CN219395044U - MEMS microphone - Google Patents
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- CN219395044U CN219395044U CN202223579771.XU CN202223579771U CN219395044U CN 219395044 U CN219395044 U CN 219395044U CN 202223579771 U CN202223579771 U CN 202223579771U CN 219395044 U CN219395044 U CN 219395044U
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Abstract
The application provides a MEMS microphone, the MEMS microphone includes two diaphragms, is first diaphragm and second diaphragm respectively, wherein, each diaphragm includes a plurality of diaphragm portions that connect gradually, the diaphragm portion includes first connecting portion, second connecting portion, third connecting portion, fourth connecting portion and fifth connecting portion that connect gradually, second connecting portion, third connecting portion and fourth connecting portion form for first connecting portion and the first protruding portion of fifth connecting portion, connect through the fifth connecting portion of a diaphragm portion and the first connecting portion of another diaphragm between two adjacent diaphragm portions, first diaphragm and second diaphragm are relative and the interval setting; at least one first back electrode plate, the first back electrode plate is located between the first vibrating diaphragm and the second vibrating diaphragm. The structure protected by the MEMS microphone has the advantages that the capacitance capacity is increased, the sensitivity of the MEMS microphone is improved, and the problem of low signal-to-noise ratio of the MEMS microphone in the prior art is solved.
Description
Technical Field
The present application relates to the field of MEMS microphones, and in particular, to a MEMS microphone.
Background
The MEMS microphone device is used as the sunward industry, is one of the high points of high and new technology competition in China in the future, and the high-end MEMS silicon microphone chip is in shortage in China and has great market demand at present.
However, the MEMS microphone device in the market still has noise problem, which results in low signal-to-noise ratio of MEMS microphone and can not meet the demands of customers. Accordingly, there is a need for a MEMS microphone that can improve the signal-to-noise ratio.
Disclosure of Invention
The main objective of the present application is to provide a MEMS microphone to solve the problem of low signal-to-noise ratio of the MEMS microphone in the prior art.
To achieve the above object, according to one aspect of the present application, there is provided a MEMS microphone comprising: the two vibrating diaphragms are respectively a first vibrating diaphragm and a second vibrating diaphragm, wherein each vibrating diaphragm comprises a plurality of vibrating diaphragm parts which are sequentially connected, each vibrating diaphragm part comprises a first connecting part, a second connecting part, a third connecting part, a fourth connecting part and a fifth connecting part which are sequentially connected, the second connecting part, the third connecting part and the fourth connecting part form a first protruding part relative to the first connecting part and the fifth connecting part, two adjacent vibrating diaphragm parts are connected through the fifth connecting part of one vibrating diaphragm part and the first connecting part of the other vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are opposite and are arranged at intervals; the first back electrode plate is positioned between the first vibrating diaphragm and the second vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are symmetrically arranged relative to the first back electrode plate.
Further, the first connecting portion is a first horizontal portion, the second connecting portion is a first vertical portion, the third connecting portion is a second horizontal portion, the fourth connecting portion is a second vertical portion, and the fifth connecting portion is a third horizontal portion.
Further, the at least one first back electrode plate comprises an insulating layer and two electrode layers which are stacked, wherein the two electrode layers are a first electrode layer and a second electrode layer respectively, the insulating layer is located between the first electrode layer and the second electrode layer, and the first electrode layer is located between the second electrode layer and the first vibrating diaphragm.
Further, the MEMS microphone further includes a first conductive extension structure, one end of the first conductive extension structure is connected to the first electrode layer, and the other end of the first conductive extension structure extends between the second connection portion and the fourth connection portion of the first diaphragm.
Further, the MEMS microphone further includes a second conductive extension structure, one end of the second conductive extension structure is connected to the second electrode layer, and the other end of the second conductive extension structure extends between the second connection portion and the fourth connection portion of the second diaphragm.
Further, the first electrode layer has a second protruding portion.
Further, the second electrode layer has a third protrusion.
Further, the MEMS microphone further includes a first support structure and a second support structure, one end of the first support structure is connected to the first connection portion of the first end portion of the first diaphragm, the other end of the first support structure is connected to the first connection portion of the first end portion of the second diaphragm, one end of the second support structure is connected to the first connection portion of the second end portion of the first diaphragm, and the other end of the second support structure is connected to the first connection portion of the second end portion of the second diaphragm.
