CN219321328U

CN219321328U - Wafer-level packaging equipment for producing image processing chips

Info

Publication number: CN219321328U
Application number: CN202223508480.1U
Authority: CN
Inventors: 王彦智; 杜彪
Original assignee: Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
Current assignee: Shengqing Yongzhi Semiconductor Equipment Suzhou Co ltd
Priority date: 2022-12-28
Filing date: 2022-12-28
Publication date: 2023-07-07
Anticipated expiration: 2032-12-28

Abstract

The utility model discloses wafer level packaging equipment for producing an image processing chip, which comprises a mounting seat and a sucker for fixing the processing chip, wherein the lower surface of the mounting seat is provided with a first motor and a second motor, the upper surface of the mounting seat is provided with a stand column and a rotating shaft, the inner side of the stand column is provided with a screw rod, the lower ends of the screw rod and the rotating shaft are respectively connected with output shafts of the first motor and the second motor, the outer side of the screw rod is provided with a lifting frame, one end of the lifting frame is provided with a lifting column through a first connecting piece, the upper end of the lifting column is provided with a mounting plate, the outer side of the upper end of the rotating shaft is provided with a sleeve, and the sleeve is connected with the lower end of the lifting column through a transmission component: through starting first motor and second motor, be used for adjusting the height of mounting panel and the angle of mounting panel respectively to for the encapsulation of image processing chip provides convenience, the effectual efficiency that improves the encapsulation.

Description

Wafer-level packaging equipment for producing image processing chips

Technical Field

The utility model relates to the technical field of wafer-level packaging equipment, in particular to wafer-level packaging equipment for producing an image processing chip.

Background

The existing wafer level packaging apparatus generally places the wafer directly on the base, which is inconvenient for fixing, and the existing wafer level packaging apparatus is inconvenient for adjusting the height of the bottom plate, so it is necessary to design a wafer level packaging apparatus for producing an image processing chip to solve the above-mentioned problems.

The patent number 202023157500.6 discloses wafer level packaging equipment for image processing chip production, including the adjustment tank, table wall fixedly connected with fixed box under the inside of adjustment tank, table wall fixedly connected with fixed plate under the inside of fixed box, the last table wall fixedly connected with biax motor of fixed plate, two output shaft top of biax motor all fixedly connected with first gear, two first gears all meshing are connected with the second gear, the equal fixedly connected with dwang of inner wall of two second gears, the one end that the second gear was kept away from to two dwang extends to the left and right sides wall outside of fixed box respectively and fixedly connected with first bevel gear, through setting up biax motor in fixed box inside, first gear, second gear, first bevel gear and second bevel gear, through the mutually supporting of above-mentioned structure, biax motor rotates alright drive threaded rod rotation, realize the regulation to the bottom plate height from this, through setting up the sucking disc at the last table wall of bottom plate, make it be convenient for fix.

The packaging equipment has the following defects when in use: through the work of bi-cycle motor, under drive gear group's effect, realized the altitude mixture control of bottom plate, nevertheless at the in-process of encapsulation, the bottom plate is whole to be able to carry out the displacement in upper and lower direction, and its installation angle is fixed relatively, leads to follow-up encapsulation process inconvenient, influences encapsulation efficiency.

Disclosure of Invention

The present utility model is directed to a wafer level packaging apparatus for producing an image processing chip, so as to solve the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an image processing chip production is with wafer level encapsulation equipment, includes the mount pad and is used for handling the fixed sucking disc of chip, the lower surface of mount pad is provided with first motor, second motor, the upper surface of mount pad is provided with stand and pivot, the inboard of stand is provided with the lead screw, the lower extreme of lead screw, pivot respectively with the output shaft of first motor, second motor, the outside of lead screw is provided with the crane, the one end of crane is provided with the lift post through first connecting piece, the upper end of lift post is provided with the mounting panel, the upper end outside of pivot is provided with the sleeve, the sleeve with the lower extreme of lift post is passed through drive assembly and is connected, the sucking disc sets up the upper surface of mounting panel.

