CN219313391U

CN219313391U - Semiconductor device with built-in detachable supporting structure

Info

Publication number: CN219313391U
Application number: CN202320250185.6U
Authority: CN
Inventors: 朱帅; 马亚玲
Original assignee: Shanghai Texian Photoelectric Technology Co ltd
Current assignee: Shanghai Texian Photoelectric Technology Co ltd
Priority date: 2023-02-20
Filing date: 2023-02-20
Publication date: 2023-07-07
Anticipated expiration: 2033-02-20

Abstract

The utility model discloses a semiconductor device with a built-in detachable supporting structure, which relates to the technical field of semiconductors and comprises a box body, wherein a semiconductor plate is arranged in the box body, a disassembly and assembly component is arranged below the semiconductor plate, a damping component is arranged between the disassembly and assembly component and the semiconductor plate, the damping component comprises an elastic steel plate, the elastic steel plate is arranged in an arc shape, the upper part of the elastic steel plate is attached to the semiconductor plate, two ends of the elastic steel plate are fixedly connected with connecting columns, and a damping block is arranged between one end of each connecting column and the inner wall of each mounting block. According to the utility model, through the damping component, the vibration force can be weakened through the damping component, the safety of the semiconductor device is ensured, the damage of the semiconductor device caused by vibration is reduced, and the arranged dismounting component can be used for rapidly dismounting the semiconductor plate, so that personnel can conveniently replace the semiconductor plate, and the efficiency of replacing the semiconductor device is prevented from being influenced due to complicated dismounting.

Description

Semiconductor device with built-in detachable supporting structure

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a semiconductor device with a built-in detachable supporting structure.

Background

Semiconductor devices are electronic devices that have electrical conductivity between good electrical conductors and insulators, and that utilize the specific electrical characteristics of semiconductor materials to perform specific functions, and can be used to generate, control, receive, transform, amplify signals, and perform energy conversion.

When the semiconductor device is installed, the semiconductor plate is directly installed inside through the screws, and vibration cannot be reduced when vibration occurs, so that the semiconductor device is damaged, and the semiconductor device is damaged.

Disclosure of Invention

Based on this, it is an object of the present utility model to provide a semiconductor device with a built-in detachable support structure, which solves the technical problems set forth in the background above.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor device of bearing structure is dismantled to built-in, includes the box, the inside semiconductor plate that is provided with of box, the semiconductor plate below is provided with the dismouting subassembly, be provided with damper between dismouting subassembly and the semiconductor plate, damper includes the elastic steel board, the elastic steel board is the arcuation setting, the elastic steel board top is laminated mutually with the semiconductor plate, elastic steel board both ends and spliced pole fixed connection, spliced pole movable mounting is inside the installation piece, be provided with the damping piece between spliced pole one end and the installation piece inner wall, be provided with the spring between damping piece outer wall and the installation piece lateral wall.

Preferably, the dismounting component comprises a mounting column, the lower part of the mounting column is fixedly connected with a limiting rod, the upper end of the mounting column is fixedly connected with the semiconductor plate, a sleeve is movably sleeved on the outer wall of the mounting column, a spring is arranged between the inner wall of the sleeve and the outer wall of the mounting column, and the limiting rod extends to the inner wall of the box body to be movably connected with the mounting plate.

Preferably, the mounting plate is provided with two, and two mounting plates set up with box center pin symmetry, mounting plate one end is provided with first guide bar, the mounting plate other end is provided with the second guide bar, be provided with the bull stick between the mounting plate, bull stick outer wall fixed cover is equipped with the carousel, carousel one side is connected with the connecting block through the pivot, connecting block one end is through pivot and pull rod swing joint, pull rod one end and connecting rod fixed connection, connecting rod both ends and mounting plate fixed connection.

Preferably, the first guide rod is movably mounted inside the mounting plate, the outer wall of the first guide rod is sleeved with a spring, the second guide rod is movably mounted inside the mounting plate, and a spring is arranged between one end of the second guide rod and the inner wall of the mounting plate.

Preferably, one end of the rotating rod is movably arranged on the inner wall of the box body through a rotating shaft, and the other end of the rotating rod extends to the outer wall of the box body to be fixedly connected with the rotating handle.

