CN219395387U - Heat dissipation module, chassis and electronic equipment - Google Patents
Heat dissipation module, chassis and electronic equipment Download PDFInfo
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- CN219395387U CN219395387U CN202223599403.1U CN202223599403U CN219395387U CN 219395387 U CN219395387 U CN 219395387U CN 202223599403 U CN202223599403 U CN 202223599403U CN 219395387 U CN219395387 U CN 219395387U
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- generating device
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- heat dissipation
- airflow generating
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The embodiment of the application discloses a heat dissipation module, a case and electronic equipment, relates to the technical field of electronic equipment, and solves the problem of poor heat dissipation effect in the related art. The heat radiation module comprises a first airflow generating device and an assembly part, wherein the first airflow generating device is arranged on a first side of a first heating component and is used for discharging heat generated by the first heating component out of a case; the assembly part is arranged on the first side of the first heating component along the extending direction of the first heating component; wherein the fitting is provided with a first fitting bit for positioning the first airflow generating device on the first side of the first heat generating component. The heat dissipation module is used for heat dissipation.
Description
Technical Field
The embodiment of the application relates to the field of electronic equipment, but is not limited to, and particularly relates to a heat dissipation module, a case and electronic equipment.
Background
The electronic device needs to dissipate heat in time in the use process, but in the related technology, the heat dissipation of the electronic device is poor, and the use of the electronic device is affected.
Disclosure of Invention
According to the heat radiation module, the case and the electronic equipment, heat radiation can be carried out on the heating component in the case, and the air flow condition in the case is improved.
In a first aspect, an embodiment of the present application provides a heat dissipation module, configured to dissipate heat of a first heat generating component in a chassis, where the heat dissipation module includes a first airflow generating device and an assembly, where the first airflow generating device is disposed on a first side of the first heat generating component, and is configured to exhaust heat generated by the first heat generating component out of the chassis; the assembly part is arranged on the first side of the first heating component along the extending direction of the first heating component; wherein the fitting is provided with a first fitting bit for positioning the first airflow generating device on the first side of the first heat generating component.
According to the heat radiation module, the first airflow generating device generates airflow, airflow nearby the first heating component can be accelerated to flow, so that heat generated by the first heating component is taken away rapidly, the heat is discharged out of the case, and the first heating component works at a proper environment temperature. Furthermore, a fitting is provided which provides a mounting basis for the first airflow generating device, which fitting is arranged on the first side of the first heat generating component in the direction of extension of the first heat generating component, so that the first airflow generating device is mounted on the first side of the first heat generating component. The first airflow generating device can improve the heat dissipation condition of the first heat generating component, facilitate the heat dissipation of the first heat generating component, improve the airflow condition in the case and assist the heat dissipation of other components in the case.
In one possible implementation of the application, the first region of the fitting arranged at intervals of the first fitting position is provided with a reinforcing rib; and/or, a second area arranged at intervals of the first assembly position on the assembly part is provided with an avoidance gap.
In one possible implementation of the application, the first fitting location is provided on a first surface of the fitting, the first surface being a side of the fitting facing or facing away from the first heat generating component.
In a second aspect, an embodiment of the present application provides a chassis, including a case body, a second airflow generating device, and a heat dissipating module of any one of the first aspect, where the heat dissipating module is disposed in the case body; the second airflow generating device is arranged on the first side wall of the box body, and a first heat dissipation channel is formed between the second airflow generating device and the first airflow generating device, so that at least part of heat generated by the first heating component is discharged out of the box body through the first heat dissipation channel.
The chassis provided by the embodiment of the application has the same technical effect as the heat dissipation module of the first aspect, namely, the heat dissipation can be performed on the heating component in the chassis, and the air flow condition in the chassis is improved.