Preferably, the first connecting piece is sleeved outside the lower end of the lifting column through a central hole penetrating through the middle part and is fixedly connected with the lifting column, and the outer side wall of the first connecting piece is positioned in a through hole of the lifting frame through a round groove.

Preferably, the outer wall of the rotating shaft is provided with a sliding rail, and the inner wall of the sleeve is provided with a sliding groove corresponding to the sliding rail.

Preferably, the transmission assembly comprises a first gear, a second gear and a toothed chain, wherein the first gear and the second gear are respectively arranged outside the ends of the lifting column and the sleeve, and the first gear and the second gear are in transmission connection through the toothed chain.

Preferably, a fixing rod is arranged on the upper surface of the mounting seat below the lifting column, and the upper end of the fixing rod extends into the jack at the lower end of the lifting column.

Preferably, the first motor and the second motor are stepper motors.

Compared with the prior art, the utility model has the beneficial effects that: through setting up stand and pivot at the upper surface of mount pad, the inboard at the stand passes through the lead screw installation crane, set up the lift post through first connecting piece in the end department of crane, the mounting panel that will be used for setting up the sucking disc sets up the upper end at the lift post, simultaneously with the crane with the pivot through the second connecting piece be connected, and with the sleeve in the pivot outside with the lift post through drive assembly connection, through start first motor and second motor, be used for the height of adjusting the mounting panel respectively and the angle of mounting panel, thereby encapsulation for image processing chip is convenient, the effectual efficiency that improves the encapsulation.

Drawings

FIG. 1 is a schematic overall structure of the present utility model;

FIG. 2 is a schematic view of the installation of the sleeve of the present utility model;

fig. 3 is a schematic structural view of a transmission assembly according to the present utility model.

In the figure: 1. a mounting base; 2. a suction cup; 3. a first motor; 4. a second motor; 5. a column; 6. a rotating shaft; 7. a screw rod; 8. a lifting frame; 9. lifting columns; 10. a mounting plate; 11. a sleeve; 12. a first connector; 13. a slide rail; 14. a chute; 15. a first gear; 16. a second gear; 17. a toothed chain; 18. a fixed rod; 19. a jack; 20. and a second connecting piece.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution: the wafer level packaging equipment for producing the image processing chip comprises a mounting seat 1 and a sucker 2 for processing chip fixation, wherein a first motor 3 and a second motor 4 are arranged on the lower surface of the mounting seat 1, a stand column 5 and a rotating shaft 6 are arranged on the upper surface of the mounting seat 1, a screw rod 7 is arranged on the inner side of the stand column 5, the screw rod 7 and the lower end of the rotating shaft 6 are respectively connected with the output shafts of the first motor 3 and the second motor 4, a lifting frame 8 is arranged on the outer side of the screw rod 7, a lifting column 9 is arranged at one end of the lifting frame 8 through a first connecting piece 12, a mounting plate 10 is arranged at the upper end of the lifting column 9, a sleeve 11 is arranged on the outer side of the upper end of the rotating shaft 6, the sleeve 11 is connected with the lower end of the lifting column 9 through a transmission component, and the sucker 2 is arranged on the upper surface of the mounting plate 10.

Wherein, sleeve 11 is connected with the crane through second connecting piece 20, and the mechanism of second connecting piece 20 is the same with the structure of first connecting piece 12.

The first connecting piece 12 is sleeved outside the lower end of the lifting column 9 through a central hole penetrating through the middle part and is fixedly connected with the lifting column 9, and the outer side wall of the first connecting piece 12 is positioned in a through hole of the lifting frame 8 through a round groove.

The outer wall of the rotating shaft 6 is provided with a sliding rail 13, and the inner wall of the sleeve 11 is provided with a sliding groove 14 corresponding to the sliding rail 13.

The transmission assembly comprises a first gear 15, a second gear 16 and a toothed chain 17, wherein the first gear 15 and the second gear 16 are respectively arranged outside the ends of the lifting column 9 and the sleeve 11, and the first gear 15 and the second gear 16 are in transmission connection through the toothed chain 17.

