CN219379369U - Laser drilling machine - Google Patents

Laser drilling machine Download PDF

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Publication number
CN219379369U
CN219379369U CN202320594957.8U CN202320594957U CN219379369U CN 219379369 U CN219379369 U CN 219379369U CN 202320594957 U CN202320594957 U CN 202320594957U CN 219379369 U CN219379369 U CN 219379369U
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CN
China
Prior art keywords
objective table
board
close
substrate
laser drilling
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Active
Application number
CN202320594957.8U
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Chinese (zh)
Inventor
王宇
陈之瀚
田乐丽
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Shenzhen Liandaqi Precision Ceramics Co ltd
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Shenzhen Liandaqi Precision Ceramics Co ltd
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Priority to CN202320594957.8U priority Critical patent/CN219379369U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Laser Beam Processing (AREA)

Abstract

The utility model belongs to the technical field that the atomizing piece was punched, relate to a laser-beam drilling machine, it includes the board, is provided with the objective table on the board, and one side that the objective table was kept away from the board is provided with laser drilling mechanism, the objective table runs through in the object plane of carrying and has offered the absorption hole including the object plane of carrying that is used for placing the atomizing substrate, and one side intercommunication that the objective table is close to the object plane of carrying has the vacuum part that is used for adsorbing the atomizing substrate in the object plane of carrying, and the board is provided with the dwang in one side of objective table, and one side that the dwang is close to the board is provided with the lift seat, is provided with the rotating component that is used for driving the dwang rotatory between dwang and the lift seat, and the one end that the board was kept away from the board is connected with the extension board, and the one end that the extension board is close to the objective table is provided with the clearance subassembly that is used for carrying out the surface clearance to the atomizing substrate. The method has the effect of reducing the influence of residual slag on the atomized substrate on subsequent stamping of the atomized substrate.

