CN219379395U - Wafer cutting and positioning device - Google Patents
Wafer cutting and positioning device Download PDFInfo
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- CN219379395U CN219379395U CN202320683526.9U CN202320683526U CN219379395U CN 219379395 U CN219379395 U CN 219379395U CN 202320683526 U CN202320683526 U CN 202320683526U CN 219379395 U CN219379395 U CN 219379395U
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- limiting block
- block
- compression spring
- displacement sensor
- laser displacement
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Abstract
The utility model discloses a wafer cutting and positioning device which comprises a laser displacement sensor and a mounting plate, wherein two groups of connecting components are arranged between the laser displacement sensor and the mounting plate, the laser displacement sensor is detachably connected with the mounting plate through the connecting components, the connecting components comprise a connector, a fixed block, a slot, a clamping groove, a first limiting block, a through hole, an extrusion column, a first mounting cavity, a first compression spring and a second limiting block, the connector comprises an inserting block, a connecting block, an ear plate, a sliding hole, a clamping column, a second compression spring, a third limiting block and a second mounting cavity, and the outer surface of one side of the fixed block is fixedly connected with the outer surface of one side of the mounting plate. The wafer cutting and positioning device has the advantages that the laser displacement sensor is convenient to install and detach, overhaul is convenient, the connecting bolts are not required to be detached during each overhaul, convenience is improved, and the like.
Description
Technical Field
The utility model relates to the technical field of wafer cutting and positioning devices, in particular to a wafer cutting and positioning device.
Background
A wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the wafer is circular in shape; various circuit element structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions; the wafer need be through cutting the back of blocking, use as the processor kernel again, among the prior art, in the Chinese patent document of the bulletin number CN210359850U of authorizing, a wafer cutting positioner has been described, this patent makes laser cutting head and turn plate connection through the spout, the movable plate, stopper and slide bar, the movable plate passes through stopper and slide bar and installs in the inside of spout, the stopper cup joints the surface at the slide bar simultaneously, the stability of movable plate at the inside removal of spout has been increased, the equilibrium degree of laser cutting head removal has been improved, the laser cutting head passes through the output shaft of movable plate and hydraulic cylinder simultaneously, the convenience of laser cutting head removal has been improved, stability and the convenience of laser cutting head to cutting the wafer board have been increased.
In the prior art, when being cut, the wafer is positioned through the laser displacement sensor, but, in the prior art, the laser displacement sensor is generally directly installed on one side of the laser cutting head through a fixing screw, and one side outer surface of the laser displacement sensor is tightly attached to one side outer surface of the laser cutting head, at first, heat dissipation can be influenced by tight attachment, this time, one side fixed connection of the laser displacement sensor and the laser cutting head through a fixing bolt is inconvenient to disassemble the laser displacement sensor, after the laser displacement sensor is disassembled every time maintenance is needed, the laser displacement sensor is installed again, the installation and the disassembly are not convenient enough, and repeated disassembly can lead to easy loosening of screw parts, thereby influencing the positioning accuracy of the laser displacement sensor and influencing the processing quality.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model provides the wafer cutting and positioning device which has the advantages of facilitating the installation and the disassembly of the laser displacement sensor, facilitating the maintenance, avoiding the disassembly of the connected bolts during each maintenance, increasing the convenience and the like, and effectively solving the problems in the background art.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the utility model provides a wafer cutting positioner, includes laser displacement sensor and mounting panel, be provided with coupling assembling between laser displacement sensor and the mounting panel, coupling assembling's quantity is two sets of, laser displacement sensor passes through coupling assembling and mounting panel and can dismantle the connection, coupling assembling includes connector, fixed block, slot, draw-in groove, first stopper, through-hole, extrusion post, first installation cavity, first compression spring and second stopper, the connector includes inserted block, connecting block, otic placode, slide hole, card post, second compression spring, third stopper and second installation cavity, one side surface fixed connection of fixed block and one side surface of mounting panel, the front end surface of fixed block is seted up to the slot, one side surface of otic placode and one side surface fixed connection of laser displacement sensor.
Preferably, the clamping groove is formed in the upper portion of the outer surface of one side of the fixed block, the clamping groove is communicated with the slot, the first limiting block is fixedly mounted on the lower portion of the slot, the through holes are formed in the left side and the right side of the outer surface of the upper end of the first limiting block, the first mounting cavity is formed in the first limiting block, and the through holes are communicated with the first mounting cavity.