In a possible implementation manner of the present application, the heat dissipation device further includes a third airflow generating device, configured to dissipate heat of the second heat generating component in the box, and a second heat dissipation channel is further formed between the first airflow generating device and the second airflow generating device, where the second heat dissipation channel passes through the third airflow generating device, and the second heat dissipation channel is different from the first heat dissipation channel.
In one possible implementation of the present application, the second airflow generating device and the third airflow generating device are disposed on the same side of the first airflow generating device, and the first heat dissipation channel and the second heat dissipation channel partially overlap.
In one possible implementation manner of the present application, the heat dissipation device further includes a fourth airflow generating device located on the second side of the first heat generating component, a third heat dissipation channel is formed between the fourth airflow generating device and the first airflow generating device, the third heat dissipation channel passes through the first heat generating component, and the fourth airflow generating device is disposed on the second side wall of the box body to guide airflow outside the box body to enter the third heat dissipation channel.
In one possible implementation of the present application, a fourth heat dissipation channel is formed between the fourth air flow generating device and the second air flow generating device, and the fourth heat dissipation channel passes through the first heat generating component.
In one possible implementation manner of the present application, the heat dissipation device further includes a fifth airflow generating device, configured to dissipate heat of the third heat generating component in the box, where the fifth airflow generating device is disposed on the second side of the first heat generating component, and a fifth heat dissipation channel is formed between the fifth airflow generating device and the first airflow generating device, so that at least part of heat generated by the first heat generating component is exhausted from the box through the fifth airflow generating device.
In a third aspect, embodiments of the present application provide an electronic device, including a chassis of any one of the second aspects.
The electronic device provided by the embodiment of the application has the same technical effect as the heat radiation module of the first aspect, namely, the heat radiation can be performed on the heating component in the case, and the air flow condition in the case is improved.
Drawings
Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a heat dissipation module according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of an assembly in a heat dissipation module according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a third connection hole in the heat dissipation module according to the embodiment of the present application;
fig. 5 is a schematic diagram of a first heat dissipation channel in a chassis provided in an embodiment of the present application;
fig. 6 is a schematic diagram of a second heat dissipation channel in a chassis provided in an embodiment of the present application;
fig. 7 is a schematic diagram of a third heat dissipation channel in a chassis provided in an embodiment of the present application;
fig. 8 is a schematic diagram of a fourth heat dissipation channel in a chassis provided in an embodiment of the present application;
fig. 9 is a schematic diagram of a fifth heat dissipation channel in a chassis according to an embodiment of the present application.
Reference numerals:
1-a case; 11-a box body; 111-a receiving cavity; 1111—a first heat dissipation channel; 1112-a second heat dissipation channel; 1113-third heat dissipation path; 1114—fourth heat dissipation channels; 1115-fifth heat dissipation channels; 112-a first sidewall; 113-a second sidewall; 12-a heat dissipation module; 121-a first gas flow generating device; 1211-a housing; 1212-a connection; 1213-a second connection hole; 122-fitting; 1221-first connecting holes; 1222-reinforcing bars; 1223-avoidance gap; 1224-a first surface; 1225-air flow holes; 1226-third connecting hole; 1227-connecting plates; 13-a second airflow generating device; 14-a third airflow generating device; 15-fourth airflow generating device; 16-fifth airflow generating device; 2-a first heat generating component; 3-a second heat generating component; 4-a third heat generating component.
Detailed Description
For the purposes, technical solutions and advantages of the embodiments of the present application to be more apparent, the specific technical solutions of the present application will be described in further detail below with reference to the accompanying drawings in the embodiments of the present application. The following examples are illustrative of the present application, but are not intended to limit the scope of the present application.
In the present embodiments, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the embodiments of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
Furthermore, in the embodiments of the present application, the terms "upper," "lower," "left," and "right," etc., are defined with respect to the orientation in which the components in the drawings are schematically disposed, and it should be understood that these directional terms are relative terms, which are used for descriptive and clarity with respect to each other, and which may vary accordingly with respect to the orientation in which the components in the drawings are disposed.
