CN219395416U - High-density flow heat dissipation module embedding device - Google Patents

Abstract

The utility model discloses a high-density flow heat dissipation module embedding device, and relates to the technical field of high-density flow heat dissipation modules. This kind of high density flows heat dissipation module embedding device, including heat dissipation module body and apron, install fixed establishment on the heat dissipation module body, fixed establishment includes two erection columns of symmetry fixed connection at heat dissipation module body lower extreme, two with erection column complex mounting groove have been seted up to apron upper end symmetry, the cavity has been seted up in the apron, cavity inner wall symmetry sliding connection has two sliders, two the lateral wall symmetry fixedly connected with two dead levers that the slider kept away from each other, two with dead lever complex fixed slot has been seted up to the erection column lateral wall. According to the utility model, the mounting column is inserted into the mounting groove, and then the fixing rod is driven to be inserted into the fixing groove by pressing the pressing hand, so that the cover plate and the radiating module body can be mounted and fixed, the mounting and the dismounting are very simple, and the time and the labor are saved.

Description

High-density flow heat dissipation module embedding device

Technical Field

The utility model relates to the technical field of high-density flow heat dissipation modules, in particular to a high-density flow heat dissipation module embedding device.

Background

In response to the trend of thinning of consumer electronic products, electronic products such as computers and handheld devices are both developed in the direction of being light and thin and having high performance, but the light and thin performance often contradict each other, when the high-performance components are running, a large amount of waste heat is generated inside the electronic products, and therefore, a heat dissipation module is required to be configured to dissipate heat of the components for cooling, however, the heat dissipation efficiency of the existing heat dissipation module is difficult to meet the requirement due to the thinned volume of the electronic products.

In order to increase the heat radiation performance of a heat radiation module, a high-density flow heat radiation channel is usually arranged in the heat radiation module, the flow resistance and the heat resistance are ensured in a deviation design range by controlling the gap and the height of a tooth sheet, so that the internal circulation of liquid is promoted to be smooth, the sealing reliability of a product is ensured, the heat flux density can reach higher heat radiation requirements, the heat radiation module can be installed in an embedded mode, the heat radiation performance is better, but the installation between the heat radiation module and a cover plate of the existing high-density flow heat radiation module embedding device is usually fastened and fixed by adopting a plurality of groups of bolts, and the installation and the disassembly of the fixing mode are very time-consuming and labor-consuming.

Disclosure of Invention

The utility model aims to provide a high-density flow heat dissipation module embedding device so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high density flow heat dissipation module embedding device, includes heat dissipation module body and apron, install fixed establishment on the heat dissipation module body, fixed establishment includes two erection columns of symmetry fixed connection at heat dissipation module body lower extreme, two with erection column complex mounting groove have been seted up to apron upper end symmetry, the cavity has been seted up in the apron, cavity inner wall symmetry sliding connection has two sliders, two the lateral wall symmetry fixedly connected with two dead levers that the slider kept away from each other, two with dead lever complex fixed slot has been seted up to the erection column lateral wall.

Preferably, the inner wall of the cavity is symmetrically provided with two communicating grooves, and the other ends of the communicating grooves are communicated with the mounting grooves.

Preferably, a driving mechanism is arranged in the cavity and comprises a bidirectional screw rod rotatably connected to the inner wall of the cavity, and the side wall of the bidirectional screw rod is in threaded connection with the two sliding blocks.

Preferably, the driving mechanism further comprises a gear fixedly connected to the side wall of the bidirectional screw rod, a rack is slidably connected to the inner wall of the cavity, the rack is connected with the gear in a meshed mode, and the lower end of the rack penetrates through the lower end of the cover plate and is fixedly connected with a pressing hand.

Preferably, the hand pressing side wall is in threaded connection with a threaded rod, and a threaded groove matched with the threaded rod is formed in the lower end of the cover plate.

Preferably, a high-density flow heat dissipation channel is arranged in the heat dissipation module body, and two water nozzle mounting holes are formed in the upper end of the heat dissipation module body.

Compared with the prior art, the utility model has the beneficial effects that:

(1) According to the high-density flow radiating module embedding device, the fixing mechanism and the driving mechanism are arranged, the mounting column is inserted into the mounting groove, then the pressing hand is pressed, the fixing rod is driven to be inserted into the fixing groove, the cover plate and the radiating module body can be installed and fixed, and the mounting and the dismounting are very simple, time-saving and labor-saving.

(2) According to the high-density flow heat dissipation module embedding device, the threaded rod and the threaded groove are arranged, the threaded rod is rotated into the threaded groove, the position of the pressing hand is fixed, the pressing hand is prevented from moving to drive the bidirectional screw rod to rotate, the fixing rod is moved out of the fixing groove, and then the cover plate and the heat dissipation module body are invalid in installation.

Drawings

FIG. 1 is a schematic structural diagram of a high density heat dissipation module embedding device according to the present utility model;

FIG. 2 is an enlarged schematic view of the structure shown at A in FIG. 1;

fig. 3 is an enlarged schematic view of the structure at B in fig. 1.

