CN219407527U - High temperature resistant dustproof semiconductor packaging box - Google Patents

Abstract

The utility model relates to the technical field of high-temperature-resistant dustproof semiconductor packaging boxes, and discloses a high-temperature-resistant dustproof semiconductor packaging box which comprises a main body mechanism, a containing mechanism and a heat dissipation mechanism, wherein the containing mechanism is positioned in the main body mechanism, the heat dissipation mechanism is positioned in the main body mechanism, the main body mechanism comprises a machine body, a machine cover, a handle, a tag groove and an observation window, the machine cover is movably arranged at the upper end of the machine body, the handle is fixedly arranged at the upper end of the machine cover, the tag groove is fixedly arranged at the front end of the machine body, and the observation window is fixedly arranged at the left end of the machine body. This high temperature resistant dustproof semiconductor packaging box through the fixed setting to receiving mechanism's installation, and the user can put the semiconductor in the inner of standing groove, and the standing groove can be spacing to it, and the fixed connection of dirt straw and suction inlet, dust catcher store the dust suction storage box of organism inside through dirt straw and suction inlet, realizes removing dust, has promoted the practicality of packing carton.

Description

High temperature resistant dustproof semiconductor packaging box

Technical Field

The utility model relates to the technical field of high-temperature-resistant dustproof semiconductor packaging boxes, in particular to a high-temperature-resistant dustproof semiconductor packaging box.

Background

With the continuous development of semiconductor packaging technology, various semiconductor packaging boxes are layered endlessly, the sizes and mounting structures of different semiconductor packaging boxes are different, and the semiconductor packaging boxes serve as a device for temporarily storing semiconductors, so that convenience is brought to users, and meanwhile, a plurality of places which can be optimized are also provided.

In the prior art, most of semiconductor packaging boxes are generally used for directly storing semiconductors, so that in the actual use process, if more dust can pollute the semiconductors, the normal use of the semiconductors is affected.

In order to solve the problem that in the actual use process, if more dust can pollute the semiconductor, the normal use of the semiconductor is affected, most of the prior art adopts a method that a user cleans the packaging box in time, but the method is troublesome.

Disclosure of Invention

(one) solving the technical problems

The utility model aims to provide a high-temperature-resistant and dust-proof semiconductor packaging box, which aims to solve the problem that most of semiconductor packaging boxes in the prior art are used for directly storing semiconductors, so that in the actual use process, if more dust can pollute the semiconductors, the normal use of the semiconductors is affected.

(II) technical scheme

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high temperature resistant dustproof semiconductor packaging box, includes main part mechanism, receiving mechanism and cooling mechanism, receiving mechanism is located main part mechanism's inside, cooling mechanism is located main part mechanism's inside, main part mechanism includes organism, lid, handle, label groove and observation window, lid movable mounting is in the upper end of organism, the fixed upper end that sets up at the lid of handle, the fixed front end that sets up at the organism in label groove, the fixed left end that sets up at the organism of observation window, receiving mechanism includes heat-resistant layer, cystosepiment and standing groove, the heat-resistant layer is fixed to be set up at the inner of organism, the cystosepiment is fixed to be set up at the inner of heat-resistant layer, the standing groove is fixed to be set up at the inner of cystosepiment.

Preferably, the containing mechanism further comprises a tray, a limiting block, a dust collector, a dust storage box, a dust suction pipe and a suction port, the tray is fixedly arranged at the inner end of the machine body, a user can place a semiconductor at the inner end of the placing groove, the placing groove can limit the semiconductor, and the stability of the packing box is improved.

Preferably, the tray fixed mounting is in the below of cystosepiment, the stopper is fixed to be set up at the inner of organism, dust catcher fixed mounting is in the upper end of stopper, and the stopper mainly used is fixed the dust catcher in the inside of organism, has promoted the stability of packing carton effectively.

Preferably, the dust storage box is fixedly arranged at the inner end of the machine body, the dust storage box is fixedly arranged at the right end of the dust collector, the dust suction pipe is fixedly arranged at the inner end of the machine body, and the dust collector sucks dust in the machine body into the dust storage box through the dust suction pipe and the suction port to store, so that dust is removed, and the practicability of the packing box is effectively improved.

Preferably, the dust suction pipe is fixedly arranged at the right end of the dust storage box, the suction port is fixedly arranged at the upper end of the dust suction pipe, the suction port is fixedly arranged at the inner end of the machine body, and the suction port sucks dust in the packaging box into the dust storage box, so that convenience of the packaging box is improved.

