CN219325118U

CN219325118U - Grinding device for monocrystalline silicon processing

Info

Publication number: CN219325118U
Application number: CN202320201875.2U
Authority: CN
Inventors: 鲁亮
Original assignee: Shanghai Ruiqi Automation Technology Co ltd
Current assignee: Shanghai Ruiqi Automation Technology Co ltd
Priority date: 2023-02-10
Filing date: 2023-02-10
Publication date: 2023-07-11
Anticipated expiration: 2033-02-10

Abstract

The utility model relates to the technical field of monocrystalline silicon processing devices, in particular to a grinding device for monocrystalline silicon processing. The technical proposal comprises: the upper surface fixedly connected with fixed column on chassis, the top fixedly connected with of fixed column is the abrasive disc down, the upper surface level of abrasive disc rotates down and is connected with the mounting disc, a plurality of mounting holes that are used for placing monocrystalline silicon individual are seted up to the mounting disc, the upper surface fixedly connected with mounting bracket on chassis, the upper surface fixedly connected with cylinder of mounting bracket, the piston rod bottom activity of cylinder runs through fixedly connected with last abrasive disc behind the mounting bracket, the individual top of monocrystalline silicon and the lower surface contact of last abrasive disc, the individual bottom of monocrystalline silicon and the upper surface contact of abrasive disc down. According to the utility model, through the design of the lower grinding disc, the upper grinding disc and the mounting disc, single crystal silicon individuals can be ground on two sides, and the mounting disc is of an independent structure, so that the single crystal silicon individuals can be replaced according to different single crystal silicon.

Description

Grinding device for monocrystalline silicon processing

Technical Field

The utility model relates to the technical field of monocrystalline silicon processing devices, in particular to a grinding device for monocrystalline silicon processing.

Background

The utility model provides a grinding device for processing monocrystalline silicon, which is suitable for processing monocrystalline silicon by using an upper grinding disc and a lower grinding disc to grind the monocrystalline silicon on two sides, wherein the monocrystalline silicon needs to be subjected to a grinding process during processing, such as a high-precision double-sided grinding device processing device for monocrystalline silicon disclosed in China patent with publication number of CN 213380953U.

Disclosure of Invention

The utility model aims to solve the problems in the background art and provides a grinding device for processing monocrystalline silicon.

The technical scheme of the utility model is as follows: the utility model provides a grinder is used in monocrystalline silicon processing, includes the chassis, the last fixed surface on chassis is connected with the fixed column, the top fixedly connected with of fixed column is the abrasive disc down, the upper surface level of abrasive disc rotates down and is connected with the mounting disc, a plurality of mounting holes that are used for placing monocrystalline silicon individual are seted up to the mounting disc, the last fixed surface on chassis is connected with the mounting bracket, the last fixed surface of mounting bracket is connected with the cylinder, the piston rod bottom activity run through mounting bracket back fixedly connected with of cylinder goes up the abrasive disc, the individual top of monocrystalline silicon and the lower surface contact of last abrasive disc, the individual bottom of monocrystalline silicon and the upper surface contact of abrasive disc down.

Preferably, the upper surface of the chassis is fixedly connected with a motor, an output shaft of the motor is fixedly connected with a main gear, and the outer ring surface of the mounting plate is fixedly sleeved with a toothed ring which can be meshed and connected with the main gear.

Preferably, the upper surface of the lower grinding disc is fixedly connected with a ring strip which enables the mounting disc to horizontally rotate on the lower grinding disc near the edge.

Preferably, the upper surface of the upper grinding disc is fixedly connected with a guide rod, and the guide rod movably penetrates through the mounting frame.

Preferably, the upper grinding disc and the lower grinding disc are provided with liquid inlet holes in a penetrating mode, wherein the liquid inlet holes are used for adding grinding liquid to the mounting disc.

Preferably, the mounting frame is provided with a bolt hole for mounting the grinding fluid storage device.

Preferably, the bottom of the mounting frame is fixedly connected with the upper surface of the chassis through bolts.

