CN219349053U - Micro light-emitting diode electrical property testing device and micro light-emitting diode detection jig - Google Patents

Abstract

The application discloses a miniature light-emitting diode electrical property testing arrangement and miniature light-emitting diode detection tool relates to miniature light-emitting diode technical field. The miniature LED electrical property testing device comprises a power supply, a connecting component, an anode component and a cathode component. The connecting component is electrically connected with the power supply, and the positive electrode component and the negative electrode component are electrically connected with the connecting component; the positive electrode assembly comprises a positive electrode test electrode which is contacted with a positive electrode bonding pad of the miniature light-emitting diode; the cathode assembly comprises a cathode test electrode contacted with a cathode bonding pad of the miniature light-emitting diode, and the anode test electrode and the cathode test electrode are both made of flexible conductive materials. The flexible conductive material is adopted to manufacture the test electrode to contact the bonding pad, so that the problem of product damage caused by electrical test operation is avoided, and the qualification rate of the product is improved.

Description

Micro light-emitting diode electrical property testing device and micro light-emitting diode detection jig

Technical Field

The present disclosure relates to the field of micro light emitting diodes, and particularly to an electrical testing device for a micro light emitting diode and a testing fixture for a micro light emitting diode.

Background

The existing test method of the micro light emitting diode relies on the metal probe of the probe station to contact the positive electrode and the negative electrode bonding pads of the micro light emitting diode to determine the electrical property. In this process, it is necessary to debug the focal length of the microscope for a long time to see the contact points of the probes with the positive and negative pads. The problem that the product is damaged due to human misoperation in the process of contacting the bonding pad with the probe under the microscope exists, for example, the sharp probe can easily scratch the bonding pad to cause damage, so that electric leakage and poor welding of the product occur, the electrical property judgment of the product is seriously influenced, and the qualification rate of the product is reduced.

Disclosure of Invention

In view of this, the purpose of the present application is to overcome the defects in the prior art, and the present application provides a micro light emitting diode electrical testing device and a micro light emitting diode testing fixture, so as to solve the technical problem in the prior art that the micro light emitting diode electrical testing process is easy to damage the product and reduce the product yield.

The present application provides:

a micro light emitting diode electrical testing device, comprising:

a power supply;

the connecting assembly is electrically connected with the power supply;

the positive electrode assembly is electrically connected with the connecting assembly and comprises a positive electrode test electrode which is contacted with a positive electrode bonding pad of the miniature light-emitting diode;

the cathode assembly is electrically connected with the connecting assembly and comprises a cathode test electrode contacted with a cathode bonding pad of the miniature light-emitting diode, and the cathode test electrode are both made of flexible conductive materials.

In addition, the micro light emitting diode electrical property testing device according to the application can also have the following additional technical characteristics:

in some embodiments of the present application, the positive electrode test electrode and the negative electrode test electrode are both made of conductive rubber strips.

In some embodiments of the present application, the number of the positive electrode test electrodes is one, and the positive electrode test electrodes are in a strip shape or a flat plate shape; and/or the number of the negative electrode test electrodes is one, and the negative electrode test electrodes are strip-shaped or flat-plate-shaped.

In some embodiments of the present application, the micro light emitting diode electrical test device further comprises an insulating sleeve connected to the positive electrode test electrode and/or the negative electrode test electrode.

In some embodiments of the present application, the number of the positive electrode test electrodes is a plurality, the positive electrode test electrodes are separated from each other, and each positive electrode test electrode is cylindrical or cuboid;

the number of the negative electrode test electrodes is multiple, the negative electrode test electrodes are separated from each other, and each negative electrode test electrode is cylindrical or cuboid.

In some embodiments of the present application, the micro light emitting diode electrical testing device further includes an insulating pad, and the positive electrode testing electrode and the negative electrode testing electrode are respectively disposed on the insulating pad.