Description

Laser drilling machine
Technical Field
The application relates to the field of atomizing piece punching, in particular to a laser punching machine.
Background
The laser puncher is a special punching device designed by utilizing a laser technology and a numerical control technology, and can be applied to punching processing of microporous atomization sheets. The micropore atomizing sheet comprises an atomizing substrate and a piezoelectric ceramic sheet, the piezoelectric ceramic generates a piezoelectric effect and generates high-frequency oscillation under the action of a driving power supply, liquid water molecules are scattered to form water mist through high-frequency metal oscillation, and the atomizing substrate is a metal sheet with micropores, so that a laser drilling machine is required to be used for drilling the atomizing substrate to form mist holes in the micropore atomizing sheet production process.
The existing laser-beam drilling machine generally comprises an objective table for placing an atomized substrate, one side of the objective table is an object carrying side, a laser drilling mechanism is arranged above the object carrying side, when the atomized substrate is placed on the object carrying side, the laser drilling mechanism can conduct laser drilling on the atomized substrate, and a punching mechanism is arranged on one side of the objective table to punch the atomized substrate to form protruding points.
However, after the atomized substrate is subjected to laser drilling, slag is easy to remain on the micropores and one side, close to the laser drilling mechanism, of the atomized substrate, and the residual slag on the atomized substrate can influence the processing effect of forming bumps by subsequent stamping of the atomized substrate.
Disclosure of Invention
In order to reduce the effect of residual slag on an atomized substrate on subsequent stamping of the atomized substrate, a laser drilling machine is provided.
The application provides a laser drilling machine adopts following technical scheme:
the utility model provides a laser-beam drilling machine, includes the board, is provided with the objective table on the board, and one side that the objective table was kept away from the board is provided with laser drilling mechanism, the objective table is including the year object plane that is used for placing the atomizing substrate, and the objective table runs through in carrying the object plane and has offered the absorption hole, and one side intercommunication that the objective table is close to carrying the object plane has the vacuum part that is used for adsorbing the atomizing substrate in carrying the object plane, and the board is provided with the dwang in one side of objective table, and one side that the dwang is close to the board is provided with the lift seat, is provided with the rotating component that is used for driving the dwang rotatory between dwang and the lift seat, and the one end that the dwang was kept away from the board is connected with the extension board, and the one end that the extension board is close to the objective table is provided with the clearance subassembly that is used for carrying out the surface clearance to the atomizing substrate.
Through adopting above-mentioned technical scheme, when atomizing substrate carries out laser drilling, atomizing substrate is placed on the objective table, and vacuum piece and objective table intercommunication are in order to make the objective table in form negative pressure environment, and the objective table adsorbs atomizing substrate in carrying the object plane through the absorption hole, and laser drilling mechanism carries out laser drilling to atomizing substrate. After the laser drilling of the atomized substrate is completed, the rotating assembly drives the rotating rod to rotate, the supporting plate rotates to the upper portion of the objective table, the lifting seat drives the rotating rod and the supporting plate to lift, so that the cleaning assembly can clean the surface of the atomized substrate, and the cleaning assembly cleans residual slag after the laser drilling, so that the influence of the residual slag on the atomized substrate on the processing effect of forming salient points on the subsequent punching of the atomized substrate is reduced.
Optionally, the clearance subassembly is including setting up in the carousel that the one end that the extension board is close to the objective table, is provided with between carousel and the extension board and is used for driving carousel pivoted driving piece, and the abrasive brick is installed to one side that the carousel is close to the objective table.
Through adopting above-mentioned technical scheme, driving piece drive carousel rotates, and the carousel drives the abrasive brick and rotates to the clearance of polishing to remaining in atomizing substrate surface's slag, in order to clear away remaining slag, the simple operation.
Optionally, the driving piece is a first motor, and an output end of the first motor is connected with a corresponding side of the turntable.
Through adopting above-mentioned technical scheme, the output of first motor is connected with the corresponding side of carousel to drive the carousel and rotate, the abrasive brick clearance atomizing substrate's that polishes surface, and first motor environment usability is strong, makes the carousel rotate steadily.
Optionally, the rotation subassembly includes the driven bevel gear of cover locating the outer wall of dwang, and driven bevel gear meshing is connected with drive bevel gear, and drive bevel gear is connected with the second motor.
Through adopting above-mentioned technical scheme, second motor drive initiative bevel gear rotates, initiative bevel gear and driven bevel gear meshing are connected in order to realize the rotation regulation of dwang, simple structure and easy operation.
Optionally, the dead lever is installed to one side that the extension board is close to the objective table, and the outer wall cover of dead lever is equipped with the pressure pipe that is used for pressing the atomizing substrate, is provided with the elastic component between the inner wall that the pressure pipe is close to objective table one end and the one end that the extension board was kept away from to the dead lever.
Through adopting above-mentioned technical scheme, the dwang drives extension board and clearance subassembly and removes to the top of objective table after, and the lifting seat drives the dwang and goes up and down so that clearance subassembly can clear up the surface of atomizing substrate. At this moment, the inner wall of pressing the pipe is connected with the outer wall of dead lever in a sliding way, and the elastic component compression is compressed state to make the one end that presses the pipe to be close to the objective table can press the atomizing substrate, so that the atomizing substrate is further fixed in objective table department, when alleviateing the clearance of clearance subassembly, the atomizing substrate removes the situation that leads to the clearance subassembly to be difficult to clear up the atomizing substrate.