Compared with the prior art, the utility model has the following beneficial technical effects:

the utility model discloses a through the design of lower grinding disc, last grinding disc and mounting disc, can carry out double-sided grinding to single crystal silicon individual, overall structure is comparatively simple, with low costs and easy operation. In addition, the mounting plate is of an independent structure, so that the mounting plate is convenient to replace according to different monocrystalline silicon.

Drawings

FIG. 1 is a schematic structural view of a polishing apparatus for processing single crystal silicon;

fig. 2 is a schematic diagram of the separation structure of fig. 1.

Reference numerals: 1. a chassis; 2. fixing the column; 3. a lower grinding disc; 4. a mounting frame; 5. a cylinder; 6. bolt holes; 7. a grinding disc is arranged; 8. a guide rod; 9. a mounting plate; 10. a toothed ring; 11. a motor; 12. a main gear; 13. a ring strip; 14. a mounting hole; 15. single crystal silicon units; 16. and (5) a liquid inlet hole.

Detailed Description

The following description is merely exemplary in nature and is not intended to limit the present application, uses, or uses. It should be understood that throughout the drawings, the same or similar reference numerals indicate the same or similar parts and features. The drawings are merely schematic representations, not necessarily showing specific dimensions and proportions of the various embodiments of the application. Specific details or structures may be shown in exaggerated form in particular figures to illustrate related details or structures of embodiments of the present application.

Examples

As shown in fig. 1-2, the grinding device for processing monocrystalline silicon provided by the utility model comprises a chassis 1, wherein a fixed column 2 is fixedly connected to the upper surface of the chassis 1, and the fixed column 2 is collinear with the central axis of the chassis 1. The top of the fixed column 2 is fixedly connected with a lower grinding disc 3, and the central axis of the lower grinding disc 3 is collinear with the fixed column 2.

As shown in fig. 2, the upper surface of the lower grinding disc 3 is fixedly connected with a ring strip 13 near the edge, the ring strip 13 and the mounting disc 9 are concentric and coaxial, the inner ring surface of the ring strip 13 is contacted with the outer ring surface at the bottom end of the mounting disc 9, and the mounting disc 9 and the lower grinding disc 3 are concentric and coaxial.

As shown in fig. 2, the mounting plate 9 is provided with a plurality of mounting holes 14 for placing single crystal silicon units 15, and the mounting holes 14 are distributed annularly about the central axis of the mounting plate 9. The upper surface of chassis 1 passes through bolt fixedly connected with mounting bracket 4, and the upper surface fixedly connected with cylinder 5 of mounting bracket 4, and the piston rod bottom activity of cylinder 5 runs through mounting bracket 4 back fixedly connected with last abrasive disc 7, and the upper surface fixedly connected with guide bar 8 of last abrasive disc 7, guide bar 8 activity run through mounting bracket 4. The top end of the single crystal silicon body 15 is in contact with the lower surface of the upper grinding disk 7, and the bottom end of the single crystal silicon body 15 is in contact with the upper surface of the lower grinding disk 3.

As shown in fig. 1-2, the upper surface of the chassis 1 is fixedly connected with a motor 11, an output shaft of the motor 11 is fixedly connected with a main gear 12, and an outer ring surface of the mounting plate 9 is fixedly sleeved with a toothed ring 10 which can be meshed with the main gear 12.

As shown in fig. 2, the upper grinding disc 7 and the lower grinding disc 3 are provided with liquid inlet holes 16 for adding grinding liquid to the mounting disc 9, the mounting frame 4 is provided with bolt holes 6 for mounting grinding liquid storage equipment, the grinding liquid storage equipment can be a liquid storage tank with a water pump, and the grinding liquid is guided from the storage equipment to the upper surface and the lower surface of the mounting disc 9 through the water pipe passing through the liquid inlet holes 16.