In the embodiments herein, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either a fixed connection, a removable connection, or an integral body; can be directly connected or indirectly connected through an intermediate medium.
In the present embodiments, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the embodiments of the present application, words such as "exemplary" or "such as" are used to mean serving as examples, illustrations, or descriptions. Any embodiment or design described herein as "exemplary" or "for example" should not be construed as preferred or advantageous over other embodiments or designs. Rather, the use of words such as "exemplary" or "such as" is intended to present related concepts in a concrete fashion.
The embodiment of the application provides electronic equipment, which can be a host, a display, an all-in-one machine, a server and the like, and for convenience in understanding, the host is used as the electronic equipment for description, and in the using process of the electronic equipment, heat is generated by a heating component in the electronic equipment, so that the electronic equipment needs to be radiated, and the electronic equipment works at a proper environment temperature.
Referring to fig. 1, an electronic device provided in this embodiment of the present application includes a chassis 1, and various electronic devices disposed in the chassis 1, where the electronic devices include a processor, a power supply, a heat generating component with a relatively large heat generation such as a hard disk, and the like, and need to dissipate heat in a targeted manner.
On the basis, the embodiment of the application also provides a case 1, referring to fig. 1, the case 1 provided in the embodiment of the application includes a case 11 and a heat dissipation module 12, and the heat dissipation module 12 is disposed in the case 1. Specifically, a housing cavity 111 is formed in the chassis 1, and the housing cavity 111 is used for housing the electronic device and the heat dissipation module 12. The heat dissipation module 12 may include an airflow channel, an airflow generating device, a heat conducting member, a heat dissipation assembly, etc., which is not limited in this application.
The form of the box 11 is not limited herein, for example, the box 11 is a hexahedral structure formed by enclosing plates, in other embodiments, a cylindrical structure may be designed, a vent hole, an interface panel and the like are provided on a wall of the box 11, a containing cavity 111 is formed in the box 11, a supporting plate, a supporting frame and the like are provided in the box 11 to divide the containing cavity 111 into a plurality of bins, such as a motherboard mounting position, a power supply mounting position, a hard disk mounting position, a wire storage position and the like, and a motherboard, a power supply unit (power supply unit, PSU), a central processing unit (central processing unit, CPU), a hard disk, a display card and the like included in the electronic device are mounted at corresponding positions in the containing cavity 111.
Correspondingly, referring to fig. 1 and fig. 2, the heat dissipation module 12 provided in the embodiment of the present application is configured to dissipate heat of the first heat generating component 2 in the chassis 1, where the heat dissipation module 12 includes a first airflow generating device 121 and an assembly 122, and the first airflow generating device 121 is disposed on a first side of the first heat generating component 2 and is configured to exhaust heat generated by the first heat generating component 2 out of the chassis 1; the fitting 122 is provided on the first side of the first heat generating member 2 in the extending direction of the first heat generating member 2; wherein the fitting 122 is provided with a first fitting position for arranging the first air flow generating device 121 on the first side of the first heat generating component 2.
According to the heat dissipation module 12 provided by the embodiment of the application, the first airflow generating device 121 generates airflow, so that airflow nearby the first heat generating component 2 can be accelerated, heat generated by the first heat generating component 2 is taken away rapidly, and the heat is discharged out of the case 1, so that the first heat generating component 2 works in a proper environment temperature.
Furthermore, a fitting 122 is provided, which fitting 122 provides a mounting basis for the first airflow generating device 121, which fitting 122 is arranged on the first side of the first heat generating component 2 in the direction of extension of the first heat generating component 2, so that the first airflow generating device 121 is mounted on the first side of the first heat generating component 2.
The first airflow generating device 121 not only can improve the heat dissipation condition of the first heat generating component 2, and facilitate the heat dissipation of the first heat generating component 2, but also can improve the airflow condition in the chassis 1 and assist the heat dissipation of other components in the chassis 1. Optionally, the first heating component 2 is a display card in the host, the display card is perpendicular to the main board, one side of the display card close to the main board is inserted on the main board, and at least one side of the display card is attached to a corresponding side board of the box 11 through a screw lock.