In some embodiments of the present application, the positive electrode test electrode and the negative electrode test electrode are disposed on the insulating pad in a crossing manner, and are disposed adjacent to each other with a space therebetween.

In some embodiments of the present application, the connection assembly includes a positive connection wire electrically connected with the positive test electrode and a negative connection wire electrically connected with the negative test electrode.

In some embodiments of the present application, the positive connection wire is provided with a positive contact connector, the positive contact connector is inserted into or wound around the positive test electrode, the negative connection wire is provided with a negative contact connector, and the negative contact connector is inserted into or wound around the negative test electrode.

The application also provides a miniature light-emitting diode detection jig, which comprises the miniature light-emitting diode electrical property testing device in any embodiment;

the insulation positioning seat is used for placing a driving plate of the electrical property to be tested, and a plurality of micro light emitting diodes are integrated on the driving plate;

and the pressing piece is arranged on the insulating positioning seat.

In some embodiments of the present application, the pressing member includes a fixed portion and a rotating portion rotatably connected with the fixed portion.

Compared with the prior art, the beneficial effects of this application are: the application provides a miniature light emitting diode electrical property testing arrangement, with coupling assembling and power electricity connection, anodal subassembly with coupling assembling electricity connection, negative pole subassembly with coupling assembling electricity connection will again anodal test electrode of anodal subassembly and miniature light emitting diode's anodal pad contact, negative pole test electrode of negative pole subassembly with miniature light emitting diode's negative pole pad contact, anodal test electrode with negative pole test electrode all adopts flexible conductive material to make, makes test electrode can the large tracts of land contact pad, can not have the poor condition of contact during the test, and the test electrode that flexible conductive material made is through extrusion contact pad simultaneously, can not scratch pad surface also can not destroy pad structure, has avoided leading to the problem of product damage because of test electrical property operation, has improved the qualification rate of product.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered limiting the scope, and that other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 shows a prior art electrical test schematic (a) and an electrical test schematic (b) of the present application;

fig. 2 is a schematic structural diagram of a micro led electrical testing device according to a first embodiment of the present disclosure;

fig. 3 is a schematic structural view of a driving board integrated with a plurality of micro light emitting diodes according to the first embodiment of the present application;

fig. 4 shows a schematic diagram of an electrical testing device for micro light emitting diodes according to a first embodiment of the present application;

fig. 5 shows a schematic structural diagram of a micro led electrical testing device according to a second embodiment of the present application;

fig. 6 shows an exemplary structural schematic diagram of an insulating liner of a second embodiment of the present application;

FIG. 7 illustrates a schematic diagram of a micro LED inspection tool according to some embodiments of the present application;

fig. 8 illustrates a schematic structural view of a pressure member in some embodiments of the present application.

Description of main reference numerals:

100-miniature LED electrical testing device; 110-a power supply; 120-a connection assembly; 121-an anode connecting wire; 122-negative electrode connecting wires; 131-positive electrode test electrode; 141-a negative electrode test electrode; 150-insulating pad, 2000-micro light emitting diode.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In this application, unless specifically stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

Example 1

As shown in fig. 2-4, an embodiment of the present application provides a micro led electrical testing device 100, which includes a power source 110, a connection component 120, a positive component (not shown) and a negative component (not shown). The connection assembly 120 is electrically connected to the power source 110, and the positive electrode assembly and the negative electrode assembly are electrically connected to the connection assembly 120.

The positive electrode assembly includes a positive electrode test electrode 131, and the negative electrode assembly includes a negative electrode test electrode 141. The positive electrode test electrode 131 and the negative electrode test electrode 141 are made of flexible conductive materials.

Further, in the present application, the positive electrode test electrode 131 and the negative electrode test electrode 141 are made of conductive rubber strips.