In summary, the utility model has the following advantages:

according to the utility model, through the damping component, the vibration force can be weakened through the damping component, the safety of the semiconductor device is ensured, the damage of the semiconductor device caused by vibration is reduced, and the arranged dismounting component can be used for rapidly dismounting the semiconductor plate, so that personnel can conveniently replace the semiconductor plate, and the efficiency of replacing the semiconductor device is prevented from being influenced due to complicated dismounting.

Drawings

FIG. 1 is a front cross-sectional view of the present utility model;

FIG. 2 is a top cross-sectional view of the present utility model;

FIG. 3 is a front view of the turntable of the present utility model;

fig. 4 is a side view of the mounting plate of the present utility model.

In the figure: 1. a case; 2. a semiconductor board; 3. a mounting column; 4. a mounting plate; 5. a rotating rod; 6. a sleeve; 7. an elastic steel plate; 8. a connecting column; 9. a rotating handle; 10. a limit rod; 11. a mounting block; 12. a damping block; 13. a first guide bar; 14. a second guide bar; 15. a pull rod; 16. a connecting rod; 17. a turntable; 18. and (5) connecting a block.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

Hereinafter, an embodiment of the present utility model will be described in accordance with its entire structure.

1-4, including box 1, box 1 inside is provided with semiconductor plate 2, and semiconductor plate 2 below is provided with the dismouting subassembly, is provided with damper between dismouting subassembly and the semiconductor plate 2, and damper includes elastic steel plate 7, and elastic steel plate 7 is the arcuation setting, and elastic steel plate 7 top is laminated mutually with semiconductor plate 2, and elastic steel plate 7 both ends and spliced pole 8 fixed connection, spliced pole 8 movable mounting are inside installation piece 11, are provided with damping piece 12 between spliced pole 8 one end and the installation piece 11 inner wall, are provided with the spring between damping piece 12 outer wall and the installation piece 11 lateral wall.

When the semiconductor plate 2 vibrates, the elastic steel plate 7 is extruded downwards, two ends of the elastic steel plate 7 move towards two sides, the connecting columns 8 are extruded, the vibration force of the elastic steel plate is weakened through springs, the semiconductor plate 2 is quickly and stably lowered through the damping blocks 12, and damage to devices above the semiconductor plate 2 caused by vibration of the semiconductor plate 2 is prevented.

Referring to fig. 2-4, the dismounting component comprises a mounting column 3, the lower part of the mounting column 3 is fixedly connected with a limiting rod 10, the upper end of the mounting column 3 is fixedly connected with a semiconductor plate 2, a sleeve 6 is movably sleeved on the outer wall of the mounting column 3, springs are arranged between the inner wall of the sleeve 6 and the outer wall of the mounting column 3, the limiting rod 10 extends to the inner wall of a box body 1 and is movably connected with a mounting plate 4, the mounting plate 4 is provided with two mounting plates 4 symmetrically arranged around the central axis of the box body 1, one end of each mounting plate 4 is provided with a first guide rod 13, the other end of each mounting plate 4 is provided with a second guide rod 14, a rotating rod 5 is arranged between the mounting plates 4, a rotating disc 17 is fixedly sleeved on the outer wall of each rotating rod 5, one side of each rotating disc 17 is connected with a connecting block 18 through a rotating shaft, one end of each connecting block 18 is movably connected with a pull rod 15 through the rotating shaft, one end of each pull rod 15 is fixedly connected with each connecting rod 16, two ends of each connecting rod 16 are fixedly connected with each mounting plate 4, each first guide rod 13 is movably mounted inside each mounting plate 4, each first guide rod 13 is movably sleeved on the outer wall of each first guide rod 13, each second guide rod 14 is movably mounted inside each mounting plate 4, each second guide rod 14 is symmetrically is respectively, a spring is arranged between one end of each mounting plate 4 and each mounting plate 5 is fixedly connected with the inner wall through the corresponding rotating rod 5 through the corresponding shaft 5.