It should be noted that the form of the first airflow generating device 121 is not limited in this application, and the first airflow generating device 121 may be an axial fan or a centrifugal fan, and optionally, in one possible embodiment of this application, the first airflow generating device 121 is a centrifugal fan, and the centrifugal fan has a relatively high pressure coefficient and is convenient for mute processing, so as to reduce noise that may be generated by the heat dissipation module 12.
Specifically, the air intake of the first air flow generating device 121 is provided along the axial direction thereof, and when the first air flow generating device 121 is mounted to the case 11 by the fitting 122, the air intake of the first air flow generating device 121 faces the first heat generating part 2; the air outlet of the first air flow generating device 121 is disposed in a radial direction thereof, and when the first air flow generating device 121 is mounted to the case 11 by the fitting 122, the air outlet of the first air flow generating device 121 faces the wall of the case 11. The first airflow generating device 121 adopting the centrifugal fan has a certain angle between the air inlet and the air outlet, so that the direction of airflow can be changed, and the influence of hot air at the air outlet of the first airflow generating device 121 on other heat dissipation components of the heat dissipation module 12 is reduced, thereby optimizing the airflow path in the box 11 and improving the heat dissipation effect.
Referring to fig. 2, in one possible embodiment of the present application, the first airflow generating device 121 includes a housing 1211, a motor and a fan blade, an air inlet and an air outlet of the first airflow generating device 121 are formed on the housing 1211, an air flow channel is formed in the housing 1211, the fan blade is disposed in the air flow channel, the fan blade is driven by the motor, in addition, in order to facilitate the fixing of the first airflow generating device 121 on the assembly 122, a connection portion 1212 is further disposed on the housing 1211, and the connection portion 1212 is used for being fixed with the assembly 122.
It should be noted that the structure of the fitting 122 is not limited in this application, the fitting 122 may be a support plate, a support frame, or the like, and referring to fig. 2 and 3, in a possible embodiment of this application, the fitting 122 is in a plate-like structure, and the fitting 122 is disposed parallel to the first heat generating component 2.
The first assembling position may be located in the middle of the assembling member 122 or may be located at an end of the assembling member 122, which is not limited in this application, and only when the first airflow generating device 121 is installed in the case 11 through the assembling member 122, the air inlet of the first airflow generating device 121 faces the position with a larger heat generating amount in the first heating component 2.
It should be noted that, the connection manner of the fitting 122 and the first airflow generating device 121 is not limited in this application, for example, a first buckle is provided at a first assembly position of the fitting 122, a connection portion 1212 of the first airflow generating device 121 is a second buckle, and the first buckle and the second buckle are engaged with each other to fix the fitting 122 and the first airflow generating device 121; for another example, the first fitting part of the fitting 122 is made of a magnetic material, the connection part 1212 of the first air flow generating device 121 is also made of a magnetic material, the magnetic material is iron, a magnet, and at least one of the first fitting part and the connection part 1212 includes a magnet to magnetically fix the first air flow generating device 121 and the fitting 122.
Referring to fig. 2 and 3, in one possible embodiment of the present application, a first connection hole 1221 is provided on a first assembly position of the fitting 122, a second connection hole 1213 is provided on the connection portion 1212 of the first air flow generating device 121, and the first air flow generating device 121 and the fitting 122 are fixed by passing a screw through the first connection hole 1221 and the second connection hole 1213.
Wherein one of the first connecting hole 1221 and the second connecting hole 1213 is a screw hole, the other is an optical hole, or both are optical holes; and the first connecting hole 1221 may be opened directly on the casing 1211, or may be opened on a leg led out from the casing 1211, which is not limited in this application.
