CN219320359U - Wafer packaging testing device - Google Patents
Wafer packaging testing device Download PDFInfo
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- CN219320359U CN219320359U CN202320214889.8U CN202320214889U CN219320359U CN 219320359 U CN219320359 U CN 219320359U CN 202320214889 U CN202320214889 U CN 202320214889U CN 219320359 U CN219320359 U CN 219320359U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
Abstract
The utility model belongs to the technical field of wafer production, in particular to a wafer packaging testing device, which aims at solving the problem that when the existing pressure resistance test is carried out, the strength of a testing probe is too high, and no overpressure protection mechanism can cause cracking and damage in the chip testing process, and the utility model provides a scheme which comprises a probe table, a glass shell, an air supply device, an air exhaust device and an air exhaust port, wherein the top of the glass shell is fixedly connected with the top of the probe table, the air supply device is fixedly connected to one side of the glass shell, the air exhaust device is fixedly connected to the top of the glass shell, and the air exhaust port is fixedly connected to one corner of the top of the glass shell; the clamping assembly is used for clamping the workpiece, the clamping assembly comprises a mounting plate which is connected to the top of the second fixing plate in a sliding manner; the overvoltage protection assembly comprises a second round rod fixedly installed at the bottom of the mounting plate. The wafer clamping device is convenient to clamp, has the overvoltage protection function, and protects the wafer from being damaged during testing.
Description
Technical Field
The utility model relates to the technical field of wafer production, in particular to a wafer packaging testing device.
Background
Package testing is a very important step in the wafer manufacturing process. The test is generally classified into a general test and a special test, the former is to place the packaged chip in various environments to detect its electrical characteristics such as power consumption, operation speed, voltage resistance, etc., and the tested chip is classified into different grades according to its electrical characteristics.
Through retrieving, the bulletin number is CN214409194U3 patent, discloses a wafer encapsulation testing arrangement, including, probe platform and probe subassembly, be provided with the glass shell on the probe platform, be provided with the through-hole that is used for placing the wafer and the air valve on the through-hole on the probe platform, still be provided with air supply device on the glass shell, still be provided with the gas vent on the glass shell, the glass shell both ends are provided with the trachea, be provided with air extraction device in the trachea, the inner wall of air supply device trachea is provided with the inlayer of fold, the inlayer is the moisture absorption layer, the trachea outer wall is provided with alternately winding cold water pipe and hot water line, cold water pipe and inside the leading to of hot water line have circulating water, tracheal inner wall is provided with temperature sensor. The problem that water vapor in the air of an open probe station is condensed on a wafer so as to influence a test result is solved.
However, the wafer is fragile and easy to damage, and when the pressure resistance test is performed, the strength of the test probe is too large, and the chip can be cracked and damaged in the test process without an over-pressure protection mechanism.
In view of the above, the present disclosure provides a wafer package testing apparatus.
Disclosure of Invention
The utility model provides a wafer packaging testing device, which solves the defects that the strength of a testing probe is too large and an overvoltage protection mechanism can cause cracking and damage in the chip testing process when the pressure resistance test is carried out in the prior art.
The utility model provides the following technical scheme:
a wafer package testing apparatus includes,
the probe comprises a probe platform, a glass shell, an air supply device, an air exhaust device and an air exhaust port, wherein the top of the glass shell is fixedly connected with the top of the probe platform, the air supply device is fixedly connected to one side of the glass shell, the air exhaust device is fixedly connected to the top of the glass shell, the air exhaust port is fixedly connected to one corner of the top of the glass shell, a second fixing plate is fixedly arranged on the inner wall of the bottom of the probe platform, and a first fixing plate is fixedly arranged on the top of the second fixing plate;
the clamping assembly comprises a mounting plate which is connected to the top of the second fixing plate in a sliding manner and is used for clamping the chip;
the overvoltage protection component comprises a second round rod fixedly arranged at the bottom of the mounting plate and is used for protecting the wafer package from overlarge pressure during the pressure resistance test.
