CN219347029U

CN219347029U - Integrated circuit semiconductor processing cooling mechanism

Info

Publication number: CN219347029U
Application number: CN202320847646.8U
Authority: CN
Inventors: 朱锦锋
Original assignee: Wuhan Xinfengxin Electronic Technology Co ltd
Current assignee: Wuhan Xinfengxin Electronic Technology Co ltd
Priority date: 2023-04-17
Filing date: 2023-04-17
Publication date: 2023-07-14
Anticipated expiration: 2033-04-17

Abstract

The utility model relates to an integrated circuit semiconductor processing cooling mechanism which comprises a cooling box body, wherein a cold air pipe is fixedly arranged at the top of the cooling box body, a plurality of air injection heads are fixedly arranged at the bottom of the cold air pipe, a plurality of placing plates are arranged in the cooling box body, a plurality of mounting grooves are formed in the placing plates, a screw rod with the other end extending to the front side of the placing plates is rotatably arranged on the inner wall of the rear side of the mounting groove, a first rotating wheel is fixedly arranged at one end of the screw rod positioned at the front side of the placing plates, two moving blocks are arranged on the surface threads of the screw rod, and connecting blocks extending to the top of the placing plates are fixedly arranged at the tops of the two moving blocks. This integrated circuit semiconductor processing cooling body can fix not unidimensional integrated circuit semiconductor through two limiting hoods and four limiting plates, and adjusts simpler and more convenient, has improved this novel practicality greatly.

Description

Integrated circuit semiconductor processing cooling mechanism

Technical Field

The utility model relates to the technical field of integrated circuit semiconductor processing, in particular to an integrated circuit semiconductor processing cooling mechanism.

Background

A semiconductor integrated circuit refers to a semiconductor integrated circuit device having at least one circuit block on a semiconductor substrate, and various processes are required in the process of semiconductor processing of the integrated circuit, and a cooling process is one of the key steps.

Chinese patent CN114935234B discloses a cooling device for processing integrated circuit semiconductors, the draw-in groove has been seted up on the cardboard surface of limiting plate terminal surface, the workman can be with integrated circuit semiconductor joint in the draw-in groove on cardboard surface to the length of different specification integrated circuit semiconductors is different, when fixing different specification integrated circuit semiconductors, can remove the slider in the inside position of horizontal track groove, then screw up the nut on connecting screw rod surface, can fix the slider in horizontal track inslot portion, makes this device can fix the integrated circuit semiconductor of different specifications, strengthens this device's practicality.

However, in the process of actual use, the workers need to slide the sliding block firstly, then screw up the nuts on the surface of the connecting screw respectively, the operation is not simple and convenient enough, and a tool for special loosening bolts is also needed, and meanwhile, the width of the clamping plate is difficult to adjust, so that the comparison file is difficult to be suitable for integrated circuit semiconductors with different widths, and therefore, the novel problem is solved by the novel method.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides an integrated circuit semiconductor processing and cooling mechanism which has the advantages of fixing integrated circuit semiconductors with different sizes and the like, and solves the problems that in the actual use process, workers need to slide a sliding block firstly and then screw nuts on the surface of a connecting screw respectively, the operation is not simple and convenient, a special loosening bolt tool is needed, and meanwhile, the width of a clamping plate is difficult to adjust, so that a comparison file is difficult to be suitable for the integrated circuit semiconductors with different widths.

In order to achieve the purpose of fixing integrated circuit semiconductors with different sizes, the utility model provides the following technical scheme: the utility model provides an integrated circuit semiconductor processing cooling body, includes the cooling tank body, the top fixed mounting of cooling tank body has the cold air pipe, the bottom fixed mounting of cold air pipe has a plurality of jet head, the inside of cooling tank body is provided with a plurality of and places the board, a plurality of mounting groove has been seted up to the inside of placing the board, the inner wall rotation of mounting groove rear side is installed the other end and is extended to the lead screw of placing the board front side, the lead screw is located the one end fixed mounting who places the board front side and has first runner, the surface screw of lead screw installs two movable blocks, two the equal fixed mounting in top of movable block has the connecting block that extends to the board top of placing, two the equal fixed mounting in top of connecting block has the limit cap, the equal screw thread mounting in the left and right sides of limit cap has the threaded rod, the threaded rod is located the inside one end rotation of limit cap and installs the limit plate, the threaded rod is located the outside one end fixed mounting of limit cap has the second runner.

Further, the screw thread directions of the front side and the rear side of the surface of the screw rod are opposite, and the two moving blocks are respectively arranged on the two sides of the surface of the screw rod in a screw thread mode.

Further, the top of placing the board and be located the top of every mounting groove and all offered the spout, connecting block and corresponding spout sliding connection.

Further, the limiting groove is formed in the inner bottom wall of the limiting cover, a limiting block with one end extending into the limiting groove is fixedly arranged at the bottom of the limiting plate, and a plurality of communication ports are formed in the surface of the placing plate.