The working principle of the embodiment is as follows: when grinding, firstly, the mounting plate 9 is placed on the upper surface of the lower grinding plate 3, the inner ring surface of the ring strip 13 is contacted with the outer ring surface of the bottom end of the mounting plate 9, at the moment, the mounting plate 9 is coaxial with the lower grinding plate 3, and the toothed ring 10 is meshed with the main gear 12 when the mounting plate is placed, so that the mounting plate 9 can horizontally rotate through the meshing connection between the main gear 12 and the toothed ring 10. The single crystal silicon body 15 to be ground is placed in the mounting hole 14, the bottom end of the single crystal silicon body 15 is contacted with the upper surface of the lower grinding disc 3 under the action of gravity, the piston rod of the air cylinder 5 drives the upper grinding disc 7 to move downwards to be contacted with the top end of the single crystal silicon body 15, then the output shaft of the motor 11 drives the main gear 12 to rotate, and then the mounting disc 9 is driven to rotate through meshing with the toothed ring 10, and the mounting hole 14 is distributed in a ring shape with the central shaft of the mounting disc 9, so that the mounting hole 14 also drives the single crystal silicon body 15 to rotate with the central shaft of the mounting disc 9, and further friction is generated between the upper end and the lower end of the mounting disc 9 and the upper grinding disc 7 and the lower grinding disc 3 respectively so as to achieve the double-sided grinding effect. During the polishing process, the polishing liquid can be added to the upper surface of the mounting plate 9 through the liquid inlet holes 16, so that the performance of the single crystal silicon unit 15 is prevented from being reduced due to the high temperature generated by dry polishing.

The exemplary implementation of the solution proposed in the present application has been described in detail hereinabove with reference to the preferred embodiments, however, it will be understood by those skilled in the art that various modifications and adaptations can be made to the specific embodiments described above and that various combinations of the technical features and structures proposed in the present application can be made without departing from the scope of protection of the present application, which is defined by the appended claims.

Claims

1. The utility model provides a grinder for monocrystalline silicon processing, includes chassis (1), its characterized in that: the utility model discloses a single crystal silicon grinding device, including chassis (1), upper surface fixedly connected with fixed column (2) of chassis (1), top fixedly connected with lower grinding disc (3) of fixed column (2), the upper surface level of lower grinding disc (3) rotates and is connected with mounting disc (9), mounting disc (9) set up a plurality of mounting holes (14) that are used for placing single crystal silicon individual (15), the upper surface fixedly connected with mounting bracket (4) of chassis (1), the upper surface fixedly connected with cylinder (5) of mounting bracket (4), the piston rod bottom activity of cylinder (5) runs through mounting bracket (4) back fixedly connected with upper grinding disc (7), the top of single crystal silicon individual (15) and the lower surface contact of upper grinding disc (7), the bottom of single crystal silicon individual (15) and the upper surface contact of lower grinding disc (3).

2. The grinding device for monocrystalline silicon processing according to claim 1, wherein a motor (11) is fixedly connected to the upper surface of the chassis (1), a main gear (12) is fixedly connected to an output shaft of the motor (11), and a toothed ring (10) capable of being in meshed connection with the main gear (12) is fixedly sleeved on the outer ring surface of the mounting plate (9).

3. The grinding device for processing monocrystalline silicon according to claim 1, wherein a ring strip (13) for horizontally rotating the mounting plate (9) on the lower grinding plate (3) is fixedly connected to the upper surface of the lower grinding plate (3) near the edge.

4. The grinding device for monocrystalline silicon processing according to claim 1, characterized in that a guide rod (8) is fixedly connected to the upper surface of the upper grinding disc (7), and the guide rod (8) movably penetrates through the mounting frame (4).

5. The polishing apparatus for single crystal silicon processing according to claim 1, wherein the upper polishing plate (7) and the lower polishing plate (3) are each provided with a liquid inlet hole (16) for adding a polishing liquid to the mounting plate (9) therethrough.

6. Grinding device for monocrystalline silicon processing according to claim 1, characterized in that the mounting bracket (4) is provided with bolt holes (6) for mounting grinding fluid storage equipment.

7. The grinding device for monocrystalline silicon processing according to claim 1, wherein the bottom end of the mounting frame (4) is fixedly connected with the upper surface of the chassis (1) through bolts.