In one possible design, four guide posts are fixedly arranged at the top of the second fixing plate, four guide posts are in sliding connection with the mounting plate, a third fixing plate is fixedly arranged at the top of the second fixing plate, the third fixing plate is in sliding connection with a first round rod, one end of the first round rod is fixedly connected with a V-shaped block, a spring is sleeved on the outer side of the first round rod between the V-shaped block and the third fixing plate, the other end of the first round rod is fixedly connected with a handle, and the bottom of the V-shaped block is in sliding connection with the top of the mounting plate.
In one possible design, the bottom of the second round bar is fixedly connected with a round pad, the outer side of the round pad is slidably connected with a round tube, and the inner part of the round tube is connected with an air tube.
In one possible design, the air pipe is connected with an air source, and a switching valve with certain pressure is arranged on the air pipe.
In one possible design, the bottom of the V-block is fixedly provided with a square rod which is in sliding connection with the mounting plate.
In one possible design, a rubber pad is fixedly installed on one side of the first fixing plate, and the rubber pad is made of elastic polyurethane material.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.
According to the utility model, the handle is pulled, the first round rod drives the V-shaped block to slide leftwards, the springs are compressed, the wafer is placed between the rubber pad and the V-shaped block, the handle is loosened, the wafer is clamped, and the first round rod is in threaded connection with the V-shaped block, so that different springs can be replaced conveniently according to different conditions;
in the utility model, when the pressure is overlarge in the test, the switch valve arranged on the air pipe is opened, the air pressure in the circular pipe is reduced, the circular pad slides downwards along the inner wall of the circular pipe, and the mounting plate and the whole clamping assembly move downwards, so that the wafer is protected;
the wafer clamping device is convenient to clamp, has the overvoltage protection function, and protects the wafer from being damaged during testing.
Drawings
Fig. 1 is a schematic diagram of an internal structure of a wafer package testing apparatus according to an embodiment of the present utility model;
fig. 2 is a schematic diagram of an overall structure of a wafer package testing apparatus according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a clamping assembly of a wafer package testing device according to an embodiment of the present utility model;
fig. 4 is a schematic diagram of an overvoltage protection structure of a wafer package testing apparatus according to an embodiment of the present utility model.
Reference numerals:
1. a probe station; 2. a glass shell; 3. an air supply device; 4. an air extracting device; 5. an exhaust port; 6. a mounting plate; 7. a V-shaped block; 8. a first fixing plate; 9. rubber cushion; 10. a second fixing plate; 11. square rods; 12. a first round bar; 13. a third fixing plate; 14. a spring; 15. a handle; 16. a round tube; 17. a second round bar; 18. a round pad; 19. an air pipe; 20. and (5) a guide post.
Detailed Description
Embodiments of the present utility model will be described below with reference to the accompanying drawings in the embodiments of the present utility model.
In describing embodiments of the present utility model, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled" and "mounted" should be interpreted broadly, and for example, "coupled" may or may not be detachably coupled; may be directly connected or indirectly connected through an intermediate medium. In addition, "communication" may be direct communication or may be indirect communication through an intermediary. Wherein, "fixed" means that the relative positional relationship is not changed after being connected to each other. References to orientation terms, such as "inner", "outer", "top", "bottom", etc., in the embodiments of the present utility model are merely to refer to the orientation of the drawings and, therefore, the use of orientation terms is intended to better and more clearly illustrate and understand the embodiments of the present utility model, rather than to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be construed as limiting the embodiments of the present utility model.
In embodiments of the present utility model, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.
In the embodiment of the present utility model, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
Reference in the specification to "one embodiment" or "some embodiments" or the like means that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the utility model. Thus, appearances of the phrases "in one embodiment," "in some embodiments," "in other embodiments," and the like in the specification are not necessarily all referring to the same embodiment, but mean "one or more but not all embodiments" unless expressly specified otherwise. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless expressly specified otherwise.