Further, the MEMS microphone further includes a third support structure, one end of the third support structure is connected to the connection portion between the two first protruding portions of the first diaphragm, and the other end of the third support structure is connected to the connection portion between the two first protruding portions of the second diaphragm.
Further, the MEMS microphone further comprises a second backplate, the second backplate being located between the third support structure and the second support structure.
Further, the number of the first conductive extension structures is plural, and the first conductive extension structures are in one-to-one correspondence with the vibrating diaphragm portions.
Further, the second conductive extension structures are multiple, and the second conductive extension structures are in one-to-one correspondence with the vibrating diaphragm parts.
Further, the first vibrating diaphragm further comprises a plurality of first insulating parts which are arranged at intervals and are arranged on the first connecting part and the fifth connecting part, and the second vibrating diaphragm further comprises a plurality of second insulating parts which are arranged at intervals and are arranged at the first connecting part and the fifth connecting part.
By means of the technical scheme, the first protruding portion is formed by bending the first vibrating diaphragm and the second vibrating diaphragm, the first vibrating diaphragm and the second vibrating diaphragm are arranged to be symmetrical structures relative to the back electrode plate, the effective contact area of the first vibrating diaphragm and the back electrode plate and the effective contact area of the second vibrating diaphragm and the back electrode plate can be increased respectively, and the capacitance capacity is proportional to the contact area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Simultaneously, the first vibrating diaphragm and the second vibrating diaphragm are easier to respond to sound waves to vibrate in a larger area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Because the signal-to-noise ratio of the MEMS microphone is the difference between the sensitivity and the noise, the signal-to-noise ratio of the MEMS microphone can be improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute an undue limitation to the application. In the drawings:
FIG. 1 shows a block diagram of a MEMS microphone according to an embodiment of the application;
FIG. 2 illustrates a block diagram of a diaphragm and a first backplate according to embodiments of the present application;
FIG. 3 is a block diagram illustrating the addition of a first conductive extension structure to that of FIG. 2;
FIG. 4 is a block diagram showing the addition of a second conductive extension structure to that of FIG. 3;
FIG. 5 shows a block diagram of the addition of a second tab to that of FIG. 4;
FIG. 6 is a block diagram showing the addition of a third tab to the one of FIG. 5;
FIG. 7 shows a block diagram of the addition of the first support structure and the second support structure to that of FIG. 6;
FIG. 8 shows a block diagram of the addition of a third support structure to that of FIG. 7;
fig. 9 shows a structure diagram with the addition of the first insulating portion on the basis of fig. 7.
Wherein the above figures include the following reference numerals:
10. a first diaphragm; 11. a second diaphragm; 12. a first back plate; 13. a first electrode layer; 14. a second electrode layer; 15. an insulating layer; 16. a first conductive extension structure; 17. a second conductive extension structure; 18. a second protruding portion; 19. a third protrusion; 20. a first support structure; 21. a second support structure; 22. a third support structure; 23. a second back plate; 24. a first insulating portion; 25. and a second insulating portion.
Detailed Description
It should be noted that the following detailed description is illustrative and is intended to provide further explanation of the present application. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present. Furthermore, in the description and in the claims, when an element is described as being "connected" to another element, the element may be "directly connected" to the other element or "connected" to the other element through a third element.
As described in the background art, the signal-to-noise ratio of the MEMS microphone in the prior art is low, and in order to solve the above problem, the present application proposes a MEMS microphone.
Fig. 1 is a block diagram of a MEMS microphone according to an embodiment of the present application. As shown in fig. 1, the MEMS microphone includes:
two diaphragms, namely a first diaphragm 10 and a second diaphragm 11, wherein each diaphragm comprises a plurality of diaphragm parts which are sequentially connected, each diaphragm part comprises a first connecting part, a second connecting part, a third connecting part, a fourth connecting part and a fifth connecting part which are sequentially connected, the second connecting part, the third connecting part and the fourth connecting part form a first protruding part relative to the first connecting part and the fifth connecting part, two adjacent diaphragm parts are connected through the fifth connecting part of one diaphragm part and the first connecting part of the other diaphragm, and the first diaphragm 10 and the second diaphragm 11 are opposite and are arranged at intervals;
in the MEMS microphone, the first connection portion may have a horizontal structure or a non-horizontal structure; the second connecting part can be of a vertical structure or a non-vertical structure; the third connecting part can be of a horizontal structure or a non-horizontal structure; the fourth connecting part can be of a vertical structure or a non-vertical structure; the fifth connecting part may have a horizontal structure or a non-horizontal structure. The vibrating diaphragm with the first protruding part is formed by the first connecting part, the second connecting part, the third connecting part, the fourth connecting part and the fifth connecting part which are sequentially connected, and the contact area of the first vibrating diaphragm and the second vibrating diaphragm can be increased through the relative arrangement of the first vibrating diaphragm and the second vibrating diaphragm, so that the sensitivity of the MEMS microphone can be improved.