In addition, the number of the first connecting holes 1221 may be one, two or more, the second connecting holes 1213 and the first connecting holes 1221 may be in one-to-one correspondence, referring to fig. 2 and 3, in one possible embodiment of the present application, the number of the first connecting holes 1221 and the second connecting holes 1213 is three, and the three first connecting holes 1221 are distributed in a triangle on the fitting 122, so as to enhance the connection stability.
In order to improve the structural strength of the fitting 122, referring to fig. 2, in a possible embodiment of the present application, a reinforcing rib 1222 is provided on the fitting 122 in a first area spaced apart from the first fitting location, where the reinforcing rib 1222 may increase the bending strength of the fitting 122 and reduce the possibility of the fitting 122 being bent under stress.
The stiffener 1222 may take many forms, for example, the stiffener 1222 may be a strip-like structure disposed perpendicular to the fitting 122; as another example, the stiffener 1222 is a protrusion or depression on the fitting 122; the stiffener 1222 may be disposed on the side of the fitting 122 close to the first heat generating component 2, or may be disposed on the side of the fitting 122 away from the first heat generating component 2; and the extending direction of the reinforcing ribs 1222 may be along the length direction of the fitting 122, or may be along the width direction of the fitting 122, or some of the plurality of reinforcing ribs 1222 may extend along the length direction of the fitting 122, and the rest may extend along the width direction of the fitting 122.
Referring to fig. 2, in one possible embodiment of the present application, the stiffener 1222 is a protrusion punched from one side of the fitting 122 near the first heat generating part 2 toward the other side, and the stiffener 1222 extends along the length direction of the fitting 122, and the plurality of stiffener 1222 are equally distributed along the width direction of the fitting 122.
In addition, the first area may have one or more, and when the plurality of first areas are provided, the structures of the reinforcing ribs 1222 in the plurality of first areas may be the same or different, referring to fig. 2, in one possible embodiment of the present application, the first fitting position is provided at one end of the fitting 122, the other end of the fitting 122 has the first area, and both sides of the first fitting position in the width direction of the fitting 122 are also provided with the first areas.
In order to avoid interference of the assembly 122 with existing components in the case 11, for example, electronic devices on a motherboard, referring to fig. 2 and 3, in a possible embodiment of the present application, the second area of the assembly 122, which is disposed at intervals of the first assembly position, is provided with an avoidance gap 1223, where the assembly gap may be square, semicircular, trapezoidal, or the like, which is not limited in this application.
It should be noted that the first airflow generating device 121 may be disposed between the fitting 122 and the first heat generating component 2, or alternatively, the fitting 122 may be disposed between the first airflow generating device 121 and the first heat generating component 2, that is, the first fitting position is disposed on a first surface 1224 of the fitting 122, where the first surface 1224 is a side of the fitting 122 facing or facing away from the first heat generating component 2, and in order to make space utilization in the housing 11 higher, referring to fig. 1 and 2, in one possible embodiment of the present application, the first surface 1224 is a side of the fitting 122 facing away from the first heat generating component 2.
On this basis, in order to facilitate the air flow through the fitting 122 into the first air flow generating device 121, referring to fig. 3, in a possible embodiment of the present application, an air flow hole 1225 is formed in the first fitting position of the first air flow generating device 121, and the air flow hole 1225 is aligned with the air inlet of the first air flow generating device 121.
In order to facilitate the connection and fixation of the fitting 122 and the case 11, referring to fig. 3 and 4, in a possible embodiment of the present application, a second fitting position is further provided on the fitting 122, and the fitting 122 is fixed to the case 11 by using the second fitting position, where the second fitting position and the case 11 may be fixed by welding, bonding, clamping, fastening, or the like, which is not limited in this application.
Referring to fig. 3 and 4, in one possible embodiment of the present application, the fitting 122 is provided with a second fitting position at both ends in the length direction thereof, the second fitting position is provided with a third connecting hole 1226, and a screw or the like passes through the third connecting hole 1226 to fix the fitting 122 to the case 11.