Optionally, one side of objective table is provided with the positioning seat, and one side that the positioning seat kept away from the board is provided with the positioning arm, and the positioning arm is including being close to each other in order to correct and fix a position first section body and the second section body of atomizing substrate, is provided with the two-way driving piece that is used for driving first section body and second section body to be close to each other or keep away from between positioning arm and the positioning seat.
Through adopting above-mentioned technical scheme, after the atomizing substrate is placed on carrying the object plane, two-way drive piece drive first section body and second section are close to each other in order to correct and fix a position the atomizing substrate, and then first section body and second section body are kept away from each other through two-way drive piece drive, and the setting of positioning arm can make the atomizing substrate be located the center department of objective table, and the accuracy of punching the location when improving laser drilling.
Optionally, the end of the first section body close to the objective table and the end of the second section body close to the objective table are inclined planes for attaching the edge of the atomized substrate.
Through adopting above-mentioned technical scheme, first section body and second section body are close to each other, and the one end that first section body is close to the objective table, the one end that second section body is close to the objective table laminate with the edge of atomizing substrate respectively, are favorable to improving the accuracy of atomizing substrate correction and location.
Optionally, the positioning seat includes the first plate body of top and the second plate body of below, and one side that the objective table was kept away from to first plate body runs through and has seted up waist type hole, and first plate body is provided with the connecting piece between waist type hole department and second plate body.
Through adopting above-mentioned technical scheme, unclamp the connecting piece, the second plate body takes place relative movement with the waist type hole department of first plate body, but the whole height of adjustable positioning seat for positioning arm and objective table looks adaptation are convenient for correct and fix a position atomizing substrate, and the second plate body is used the connecting piece to realize being connected fixedly with first plate body, are favorable to improving the flexibility when the positioning seat uses.
In summary, the present application includes the following beneficial technical effects:
1. when the atomized substrate is subjected to laser drilling, the atomized substrate can be adsorbed on the object carrying surface through the vacuum piece, and the laser drilling mechanism is used for carrying out laser drilling on the atomized substrate. After the laser drilling of the atomized substrate is completed, the rotating assembly drives the rotating rod and enables the support plate to rotate to the upper part of the objective table, the lifting seat drives the rotating rod and the support plate to lift, the cleaning assembly cleans residual slag after the laser drilling, and the influence of the residual slag on subsequent punching processing of the atomized substrate is reduced;
2. the arrangement of the fixing rod, the elastic piece and the pressing pipe is beneficial to improving the stability of the atomized substrate fixed on the objective table when the cleaning assembly is cleaned;
3. after the atomized substrate is placed on the object carrying surface, the atomized substrate is corrected and positioned by the positioning arm, the atomized substrate can be positioned at the center of the object carrying table by the positioning arm, and the accuracy of punching and positioning during laser punching is improved.
Drawings
Fig. 1 is a schematic structural view of a laser drilling machine according to the present application.
Fig. 2 is a schematic view showing a partial structure at a rotating assembly.
Fig. 3 is a schematic view showing a partial structure at the positioning seat.
FIG. 4 is a schematic partial structure of the cleaning assembly.
Fig. 5 is an exploded view of the fixing rod in the axial direction.
Fig. 6 is a schematic diagram showing a partial structure at a carrier plane.
Reference numerals illustrate:
1. a machine table; 11. a bracket; 2. a laser drilling mechanism; 3. an objective table; 31. a carrier surface; 311. adsorption holes; 32. a vacuum member; 4. a rotating lever; 41. a lifting seat; 411. a first lifting plate; 412. a second lifting plate; 413. a cylinder; 42. a rotating assembly; 421. a driven bevel gear; 422. a drive bevel gear; 423. a second motor; 5. a support plate; 6. cleaning the assembly; 61. a turntable; 62. a grinding block; 63. a first motor; 64. a fixed rod; 641. an elastic member; 642. pressing a pipe; 7. a positioning seat; 71. a positioning arm; 711. a first segment; 712. a second segment; 713. a bi-directional driving member; 714. an inclined plane; 72. a first plate body; 721. a waist-shaped hole; 73. a second plate body; 74. a connecting piece; 8. atomizing the substrate.
Detailed Description
The present application is described in further detail below.
Example 1
The utility model provides a laser-beam drilling machine, refers to FIG. 1, is provided with objective table 3 on including board 1, and one side that objective table 3 is kept away from board 1 is provided with laser drilling mechanism 2, and one side of objective table 3 is provided with dwang 4, and the one end that dwang 4 kept away from board 1 is connected with extension board 5, and one side that extension board 5 is close to objective table 3 is provided with clearance subassembly 6.
Referring to fig. 4 and 6, a support 11 is mounted on the machine 1, a stage 3 is disposed on a side of the support 11 away from the machine 1, the stage 3 is a vertically disposed cylinder, and an axial direction of the stage 3 is parallel to a height direction of the machine 1. One end of the objective table 3 far away from the bracket 11 is an object carrying surface 31 for placing the atomized substrate 8, the objective table 3 is provided with a plurality of adsorption holes 311 in a penetrating way in the object carrying surface 31, the adsorption holes 311 are uniformly distributed along the annular edge of the objective table 3, and the adsorption holes 311 are circular through holes. The stage 3 is connected to a vacuum member 32 on a side thereof adjacent to the frame 11, and the vacuum member 32 may be a vacuum pump. The side of the stage 3 remote from the support 11 is provided with a laser drilling mechanism 2 for laser drilling of the atomized substrate 8.
