CN219370095U

CN219370095U - Optical sensor module and electronic device

Info

Publication number: CN219370095U
Application number: CN202320678621.XU
Authority: CN
Inventors: 周岩
Original assignee: Beijing Xiaomi Mobile Software Co Ltd
Current assignee: Beijing Xiaomi Mobile Software Co Ltd
Priority date: 2023-03-30
Filing date: 2023-03-30
Publication date: 2023-07-18
Anticipated expiration: 2033-03-30

Abstract

The utility model discloses an optical sensor module and electronic equipment, and belongs to the technical field of electronics. The optical sensor module includes: an optical element, a light-guiding lampshade and an adapter; the light guide lampshade is positioned on the structural member of the electronic equipment, and the adapter is positioned in the structural member and connected with the circuit board of the electronic equipment; the optical element is positioned on the adapter, and the distance between the optical center of the optical element and the central line of the light guide lampshade is smaller than or equal to a target threshold value. The optical sensor module has the advantages that the position of the optical element is free from the limitation of the internal stacking structure such as the circuit board, the optical element has better stacking freedom degree, the optical sensor module can be better adapted to the position of the light guide lampshade, and the transmittance of infrared light is ensured to be higher.

Description

Optical sensor module and electronic device

Technical Field

The present disclosure relates to electronic technology, and in particular, to an optical sensor module and an electronic device.

Background

With the continuous development of electronic technology, mobile devices such as mobile phones are lighter and thinner, and meanwhile, the limited main board area is smaller and smaller due to the increase of functions such as high-power wired and wireless charging, and the difficulty of stacking the sensors is increased due to the shape of the main board and the special requirements of the sensors.

The mobile device may exchange information with other related devices via infrared functions, for example, may control a television, an air conditioner, or may be wirelessly connected to a computer or other mobile device. The realization of infrared function is with the help of the infrared lamp, and needs to use with the light guide lamp shade collocation, and the light guide lamp shade can be with the light transmission of minimum loss with the infrared lamp to the remote position, and the concentricity of infrared lamp and light guide lamp shade has apparent influence to the receiving and dispatching efficiency of infrared light.

But limited by the internal stacking structure and appearance of the mobile device, concentricity of the infrared lamp and the light guide lampshade cannot be guaranteed, so that the transmittance of infrared light is low, and the infrared performance is affected.

Disclosure of Invention

The utility model provides an optical sensor module and electronic equipment, which can solve the problems that the concentricity of an infrared lamp and a light guide lampshade cannot be ensured, the transmittance of infrared light is low, and the infrared performance is influenced.

The technical scheme is as follows:

in one aspect, an optical sensor module is provided, the optical sensor module comprising: an optical element, a light-guiding lampshade and an adapter;

the light guide lampshade is positioned on a structural member of the electronic equipment, and the adapter is positioned in the structural member and is connected with a circuit board of the electronic equipment;

the optical element is positioned on the adapter, and the distance between the optical center of the optical element and the central line of the light guide lampshade is smaller than or equal to a target threshold value.

In some embodiments, the circuit board includes a first working surface and a second working surface;

one of the first working surface and the second working surface is attached to the surface of the adapter so that the adapter is connected with the circuit board.

In some embodiments, the adapter includes a third working surface facing toward the circuit board and a fourth working surface facing away from the circuit board;

the optical element is located on one of the third working surface and the fourth working surface.

In some embodiments, the optical element is electrically connected to the circuit board.

In some embodiments, the circuit board is provided with a main circuit structure, and the adaptor is provided with an adaptor circuit structure;

the optical element is electrically connected with the switching circuit structure;

when the adapter is connected with the circuit board, the adapter circuit structure is electrically connected with the main circuit structure.

In some embodiments, the main circuit structure includes a first pad and the interposer circuit structure includes a second pad;

the first bonding pad and the second bonding pad are connected in a welding mode.

In some embodiments, the interposer circuit structure further includes a third pad electrically connected to the second pad, the optical element soldered to the third pad.

In some embodiments, the circuit board is provided with a main circuit structure, and the optical sensor module further comprises a conductive circuit, and when the adapter is connected with the circuit board, the conductive circuit is connected between the optical element and the main circuit structure.

In some embodiments, the circuit board is provided with a relief portion near an edge of the light guide lampshade, and at least part of the optical element is located in the relief portion.