In order to facilitate the locking operation of the screws, referring to fig. 3 and 4, in one possible embodiment of the present application, the second assembly position has a connection board 1227, the connection board 1227 is disposed perpendicular to the extending direction of the assembly 122, the third connection hole 1226 is opened on the connection board 1227, and the central axis of the third connection hole 1226 is disposed parallel to the length direction of the assembly 122, specifically, four connection boards 1227 are divided into four corners of the assembly 122, and each connection board 1227 is opened with a third connection hole 1226, so as to make the stress of the assembly 122 more balanced.
On this basis, referring to fig. 5, the chassis 1 provided in the embodiment of the present application further includes a second airflow generating device 13, where the second airflow generating device 13 is disposed on the first side wall 112 of the chassis 1, and a first heat dissipation channel 1111 is formed between the second airflow generating device 13 and the first airflow generating device 121, so that at least part of heat generated by the first heat generating component 2 is exhausted from the chassis 1 through the first heat dissipation channel 1111, where the second airflow generating device 13 may be a rear exhaust fan on the chassis 1.
It should be noted that, in the drawings, the structure of the heat dissipation channel is not limited to a specific embodiment, and the first heat dissipation channel 1111 may be any channel communicating the second air flow generating device 13 and the first air flow generating device 121.
Referring to fig. 6, in a possible embodiment of the present application, the chassis 1 further includes a third airflow generating device 14, configured to dissipate heat from the second heat generating component 3 in the chassis 1, a second heat dissipation channel 1112 is further formed between the first airflow generating device 121 and the second airflow generating device 13, and the second heat dissipation channel 1112 passes through the third airflow generating device 14, where the second heat dissipation channel 1112 is different from the first heat dissipation channel 1111, the second heat generating component 3 may be a CPU on a motherboard, and the third airflow generating device 14 is a CPU fan.
It should be noted that, the second airflow generating device 13 and the third airflow generating device 14 may be disposed on the same side or different sides of the first airflow generating device 121, and referring to fig. 6, in a possible embodiment of the present application, the second airflow generating device 13 and the third airflow generating device 14 are disposed on the same side of the first airflow generating device 121, and the first heat dissipation channel 1111 is partially overlapped with the second heat dissipation channel 1112.
Referring to fig. 7, in one possible embodiment of the present application, the chassis 1 further includes a fourth airflow generating device 15, the fourth airflow generating device 15 is located on the second side of the first heat generating component 2, a third heat dissipation channel 1113 is formed between the fourth airflow generating device 15 and the first airflow generating device 121, the third heat dissipation channel 1113 passes through the first heat generating component 2, and the fourth airflow generating device 15 is disposed on the second side wall 113 of the chassis 1 to guide airflow outside the chassis 1 into the third heat dissipation channel 1113, where the fourth airflow generating device 15 may be a front fan of the chassis 1, and the second side wall 113 and the first side wall 112 are disposed opposite to each other.
Referring to fig. 8, in one possible embodiment of the present application, a fourth heat dissipation passage 1114 is formed between the fourth air flow generating device 15 and the second air flow generating device 13, and the fourth heat dissipation passage 1114 passes through the first heat generating component 2.
Referring to fig. 9, in a possible embodiment of the present application, the heat dissipation device further includes a fifth airflow generating device 16 for dissipating heat of the third heat generating component 4 in the chassis 1, where the fifth airflow generating device 16 is disposed on the second side of the first heat generating component 2, and a fifth heat dissipation channel 1115 is formed between the fifth airflow generating device 16 and the first airflow generating device 121, so that at least part of heat generated by the first heat generating component 2 is exhausted from the chassis 1 via the fifth airflow generating device 16, and the third heat generating component 4 may be a PSU, and the fifth airflow generating device 16 is a PSU fan.