The upper surface of mount pad 1 is provided with dead lever 18 below lift post 9, and the upper end of dead lever 18 extends into jack 19 of lift post 9 lower extreme.

The first motor 3 and the second motor 4 are stepping motors.

Specifically, when the utility model is used, the image processing chip to be packaged is placed on the upper surface of the mounting plate 10 and is adsorbed and fixed by the sucker 2, the first motor 3 is started to drive the screw rod 7 to rotate, so that the lifting frame 8 and the lifting column 9 at the end synchronously move up and down, the height positions of the mounting plate 10 and the image processing chip on the upper surface are adjusted, the second motor 4 is started in the packaging process, the second motor 4 drives the rotating shaft 6 to rotate, the sleeve 11 at the outer side of the rotating shaft 6 and the second gear 16 at the lower end of the sleeve 11 synchronously rotate, and the first gear 15 drives the lifting column 9 to rotate under the action of the toothed chain 17, so that the placement angle of the mounting plate 10 and the image processing chip on the upper surface is adjusted, the packaging is convenient, and the packaging efficiency is effectively improved.

In the description of the present utility model, it should be understood that the terms "coaxial," "bottom," "one end," "top," "middle," "another end," "upper," "one side," "top," "inner," "front," "center," "two ends," etc. indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," "third," "fourth," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby features defining "first," "second," "third," "fourth" may explicitly or implicitly include at least one such feature.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "configured," "connected," "secured," "screwed," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intermediaries, or in communication with each other or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms described above in this application will be understood by those of ordinary skill in the art in view of the specific circumstances.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The wafer level packaging equipment for producing the image processing chip is characterized by comprising a mounting seat (1) and a sucker (2) for processing chip fixation, wherein a first motor (3) and a second motor (4) are arranged on the lower surface of the mounting seat (1), a stand column (5) and a rotating shaft (6) are arranged on the upper surface of the mounting seat (1), a screw rod (7) is arranged on the inner side of the stand column (5), the lower ends of the screw rod (7) and the rotating shaft (6) are respectively connected with output shafts of the first motor (3) and the second motor (4), a lifting frame (8) is arranged on the outer side of the screw rod (7), a lifting column (9) is arranged at one end of the lifting frame (8) through a first connecting piece (12), a mounting plate (10) is arranged at the upper end of the lifting column (9), a sleeve (11) is arranged on the outer side of the upper end of the rotating shaft (6), the sleeve (11) is connected with the lower end of the lifting column (9) through a transmission assembly, and the sucker (2) is arranged on the upper surface of the mounting plate (10).

2. The wafer level packaging apparatus for producing an image processing chip as defined in claim 1, wherein: the first connecting piece (12) is sleeved outside the lower end of the lifting column (9) through a central hole penetrating through the middle part and is fixedly connected with the lifting column (9), and the outer side wall of the first connecting piece (12) is positioned in a through hole of the lifting frame (8) through a round groove.

3. The wafer level packaging apparatus for producing an image processing chip as defined in claim 1, wherein: the outer wall of the rotating shaft (6) is provided with a sliding rail (13), and the inner wall of the sleeve (11) is provided with a sliding groove (14) corresponding to the sliding rail (13).

4. The wafer level packaging apparatus for producing an image processing chip as defined in claim 1, wherein: the transmission assembly comprises a first gear (15), a second gear (16) and a toothed chain (17), wherein the first gear (15) and the second gear (16) are respectively arranged outside the ends of the lifting column (9) and the sleeve (11), and the first gear (15) and the second gear (16) are in transmission connection through the toothed chain (17).

5. The wafer level packaging apparatus for producing an image processing chip as defined in claim 1, wherein: the upper surface of mount pad (1) is provided with dead lever (18) in the below of lift post (9), the upper end of dead lever (18) extends to in jack (19) of lift post (9) lower extreme.

6. The wafer level packaging apparatus for producing an image processing chip as defined in claim 1, wherein: the first motor (3) and the second motor (4) are stepping motors.