Example 1
Referring to fig. 1-4, a wafer package testing apparatus includes:
the probe comprises a probe platform 1, a glass shell 2, an air supply device 3, an air exhaust device 4 and an air exhaust port 5, wherein the top of the glass shell 2 is fixedly connected with the top of the probe platform 1, the air supply device 3 is fixedly connected to one side of the glass shell 2, the air exhaust device 4 is fixedly connected to the top of the glass shell 2, the air exhaust port 5 is fixedly connected to one corner of the top of the glass shell 2, a second fixing plate 10 is fixedly arranged on the inner wall of the bottom of the probe platform 1, and a first fixing plate 8 is fixedly arranged on the top of the second fixing plate 10;
the clamping assembly comprises a mounting plate 6 which is connected to the top of the second fixing plate 10 in a sliding manner and is used for clamping the chip;
the overvoltage protection component comprises a second round rod 17 fixedly arranged at the bottom of the mounting plate 6 and is used for protecting the wafer package from excessive pressure during the pressure resistance test.
In the technical proposal, the handle 15 is pulled, the first round rod 12 drives the V-shaped block 7 to slide leftwards, the spring 14 is compressed, the wafer is placed between the rubber pad 9 and the V-shaped block 7, the handle 15 is loosened, the wafer is clamped, and the first round rod 12 is in threaded connection with the V-shaped block 7; when the pressure is too high in the test, the switch valve arranged on the air pipe 19 is opened, the air pressure in the circular pipe 16 is reduced, the circular pad 18 slides downwards along the inner wall of the circular pipe 16, the mounting plate 6 and the whole clamping assembly move downwards,
the wafer clamping is convenient, and the technical effect of damaging the wafer by overvoltage during testing is protected.
With reference to figures 1 and 3 of the drawings,
four guide posts 20 are fixedly arranged at the top of the second fixing plate 10, the four guide posts 20 are in sliding connection with the mounting plate 6, a third fixing plate 13 is fixedly arranged at the top of the second fixing plate 10, the third fixing plate 13 is in sliding connection with a first round rod 12, one end of the first round rod 12 is fixedly connected with a V-shaped block 7, a spring 14 is sleeved outside the first round rod 12 between the V-shaped block 7 and the third fixing plate 13, the other end of the first round rod 12 is fixedly connected with a handle 15, and the bottom of the V-shaped block 7 is in sliding connection with the top of the mounting plate 6
In the technical scheme, the handle 15 is pulled, the first round rod 12 drives the V-shaped block 7 to slide leftwards, the spring 14 is compressed, the wafer is placed between the rubber pad 9 and the V-shaped block 7, the handle 15 is loosened, the wafer is clamped, and the first round rod 12 is in threaded connection with the V-shaped block 7;
the technical effect of conveniently replacing different springs 14 according to different conditions for quick clamping can be achieved.
With reference to figure 4 of the drawings,
the bottom fixedly connected with circular pad 18 of second round bar 17, the outside sliding connection of circular pad 18 has pipe 16, and the inside connection of pipe 16 has trachea 19.
In the above technical solution, the outer side of the round pad 18 is slidably connected with the round tube 16
The technical effect that the mounting plate 6 can move up and down can be achieved.
With reference to figure 4 of the drawings,
the air pipe 19 is connected with an air source, and a switching valve with certain pressure is arranged on the air pipe 19.
In the above technical solution, the air pipe 19 is provided with a switching valve with a certain pressure.
The technical effect that the switch valve is opened and the round pad 18 is lowered when the pressure in the round tube 16 reaches a certain degree can be achieved.
