testing assembly, is connected in the first guiding structure in a sliding mode, is connected with the first driving mechanism in a transmission mode, and moves along the first direction under the driving of the first driving mechanism.

In one embodiment, the second driving mechanism includes:

the first driving piece is connected in the first guide structure in a sliding way, and one end of the first driving piece is in transmission connection with the first driving mechanism;

the second driving piece is connected with the other end of the first driving piece and is used for fixing the test assembly;

the first driving piece drives the second driving piece to move along the first direction in the first guiding structure under the driving of the first driving mechanism.

In one embodiment, the first driving mechanism includes:

the driving motor is fixedly connected to the first substrate;

the switching piece is fixedly connected to the rotating shaft of the driving motor, a containing groove is formed in the switching piece, and one end, close to the switching piece, of the first driving piece is contained in the containing groove.

In one embodiment, the guiding mechanism further comprises:

the second guide structure extends along a second direction and is communicated with the first guide structure;

the first driving piece moves in the first guide structure and the second guide structure under the driving of the adapter piece;

the first driving piece moves in the second guiding structure so as to enable the first driving piece to move in the second direction;

wherein the first direction and the second direction are perpendicular to each other.

In one embodiment, the guiding mechanism further comprises:

the guide plate is fixedly connected to the first substrate, the first guide structure and the second guide structure are of hole structures, and the first guide structure and the second guide structure are formed on the guide plate and penetrate through the guide plate along a third direction;

the first direction, the second direction and the third direction are perpendicular to each other.

In one embodiment, the IC test hold-down device further includes:

the first guide piece is connected to the first base plate in a sliding manner and slides relative to the first base plate along the second direction;

the second driving piece is connected with the first guiding piece in a sliding mode and slides relative to the first guiding piece along the first direction.

In one embodiment, the IC test hold-down device further includes:

the baffle is fixedly connected to the first guide piece;

the photoelectric sensor is fixedly connected to the first substrate and used for detecting the position of the first guide piece when the first guide piece drives the baffle to move along the second direction and the baffle moves to a position between the transmitting end and the receiving end of the photoelectric sensor.

In one embodiment, the IC test hold-down device further includes:

a second substrate;

and the third driving mechanism is fixedly connected with the second substrate, is in transmission connection with the first substrate and is used for driving the first substrate to slide along the third direction relative to the second substrate.

In one embodiment, the IC test hold-down device further includes:

and the buffer is fixedly connected with one end, far away from the third driving mechanism, of the second substrate and is used for limiting the movement of the first substrate along the third direction.

The IC test that this application provided is with pushing down device's beneficial effect lies in: compared with the prior art, the pressing device for IC test comprises a first substrate, a first driving mechanism, a guiding mechanism and a second driving mechanism. The first driving mechanism is fixedly connected with the first substrate. The guiding mechanism is fixedly connected to the first substrate, a first guiding structure extending along the vertical direction is formed, the second driving mechanism is slidably connected in the first guiding structure and is in transmission connection with the first driving mechanism, and the second driving mechanism moves along the vertical direction under the driving of the first driving mechanism, so that the second driving mechanism moves along the vertical direction to drive the testing assembly, and the travel of the second driving mechanism in the vertical direction is shortened by the first guiding structure extending along the vertical direction arranged on the guiding mechanism, so that the testing efficiency of the testing assembly is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required for the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a pressing device for IC testing according to an embodiment of the present disclosure;

fig. 2 is a schematic structural diagram of a pressing device for IC testing according to an embodiment of the present disclosure;

FIG. 3 is an enlarged view of the structure of portion A of FIG. 2 of the present application;

fig. 4 is a schematic structural diagram of a first driving mechanism according to an embodiment of the present disclosure;

fig. 5 is a schematic structural diagram of a guiding mechanism according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a guiding mechanism according to an embodiment of the present application.