On the other hand, an electronic device is provided, and the electronic device comprises the optical sensor module.

The technical scheme provided by the utility model has the beneficial effects that at least:

according to the optical sensor module, the bridging adaptor is added between the optical element and the circuit board, the position of the optical element in the stacking direction of the circuit board can be adjusted by using the adaptor, so that the distance between the optical center of the optical element and the central line of the light guide lampshade is smaller than or equal to a target threshold value, the position of the optical element is free from the limitation of internal stacking structures such as the circuit board, the optical sensor module has better stacking freedom, can be better adapted to the position of the light guide lampshade, and ensures that the transmittance of infrared light is higher. The stacking freedom of the optical element is improved, the transmittance of infrared light is ensured, the diameter of the light guide lampshade is also favorably reduced, the opening on the structural part of the electronic equipment is smaller, and the appearance integrity is higher.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an optical sensor module according to a first embodiment of the present utility model;

FIG. 2 is a schematic diagram of an optical sensor module according to a second embodiment of the present utility model;

FIG. 3 is a schematic diagram of an optical sensor module according to a third embodiment of the present utility model;

FIG. 4 is a schematic structural diagram of an optical sensor module according to a fourth embodiment of the present utility model;

fig. 5 is a schematic diagram of electrical connection between an optical element and a circuit board according to an embodiment of the present utility model;

FIG. 6 is a schematic diagram of an electrical connection between an optical element and a circuit board according to another embodiment of the present utility model;

fig. 7 is a schematic diagram of the positions of an optical element and a circuit board according to an embodiment of the present utility model.

Reference numerals in the drawings are respectively expressed as:

10. structural members; 20. a circuit board;

1001. a mounting hole;

2001. a first working surface; 2002. a second working surface; 2003. a main circuit structure; 20031. a first bonding pad; 2004. an avoidance unit;

1. an optical element;

2. a light guide lamp cover;

3. an adapter; 301. a third working surface; 302. a fourth working surface; 303. a switching circuit structure; 3031. a second bonding pad; 3032. a third bonding pad;

4. and a conductive circuit.

Detailed Description

Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in fig. 1 are merely for convenience in describing the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Unless defined otherwise, all technical terms used in the embodiments of the present utility model have the same meaning as commonly understood by one of ordinary skill in the art.

In the related art, since the infrared lamp is mounted on the main board as an electronic component using a surface mount technology (Surface Mounted Technology, SMT), the position of the infrared lamp in the stacking direction depends on the stacking of the main board.

The light guide cover is required to be assembled to the middle frame, and the light guide cover is generally required to be disposed at a midpoint of the middle frame in the thickness direction, for the outer appearance of the middle frame. Therefore, the positions of the infrared lamp and the light guide lampshade cannot be adaptively adjusted, and concentricity of the infrared lamp and the light guide lampshade is difficult to ensure.

On the other hand, along with the light and thin design of electronic equipment and the popularization of the full screen, the thickness of the middle frame is reduced, and the light guide lampshade can only be reduced adaptively along with the thickness of the middle frame, so that the eccentricity of the infrared lamp and the light guide lampshade is further aggravated, and the light receiving and emitting efficiency of the infrared lamp is greatly reduced.

Therefore, the optical sensor module provided by the utility model has the advantages that the position of the optical element is free from the limitation of the internal stacking structure such as the circuit board, the optical element has better stacking freedom degree, the optical sensor module can be better adapted to the position of the light guide lampshade, and the infrared light transmittance is ensured to be higher.

The electronic equipment in the embodiment of the utility model can be a mobile phone, a tablet personal computer, a notebook computer, an intelligent bracelet, an intelligent watch, an intelligent helmet, intelligent glasses and the like. The electronic device may also be a cellular telephone, a cordless telephone, a session initiation protocol (Session Initiation Protocol, SIP) phone, a wireless local loop (Wireless Local Loop, WLL) station, a personal digital assistant (Personal Digital Assistant, PDA), a handheld device having wireless communication capabilities, a computing device or other processing device connected to a wireless modem, an in-vehicle device, or the like, as the embodiments of the utility model are not limited in this respect.

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, the embodiments of the present utility model will be described in further detail with reference to the accompanying drawings.

In one aspect, as shown in connection with fig. 1-4, the present embodiment provides an optical sensor module, the optical sensor module comprising: an optical element 1, a light guiding lampshade 2 and an adapter 3.