Example 2
Referring to fig. 1-4, a wafer package testing apparatus includes:
the probe comprises a probe platform 1, a glass shell 2, an air supply device 3, an air exhaust device 4 and an air exhaust port 5, wherein the top of the glass shell 2 is fixedly connected with the top of the probe platform 1, the air supply device 3 is fixedly connected to one side of the glass shell 2, the air exhaust device 4 is fixedly connected to the top of the glass shell 2, the air exhaust port 5 is fixedly connected to one corner of the top of the glass shell 2, a second fixing plate 10 is fixedly arranged on the inner wall of the bottom of the probe platform 1, and a first fixing plate 8 is fixedly arranged on the top of the second fixing plate 10;
the clamping assembly comprises a mounting plate 6 which is connected to the top of the second fixing plate 10 in a sliding manner and is used for clamping the chip;
the overvoltage protection component comprises a second round rod 17 fixedly arranged at the bottom of the mounting plate 6 and is used for protecting the wafer package from excessive pressure during the pressure resistance test.
In the technical scheme, the handle 15 is pulled, the first round rod 12 drives the V-shaped block 7 to slide leftwards, the spring 14 is compressed, the wafer is placed between the rubber pad 9 and the V-shaped block 7, the handle 15 is loosened, the wafer is clamped, and the first round rod 12 is in threaded connection with the V-shaped block 7; when the pressure is too high in the test, the switch valve arranged on the air pipe 19 is opened, the air pressure in the circular pipe 16 is reduced, the circular pad 18 slides downwards along the inner wall of the circular pipe 16, the mounting plate 6 and the whole clamping assembly move downwards,
the wafer clamping is convenient, and the technical effect of damaging the wafer by overvoltage during testing is protected.
With reference to figures 1 and 3 of the drawings,
four guide posts 20 are fixedly arranged at the top of the second fixing plate 10, the four guide posts 20 are in sliding connection with the mounting plate 6, a third fixing plate 13 is fixedly arranged at the top of the second fixing plate 10, the third fixing plate 13 is in sliding connection with a first round rod 12, one end of the first round rod 12 is fixedly connected with a V-shaped block 7, a spring 14 is sleeved outside the first round rod 12 between the V-shaped block 7 and the third fixing plate 13, the other end of the first round rod 12 is fixedly connected with a handle 15, and the bottom of the V-shaped block 7 is in sliding connection with the top of the mounting plate 6
In the technical scheme, the handle 15 is pulled, the first round rod 12 drives the V-shaped block 7 to slide leftwards, the spring 14 is compressed, the wafer is placed between the rubber pad 9 and the V-shaped block 7, the handle 15 is loosened, the wafer is clamped, and the first round rod 12 is in threaded connection with the V-shaped block 7;
the technical effect of conveniently replacing different springs 14 according to different conditions for quick clamping can be achieved.
With reference to figure 4 of the drawings,
the bottom fixedly connected with circular pad 18 of second round bar 17, the outside sliding connection of circular pad 18 has pipe 16, and the inside connection of pipe 16 has trachea 19.
In the above technical solution, the outer side of the round pad 18 is slidably connected with the round tube 16
The technical effect that the mounting plate 6 can move up and down can be achieved.
With reference to figure 4 of the drawings,
the air pipe 19 is connected with an air source, and a switching valve with certain pressure is arranged on the air pipe 19.
In the above technical solution, the air pipe 19 is provided with a switching valve with a certain pressure.
The technical effect that the switch valve is opened and the round pad 18 is lowered when the pressure in the round tube 16 reaches a certain degree can be achieved.
With reference to figures 1 and 3 of the drawings,
in the above technical scheme, square rod 11 is fixedly installed at the bottom of V-shaped block 7, and square rod 11 is in sliding connection with mounting plate 6.
The technical effect of smooth left-right movement of the V-shaped block 7 can be achieved.
With reference to figure 1 of the drawings,
in the above technical scheme, one side of the first fixing plate 8 is fixedly provided with the rubber pad 9, and the rubber pad 9 is made of elastic polyurethane material.
The technical effect of protecting the surface of the wafer can be achieved.
However, as those skilled in the art will appreciate, the present utility model is not described in detail herein, and any choice can be made by those skilled in the art according to the needs or convenience thereof.