Wherein, each reference sign in the figure:

10. a first substrate; 11. a first guide rail; 12. a photoelectric sensor; 13. a third slider; 20. a first driving mechanism; 21. a driving motor; 22. an adapter; 221. a receiving groove; 30. a guide mechanism; 31. a guide plate; 32. a first guide structure; 33. a second guide structure; 40. a second driving mechanism; 41. a first driving member; 42. a second driving member; 421. a second slider; 43. a bearing; 50. a testing component; 60. a guide member; 61. a first slider; 62. a second guide rail; 63. a baffle; 70. a second substrate; 71. a buffer; 72. a third guide rail; 80. a third driving mechanism; 81. and a telescopic cylinder.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved by the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the present application.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present application and simplify description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1 to 6, a description will be given of a pressing device for IC testing according to an embodiment of the present application.

A hold-down device for IC test comprises a first substrate 10, a first driving mechanism 20, a guiding mechanism 30, and a second driving mechanism 40. Wherein, the first driving mechanism 20 is fixedly connected with the first substrate 10. The guide mechanism 30 is fixedly coupled to the first substrate 10, and is formed with a first guide structure 32 extending in a first direction. The second driving mechanism 40 is provided for fixing the testing assembly 50, the second driving mechanism 40 is slidably connected in the first guiding structure 32 and is in transmission connection with the first driving mechanism 20, and the second driving mechanism 40 is driven by the first driving mechanism 20 to move along the first direction.

In the present application, the first direction is set as the Z-axis direction in fig. 1 of the present application, the second direction is set as the X-axis direction in fig. 1 of the present application, and the third direction is set as the Y-axis direction in fig. 1 of the present application, where the first direction, the second direction, and the third direction are perpendicular to each other. Assuming that the Z-axis direction is vertical, the first driving mechanism 20 drives the second driving mechanism to move in the vertical direction in the first guiding structure 32, so that the second driving mechanism 40 can drive the testing assembly 50 to move up and down in the vertical direction, so that the testing assembly 50 is pressed down in the vertical direction to test the IC.

Compared with the prior art, the pressing device for IC test comprises a first substrate 10, a first driving mechanism 20, a guiding mechanism 30 and a second driving mechanism 40. Wherein, the first driving mechanism 20 is fixedly connected with the first substrate 10. The guide mechanism 30 is fixedly connected to the first substrate 10, and is provided with a first guide structure 32 extending along a vertical direction, the second driving mechanism 40 is slidably connected in the first guide structure 32 and is in transmission connection with the first driving mechanism 20, and the second driving mechanism 40 moves along the vertical direction under the driving of the first driving mechanism 20, so that the second driving mechanism 40 moves along the vertical direction to drive the test assembly 50, and the first guide structure 32 extending along the vertical direction is arranged on the guide mechanism 30, so that the stroke of the second driving mechanism 40 in the vertical direction is shortened, and the test efficiency of the test assembly 50 is improved.

Specifically, in the present application, the first driving mechanism 20 includes a driving motor 21 and an adapter 22. The driving motor 21 has a motor fixing seat, and the driving motor 21 is fixedly connected with the motor fixing seat, and the motor fixing seat is fixedly connected to the first substrate 10, so that the driving motor 21 is fixedly connected with the first substrate. The adapter 22 comprises a connecting part and a containing groove 221 on the connecting part, the connecting part is of a cylindrical structure, the connecting part is sleeved on the rotating shaft of the driving motor 21 and fixedly connected with the rotating shaft of the driving motor 21, the connecting part extends along the direction perpendicular to the extending direction of the connecting part, the connecting part is of a plate-shaped structure, the containing groove 221 is formed on the connecting part, the containing groove 221 is provided with an opening, and a notch of the containing groove 221 is positioned on the side wall of the adapter 22.

The guide mechanism 30 includes a guide plate 31, where the guide plate 31 is fixed on the motor fixing base, or the guide plate 31 is fixed on the first substrate 10, and in the embodiment of the present application, the guide plate 31 is fixed on the motor fixing base for example. The first guide plate 31 is formed with a first guide structure 32 extending in a first direction.

Preferably, in the embodiment of the present application, the first guide structure 32 is a hole structure, and the first guide structure 32 penetrates the guide plate 31 in the second direction.

The second driving mechanism 40 includes a first driving member 41 and a second driving member 42, the first driving member 41 has a columnar structure, and the first driving member 41 is accommodated in the first guiding structure 32. One end of the first driving member 41 is accommodated in the accommodating groove 221, the other end is fixedly connected with the second driving member 42, and the second driving member 42 is further used for fixing the testing assembly 50.