Preferably, the second limiting block and the first compression spring are both positioned in the first installation cavity, the outer surface of the lower end of the first compression spring is fixedly connected with the bottom of the first installation cavity, the outer surface of the upper end of the first compression spring is fixedly connected with the outer surface of the lower end of the second limiting block, the extrusion columns are fixedly arranged on the left side and the right side of the outer surface of the upper end of the second limiting block, sliding connection is arranged between the outer wall of the extrusion column and the through hole, and the outer surface of the lower end of the second limiting block is elastically connected with the bottom of the first installation cavity through the first compression spring.
Preferably, the outer surface of one end of the connecting block is fixedly connected with the middle part of the outer surface of the front end of the inserting block, the lug plate is fixedly arranged at one end of the outer surfaces of the upper side and the lower side of the connecting block, the second mounting cavity is formed in the inserting block, the sliding hole is formed in the middle part of the outer surface of one side of the inserting block, and the sliding hole is communicated with the second mounting cavity.
Preferably, the second compression spring and the third limiting block are both positioned in the second installation cavity, one end outer surface of the second compression spring is fixedly connected with one end of the second installation cavity, the other end outer surface of the second compression spring is fixedly connected with one side outer surface of the third limiting block, and one end outer surface of the clamping column is fixedly connected with the middle part of the other side outer surface of the third limiting block.
Preferably, the outer surface of one side of the third limiting block is elastically connected with one end of the second installation cavity through a second compression spring, the outer wall of the clamping column is in sliding connection with the sliding hole, the outer wall of the inserting block is in inserting connection with the inserting groove, and the outer wall of one end of the clamping column is in clamping connection with the clamping groove.
Compared with the prior art, the utility model provides a wafer cutting and positioning device, which has the following beneficial effects:
this wafer cutting positioner through the coupling assembling that sets up for convenient to detach between laser displacement sensor and the mounting panel, one side fixed connection of mounting panel and laser cutting head makes need not to dismantle the bolt of connection when overhauing at every turn, increases the convenience.
This wafer cutting positioner, installation back, first compression spring are in by extruded state for laser displacement sensor installs more stably, and has the space between laser displacement sensor and the mounting panel, the heat dissipation of laser displacement sensor of being convenient for guarantees laser displacement sensor's normal operating.
Drawings
Fig. 1 is a schematic overall structure of a wafer dicing and positioning apparatus according to the present utility model.
Fig. 2 is a schematic structural diagram of a connection assembly in a wafer dicing and positioning apparatus according to the present utility model.
Fig. 3 is a schematic structural view of a fixing block in the wafer dicing and positioning apparatus according to the present utility model.
Fig. 4 is a front cross-sectional view of fig. 3 of a wafer dicing and positioning apparatus according to the present utility model.
Fig. 5 is a schematic structural diagram of a connector in a wafer dicing and positioning apparatus according to the present utility model.
Fig. 6 is a front cross-sectional view of a connector of a wafer dicing and positioning apparatus according to the present utility model.
In the figure: 1. a laser displacement sensor; 2. a mounting plate; 3. a connection assembly; 4. a connector; 5. a fixed block; 6. a slot; 7. a clamping groove; 8. a first limiting block; 9. a through hole; 10. an extrusion column; 11. a first mounting cavity; 12. a first compression spring; 13. a second limiting block; 14. inserting blocks; 15. a connecting block; 16. ear plates; 17. a slide hole; 18. a clamping column; 19. a second compression spring; 20. a third limiting block; 21. and a second mounting cavity.
Description of the embodiments
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
The embodiment is a wafer dicing and positioning device.
As shown in fig. 1-6, the laser displacement sensor comprises a laser displacement sensor 1 and a mounting plate 2, a connecting component 3 is arranged between the laser displacement sensor 1 and the mounting plate 2, the number of the connecting components 3 is two, the laser displacement sensor 1 is detachably connected with the mounting plate 2 through the connecting component 3, the connecting component 3 comprises a connector 4, a fixed block 5, a slot 6, a clamping groove 7, a first limiting block 8, a through hole 9, an extrusion column 10, a first mounting cavity 11, a first compression spring 12 and a second limiting block 13, the connector 4 comprises an inserting block 14, a connecting block 15, an ear plate 16, a sliding hole 17, a clamping column 18, a second compression spring 19, a third limiting block 20 and a second mounting cavity 21, one side outer surface of the fixed block 5 is fixedly connected with one side outer surface of the mounting plate 2, the slot 6 is arranged on the front end outer surface of the fixed block 5, and one side outer surface of the ear plate 16 is fixedly connected with one side outer surface of the laser displacement sensor 1.