The working principle and the using flow of the technical scheme are as follows:
in the wafer packaging process, when the pressure resistance test is carried out, the handle 15 is pulled, the first round rod 12 drives the V-shaped block 7 to slide leftwards, the springs 14 are compressed, the wafer is placed between the rubber pad 9 and the V-shaped block 7, the handle 15 is loosened, the wafer is clamped, the first round rod 12 is in threaded connection with the V-shaped block 7, and different springs 14 can be replaced conveniently according to different conditions; when the pressure is too high in the test, the switch valve arranged on the air pipe 19 is opened, the air pressure in the circular pipe 16 is reduced, the circular pad 18 slides downwards along the inner wall of the circular pipe 16, and the mounting plate 6 and the whole clamping assembly move downwards, so that the wafer is protected.
The present utility model is not limited to the above embodiments, and any person skilled in the art can easily think about the changes or substitutions within the technical scope of the present utility model, and the changes or substitutions are intended to be covered by the scope of the present utility model; embodiments of the utility model and features of the embodiments may be combined with each other without conflict. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (6)
1. A wafer package testing apparatus, comprising: the probe comprises a probe platform (1), a glass shell (2), an air supply device (3), an air exhaust device (4) and an air exhaust port (5), wherein the top of the glass shell (2) is fixedly connected with the top of the probe platform (1), the air supply device (3) is fixedly connected to one side of the glass shell (2), the air exhaust device (4) is fixedly connected to the top of the glass shell (2), the air exhaust port (5) is fixedly connected to one corner of the top of the glass shell (2), a second fixing plate (10) is fixedly arranged on the inner wall of the bottom of the probe platform (1), and a first fixing plate (8) is fixedly arranged on the top of the second fixing plate (10);
the clamping assembly comprises a mounting plate (6) which is connected to the top of the second fixing plate (10) in a sliding manner and is used for clamping the chip;
the overvoltage protection assembly comprises a second round rod (17) fixedly arranged at the bottom of the mounting plate (6).
2. The wafer packaging testing device according to claim 1, wherein four guide posts (20) are fixedly installed at the top of the second fixing plate (10), four guide posts (20) are in sliding connection with the mounting plate (6), a third fixing plate (13) is fixedly installed at the top of the second fixing plate (10), the third fixing plate (13) is in sliding connection with a first round rod (12), one end of the first round rod (12) is fixedly connected with a V-shaped block (7), a spring (14) is sleeved on the outer side of the first round rod (12) between the V-shaped block (7) and the third fixing plate (13), a handle (15) is fixedly connected with the other end of the first round rod (12), and the bottom of the V-shaped block (7) is in sliding connection with the top of the mounting plate (6).
3. The wafer package testing device according to claim 1, wherein a round pad (18) is fixedly connected to the bottom of the second round rod (17), a round tube (16) is slidingly connected to the outer side of the round pad (18), and an air tube (19) is connected to the inner side of the round tube (16).
4. A wafer package testing device according to claim 3, wherein the air pipe (19) is connected to an air source, and a switching valve with a certain pressure is installed on the air pipe (19).
5. A wafer package testing device according to claim 2, characterized in that the bottom of the V-shaped block (7) is fixedly provided with a square bar (11), the square bar (11) being in sliding connection with the mounting plate (6).
6. A wafer package testing device according to any one of claims 1-3, wherein a rubber pad (9) is fixedly mounted on one side of the first fixing plate (8), and the rubber pad (9) is made of elastic polyurethane material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320214889.8U CN219320359U (en) | 2023-02-15 | 2023-02-15 | Wafer packaging testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320214889.8U CN219320359U (en) | 2023-02-15 | 2023-02-15 | Wafer packaging testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219320359U true CN219320359U (en) | 2023-07-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320214889.8U Active CN219320359U (en) | 2023-02-15 | 2023-02-15 | Wafer packaging testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219320359U (en) |
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- 2023-02-15 CN CN202320214889.8U patent/CN219320359U/en active Active
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