The conductive rubber strip is also called a zebra strip and is formed by alternately layering conductive silica gel and insulating silica gel and vulcanizing the same. The conductive rubber connector has stable and reliable performance, and is simple and efficient to produce and assemble. Which can bring the conductive particles therein into contact by pressure, thereby achieving good conductive properties. As shown in fig. 1, fig. 1 (a) shows a prior art test electrode made of a metal probe, which works in such a way that the metal probe contacts the positive and negative electrode pads of the micro light emitting diode to determine the electrical property. The test electrode made of the conductive rubber strip in the graph (b) is made by extruding the contact pad, and compared with a metal probe, the conductive rubber strip is lighter, the surface of the pad is not scratched, the pad structure is not damaged, the problem of product damage caused by test electrical operation is avoided, and the qualification rate of the product is improved.

In this embodiment, the number of the positive electrode test electrodes 131 is one, and/or the number of the negative electrode test electrodes 141 is one. The micro led electrical testing device 100 further comprises an insulating sleeve (not shown) connected to the positive electrode testing electrode 131 and/or the negative electrode testing electrode 141. The insulating sheath is used to move the positive test electrode 131 and the negative test electrode 141.

Referring to fig. 2, in fig. 2, a plurality of micro light emitting diodes 2000 are integrated on a driving board 3000, and the positive electrode pads 2001 of the micro light emitting diodes 2000 are integrated at a first position 2100, and the negative electrode pads 2002 are integrated at a second position 2200. The first location 2100 and the second location 2200 are disposed insulated from each other. Specifically, the first position 2100 and the second position 2200 may be respectively embedded in the driving plate 3000, and the first position 2100 and the second position 2200 may be spaced apart from each other.

Referring to fig. 3, the working principle of the micro led electrical testing device 100 is as follows:

the positive electrode test electrode 131 is disposed at the first position 2100, so that the positive electrode test electrode 131 is electrically connected to all the positive electrode pads 2001, the negative electrode test electrode 141 is disposed at the second position 2200, and the negative electrode test electrode 141 is electrically connected to all the negative electrode pads 2002, so as to realize parallel connection of a plurality of the micro light emitting diodes 2000.

The positive electrode test electrode 131, the positive electrode connection line 121 and the power supply 110 are electrically connected; the negative electrode test electrode 141, the negative electrode connection line 122, and the power supply 110 are electrically connected.

The power supply 110 is turned on, the micro light emitting diode 2000 that is qualified will be lighted and display normal brightness, and the micro light emitting diode 2000 that is unqualified will not be lighted or display brightness is dark. In this electrical test mode, compared with the conventional mode of determining the electrical mode by point-contacting the positive electrode and the negative electrode pad of the micro light emitting diode with the metal probe, the positive electrode test electrode 131 and the negative electrode test electrode 141 in this application contact the positive electrode pad 2001 and the negative electrode pad 2002 by way of surface contact, and there is no poor contact during the test.

The positive electrode test electrode 131 is in a strip shape or a flat plate shape, and the negative electrode test electrode 141 is in a strip shape or a flat plate shape. In this embodiment, the positive electrode test electrode 131 is strip-shaped, and the negative electrode test electrode 141 is strip-shaped. More specifically, the shapes of the positive electrode test electrode 131 and the negative electrode test electrode 141 should match the integrated shapes of the positive electrode pad 2001 and the negative electrode pad 2002.

For example, when a plurality of positive electrode pads 2001 are circularly integrated at the first position 2100, the positive electrode test electrode 131 may be provided in a disc shape or a ring shape; a plurality of the negative electrode pads 2002 are integrated in the second location 2200 in a quadrilateral shape, and the negative electrode test electrodes 141 may be disposed in a flat plate shape or a quadrilateral shape. The shape of the positive test electrode 131 electrically connected to all the positive electrode pads 2001 is within the scope of the present application as long as the positive test electrode 131 can be connected to all the positive electrode pads 2001. The shape protection mode of the negative electrode test electrode 141 is the same as that of the positive electrode test electrode 131. With this structure, the electrical properties of the micro light emitting diodes 2000 can be detected at the same time, so as to improve the detection efficiency of the product of the micro light emitting diode electrical property test device 100.