In the figure: the heat dissipation module comprises a heat dissipation module body 1, a cover plate 2, a mounting column 3, a mounting groove 4, a cavity 5, a sliding block 6, a fixing rod 7, a communicating groove 71, a fixing groove 8, a bi-directional screw rod 9, a gear 10, a rack 11, a hand pressing 12, a threaded rod 13, a threaded groove 14, a high-density flow heat dissipation channel 15 and a water nozzle mounting hole 16.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the utility model provides a high density flow heat dissipation module embedding device, including heat dissipation module body 1 and apron 2, install fixed establishment on the heat dissipation module body 1, fixed establishment includes two erection columns 3 of symmetry fixed connection at heat dissipation module body 1 lower extreme, two with erection column 3 complex mounting groove 4 have been seted up to apron 2 upper end symmetry, cavity 5 has been seted up in the apron 2, cavity 5 inner wall symmetry sliding connection has two sliders 6, two lateral wall symmetry fixedly connected with two dead levers 7 that keep away from each other of two sliders 6, two erection column 3 lateral walls have been seted up with dead lever 7 complex fixed slot 8.

Two communicating grooves 71 are symmetrically formed in the inner wall of the cavity 5, the other end of each communicating groove 71 is communicated with the mounting groove 4, and the communicating grooves 71 and the fixing rods 7 are located at the same horizontal height.

The driving mechanism is arranged in the cavity 5 and comprises a bidirectional screw rod 9 rotatably connected to the inner wall of the cavity 5, the side wall of the bidirectional screw rod 9 is in threaded connection with two sliding blocks 6, the side wall of each sliding block 6 abuts against the inner wall of the cavity 5, and the sliding blocks 6 cannot rotate along with the bidirectional screw rod 9.

The driving mechanism further comprises a gear 10 fixedly connected to the side wall of the bidirectional screw rod 9, a rack 11 is slidably connected to the inner wall of the cavity 5, the rack 11 is in meshed connection with the gear 10, and the lower end of the rack 11 penetrates through the lower end of the cover plate 2 and is fixedly connected with a pressing hand 12.

The side wall threaded connection of the pressing hand 12 has the threaded rod 13, and the thread groove 14 with threaded rod 13 complex is offered to apron 2 lower extreme, through turning into threaded rod 13 in the thread groove 14, fixes the position of pressing hand 12, avoids pressing hand 12 to remove and drives bi-directional lead screw 9 and rotate for dead lever 7 removes out fixed slot 8, and then causes the installation inefficacy between apron 2 and the heat dissipation module body 1.

The heat radiation module body 1 is internally provided with a high-density flow heat radiation channel 15, the high-density flow heat radiation channel 15 mainly ensures the flow resistance and the heat resistance in a deviation design range by controlling the tooth gap and the height, promotes the internal circulation of liquid to smoothly ensure the sealing reliability of products, ensures the heat flow density to reach higher heat radiation requirement, has a specific structure in the prior art, is not described in detail herein, and is mainly used for the installation of water nozzles by arranging two water nozzle installation holes 16 at the upper end of the heat radiation module body 1.

According to the utility model, firstly, the mounting column 3 is inserted into the mounting groove 4, then the press hand 12 is pressed, the rack 11 is driven to slide upwards on the inner wall of the cavity 5, the gear 10 is driven to rotate, the bidirectional screw rod 9 is driven to rotate, the two sliding blocks 6 are driven to slide far away from each other on the inner wall of the cavity 5, the fixing rod 7 is driven to move, the fixing rod 7 penetrates through the communication groove 71 to enter the fixing groove 8, so that the mounting column 3 can be fixed, the cover plate 2 and the heat radiation module body 1 are further mounted and fixed together, finally the threaded rod 13 is transferred into the threaded groove 14, and the press hand 12 is fixed.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The utility model provides a high density flows heat dissipation module embedding device, includes heat dissipation module body (1) and apron (2), its characterized in that: install fixed establishment on heat dissipation module body (1), fixed establishment includes two erection columns (3) of symmetry fixed connection in heat dissipation module body (1) lower extreme, two with erection column (3) complex mounting groove (4) have been seted up to apron (2) upper end symmetry, cavity (5) have been seted up in apron (2), cavity (5) inner wall symmetry sliding connection has two sliders (6), two lateral wall symmetry fixedly connected with two dead levers (7) that slider (6) kept away from each other, two dead lever (7) complex mounting groove (8) have been seted up with dead lever (7) to erection column (3) lateral wall.

2. The high-density heat dissipation module embedding device as defined in claim 1, wherein: two communicating grooves (71) are symmetrically formed in the inner wall of the cavity (5), and the other end of each communicating groove (71) is communicated with the corresponding mounting groove (4).

3. The high-density heat dissipation module embedding device as defined in claim 2, wherein: the driving mechanism is arranged in the cavity (5) and comprises a bidirectional screw rod (9) rotatably connected to the inner wall of the cavity (5), and the side wall of the bidirectional screw rod (9) is in threaded connection with the two sliding blocks (6).

4. A high density flow heat sink module embedment device in accordance with claim 3, wherein: the driving mechanism further comprises a gear (10) fixedly connected to the side wall of the bidirectional screw rod (9), a rack (11) is slidably connected to the inner wall of the cavity (5), the rack (11) is connected with the gear (10) in a meshed mode, and the lower end of the rack (11) penetrates through the lower end of the cover plate (2) and is fixedly connected with a pressing hand (12).

5. The high-density heat dissipation module embedding device as defined in claim 4, wherein: the side wall of the pressing hand (12) is in threaded connection with a threaded rod (13), and a threaded groove (14) matched with the threaded rod (13) is formed in the lower end of the cover plate (2).

6. The high-density heat dissipation module embedding device as defined in claim 5, wherein: the high-density flow heat dissipation channel (15) is arranged in the heat dissipation module body (1), and two water nozzle mounting holes (16) are formed in the upper end of the heat dissipation module body (1).