On the basis, the electronic equipment applying the heat radiation module 12 of the application, and the use of the first airflow generating device 121 effectively improves the airflow velocity and the airflow direction around the first heating component 2, and is beneficial to heat radiation of each heating component in the electronic equipment.
The foregoing embodiment numbers of the present application are merely for describing, and do not represent advantages or disadvantages of the embodiments. The foregoing description is only of the preferred embodiments of the present application, and is not intended to limit the scope of the claims, and all equivalent structures or equivalent processes using the descriptions and drawings of the present application, or direct or indirect application in other related technical fields are included in the scope of the claims of the present application.
Claims (10)
1. A heat dissipation module for dispel the heat to the first heating element of quick-witted incasement, its characterized in that, heat dissipation module includes:
the first airflow generating device is arranged on the first side of the first heating component and is used for discharging heat generated by the first heating component out of the chassis;
a fitting provided on a first side of the first heat generating member in an extending direction of the first heat generating member;
wherein a first mounting location is provided on the fitting to position the first airflow generating device on a first side of the first heat generating component.
2. The heat dissipating module of claim 1, wherein a first region of the fitting that is spaced from the first fitting location is provided with a stiffener; and/or the number of the groups of groups,
and a second area arranged on the assembly part at intervals of the first assembly position is provided with an avoidance gap.
3. The heat dissipating module of claim 1 or 2, wherein the first mounting location is provided on a first surface of the fitting, the first surface being a side of the fitting facing or facing away from the first heat generating component.
4. A chassis, comprising:
a case;
a heat dissipation module as defined in any one of claims 1 to 3, disposed within the case;
the second airflow generating device is arranged on the first side wall of the box body, and a first heat dissipation channel is formed between the second airflow generating device and the first airflow generating device, so that at least part of heat generated by the first heating component is discharged out of the box body through the first heat dissipation channel.
5. The cabinet of claim 4, further comprising a third airflow generating device configured to dissipate heat from a second heat generating component in the cabinet, wherein a second heat dissipation channel is further formed between the first airflow generating device and the second airflow generating device, and the second heat dissipation channel passes through the third airflow generating device, and wherein the second heat dissipation channel and the first heat dissipation channel are different.
6. The chassis of claim 5, wherein the second airflow generating device and the third airflow generating device are disposed on a same side of the first airflow generating device, and the first heat dissipation channel partially overlaps the second heat dissipation channel.
7. The cabinet of any one of claims 4 to 6, further comprising a fourth airflow generating device positioned on the second side of the first heat generating component, a third heat dissipation channel being formed between the fourth airflow generating device and the first airflow generating device, the third heat dissipation channel passing through the first heat generating component, and the fourth airflow generating device being disposed on the second side wall of the cabinet to guide an airflow outside the cabinet into the third heat dissipation channel.
8. The cabinet of claim 7, wherein a fourth heat dissipation path is formed between the fourth air flow generating device and the second air flow generating device, the fourth heat dissipation path passing through the first heat generating component.
9. The cabinet of any one of claims 4 to 6, further comprising a fifth airflow generating device for radiating heat from a third heat generating component within the cabinet, the fifth airflow generating device being disposed on a second side of the first heat generating component, a fifth heat radiating passage being formed between the fifth airflow generating device and the first airflow generating device so that at least a portion of heat generated by the first heat generating component is exhausted from the cabinet via the fifth airflow generating device.
10. An electronic device, comprising: the chassis of any of claims 4 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223599403.1U CN219395387U (en) | 2022-12-30 | 2022-12-30 | Heat dissipation module, chassis and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223599403.1U CN219395387U (en) | 2022-12-30 | 2022-12-30 | Heat dissipation module, chassis and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219395387U true CN219395387U (en) | 2023-07-21 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223599403.1U Active CN219395387U (en) | 2022-12-30 | 2022-12-30 | Heat dissipation module, chassis and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219395387U (en) |
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2022
- 2022-12-30 CN CN202223599403.1U patent/CN219395387U/en active Active
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