The rotating shaft of the driving motor 21 rotates, and the adaptor 22 toggles the first driving piece 41 to move in the first guiding structure 32 along the vertical direction, and the first driving piece 41 drives the second driving piece 42 to move in the vertical direction, so that the second driving piece 42 drives the testing assembly 50 to move in the vertical direction.

In one embodiment of the present application, the bearing 43 is sleeved on the first driving workpiece, and the bearing 43 is located at a contact position between the first driving member 41 and the first guiding structure 32 of the accommodating groove 221, so as to improve the rotational connection between the first driving member 41 and the adapter member 22, and improve the movement smoothness of the first driving member 41 in the first guiding structure 32.

In one embodiment of the present application, the guiding mechanism 30 further comprises a second guiding structure 33, the second guiding structure 33 extends along the second direction, and the second guiding structure 33 is disposed in communication with the first guiding structure 32. The first driving member 41 moves within the first guide structure 30 and the second guide structure 30 under the driving of the adapter member 22. The first driving member 41 moves within the second guide structure 30 to move the first driving member 41 in the second direction.

Specifically, in the present application, the second guide structure 33 is formed on the guide plate 31, and preferably, in the present application, the second guide structure 33 is also a hole structure, and the second guide structure 33 extends in the second direction and penetrates the guide plate 31 in the third direction.

The second guiding structure 33 and the guiding member 60 are in structural communication, and the communication part of the second guiding structure 33 and the guiding member 60 is in transition by adopting a smooth cambered surface so as to ensure the smoothness of the movement of the bearing 43 on the first driving member 41 between the first guiding structure 32 and the second guiding structure 33.

Under the driving of the first rotating shaft, the adaptor 22 drives the first driving member 41 to move from the first guiding structure 32 into the second guiding structure 33, so that the first driving member 41 drives the second driving member 42 to move along the second direction.

In one embodiment of the present application, the IC test hold-down device further includes a guide 60, where the guide 60 is slidably connected to the first substrate 10 and slides along the second direction relative to the first substrate 10. The second driving member 42 is slidably coupled to the guide member 60 and slides in a first direction relative to the guide member 60.

Specifically, in the embodiment of the present application, the first substrate 10 is provided with the first guide rail 11 extending along the second direction, the guide member 60 is fixedly connected with the first slide seat 61, the guide member 60 is slidably connected with the first guide rail 11 through the first slide seat 61, when the driving motor 21 rotates, the adaptor 22 drives the first driving member 41 to move from the first guide structure 32 into the second guide structure 33 and move in the second guide structure 33, and when the first driving member is limited by the first guide rail 11 and the first slide seat 61, the guide member 60 moves relative to the first substrate 10 along the second direction.

The second guide rail 62 is disposed on a side of the guide member 60 facing the second driving member 42, the second guide rail 62 extends along the first direction, the second driving member 42 is fixedly connected with the second slide 421, and when the driving motor 21 rotates, the adapter member 22 drives the first driving member 41 to move into the first guide structure 32 from the second guide structure 33, and when the adapter member moves in the first guide structure 32, the second driving member 42 moves relative to the guide member 60 along the first direction under the limitation of the second guide rail 62 and the second slide 421.

In one embodiment of the present application, the IC test hold down device further includes a baffle 63 and a photo sensor 12. Wherein the baffle 63 is fixedly connected to the guide 60. The photo sensor 12 is fixedly connected to the first substrate 10. When the guide 60 drives the shutter 63 to move in the second direction and the shutter 63 moves between the transmitting end and the receiving end of the photo sensor 12, the sensing between the transmitting end and the receiving end of the photo sensor 12 is interrupted, the photo sensor 12 transmits an interruption sensing signal to the controller, and the controller controls the driving motor 21 to stop rotating or reversely rotating so that the shutter 63 moves away from the transmitting end and the receiving end of the photo sensor 12, thereby defining the moving positions of the guide 60, the second driving member 42 and the test assembly 50 in the second direction.

In one embodiment of the present application, the IC test hold-down device further includes a second substrate 70 and a third drive mechanism 80.