It is understood that when the positive electrode test electrode 131 is covered on the surface of the positive electrode pad 2001 and the negative electrode test electrode 141 is covered on the surface of the negative electrode pad 2002, the positive electrode test electrode 131 and the negative electrode test electrode 141 are arranged to be insulated from each other. Thus, the electrical connection between the two test electrodes can be prevented from being shorted, and the reliability of the micro light emitting diode electrical test device 100 is improved.

The connection assembly 120 includes a positive connection line 121 and a negative connection line 122, the positive connection line 121 is electrically connected to the positive test electrode 131, and the negative connection line 122 is electrically connected to the negative test electrode 141.

Specifically, the positive electrode connection wire 121 is provided with a positive electrode contact connector 1211, the positive electrode contact connector 1211 is inserted into or wound around the positive electrode test electrode 131, the negative electrode connection wire 122 is provided with a negative electrode contact connector 1221, and the negative electrode contact connector 1221 is inserted into or wound around the negative electrode test electrode 141. The structure of the micro light emitting diode electrical testing device 100 is simpler, and when the micro light emitting diode electrical testing device 100 is broken, the open circuit position can be quickly determined for maintenance.

Example two

As shown in fig. 5, this embodiment is different from the first embodiment in that:

1. the micro led electrical testing device 100 of the present embodiment further includes an insulating pad 150, and the positive electrode testing electrode 131 and the negative electrode testing electrode 141 are both disposed on the insulating pad 150;

2. the number of the positive electrode test electrodes 131 is plural, and the number of the negative electrode test electrodes 141 is plural. In addition, one of the positive electrode test electrodes 131 in the present embodiment contacts only one of the positive electrode pads 2001, and one of the negative electrode test electrodes 141 contacts only one of the negative electrode pads 2002.

Specifically, when the number of the micro light emitting diodes 2000 is plural and the plurality of positive electrode pads 2001 and the plurality of negative electrode pads 2002 are not integrated in one place, only one positive electrode test electrode 131 is connected to all the positive electrode pads 2001 and one negative electrode test electrode 141 is connected to all the negative electrode pads 2002, the positive electrode test electrode 131 and the negative electrode test electrode 141 are easily contacted, so that the micro light emitting diode electrical test device 100 is short-circuited.

Therefore, the positive electrode test electrode 131 is adopted to contact only one positive electrode pad 2001, the negative electrode test electrode 141 is adopted to contact only one negative electrode pad 2002, the positive electrode test electrodes 131 are separated from each other, and the negative electrode test electrodes 141 are separated from each other.

As an example, the plurality of positive electrode pads 2001 and the plurality of negative electrode pads 2002 are cross-distributed, and the number of the positive electrode test electrodes 131 and the number of the negative electrode test electrodes 141 are equal to the number of the micro light emitting diodes 2000.

Accordingly, as shown in fig. 5, the positive electrode test electrode 131 and the negative electrode test electrode 141 are respectively disposed on the insulating pad 150. Further, the positive electrode test electrode 131 and the negative electrode test electrode 141 are disposed on the insulating pad 150 in a crossing manner corresponding to the positive electrode pad 2001 and the negative electrode pad 2002, respectively. The adjacent positive electrode test electrode 131 and the adjacent negative electrode test electrode 141 are arranged at intervals, so that the positive electrode test electrode 131 and the negative electrode test electrode 141 are insulated from each other, and short circuit is avoided due to contact.

In this embodiment, each of the negative electrode test electrodes has a cylindrical shape or a rectangular parallelepiped shape; each positive electrode test electrode is cylindrical or cuboid.