Referring to fig. 2, a lifting base 41 is mounted on the machine 1 at one side of the stage 3, the lifting base 41 includes a first lifting plate 411 mounted on the machine 1, the first lifting plate 411 is a horizontally arranged long plate, and the length direction of the first lifting plate 411 is perpendicular to the height direction of the machine 1. The first lifting plate 411 is provided with a second lifting plate 412 on a side far away from the machine 1, the second lifting plate 412 is in a long plate shape horizontally arranged, and the length direction of the second lifting plate 412 is consistent with the length direction of the first lifting plate 411. An air cylinder 413 for driving the second lifting plate 412 to lift is arranged between the first lifting plate 411 and the second lifting plate 412, and a piston rod end of the air cylinder 413 is connected with the second lifting plate 412.
The second lifter plate 412 is provided with the dwang 4 in the side of keeping away from the cylinder 413, and dwang 4 is the round bar of vertical setting, and the axis direction of dwang 4 is perpendicular with the length direction of second lifter plate 412. The outer wall of the rotating rod 4 is sleeved with a driven bevel gear 421, the driven bevel gear 421 is connected with a driving bevel gear 422 in a meshed mode, the driving bevel gear 422 is connected with a second motor 423, and the second motor 423 is installed on the corresponding side of the second lifting plate 412.
Referring to fig. 4, a support plate 5 is installed at one end of the rotation rod 4 far from the lifting seat 41, the support plate 5 is a horizontally arranged long plate, and the length direction of the support plate 5 is perpendicular to the axial direction of the rotation rod 4. The support plate 5 is located at the end of the rotation rod 4 and is provided with a turntable 61 at the side close to the stage 3. The turntable 61 is a horizontally arranged disk, and the axis direction of the turntable 61 is parallel to the axis direction of the rotating lever 4. The grinding block 62 is installed to the end that carousel 61 kept away from extension board 5, and the one end that carousel 61 kept away from grinding block 62 runs through extension board 5 and is connected with the first motor 63 that is used for driving carousel 61 rotation.
Referring to fig. 5, the support plate 5 is provided with fixing rods 64 at both sides of the turntable 61, the fixing rods 64 are round rods vertically arranged, the axial direction of the fixing rods 64 is parallel to the axial direction of the rotating rod 4, one end of the fixing rods 64 far away from the support plate 5 is provided with elastic elements 641, the elastic elements 641 are springs, and one end of each spring far away from the fixing rods 64 is connected with a pressing tube 642. The pressing pipe 642 is a vertically arranged round pipe, the axial direction of the pressing pipe 642 is consistent with the axial direction of the fixed rod 64, and the inner wall of the pressing pipe 642 is connected with the outer wall of the fixed rod 64 in a sliding manner.
The implementation principle of the embodiment 1 is as follows: referring to fig. 2, when the atomized substrate 8 is placed on the carrier surface 31, the vacuum member 32 can adsorb and fix the atomized substrate 8 to the stage 3. The laser drilling mechanism 2 performs laser drilling on the atomized substrate 8, and after the atomized substrate 8 is drilled, the second motor 423 drives the driving bevel gear 422 to rotate, the driving bevel gear 422 is connected with the driven bevel gear 421 in a meshed manner, and the rotating rod 4 realizes rotation and drives the support plate 5 to move to the upper part of the objective table 3. Referring to fig. 4, the lifting base 41 drives the rotating rod 4 and the support plate 5 to descend to the surface of the atomized substrate 8, and when the first motor 63 drives the turntable 61 to rotate, the grinding block 62 polishes and cleans slag remained on the surface of the atomized substrate 8, so as to reduce the influence of the residual slag on the atomized substrate 8 on the processing effect of forming bumps on the atomized substrate 8 in the subsequent punching process.
Example 2
Referring to fig. 3, a laser drilling machine is different from embodiment 1 in that a positioning base 7 is mounted on a bracket 11 on one side of a stage 3. The positioning seat 7 comprises a first plate 72 below and a second plate 73 above, the first plate 72 is an L-shaped plate arranged vertically, and the transverse section of the first plate 72 is mounted on the corresponding side of the bracket 11. The first plate 72 has a waist-shaped hole 721 penetrating through a side thereof away from the stage 3, and a longitudinal direction of the waist-shaped hole 721 is parallel to an axial direction of the stage 3. The second plate 73 is an L-shaped plate that is vertically arranged, the vertical section of the second plate 73 is attached to the vertical section of the first plate 72, and a connecting piece 74 is arranged between the waist-shaped hole 721 of the first plate 72 and the second plate 73, and the connecting piece 74 can be a bolt.
The second plate 73 is provided with a positioning arm 71 on a side away from the first plate 72, and the positioning arm 71 includes a first segment 711 and a second segment 712, where the first segment 711 and the second segment 712 are distributed on two sides of the stage 3 along the direction perpendicular to the axis of the stage 3. The first section body 711 is a horizontally arranged door-shaped plate, the opening of the first section body 711 faces the object stage 3, the second section body 712 is a horizontally arranged door-shaped plate, and the opening of the second section body 712 faces the object stage 3. One end of the first segment 711 near the stage 3 and one end of the second segment 712 near the stage 3 are inclined surfaces 714 for attaching to the edge of the atomized substrate 8. A bidirectional driving member 713 is disposed between the first section body 711 and the second section body 712, the bidirectional driving member 713 is a rodless cylinder 413, and the rodless cylinder 413 is mounted on a corresponding side of the second positioning plate.
The implementation principle of the embodiment 2 is as follows: after the atomized substrate 8 is placed on the object carrying surface 31, the bidirectional driving member 713 drives the first segment 711 and the second segment 712 to approach each other to correct and position the atomized substrate 8, and then the first segment 711 and the second segment 712 are driven to depart from each other by the bidirectional driving member 713, and the positioning arm 71 is arranged to enable the atomized substrate 8 to be located at the center of the object carrying table 3, so that accuracy of punching and positioning during laser punching is improved.
The foregoing are all preferred embodiments of the present application, and are not intended to limit the scope of the present application in any way, therefore: all equivalent changes in structure, shape and principle of this application should be covered in the protection scope of this application.