At least one first back electrode plate 12, wherein the first back electrode plate 12 is located between the first diaphragm 10 and the second diaphragm 11, and the first diaphragm 10 and the second diaphragm 11 are symmetrically disposed with respect to the first back electrode plate 12.
In the MEMS microphone, the first back electrode plate and the first diaphragm may form a first signal, the first back electrode plate and the second diaphragm may form a second signal, and the first diaphragm and the second diaphragm may be symmetrically arranged to move up and down relative to the first back electrode plate, so that the first back electrode plate outputs a differential signal formed by the first signal and the second signal. The first diaphragm and the second diaphragm may be symmetrically disposed with a horizontal straight line passing through a center point of the first back electrode plate as a symmetry axis. The symmetrical structure formed by the first vibrating diaphragm and the second vibrating diaphragm relative to the first back polar plate not only simplifies the structure of the MEMS microphone, is beneficial to mass production, but also can widen the inter-plate distance of the MEMS microphone, can increase the capacitance capacity, and further can improve the signal to noise ratio of the MEMS microphone.
The first protruding portion is formed by bending the first vibrating diaphragm and the second vibrating diaphragm, the first vibrating diaphragm and the second vibrating diaphragm are arranged to be symmetrical to the back electrode plate, the effective contact area of the first vibrating diaphragm and the back electrode plate and the effective contact area of the second vibrating diaphragm and the back electrode plate can be increased respectively, and the capacitance capacity is proportional to the contact area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Simultaneously, the first vibrating diaphragm and the second vibrating diaphragm are easier to respond to sound waves to vibrate in a larger area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Because the signal-to-noise ratio of the MEMS microphone is the difference between the sensitivity and the noise, the signal-to-noise ratio of the MEMS microphone can be improved.
In order to further improve the signal-to-noise ratio of the MEMS microphone, in a specific embodiment of the present application, as shown in fig. 2, at least one of the first back-electrode plates includes a stacked insulating layer 15 and two electrode layers, wherein the two electrode layers are a first electrode layer 13 and a second electrode layer 14, respectively, the insulating layer 15 is located between the first electrode layer 13 and the second electrode layer 14, and the first electrode layer 13 is located between the second electrode layer 14 and the first diaphragm 10. In the MEMS microphone, the first back electrode plate is divided into three parts, namely, a first electrode layer, an insulating layer and a second electrode layer, wherein the insulating layer can electrically isolate the first electrode layer from the second electrode layer, the first electrode layer is used for outputting a signal formed by an interval between the first electrode layer and the first diaphragm, and the second electrode layer is used for outputting a signal formed by an interval between the second electrode layer and the second diaphragm, and the two signals form a differential signal. The three-layer structure of the first back electrode plate can further improve the accuracy of outputting differential signals and further improve the signal to noise ratio of the MEMS microphone.
In a specific embodiment of the present application, as shown in fig. 3, the MEMS microphone further includes a first conductive extension structure 16, one end of the first conductive extension structure 16 is connected to the first electrode layer 13, and the other end of the first conductive extension structure 16 extends between the second connection portion and the fourth connection portion of the first diaphragm 10. In the MEMS microphone, the first conductive extension structure may reinforce the MEMS monolithic structure. In addition, the first conductive extension structure, the first electrode layer and the first diaphragm may form a stopper unit, and the stopper unit may apply a defined voltage between the first electrode layer and the first diaphragm, may further define a distance between the first electrode layer and the first diaphragm, and may correct deformation of the first diaphragm material.
In still another specific embodiment of the present application, as shown in fig. 4, the MEMS microphone further includes a second conductive extension structure 17, one end of the second conductive extension structure 17 is connected to the second electrode layer 14, and the other end of the second conductive extension structure 17 extends between the second connection portion and the fourth connection portion of the second diaphragm 11. In the MEMS microphone, the second conductive extension structure may reinforce the MEMS monolithic structure. In addition, the second conductive extension structure, the second electrode layer and the second diaphragm may form a stopper unit, and the stopper unit may apply a defined voltage between the second electrode layer and the second diaphragm, may further define a distance between the second electrode layer and the second diaphragm, and may correct deformation of the second diaphragm material.