The light guide lampshade 2 is positioned on a structural member of the electronic equipment, and the adapter 3 is positioned in the structural member and connected with the circuit board 20 of the electronic equipment; the optical element 1 is positioned on the adapter 3, and the distance between the optical center of the optical element 1 and the central line of the light guide lampshade 2 is smaller than or equal to a target threshold value.

In the optical sensor module of the embodiment, the bridging adaptor 3 is added between the optical element 1 and the circuit board 20, and by using the adaptor 3, the position of the optical element 1 in the stacking direction of the circuit board 20 can be adjusted, so that the distance between the optical center of the optical element 1 and the central line of the light guide lampshade 2 and the distance between the optical center of the optical element 1 and the central line of the light guide lampshade 2 are smaller than or equal to the target threshold, the position of the optical element 1 gets rid of the limitation of the internal stacking structure such as the circuit board 20, and the optical sensor module has better stacking freedom, can better adapt to the position of the light guide lampshade 2, and ensures higher transmittance of infrared light. The stacking freedom of the optical element 1 is improved, the transmittance of infrared light is ensured, the diameter of the light guide lampshade 2 is also favorably reduced in an optimized manner, the opening on a structural member of the electronic equipment is smaller, and the appearance integrity is higher.

Illustratively, the target threshold is ±0.2mm, when the distance between the optical center of the optical element 1 and the center line of the light guiding lamp housing 2 is less than or equal to the target threshold, the optical center of the optical element 1 and the center line of the light guiding lamp housing 2 tend to coincide, and at this time, the optical element 1 is aligned with the light guiding lamp housing 2, so that it is possible to ensure that the transmittance of infrared rays in the light guiding lamp housing 2 is high.

In some possible implementations, the optical element 1 may be a light emitting element, such as an LED, a laser infrared lamp, etc., and the optical element 1 may also be a light receiving element, such as a photoresistor, a photo-sensitive chip, etc. The optical element 1 may also be an integrated device of a light emitting element and a light receiving element, such as an optical distance sensor or the like that implements optical ranging.

It will be appreciated that the optical center of the optical element 1 may be the light emitting center of the light emitting element or the light sensing center of the light receiving element.

In some possible implementations, the light guiding lampshade 2 is made of light guiding materials, has good light transmission characteristics, and light can be transmitted in the light guiding lampshade 2 with low loss and high efficiency by utilizing the total reflection effect.

Exemplary light guiding materials include, but are not limited to, polyamides (also known as Nylon), polycarbonates (PC), fiberglass (FG), polyethylene (PE), polyethylether (Polyethylene), polyethylene terephthalate (Polyethylene Glycol Terephthalate, PET), polymethyl methacrylate (Polymethyl Methacrylate, PMMA), polypropylene (Polypropylene), polystyrene (PS), polyvinylchloride (Polyvinyl Chloride, PVC), and the like. Any one or a combination of any of the above materials may be used to form the present embodiments.

Fig. 1 of the present utility model shows the center line of the light guiding lamp housing 2 with a dotted line a, and it can be understood that the center line of the light guiding lamp housing 2 is located at the center of the light channel of the light guiding lamp housing 2, and when light is incident along the center line, the transmission efficiency of the light along the light guiding lamp housing 2 is highest. For example, when the light guiding globe 2 is cylindrical, the center line coincides with the axis of the cylinder.

In some possible implementations, the cross-sectional shape of the light guiding globe 2 includes, but is not limited to, circular, square, rectangular, triangular, and the like. Alternatively, the cross-sectional shape of the light guiding globe 2 is circular, i.e. the light guiding globe 2 is a cylindrical structure, and such a light guiding globe 2 has a more uniform light guiding effect.

In some possible implementations, the structural member is an external structural member of the electronic device, including but not limited to a housing, a center, and the like.

In other possible implementations, the wiring board 20 includes a printed wiring board 20 (Printed Circuit Board, PCB), a flexible printed wiring board 20 (Flexible Printed Circuit board, FPC), a rigid-flex board, and the like.

As shown in connection with fig. 1-4, in some embodiments, the wiring board 20 includes a first working surface 2001 and a second working surface 2002; one of the first working surface 2001 and the second working surface 2002 is attached to the surface of the adapter 3 so that the adapter 3 is connected to the wiring board 20.