In this application, preferably, the third driving mechanism 80 is a telescopic cylinder 81, the cylinder body of the telescopic cylinder 81 is fixedly connected to the second substrate 70, the telescopic rod of the telescopic cylinder 81 is in transmission connection with the first substrate 10, and when the telescopic rod stretches relative to the telescopic cylinder 81, the first substrate 10 is driven to slide relative to the second substrate 70 along the third direction, so that the first substrate 10 drives the first driving mechanism 20, the guiding mechanism 30 and the second driving mechanism 40 to move along the third direction. The second substrate 70 is provided with a third guide rail 72 extending along a third direction, the second substrate 70 is provided with a third slide seat 13, the third slide seat 13 is slidably connected with the third guide rail 72, and when the telescopic rod of the telescopic cylinder 81 stretches, the second substrate 70 slides along the third direction relative to the first substrate 10 through the third slide seat 13 and the third guide rail 72.

In one embodiment of the present application, the IC test pressing apparatus further includes a buffer 71, where the buffer 71 is fixedly connected to an end of the second substrate 70 away from the third driving mechanism 80, and when the telescopic cylinder 81 drives the second substrate 70 to move toward the buffer 71 along the third direction, the second substrate 70 abuts against the buffer 71 to limit the movement of the first substrate 10 along the third direction.

The foregoing description of the preferred embodiment of the present utility model is not intended to limit the utility model to the particular form disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the utility model.

Claims (9)

1. A hold-down device for IC testing, comprising:

a first substrate;

the first driving mechanism is fixedly connected with the first substrate;

the guide mechanism is fixedly connected to the first substrate and is provided with a first guide structure extending along a first direction;

the second driving mechanism is used for fixing the testing assembly, is connected in the first guiding structure in a sliding mode, is connected with the first driving mechanism in a transmission mode, and moves along the first direction under the driving of the first driving mechanism.

2. The IC test hold-down device according to claim 1, wherein the second driving mechanism includes:

the first driving piece is connected in the first guide structure in a sliding way, and one end of the first driving piece is in transmission connection with the first driving mechanism;

the second driving piece is connected with the other end of the first driving piece and is used for fixing the test assembly;

the first driving piece drives the second driving piece to move along the first direction in the first guiding structure under the driving of the first driving mechanism.

3. The IC test hold-down device according to claim 2, wherein the first driving mechanism includes:

the driving motor is fixedly connected to the first substrate;

the switching piece is fixedly connected to the rotating shaft of the driving motor, a containing groove is formed in the switching piece, and one end, close to the switching piece, of the first driving piece is contained in the containing groove.

4. The IC testing hold-down device of claim 3, wherein the guide mechanism further comprises:

the second guide structure extends along a second direction and is communicated with the first guide structure;

the first driving piece moves in the first guide structure and the second guide structure under the driving of the adapter piece;

the first driving piece moves in the second guiding structure so as to enable the first driving piece to move in the second direction;

wherein the first direction and the second direction are perpendicular to each other.

5. The IC test hold-down device of claim 4, wherein the guide mechanism further comprises:

the guide plate is fixedly connected to the first substrate, the first guide structure and the second guide structure are of hole structures, and the first guide structure and the second guide structure are formed on the guide plate and penetrate through the guide plate along a third direction;

the first direction, the second direction and the third direction are perpendicular to each other.

6. The IC test hold-down device of claim 5, further comprising:

the first guide piece is connected to the first base plate in a sliding manner and slides relative to the first base plate along the second direction;

the second driving piece is connected with the first guiding piece in a sliding mode and slides relative to the first guiding piece along the first direction.

7. The IC test hold-down device of claim 6, further comprising:

the baffle is fixedly connected to the first guide piece;

the photoelectric sensor is fixedly connected to the first substrate and used for detecting the position of the first guide piece when the first guide piece drives the baffle to move along the second direction and the baffle moves to a position between the transmitting end and the receiving end of the photoelectric sensor.

8. The IC test hold-down device of claim 7, further comprising:

a second substrate;

and the third driving mechanism is fixedly connected with the second substrate, is in transmission connection with the first substrate and is used for driving the first substrate to slide along the third direction relative to the second substrate.

9. The IC test hold-down device of claim 8, further comprising:

and the buffer is fixedly connected with one end, far away from the third driving mechanism, of the second substrate and is used for limiting the movement of the first substrate along the third direction.