It can be understood that the rectangle and the circle are the most common two shapes of the bonding pad, and the positive electrode test electrode 131 is cylindrical or cuboid, so that the cross section of the positive electrode test electrode 131 is correspondingly rectangular or circular; each of the negative electrode test electrodes 141 has a cylindrical shape or a rectangular parallelepiped shape such that the cross section of the negative electrode test electrode 141 is correspondingly rectangular or circular. In this configuration, compared to the conventional method of determining the electrical mode by point-contacting the positive electrode and the negative electrode pad of the micro light emitting diode with the metal probe, the positive electrode test electrode 131 and the negative electrode test electrode 141 of the present application contact the positive electrode pad 2001 and the negative electrode pad 2002 by way of surface contact, and there is no poor contact during the test.

The positive electrode test electrode 131 and the negative electrode test electrode 141 are disposed adjacent to each other at a distance, and the positive electrode test electrode 131 and the negative electrode test electrode 141 are insulated from each other on the insulating spacer 150. When the plurality of positive electrode test electrodes 131 and the plurality of negative electrode test electrodes 141 are distributed on the insulating pad 150 in a crossing manner, the adjacent test electrodes are spaced apart by a short distance, so that the adjacent test electrodes are required to be insulated from each other, and the short circuit caused by the contact of the adjacent test electrodes is avoided, so that the micro light emitting diode electrical test device 100 of the embodiment is safer and more reliable.

Preferably, the shape of the insulating pad 150 is the same as the distribution paths of the positive electrode pads 2001 and the negative electrode pads 2002 of the plurality of micro light emitting diodes 2000. For example, when the positive electrode pads 2001 and the negative electrode pads 2002 are circularly distributed, the insulating pads 150 are correspondingly arranged in a circular shape, and the positions of the positive electrode test electrodes 131 and the negative electrode test electrodes 141 on the insulating pads 150 are in one-to-one correspondence with the positive electrode pads 2001 and the negative electrode pads 2002.

As shown in fig. 6, (d) shows a distribution path diagram of the positive electrode pad and the negative electrode pad, (c) shows a shape of an insulating pad, and (e) shows an insulating pad provided with a positive electrode test electrode and the negative electrode test electrode; (f) The figure is a combination diagram of a positive electrode pad and a negative electrode pad and an insulating pad provided with a positive electrode test electrode and a negative electrode test electrode. As can be seen from the figure, the shape of the insulating pad 150 is the same as the distribution paths of the positive electrode pads 2001 and the negative electrode pads 2002 of the plurality of micro light emitting diodes 2000, and the positions of the positive electrode test electrodes 131 and the negative electrode test electrodes 141 on the insulating pad 150 are in one-to-one correspondence with the positive electrode pads 2001 and the negative electrode pads 2002.

With this structure, the electrical properties of the micro light emitting diodes 2000 can be detected at the same time, so as to improve the detection efficiency of the product of the micro light emitting diode electrical property test device 100.

As shown in fig. 7, the present application further provides a micro led inspection fixture, which includes the micro led electrical testing device 100, the insulating positioning seat 200, and the pressing member 300.

The detection principle of the miniature light emitting diode detection jig is as follows:

the insulating positioning seat 200 is used for placing the driving board 3000, and a plurality of micro light emitting diodes 2000 with electrical properties to be tested are integrated on the driving board 3000; the pressing member 300 is disposed on the insulating holder 200.

The insulating pad 150 is disposed on the pressing member 300, so that the positive electrode test assembly and the negative electrode test assembly are both disposed on the pressing member 300.

As shown in fig. 8, the pressing member 300 includes a fixing portion 310 and a rotating portion 320, the fixing portion 310 is used to fix the insulation pad 150, and the rotating portion 320 is rotatable with the fixing portion 310.

The number of the insulating spacers 150 is plural, the plural insulating spacers 150 are provided on the fixing portion 310, and two adjacent insulating spacers 150 are provided on the fixing portion 310 in an insulating manner.

Each insulating pad 150 is provided with the positive electrode test electrode 131 and the negative electrode test electrode 141, and the distribution mode of the two test electrodes corresponds to the pad arrangement of one electrical product to be tested.