In order to provide the surface utilization rate of the circuit board 20 in the electronic device, two surfaces of the circuit board 20 along the stacking direction are a first working surface 2001 and a second working surface 2002 respectively, the adapter 3 can be attached to the first working surface 2001 or the second working surface 2002, and then the optical element 1 is supported at a position concentric with the light guide lampshade 2, so that the connection position of the adapter 3 can be reasonably selected according to the stacking condition in the electronic device, and the concentricity requirement of the optical element 1 and the light guide lampshade 2 is met.

In addition, the adaptor 3 can be respectively attached to the first working surface 2001 and the second working surface 2002 of the circuit board 20, which is beneficial to improving the compatibility of the optical sensing module.

Illustratively, the first working surface 2001 is in conforming connection with the surface of the adapter 3, or the second working surface 2002 is in conforming connection with the surface of the adapter 3. It should be noted that the conforming connection includes, but is not limited to, a welded connection, an adhesive connection, a fastener connection, and the like. In the bonded state, the adapter 3 and the wiring board 20 have a larger contact area, and the connection reliability between the adapter 3 and the wiring board 20 can be ensured.

As shown in connection with fig. 1-4, in some embodiments, the adapter 3 includes a third working surface 301 facing toward the wiring board 20 and a fourth working surface 302 facing away from the wiring board 20; the optical element 1 is located on one of the third working surface 301 and the fourth working surface 302.

The adapter 3 has two working surfaces, wherein the third working surface 301 faces the circuit board 20, the fourth working surface 302 faces away from the fourth working surface 302, and the optical element 1 can select different connection positions according to the positions of the optical element and the light guiding lampshade 2, so that the stacking freedom of the optical element 1 is further improved.

The shape of the adaptor 3 is not limited to a plate shape, and the thickness and shape of the adaptor 3 are not limited in the present utility model, and may be appropriately modified according to the stacking environment of the light guide housing 2 and the optical element 1.

In some embodiments, as shown in fig. 5, the optical element 1 is electrically connected to the circuit board 20, and the optical element 1 receives and transmits electrical energy and data by using the circuit board 20.

Optionally, the circuit board 20 is a motherboard of an electronic device, and is formed by cutting a board (copper foil on an insulating board) with a certain size according to requirements with an insulating material as a base material, and punching holes (such as component holes, fastening holes, metallized holes, etc.) according to wiring requirements to realize interconnection between electronic components.

The main board is an important component of electronic equipment such as a mobile phone and the like, and is made of a plurality of layers of insulating boards. It serves to support various components and to enable electrical connection or insulation therebetween. The main board consists of components such as a PCB (printed circuit board), a resistor, a capacitor, an inductor, a diode, a triode, a field effect tube, an interface device, a sensor, an integrated circuit and the like, and is used for realizing the processing of internal and external signals and the control of all functions of electronic equipment, including display, charging, on-off, functional application and the like.

Taking a smart phone as an example, the main board is connected with each functional component through a plurality of interface flat cables, for example: power switch wires, screen wires, front camera, main camera, earphone/receiver wires, touch wires, bottom key wires, etc.

Referring to fig. 5, in some embodiments, the circuit board 20 is provided with a main circuit structure 2003, and the adaptor 3 is provided with an adaptor circuit structure 303; the optical element 1 is electrically connected with the switching circuit structure 303; when the adaptor 3 is connected to the circuit board 20, the adaptor circuit structure 303 is electrically connected to the main circuit structure 2003.

By using the switching circuit structure 303 on the switching element 3, the optical element 1 and the circuit board 20 can be electrically connected.

In some possible implementations, the main circuit structure 2003 includes connection wires located on the surface of the wiring board 20; the interposer circuit structure 303 includes connecting wires on the surface of the interposer 3. Optionally, the connecting wires are formed on the surface of the circuit board 20 or the adapter 3 by printing, etching, laser etching, or the like.

As shown in connection with fig. 5, in some embodiments, the main circuit structure 2003 includes a first pad 20031 and the transit circuit structure 303 includes a second pad 3031; the first pad 20031 and the second pad 3031 are solder-connected. With the first pads 20031 disposed on the surface of the wiring board 20 and the second pads 3031 disposed on the surface of the relay member 3, the electrical connection of the main circuit structure 2003 and the relay circuit structure 303 can be achieved while connecting the relay member 3 with the wiring board 20.