Preferably, the heat dissipation mechanism comprises a fixed shaft, a motor, a rotating shaft and a fan, wherein the fixed shaft is fixedly arranged at the inner end of the machine body, and can fix the motor, the rotating shaft and the fan in the machine body, so that the stability of the packaging box can be improved.

Preferably, the motor is fixedly arranged at the upper end of the first fixed shaft, the rotating shaft is fixedly arranged at the left end of the motor, the fan is movably arranged at the left end of the rotating shaft, the motor is started to drive the rotating shaft to rotate, the rotating shaft rotates to drive the fan to rotate, the fan rotates to generate wind, heat can be dissipated in the machine body, and the safety of the packaging box is improved.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the high-temperature-resistant dustproof semiconductor packaging box, through the installation of the storage mechanism and the fixed arrangement of the placing groove, a user can place a semiconductor at the inner end of the placing groove, the placing groove can limit the semiconductor, the dust suction pipe is fixedly connected with the suction port, and the dust collector sucks dust in the machine body into the dust storage box through the dust suction pipe and the suction port to store, so that dust is removed, and the practicability of the packaging box is effectively improved;

2. according to the high-temperature-resistant dustproof semiconductor packaging box, through the installation of the main body mechanism and the fixed connection of the cover and the handle, a user can pull the packaging box through the handle, so that the convenience of the packaging box is improved, and the safety of the packaging box is effectively improved through the fixed arrangement of the observation window;

3. this high temperature resistant dustproof semiconductor packaging box through the installation to cooling body, through the fixed connection of rotation axis and fan, and the motor starts, and the drive rotation axis rotates, and the rotation axis rotates and drives the fan and rotate, and the fan rotates and produces wind, can dispel the heat to the inside of organism, helps promoting the security of packing carton.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic perspective view of the present utility model;

FIG. 3 is a schematic view of a storage structure of the present utility model;

FIG. 4 is a schematic view of a dust-proof structure of the present utility model;

fig. 5 is a schematic view of a part of the structure of the housing mechanism of the present utility model.

In the figure: 1. a main body mechanism; 101. a body; 102. a cover; 103. a handle; 104. a label slot; 105. an observation window; 2. a storage mechanism; 201. a heat-resistant layer; 202. a foam board; 203. a placement groove; 204. a tray; 205. a limiting block; 206. a dust collector; 207. a dust storage box; 208. a dust suction pipe; 209. a suction port; 3. a heat dissipation mechanism; 301. a fixed shaft; 302. a motor; 303. a rotation shaft; 304. a fan.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-5, the present utility model provides a technical solution: the utility model provides a high temperature resistant dustproof semiconductor packaging box, including main part mechanism 1, receiving mechanism 2 and cooling mechanism 3, receiving mechanism 2 is located the inside of main part mechanism 1, cooling mechanism 3 is located the inside of main part mechanism 1, main part mechanism 1 includes organism 101, lid 102, handle 103, label groove 104 and observation window 105, lid 102 movable mounting is in the upper end of organism 101, handle 103 is fixed to be set up in the upper end of lid 102, label groove 104 is fixed to be set up in the front end of organism 101, the left end at organism 101 is fixed to the observation window 105, receiving mechanism 2 includes heat-resistant layer 201, foam board 202 and standing groove 203, heat-resistant layer 201 is fixed to be set up at the inner of organism 101, foam board 202 is fixed to be set up at the inner of heat-resistant layer 201, standing groove 203 is fixed to be set up at the inner of foam board 202.

The containing mechanism 2 further comprises a tray 204, a limiting block 205, a dust collector 206, a dust storage box 207, a dust suction pipe 208 and a suction port 209, wherein the tray 204 is fixedly installed at the inner end of the machine body 101, the tray 204 is fixedly installed below the foam plate 202, the limiting block 205 is fixedly arranged at the inner end of the machine body 101, the dust collector 206 is fixedly installed at the upper end of the limiting block 205, the dust storage box 207 is fixedly installed at the inner end of the machine body 101, the dust storage box 207 is fixedly installed at the right end of the dust collector 206, the dust suction pipe 208 is fixedly installed at the inner end of the machine body 101, the suction port 209 is fixedly installed at the upper end of the dust suction pipe 208, the suction port 209 is fixedly installed at the inner end of the machine body 101, when the high-temperature-resistant dustproof semiconductor packing box is used, a user can firstly place a semiconductor at the inner end of the placing groove 203 on the foam plate 202, the placing groove 203 can limit the placed semiconductor, and the dust collector 206 sucks the dust inside the machine body 101 into the dust storage box 207 through the dust 208 and the suction port 209, so that dust is removed.