Before the pressing piece 300 is pressed down, the fixing portion 310 is rotated, and the insulating pad 150 corresponding to the electrical product to be tested is called out, where the positive electrode test electrode 131 and the negative electrode test electrode 141 correspond to the pad position of the electrical product to be tested;

the pressing member 300 is pressed down, the positive test electrode 131 is pressed against the positive electrode pad 2001 on the driving plate 3000, and the negative test electrode 141 is also pressed against the negative electrode pad 2002.

Compared with the conventional method for determining the electrical mode by point-contacting the positive electrode and the negative electrode of the miniature light-emitting diode through the metal probe, the structure is characterized in that the pressing piece 300 is simply pressed down when the electrical detection operation is performed, so that the detection time is greatly shortened, the operation difficulty is reduced, and the detection efficiency of a product is improved. Meanwhile, compared with a metal probe, the test electrode made of the conductive rubber strip is lighter, and the test electrode made of the conductive rubber strip is in extrusion contact with the bonding pad, so that the surface of the bonding pad is not scratched, the bonding pad structure is not damaged, the problem of product damage caused by test electrical operation is avoided, and the qualification rate of products is improved.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives, and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application.

Claims (11)

1. The utility model provides a miniature emitting diode electrical property testing arrangement which characterized in that includes:

a power supply;

the connecting assembly is electrically connected with the power supply;

the positive electrode assembly is electrically connected with the connecting assembly and comprises a positive electrode test electrode which is contacted with a positive electrode bonding pad of the miniature light-emitting diode;

the cathode assembly is electrically connected with the connecting assembly and comprises a cathode test electrode contacted with a cathode bonding pad of the miniature light-emitting diode, and the cathode test electrode are both made of flexible conductive materials.

2. The electrical testing device of claim 1, wherein the positive electrode testing electrode and the negative electrode testing electrode are made of conductive rubber strips.

3. The electrical testing device of claim 1, wherein the number of the positive electrode testing electrodes is one, and the positive electrode testing electrodes are strip-shaped or flat-plate-shaped; and/or the number of the negative electrode test electrodes is one, and the negative electrode test electrodes are strip-shaped or flat-plate-shaped.

4. The micro light emitting diode electrical testing device of claim 3, further comprising an insulating sleeve connected to the positive electrode test electrode and/or the negative electrode test electrode.

5. The electrical testing device of claim 1, wherein the number of the positive electrode testing electrodes is plural, the positive electrode testing electrodes are separated from each other, and each positive electrode testing electrode is cylindrical or rectangular;

the number of the negative electrode test electrodes is multiple, the negative electrode test electrodes are separated from each other, and each negative electrode test electrode is cylindrical or cuboid.

6. The electrical testing device of claim 5, further comprising an insulating pad, wherein the positive electrode testing electrode and the negative electrode testing electrode are disposed on the insulating pad, respectively.

7. The electrical testing device of claim 6, wherein the positive electrode testing electrode and the negative electrode testing electrode are disposed on the insulating pad in a crossing manner, and are disposed adjacent to each other with a space therebetween.

8. The electrical testing device of claim 1, wherein the connection assembly comprises a positive connection wire and a negative connection wire, the positive connection wire being electrically connected to the positive test electrode, the negative connection wire being electrically connected to the negative test electrode.

9. The electrical testing device of claim 8, wherein the positive connection wire is provided with a positive contact connector, the positive contact connector is inserted into or wound around the positive test electrode, the negative connection wire is provided with a negative contact connector, and the negative contact connector is inserted into or wound around the negative test electrode.

10. A micro light emitting diode detection jig, comprising the micro light emitting diode electrical test device of any one of claims 1 to 9;

the insulation positioning seat is used for placing a driving plate of the electrical property to be tested, and a plurality of micro light emitting diodes are integrated on the driving plate;

and the pressing piece is arranged on the insulating positioning seat.

11. The fixture of claim 10, wherein the pressing member comprises a fixing portion and a rotating portion, and the rotating portion is rotatably connected with the fixing portion.

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