As shown in connection with fig. 5, in some embodiments, the transit circuit structure 303 further includes a third pad 3032, the third pad 3032 is electrically connected to the second pad 3031, and the optical element 1 is soldered on the third pad 3032.

With the third pad 3032 disposed on the surface of the interposer 3, electrical connection of the optical element 1 to the interposer circuit structure 303 can be achieved while the optical element 1 is connected.

Referring to fig. 6, in some embodiments, the circuit board 20 is provided with a main circuit structure 2003, and the optical sensor module further includes a conductive line 4, where the conductive line 4 is connected between the optical element 1 and the main circuit structure 2003 when the adaptor 3 is connected to the circuit board 20.

After the optical element 1 is supported at the center line position of the light guide lampshade 2 by the adapter 3, the optical element 1 is connected with the circuit board 20 by the conductive circuit 4, so that the optical element 1 is electrically connected.

Referring to fig. 7, in some embodiments, the edge of the circuit board 20 near the light guiding lampshade 2 is provided with a relief portion 2004, and at least part of the optical element 1 is located in the relief portion 2004, so that interference between the optical element 1 and the circuit board 20 can be avoided, and stacking density of the electronic device can be improved.

On the other hand, the embodiment provides electronic equipment, and the electronic equipment comprises the optical sensor module.

The electronic device of the embodiment adopts the optical sensor module of the utility model, and has all the beneficial technical effects of all the embodiments.

In the description of the present specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "an exemplary embodiment," "an example," "a particular example," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model.

The foregoing description of the embodiments of the utility model is not intended to limit the utility model, but rather, the utility model is to be construed as limited to the embodiments disclosed.

Claims

1. An optical sensor module, the optical sensor module comprising: an optical element (1), a light guide lampshade (2) and an adapter (3);

the light guide lampshade (2) is positioned on a structural member (10) of the electronic equipment, and the adapter (3) is positioned in the structural member (10) and connected with a circuit board (20) of the electronic equipment;

the optical element (1) is positioned on the adapter (3), and the distance between the optical center of the optical element (1) and the central line of the light guide lampshade (2) is smaller than or equal to a target threshold value.

2. The optical sensor module according to claim 1, wherein the wiring board (20) comprises a first working surface (2001) and a second working surface (2002);

one of the first working surface (2001) and the second working surface (2002) is attached to a surface of the adapter (3) so that the adapter (3) is connected to the wiring board (20).

3. The optical sensor module according to claim 2, characterized in that the adapter (3) comprises a third working surface (301) facing towards the circuit board (20) and a fourth working surface (302) facing away from the circuit board (20);

the optical element (1) is located on one of the third working surface (301) and the fourth working surface (302).

4. An optical sensor module according to any one of claims 1-3, characterized in that the optical element (1) is electrically connected to the wiring board (20).

5. The optical sensor module according to claim 4, wherein the circuit board (20) is provided with a main circuit structure (2003), and the adaptor (3) is provided with an adaptor circuit structure (303);

the optical element (1) is electrically connected with the switching circuit structure (303);

when the adapter (3) is connected with the circuit board (20), the adapter circuit structure (303) is electrically connected with the main circuit structure (2003).

6. The optical sensor module according to claim 5, wherein the main circuit structure (2003) comprises a first pad (20031) and the transit circuit structure (303) comprises a second pad (3031);

the first bonding pad (20031) and the second bonding pad (3031) are connected in a welding way.

7. The optical sensor module according to claim 6, wherein the interposer circuit structure (303) further comprises a third pad (3032), the third pad (3032) being electrically connected to the second pad (3031), the optical element (1) being soldered to the third pad (3032).

8. The optical sensor module according to claim 4, wherein the circuit board (20) is provided with a main circuit structure (2003), the optical sensor module further comprising a conductive line (4), the conductive line (4) being connected between the optical element (1) and the main circuit structure (2003) when the adapter (3) is connected to the circuit board (20).

9. The optical sensor module according to claim 1, wherein the edge of the circuit board (20) close to the light guiding lampshade (2) is provided with an avoidance portion (2004), and at least part of the optical element (1) is located in the avoidance portion (2004).

10. An electronic device, characterized in that it comprises an optical sensor module according to any one of claims 1-9.