In order to further prevent the first diaphragm and the first electrode layer from adhering to each other, in still another specific embodiment of the present application, as shown in fig. 5, the first electrode layer 13 has a second protrusion 18. In the MEMS microphone, the second protruding part can prevent the first vibrating diaphragm from being adhered to the first electrode layer when the first vibrating diaphragm moves up and down. The shape of the second protruding part can be a cylinder, a cuboid, a cone or other shapes which can realize the anti-adhesion. The shape of the second projection in fig. 5 is exemplified by a cone, and thus the side view is a triangle.
In order to further prevent the second diaphragm from adhering to the second electrode layer, in still another embodiment of the present application, as shown in fig. 6, the second electrode layer 14 has a third protrusion 19. In the MEMS microphone, the third protrusion may prevent the second diaphragm from adhering to the second electrode layer when the second diaphragm moves up and down. The third protruding part can be in the shape of a cylinder, a cuboid, a cone or other shapes which can realize the anti-adhesion. The third projection in fig. 6 is in the shape of a cone, for example, and thus in side view is triangular.
In another specific embodiment of the present application, as shown in fig. 7, the MEMS microphone further includes a first support structure 20 and a second support structure 21, one end of the first support structure 20 is connected to the first connection portion of the first end portion of the first diaphragm 10, the other end of the first support structure 20 is connected to the first connection portion of the first end portion of the second diaphragm 11, one end of the second support structure 21 is connected to the first connection portion of the second end portion of the first diaphragm 10, and the other end of the second support structure 21 is connected to the first connection portion of the second end portion of the second diaphragm 11. In the MEMS microphone, the first support structure and the second support structure may be made of an insulating material or a conductive material. When the first support structure and the second support structure are made of insulating materials, the first support structure, the first vibrating diaphragm, the second support structure, the second vibrating diaphragm and the back electrode plate can form a differential structure, and the MEMS structure can output differential signals. When the first supporting structure and the second supporting structure are made of conductive materials, the first vibrating diaphragm and the second vibrating diaphragm can be electrically connected through the first supporting structure and the second supporting structure, the whole MEMS structure can form a horseshoe-shaped capacitor, the capacity of the capacitor can be increased, and then the signal to noise ratio of the MEMS microphone is further improved. Above-mentioned first bearing structure and second bearing structure can realize different MEMS functions through different kinds of material, can further promote the adaptability of MEMS microphone.
In still another specific embodiment of the present application, as shown in fig. 8, the MEMS microphone further includes a third support structure 22, wherein one end of the third support structure 22 is connected to the connection portion between the two first protruding portions of the first diaphragm 10, and the other end of the third support structure 22 is connected to the connection portion between the two first protruding portions of the second diaphragm 11. In the MEMS microphone, the material of the third support structure may be an insulating material or a conductive material. When the third supporting structure is made of insulating materials, the first supporting structure, the first vibrating diaphragm, the third supporting structure, the second vibrating diaphragm and the back electrode plate can form a differential structure, and the MEMS structure can output differential signals. The second support structure, the first diaphragm, the third support structure, the second diaphragm and the back plate may form a differential structure, and the MEMS structure may output differential signals. When the third bearing structure is conductive material, first vibrating diaphragm and second vibrating diaphragm can realize the electricity through first bearing structure and third bearing structure and be connected, and whole MEMS structure can form the electric capacity of similar horseshoe shape, can increase the capacity of electric capacity, and then further promotes the signal to noise ratio of MEMS microphone. Above-mentioned third bearing structure can realize different MEMS functions through different kinds of material, can further promote the adaptability of MEMS microphone. In the structure shown in fig. 8, the ratio of the differential structure formed by the first support structure, the first diaphragm, the third support structure, the second diaphragm and the back plate to the differential structure formed by the second support structure, the first diaphragm, the third support structure, the second diaphragm and the back plate is 2:1, in practical application, the person skilled in the art can adjust according to the actual process and change the ratio into other ratios. While other ratios may cause variations in the size of the MEMS microphone, there is little impact on the performance of the MEMS microphone.