Claims (8)

1. The utility model provides a laser drilling machine, includes board (1), is provided with objective table (3) on board (1), and one side that board (1) was kept away from to objective table (3) is provided with laser drilling mechanism (2), its characterized in that: the utility model provides a device for atomizing substrate, including carrying object plane (31) that is used for placing atomizing substrate (8), carrying object plane (31) runs through in carrying object plane (31) and has seted up absorption hole (311), one side intercommunication that carrying object plane (3) is close to carrying object plane (31) has vacuum piece (32) that are used for adsorbing atomizing substrate (8) in carrying object plane (31), board (1) is provided with dwang (4) in one side of carrying object plane (3), one side that dwang (4) is close to board (1) is provided with elevating socket (41), be provided with between dwang (4) and elevating socket (41) and be used for driving dwang (4) rotatory rotating assembly (42), the one end that dwang (4) kept away from board (1) is connected with extension board (5), the one end that extension board (5) are close to carrying object plane (3) is provided with clearance subassembly (6) that are used for clear up atomizing substrate (8) surface.
2. A laser drilling machine as recited in claim 1, wherein: the cleaning assembly (6) comprises a rotary table (61) arranged at one end, close to the objective table (3), of the support plate (5), a driving piece used for driving the rotary table (61) to rotate is arranged between the rotary table (61) and the support plate (5), and a grinding block (62) is arranged at one side, close to the objective table (3), of the rotary table (61).
3. A laser drilling machine as recited in claim 2, wherein: the driving piece is a first motor (63), and the output end of the first motor (63) is connected with the corresponding side of the turntable (61).
4. A laser drilling machine as recited in claim 1, wherein: the rotating assembly (42) comprises a driven bevel gear (421) sleeved on the outer wall of the rotating rod (4), the driven bevel gear (421) is connected with a driving bevel gear (422) in a meshed mode, and the driving bevel gear (422) is connected with a second motor (423).
5. A laser drilling machine as recited in claim 1, wherein: one side of the support plate (5) close to the objective table (3) is provided with a fixing rod (64), the outer wall of the fixing rod (64) is sleeved with a pressing pipe (642) for pressing the atomized substrate (8), and an elastic piece (641) is arranged between the inner wall of the pressing pipe (642) close to one end of the objective table (3) and one end of the fixing rod (64) far away from the support plate (5).
6. A laser drilling machine as recited in claim 1, wherein: one side of objective table (3) is provided with positioning seat (7), and one side that positioning seat (7) kept away from board (1) is provided with positioning arm (71), and positioning arm (71) are including first section body (711) and second section body (712) that are close to each other in order to correct and fix a position atomizing substrate (8), are provided with between positioning arm (71) and positioning seat (7) and are used for driving two-way drive piece (713) that first section body (711) and second section body (712) are close to each other or keep away from.
7. A laser drilling machine as recited in claim 6, wherein: one end of the first section body (711) close to the objective table (3) and one end of the second section body (712) close to the objective table (3) are inclined planes (714) used for being attached to the edge of the atomized substrate (8).
8. A laser drilling machine as recited in claim 6, wherein: the positioning seat (7) comprises a first plate body (72) below and a second plate body (73) above, a waist-shaped hole (721) is formed in one side, far away from the objective table (3), of the first plate body (72), and a connecting piece (74) is arranged between the waist-shaped hole (721) and the second plate body (73) of the first plate body (72).
CN202320594957.8U 2023-03-15 2023-03-15 Laser drilling machine Active CN219379369U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320594957.8U CN219379369U (en) 2023-03-15 2023-03-15 Laser drilling machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320594957.8U CN219379369U (en) 2023-03-15 2023-03-15 Laser drilling machine

Publications (1)

Publication Number Publication Date
CN219379369U true CN219379369U (en) 2023-07-21

Family

ID=87197494

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320594957.8U Active CN219379369U (en) 2023-03-15 2023-03-15 Laser drilling machine

Country Status (1)

Country Link
CN (1) CN219379369U (en)

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