The clamping groove 7 is formed in the upper portion of the outer surface of one side of the fixed block 5, the clamping groove 7 is communicated with the slot 6, the first limiting block 8 is fixedly arranged on the lower portion of the slot 6, the through hole 9 is formed in the left side and the right side of the outer surface of the upper end of the first limiting block 8, the first mounting cavity 11 is formed in the first limiting block 8, and the through hole 9 is communicated with the first mounting cavity 11; the second limiting block 13 and the first compression spring 12 are both positioned in the first installation cavity 11, the outer surface of the lower end of the first compression spring 12 is fixedly connected with the bottom of the first installation cavity 11, the outer surface of the upper end of the first compression spring 12 is fixedly connected with the outer surface of the lower end of the second limiting block 13, the extrusion column 10 is fixedly arranged on the left side and the right side of the outer surface of the upper end of the second limiting block 13, the outer wall of the extrusion column 10 is in sliding connection with the through hole 9, and the outer surface of the lower end of the second limiting block 13 is elastically connected with the bottom of the first installation cavity 11 through the first compression spring 12; the outer surface of one end of the connecting block 15 is fixedly connected with the middle part of the outer surface of the front end of the inserting block 14, the lug plate 16 is fixedly arranged at one end of the outer surfaces of the upper side and the lower side of the connecting block 15, the second mounting cavity 21 is arranged in the inserting block 14, the sliding hole 17 is arranged in the middle part of the outer surface of one side of the inserting block 14, and the sliding hole 17 is communicated with the second mounting cavity 21; the second compression spring 19 and the third limiting block 20 are both positioned in the second installation cavity 21, one end outer surface of the second compression spring 19 is fixedly connected with one end of the second installation cavity 21, the other end outer surface of the second compression spring 19 is fixedly connected with one side outer surface of the third limiting block 20, and one end outer surface of the clamping column 18 is fixedly connected with the middle part of the other side outer surface of the third limiting block 20; the outer surface of one side of the third limiting block 20 is elastically connected with one end of the second installation cavity 21 through the second compression spring 19, the outer wall of the clamping column 18 is in sliding connection with the sliding hole 17, the outer wall of the insertion block 14 is in insertion connection with the slot 6, and the outer wall of one end of the clamping column 18 is in clamping connection with the clamping groove 7.
It should be noted that, the utility model is a wafer cutting positioning device, the laser displacement sensor 1 described herein is convenient for playing a role in positioning when cutting a wafer, and increasing the accuracy of cutting, therefore, the applicant does not make too much redundancy on the surface of the lower end of the insert block 14, the mounting plate 2 is fixedly connected with one side of the laser cutting head, the ear plate 16 is fixedly connected with one side of the laser displacement sensor 1, when the laser displacement sensor 1 is installed, the clamp column 18 slides along the sliding hole 17 through extrusion of the clamp column 18, one end of the clamp column 18 enters the inside of the sliding hole 17, the clamp column 18 drives the third limiting block 20 to squeeze the second compression spring 19 in the inside of the second mounting cavity 21, then the insert block 14 is inserted into the inside of the slot 6, the upper end outer surface of the extrusion column 10 is extruded by the lower end surface of the insert block 14, the extrusion column 10 slides along the through hole 9, the extrusion column 10 drives the second limiting block 13 to squeeze the first compression spring 12 in the inside of the first mounting cavity 11, when the clamp column 18 reaches the position of the clamp column 7, the clamp column 18 is connected with the first compression spring 18, and the laser displacement sensor 1 is conveniently dismounted after the clamp column is installed, the clamp column is connected with the first compression spring 1, and the laser displacement sensor 1 is conveniently and the laser displacement sensor is conveniently and installed, and the position of the clamp column is not required to be dismounted, and the laser displacement sensor is conveniently and connected with the first compression sensor 1.