Further, the inner walls of the left side and the right side of the cooling box body are fixedly provided with a plurality of U-shaped blocks, and the placing plate is movably arranged between the two corresponding U-shaped blocks.

Further, the top and the bottom of U-shaped piece are all fixed mounting has the installation piece, the installation piece is fixed mutually with the inner wall of cooling box body through the bolt, U-shaped piece passes through installation piece and bolt fixed mounting at the inner wall of cooling box body.

Compared with the prior art, the utility model provides an integrated circuit semiconductor processing and cooling mechanism, which has the following beneficial effects:

1. this integrated circuit semiconductor processing cooling body makes the lead screw rotate through rotating first runner to make two movable blocks can be to moving in opposite directions or opposite directions, and then make the distance between two limiting hoods adjustable, rotate two threaded rods respectively and make the limiting plates remove, thereby make the distance between two limiting plates adjustable, can fix not unidimensional integrated circuit semiconductor through two limiting hoods and four limiting plates from this, and adjust simpler and more convenient, improved this novel practicality greatly.

2. According to the integrated circuit semiconductor processing and cooling mechanism, the plurality of placing plates are arranged, and the plurality of groups of limiting covers are arranged on each placing plate, so that the device can cool the plurality of integrated circuit semiconductors at one time, and the cooling efficiency of the integrated circuit semiconductors is greatly improved.

Drawings

FIG. 1 is a front cross-sectional view of the present utility model;

FIG. 2 is an enlarged view of the utility model at A in FIG. 1;

FIG. 3 is a side cross-sectional view of the placement plate, mounting groove, lead screw, moving block, connecting block, limit cover and limit plate of the present utility model.

In the figure: 1. a cooling box body; 2. a cold air pipe; 3. a jet head; 4. placing a plate; 5. a mounting groove; 6. a screw rod; 7. a first wheel; 8. a moving block; 9. a connecting block; 10. a limiting cover; 11. a threaded rod; 12. a limiting plate; 13. a second wheel; 14. a communication port; 15. a limiting block; 16. a limit groove; 17. a chute; 18. a U-shaped block; 19. and (5) installing a block.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1, fig. 2 and fig. 3, an integrated circuit semiconductor processing cooling mechanism comprises a cooling box body 1, cold air pipes 2 are fixedly installed at the top of the cooling box body 1, a plurality of air injection heads 3 are fixedly installed at the bottom of the cold air pipes 2, a plurality of placing plates 4 are arranged in the cooling box body 1, a plurality of mounting grooves 5 are formed in the placing plates 4, a screw rod 6 with the other end extending to the front side of the placing plates 4 is rotatably installed on the inner wall of the rear side of the mounting grooves 5, a first rotating wheel 7 is fixedly installed at one end of the screw rod 6, two moving blocks 8 are installed on the surface threads of the screw rod 6, connecting blocks 9 extending to the top of the placing plates 4 are fixedly installed at the tops of the two moving blocks 8, limiting covers 10 are fixedly installed at the tops of the two connecting blocks 9, threaded rods 11 are installed on the left and right sides of the limiting covers 10, limiting plates 12 are rotatably installed at one ends of the inner sides of the threaded rods 11, and a second rotating wheel 13 is fixedly installed at one end of the outer side of the limiting covers 10.

The first runner 7 is rotated to enable the screw rod 6 to rotate, so that the two moving blocks 8 can move in opposite directions or opposite directions, the distance between the two limiting covers 10 can be adjusted, the two threaded rods 11 are respectively rotated to enable the limiting plates 12 to move, the distance between the two limiting plates 12 can be adjusted, integrated circuit semiconductors with different sizes can be fixed through the two limiting covers 10 and the four limiting plates 12, and the adjustment is simpler and more convenient, and the novel practicability is greatly improved.

The cooling box body 1 is an existing cooling device, and will not be described here too much.

In this embodiment, the screw thread directions on the front and rear sides of the surface of the screw rod 6 are opposite, and the two moving blocks 8 are respectively screwed on the two sides of the surface of the screw rod 6 with the screw thread directions opposite.

In this embodiment, a chute 17 is formed on the top of the placement plate 4 and above each mounting groove 5, and the connection block 9 is slidably connected with the corresponding chute 17.

Through the chute 17 that sets up, make things convenient for connecting block 9 to remove, and then make things convenient for limiting cover 10 to remove.

In this embodiment, a limiting groove 16 is formed in the inner bottom wall of the limiting cover 10, a limiting block 15 with one end extending into the limiting groove 16 is fixedly installed at the bottom of the limiting plate 12, and a plurality of communication ports 14 are formed in the surface of the placing plate 4.

The limiting groove 16 and the limiting block 15 are arranged for limiting the limiting plate 12, so that the limiting plate is more stable in moving.

The communication port 14 is used for cooling the integrated circuit semiconductor.