In order to further improve the signal-to-noise ratio of the MEMS microphone, in still another specific embodiment of the present application, as shown in fig. 8, the MEMS microphone further includes a second back-plate 23, where the second back-plate 23 is located between the third support structure 22 and the second support structure. In the MEMS microphone, the second back electrode plate may have a single electrode layer structure, or may have a double electrode layer structure including an insulating layer like the first back electrode plate. When the second back electrode plate is of a three-layer structure, the insulating layer can electrically isolate the first electrode layer from the second electrode layer, the first electrode layer is used for outputting signals formed by the interval between the first electrode layer and the first vibrating diaphragm, and the second electrode layer is used for outputting signals formed by the interval between the second electrode layer and the second vibrating diaphragm, and the two signals form differential signals. The three-layer structure of the second back electrode plate can further improve the accuracy of outputting differential signals and further improve the signal to noise ratio of the MEMS microphone.
In still another specific embodiment of the present application, there are a plurality of the first conductive extension structures, and the first conductive extension structures are in one-to-one correspondence with the diaphragm portions. In the MEMS structure, the plurality of first conductive extension structures may further strengthen the MEMS microphone structure. In addition, the first conductive extension structure corresponds to the vibrating diaphragm part one by one, so that the MEMS microphone structure can be further simplified, and the mass production is facilitated.
In still another specific embodiment of the present application, there are a plurality of second conductive extension structures, and the second conductive extension structures are in one-to-one correspondence with the diaphragm portions. In the MEMS structure, the plurality of second conductive extension structures may further strengthen the MEMS microphone structure. In addition, the second conductive extension structure corresponds to the vibrating diaphragm part one by one, so that the MEMS microphone structure can be further simplified, and the mass production is facilitated.
In order to further improve the signal-to-noise ratio of the MEMS microphone, in still another specific embodiment of the present application, as shown in fig. 9, the first diaphragm 10 further includes a plurality of first insulating portions 24 disposed at intervals between the first connecting portion and the fifth connecting portion, and the second diaphragm 11 further includes a plurality of second insulating portions 25 disposed at intervals between the first connecting portion and the fifth connecting portion. In the MEMS structure, the first insulating portion and the second insulating portion may be electrically insulating elements, and the first insulating portion may reduce an influence of parasitic capacitance between the first diaphragm and the first conductive extension structure. In addition, when the first support structure and the second support structure are conductive materials, a reference voltage may be applied to the first electrode layer, and a uniform operating voltage may be applied to the first diaphragm and the second diaphragm. Therefore, the area of the capacitor formed by the first vibrating diaphragm, the second vibrating diaphragm and the second electrode layer can be increased, the sensitivity of the MEMS microphone is improved, and the signal-to-noise ratio of the MEMS microphone is further improved. The second insulating part can reduce the influence of parasitic capacitance between the second vibrating diaphragm and the second conductive extension structure. In addition, when the first support structure and the second support structure are conductive materials, a reference voltage may be applied to the second electrode layer, and a uniform operating voltage may be applied to the first diaphragm and the second diaphragm. Therefore, the area of the capacitor formed by the first vibrating diaphragm, the second vibrating diaphragm and the second electrode layer can be increased, the sensitivity of the MEMS microphone is improved, and the signal-to-noise ratio of the MEMS microphone is further improved.
From the above description, it can be seen that the above embodiments of the present application achieve the following technical effects:
1) The MEMS microphone comprises two diaphragms, namely a first diaphragm and a second diaphragm, wherein each diaphragm comprises a plurality of diaphragm parts which are sequentially connected, each diaphragm part comprises a first connecting part, a second connecting part, a third connecting part, a fourth connecting part and a fifth connecting part which are sequentially connected, the second connecting part, the third connecting part and the fourth connecting part form a first protruding part relative to the first connecting part and the fifth connecting part, the two adjacent diaphragm parts are connected through the fifth connecting part of one diaphragm part and the first connecting part of the other diaphragm, and the first diaphragm and the second diaphragm are opposite and are arranged at intervals; the first back electrode plate is positioned between the first vibrating diaphragm and the second vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are symmetrically arranged relative to the first back electrode plate. The first protruding portion is formed by bending the first vibrating diaphragm and the second vibrating diaphragm, the first vibrating diaphragm and the second vibrating diaphragm are arranged to be symmetrical to the back electrode plate, the effective contact area of the first vibrating diaphragm and the back electrode plate and the effective contact area of the second vibrating diaphragm and the back electrode plate can be increased respectively, and the capacitance capacity is proportional to the contact area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Simultaneously, the first vibrating diaphragm and the second vibrating diaphragm are easier to respond to sound waves to vibrate in a larger area, so that the capacitance capacity can be increased, and the sensitivity of the MEMS microphone is improved. Because the signal-to-noise ratio of the MEMS microphone is the difference between the sensitivity and the noise, the signal-to-noise ratio of the MEMS microphone can be improved.