It should be noted that in this document, relational terms such as first and second (first and second), and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. The utility model provides a wafer cutting positioner, includes laser displacement sensor (1) and mounting panel (2), its characterized in that: the laser displacement sensor is characterized in that a connecting component (3) is arranged between the laser displacement sensor (1) and the mounting plate (2), the number of the connecting component (3) is two, the laser displacement sensor (1) is detachably connected with the mounting plate (2) through the connecting component (3), the connecting component (3) comprises a connector (4), a fixed block (5), a slot (6), a clamping groove (7), a first limiting block (8), a through hole (9), an extrusion column (10), a first mounting cavity (11), a first compression spring (12) and a second limiting block (13), the connector (4) comprises an inserting block (14), a connecting block (15), an ear plate (16), a sliding hole (17), a clamping column (18), a second compression spring (19), a third limiting block (20) and a second mounting cavity (21), one side outer surface of the fixed block (5) is fixedly connected with one side outer surface of the mounting plate (2), the slot (6) is formed in the outer surface of the front end of the fixed block (5), and one side outer surface of the ear plate (16) is fixedly connected with one side of the laser displacement sensor (1).
2. The wafer dicing and positioning apparatus according to claim 1, wherein: the clamping groove (7) is formed in the upper portion of one side outer surface of the fixed block (5), the clamping groove (7) is communicated with the slot (6), the first limiting block (8) is fixedly mounted on the lower portion of the slot (6), the through holes (9) are formed in the left side and the right side of the outer surface of the upper end of the first limiting block (8), the first mounting cavity (11) is formed in the first limiting block (8), and the through holes (9) are communicated with the first mounting cavity (11).
3. The wafer dicing and positioning apparatus according to claim 2, wherein: the novel compression device is characterized in that the second limiting block (13) and the first compression spring (12) are both positioned in the first installation cavity (11), the outer surface of the lower end of the first compression spring (12) is fixedly connected with the bottom of the first installation cavity (11), the outer surface of the upper end of the first compression spring (12) is fixedly connected with the outer surface of the lower end of the second limiting block (13), the extrusion column (10) is fixedly arranged on the left side and the right side of the outer surface of the upper end of the second limiting block (13), sliding connection is arranged between the outer wall of the extrusion column (10) and the through hole (9), and the outer surface of the lower end of the second limiting block (13) is elastically connected with the bottom of the first installation cavity (11) through the first compression spring (12).
4. A wafer dicing and positioning apparatus according to claim 3, wherein: the outer surface of one end of the connecting block (15) is fixedly connected with the middle part of the outer surface of the front end of the inserting block (14), the lug plate (16) is fixedly arranged at one end of the outer surfaces of the upper side and the lower side of the connecting block (15), the second installation cavity (21) is formed in the inserting block (14), the sliding hole (17) is formed in the middle part of the outer surface of one side of the inserting block (14), and the sliding hole (17) is communicated with the second installation cavity (21).
5. The wafer dicing and positioning apparatus according to claim 4, wherein: the second compression spring (19) and the third limiting block (20) are both positioned in the second installation cavity (21), one end outer surface of the second compression spring (19) is fixedly connected with one end of the second installation cavity (21), the other end outer surface of the second compression spring (19) is fixedly connected with one side outer surface of the third limiting block (20), and one end outer surface of the clamping column (18) is fixedly connected with the middle part of the other side outer surface of the third limiting block (20).
6. The wafer dicing and positioning apparatus according to claim 5, wherein: one side surface of the third limiting block (20) is elastically connected with one end of the second installation cavity (21) through the second compression spring (19), the outer wall of the clamping column (18) is in sliding connection with the sliding hole (17), the outer wall of the inserting block (14) is in inserting connection with the inserting groove (6), and the outer wall of one end of the clamping column (18) is in clamping connection with the clamping groove (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320683526.9U CN219379395U (en) | 2023-03-31 | 2023-03-31 | Wafer cutting and positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320683526.9U CN219379395U (en) | 2023-03-31 | 2023-03-31 | Wafer cutting and positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219379395U true CN219379395U (en) | 2023-07-21 |
Family
ID=87190695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320683526.9U Active CN219379395U (en) | 2023-03-31 | 2023-03-31 | Wafer cutting and positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219379395U (en) |
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2023
- 2023-03-31 CN CN202320683526.9U patent/CN219379395U/en active Active
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