Through rotating handle 9, drive bull stick 5 and rotate, drive carousel 17 and rotate then, pull rod 15 through connecting block 18, then the pulling connecting rod 16 inwards moves, drive mounting panel 4 to one side removal, make the inside recess of its mounting panel 4 break away from gag lever post 10, the spring that sets up through sleeve 6 inner wall, drive gag lever post 10 break away from box 1 inner wall, can accomplish the dismantlement, during the installation, downwardly moving semiconductor plate 2, extrude mounting panel 4 through the hole, after the extrusion is to the certain position, reset through the spring, carry out spacingly to gag lever post 10, can accomplish the installation, quick dismouting, the required time of workman's change semiconductor device can be reduced.

When the vibration damping device is used, the rotating rod 5 is driven to rotate through the rotating handle 9, the turntable 17 is driven to rotate, the pull rod 15 is pulled through the connecting block 18, the connecting rod 16 is pulled to move inwards, the mounting plate 4 is driven to move to one side, the groove in the mounting plate 4 is separated from the limiting rod 10, the spring arranged through the inner wall of the sleeve 6 drives the limiting rod 10 to be separated from the inner wall of the box body 1, the disassembly can be completed, and vibration is weakened through the damping component when vibration occurs.

Although embodiments of the utility model have been shown and described, the detailed description is to be construed as exemplary only and is not limiting of the utility model as the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples, and modifications, substitutions, variations, etc. may be made in the embodiments as desired by those skilled in the art without departing from the principles and spirit of the utility model, provided that such modifications are within the scope of the appended claims.

Claims

1. The utility model provides a semiconductor device of supporting structure is dismantled to built-in, includes box (1), its characterized in that: a semiconductor plate (2) is arranged in the box body (1), a disassembly and assembly component is arranged below the semiconductor plate (2), and a damping component is arranged between the disassembly and assembly component and the semiconductor plate (2);

the damping assembly comprises an elastic steel plate (7), the elastic steel plate (7) is arranged in an arc shape, the upper portion of the elastic steel plate (7) is attached to a semiconductor plate (2), two ends of the elastic steel plate (7) are fixedly connected with a connecting column (8), the connecting column (8) is movably mounted inside a mounting block (11), a damping block (12) is arranged between one end of the connecting column (8) and the inner wall of the mounting block (11), and a spring is arranged between the outer wall of the damping block (12) and the side wall of the mounting block (11).

2. A semiconductor device incorporating a detachable support structure according to claim 1, wherein: the assembly and disassembly components comprise mounting columns (3), the lower portions of the mounting columns (3) are fixedly connected with limiting rods (10), the upper ends of the mounting columns (3) are fixedly connected with a semiconductor plate (2), sleeves (6) are movably sleeved on the outer walls of the mounting columns (3), springs are arranged between the inner walls of the sleeves (6) and the outer walls of the mounting columns (3), and the limiting rods (10) extend to the inner walls of the box body (1) to be movably connected with the mounting plates (4).

3. A semiconductor device incorporating a detachable support structure according to claim 2, wherein: the utility model discloses a box, including box (1) center pin symmetry, mounting panel (4) are provided with two, and two mounting panel (4) set up about box (1) center pin symmetry, mounting panel (4) one end is provided with first guide bar (13), the mounting panel (4) other end is provided with second guide bar (14), be provided with bull stick (5) between mounting panel (4), the fixed cover of bull stick (5) outer wall is equipped with carousel (17), carousel (17) one side is connected with connecting block (18) through the pivot, connecting block (18) one end is through pivot and pull rod (15) swing joint, pull rod (15) one end and connecting rod (16) fixed connection, connecting rod (16) both ends and mounting panel (4) fixed connection.

4. A semiconductor device incorporating a detachable support structure according to claim 3, wherein: the first guide rod (13) is movably mounted inside the mounting plate (4), a spring is sleeved on the outer wall of the first guide rod (13), the second guide rod (14) is movably mounted inside the mounting plate (4), and a spring is arranged between one end of the second guide rod (14) and the inner wall of the mounting plate (4).

5. A semiconductor device incorporating a detachable support structure according to claim 3, wherein: one end of the rotating rod (5) is movably arranged on the inner wall of the box body (1) through a rotating shaft, and the other end of the rotating rod (5) extends to the outer wall of the box body (1) to be fixedly connected with the rotating handle (9).