The foregoing is merely a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and variations may be made to the present application by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application should be included in the protection scope of the present application.
Claims (13)
1. A MEMS microphone, comprising:
the vibrating diaphragms comprise a first vibrating diaphragm and a second vibrating diaphragm, wherein each vibrating diaphragm comprises a plurality of vibrating diaphragm parts which are sequentially connected, each vibrating diaphragm part comprises a first connecting part, a second connecting part, a third connecting part, a fourth connecting part and a fifth connecting part which are sequentially connected, the second connecting part, the third connecting part and the fourth connecting part form first protruding parts relative to the first connecting part and the fifth connecting part, two adjacent vibrating diaphragm parts are connected through the fifth connecting part of one vibrating diaphragm part and the first connecting part of the other vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are opposite and are arranged at intervals;
the first back electrode plate is positioned between the first vibrating diaphragm and the second vibrating diaphragm, and the first vibrating diaphragm and the second vibrating diaphragm are symmetrically arranged relative to the first back electrode plate.
2. The MEMS microphone of claim 1, wherein the first connection is a first horizontal portion, the second connection is a first vertical portion, the third connection is a second horizontal portion, the fourth connection is a second vertical portion, and the fifth connection is a third horizontal portion.
3. The MEMS microphone of claim 1, wherein at least one of the first backplate comprises a stacked insulating layer and two electrode layers, the two electrode layers being a first electrode layer and a second electrode layer, respectively, wherein the insulating layer is located between the first electrode layer and the second electrode layer, and the first electrode layer is located between the second electrode layer and the first diaphragm.
4. A MEMS microphone according to claim 3, further comprising a first conductive extension structure, one end of the first conductive extension structure being connected to the first electrode layer, the other end of the first conductive extension structure extending between the second and fourth connection portions of the first diaphragm.
5. A MEMS microphone according to claim 3, further comprising a second conductive extension structure, one end of the second conductive extension structure being connected to the second electrode layer, the other end of the second conductive extension structure extending between the second connection portion and the fourth connection portion of the second diaphragm.
6. A MEMS microphone according to claim 3, wherein the first electrode layer has a second protrusion.
7. A MEMS microphone according to claim 3, wherein the second electrode layer has a third protrusion.
8. The MEMS microphone of claim 1, further comprising a first support structure and a second support structure, wherein one end of the first support structure is connected to the first connection portion of the first end of the first diaphragm, the other end of the first support structure is connected to the first connection portion of the first end of the second diaphragm, one end of the second support structure is connected to the first connection portion of the second end of the first diaphragm, and the other end of the second support structure is connected to the first connection portion of the second end of the second diaphragm.
9. The MEMS microphone of claim 8, further comprising a third support structure having one end connected to the connection between the two first protrusions of the first diaphragm and another end connected to the connection between the two first protrusions of the second diaphragm.
10. The MEMS microphone of claim 9, further comprising a second backplate located between the third support structure and the second support structure, the second backplate located between the first diaphragm and the second diaphragm, and the first diaphragm and the second diaphragm being symmetrically disposed about the second backplate.
11. The MEMS microphone of claim 4, wherein there are a plurality of the first conductive extension structures, and the first conductive extension structures are in one-to-one correspondence with the diaphragm portions.
12. The MEMS microphone of claim 5, wherein there are a plurality of the second conductive extension structures, wherein the second conductive extension structures are in one-to-one correspondence with the diaphragm portion.
13. The MEMS microphone of claim 1, wherein the first diaphragm further comprises a plurality of first insulating portions disposed at intervals between the first connecting portion and the fifth connecting portion, and the second diaphragm further comprises a plurality of second insulating portions disposed at intervals between the first connecting portion and the fifth connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223579771.XU CN219395044U (en) | 2022-12-31 | 2022-12-31 | MEMS microphone |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223579771.XU CN219395044U (en) | 2022-12-31 | 2022-12-31 | MEMS microphone |
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| CN219395044U true CN219395044U (en) | 2023-07-21 |
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| CN202223579771.XU Active CN219395044U (en) | 2022-12-31 | 2022-12-31 | MEMS microphone |
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