The heat dissipation mechanism 3 comprises a fixed shaft 301, a motor 302, a rotating shaft 303 and a fan 304, wherein the fixed shaft 301 is fixedly arranged at the inner end of the machine body 101, the motor 302 is fixedly arranged at the upper end of the fixed shaft 301, the rotating shaft 303 is fixedly arranged at the left end of the motor 302, the fan 304 is movably arranged at the left end of the rotating shaft 303, the motor 302 is started to drive the rotating shaft 303 to rotate, the rotating shaft 303 rotates to drive the fan 304 to rotate, and the fan 304 rotates to generate wind, so that the interior of the machine body 101 can be dissipated.

Working principle: when the high-temperature-resistant and dustproof semiconductor packaging box is used, a user can firstly put a semiconductor on the inner end of the placing groove 203 on the foam board 202, the placing groove 203 can limit the placed semiconductor, the dust collector 206 sucks dust in the machine body 101 into the dust storage box 207 through the dust suction pipe 208 and the suction port 209 to store the dust, the dust is removed, the motor 302 is started, the rotating shaft 303 is driven to rotate, the rotating shaft 303 rotates to drive the fan 304 to rotate, the fan 304 rotates to generate wind, and the interior of the machine body 101 can be cooled.

Finally, it should be noted that the above description is only for illustrating the technical solution of the present utility model, and not for limiting the scope of the present utility model, and that the simple modification and equivalent substitution of the technical solution of the present utility model can be made by those skilled in the art without departing from the spirit and scope of the technical solution of the present utility model.

Claims (7)

1. The utility model provides a high temperature resistant dustproof semiconductor packaging box, includes main part mechanism (1), receiving mechanism (2) and heat dissipation mechanism (3), its characterized in that: the utility model provides a take-up mechanism (2) is located the inside of main part mechanism (1), radiating mechanism (3) are located the inside of main part mechanism (1), main part mechanism (1) includes organism (101), lid (102), handle (103), label groove (104) and observation window (105), lid (102) movable mounting is in the upper end of organism (101), handle (103) are fixed to be set up in the upper end of lid (102), label groove (104) are fixed to be set up in the front end of organism (101), the left end at organism (101) is fixed to be set up in observation window (105), take-up mechanism (2) include heat-resisting layer (201), foam board (202) and standing groove (203), heat-resisting layer (201) are fixed to be set up in the inner of organism (101), foam board (202) are fixed to be set up in the inner of heat-resisting layer (201), standing groove (203) are fixed to be set up in the inner of foam board (202).

2. The high temperature resistant and dustproof semiconductor package according to claim 1, wherein: the accommodating mechanism (2) further comprises a tray (204), a limiting block (205), a dust collector (206), a dust storage box (207), a dust suction pipe (208) and a suction port (209), and the tray (204) is fixedly arranged at the inner end of the machine body (101).

3. The high temperature resistant and dustproof semiconductor package according to claim 2, wherein: the tray (204) is fixedly arranged below the foam plate (202), the limiting block (205) is fixedly arranged at the inner end of the machine body (101), and the dust collector (206) is fixedly arranged at the upper end of the limiting block (205).

4. A high temperature resistant and dustproof semiconductor package according to claim 3, wherein: the dust storage box (207) is fixedly arranged at the inner end of the machine body (101), the dust storage box (207) is fixedly arranged at the right end of the dust collector (206), and the dust suction pipe (208) is fixedly arranged at the inner end of the machine body (101).

5. The high temperature resistant and dustproof semiconductor package according to claim 4, wherein: the dust suction pipe (208) is fixedly arranged at the right end of the dust storage box (207), the suction port (209) is fixedly arranged at the upper end of the dust suction pipe (208), and the suction port (209) is fixedly arranged at the inner end of the machine body (101).

6. The high temperature resistant and dustproof semiconductor package according to claim 5, wherein: the heat dissipation mechanism (3) comprises a fixed shaft (301), a motor (302), a rotating shaft (303) and a fan (304), and the fixed shaft (301) is fixedly arranged at the inner end of the machine body (101).

7. The high temperature resistant and dustproof semiconductor package as claimed in claim 6, wherein: the motor (302) is fixedly arranged at the upper end of the fixed shaft (301), the rotating shaft (303) is fixedly arranged at the left end of the motor (302), and the fan (304) is movably arranged at the left end of the rotating shaft (303).