Referring to fig. 1, in this embodiment, a plurality of U-shaped blocks 18 are fixedly mounted on the inner walls of the left and right sides of the cooling box body 1, the placement plate 4 is movably mounted between the two corresponding U-shaped blocks 18, mounting blocks 19 are fixedly mounted on the top and bottom of the U-shaped blocks 18, the mounting blocks 19 are fixed to the inner wall of the cooling box body 1 through bolts, and the U-shaped blocks 18 are fixedly mounted on the inner wall of the cooling box body 1 through the mounting blocks 19 and the bolts.

Through the installation piece 19 and the U-shaped piece 18 that set up, conveniently place board 4 according to the increase of integrated circuit semiconductor's quantity or reduce, place board 4 simultaneously and dismantle also can be better maintain the internals, from this novel practicality has further been improved.

When the integrated circuit semiconductor cooling device is used, the first rotating wheel 7 is rotated according to the size of the integrated circuit semiconductor, the screw rod 6 is rotated, the screw rod 6 can drive the two moving blocks 8 to move oppositely or reversely when rotating, after the front limiting cover 10 and the rear limiting cover 10 are adjusted to a proper distance, the integrated circuit semiconductor is placed between the two limiting covers 10, the second rotating wheel 13 is rotated, the threaded rod 11 drives the limiting plate 12 to clamp the integrated circuit semiconductor, so that the integrated circuit semiconductor is fixed, after the integrated circuit semiconductor is fixed, the cooling box body 1 is started, the cooling box body can cool the integrated circuit semiconductor placed on the plate 4 through the air jet head 3 through the cold air pipe 2, after the cooling is finished, the limiting plate 12 can be taken out without limiting the integrated circuit semiconductor, the operation is very convenient, and the integrated circuit semiconductors can be cooled simultaneously, so that the cooling efficiency of the integrated circuit semiconductor is greatly improved, and the novel cold air practicability is higher.

The electrical components appearing herein are all electrically connected with the master controller and the power supply, the master controller can be a conventional known device for controlling a computer and the like, and the prior art of power connection is not described in detail herein.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides an integrated circuit semiconductor processing cooling mechanism, includes cooling box body (1), its characterized in that: the cooling box comprises a cooling box body (1), wherein a cold air pipe (2) is fixedly arranged at the top of the cooling box body (1), a plurality of air injection heads (3) are fixedly arranged at the bottom of the cold air pipe (2), a plurality of installation grooves (5) are formed in the inner portion of the cooling box body (1), a screw rod (6) extending to the front side of the installation plate (4) is rotatably arranged at the other end of the inner wall of the installation groove (5), a first rotating wheel (7) is fixedly arranged at one end of the screw rod (6) positioned at the front side of the installation plate (4), two moving blocks (8) are arranged on the surface threads of the screw rod (6), connecting blocks (9) extending to the top of the installation plate (4) are fixedly arranged at the top of the moving blocks (8), limiting covers (10) are fixedly arranged at the top of the connecting blocks, threaded rods (11) are arranged on the left and right sides of the limiting covers (10), one end of the threaded rods (11) positioned in the limiting covers (10) is rotatably provided with a first rotating wheel (12), and the threaded rods (11) are fixedly arranged at the other end of the limiting covers (13).

2. An integrated circuit semiconductor process cooling mechanism as recited in claim 1, wherein: the screw threads on the front side and the rear side of the surface of the screw rod (6) are opposite in direction, and the two moving blocks (8) are respectively arranged on the two sides of the surface of the screw rod (6) in the opposite direction in a threaded manner.

3. An integrated circuit semiconductor process cooling mechanism as recited in claim 1, wherein: the top of placing board (4) and be located the top of every mounting groove (5) and all offered spout (17), connecting block (9) and corresponding spout (17) sliding connection.

4. An integrated circuit semiconductor process cooling mechanism as recited in claim 1, wherein: the limiting cover is characterized in that a limiting groove (16) is formed in the inner bottom wall of the limiting cover (10), a limiting block (15) with one end extending to the inside of the limiting groove (16) is fixedly arranged at the bottom of the limiting plate (12), and a plurality of communicating ports (14) are formed in the surface of the placing plate (4).

5. An integrated circuit semiconductor process cooling mechanism as recited in claim 1, wherein: the inner walls of the left side and the right side of the cooling box body (1) are fixedly provided with a plurality of U-shaped blocks (18), and the placing plate (4) is movably arranged between the two corresponding U-shaped blocks (18).

6. An integrated circuit semiconductor process cooling mechanism as recited in claim 5, wherein: the top and the bottom of U-shaped piece (18) are all fixed mounting have installation piece (19), installation piece (19) are fixed mutually with the inner wall of cooling tank body (1) through the bolt, the inner wall at cooling tank body (1) is fixed mounting through installation piece (19) and bolt to U-shaped piece (18).