CN219304903U - Depth imaging module - Google Patents

Abstract

The application belongs to the 3D camera field, specifically discloses a degree of depth imaging module, including installation mechanism, formation of image subassembly and master control circuit board, master control circuit board is connected with installation mechanism, and formation of image subassembly is attached on master control circuit board, and formation of image subassembly and master control circuit board electric connection, and the corresponding position punishment with formation of image subassembly on the installation mechanism do not is provided with the trompil, and the up end of formation of image subassembly stretches out the trompil that corresponds respectively. In the method, the whole main control circuit board is connected with the mounting mechanism for limiting, so that the difficulty of assembly is reduced; the imaging assembly is integrally attached to the main control circuit board, and each module is not required to be manufactured independently, so that manufacturing process steps are saved, and the overall manufacturing cost can be effectively reduced.

Description

Depth imaging module

Technical Field

The application belongs to the technical field of 3D cameras, and more specifically relates to a depth imaging module.

Background

The 3D camera is also called a depth camera, and is most different from a general video camera in that distance information of a photographing space can be detected by the 3D camera. 3D camera technology has been widely used in various fields, for example: robot, unmanned aerial vehicle, intelligent house, security protection etc..

The depth imaging module is an important component of a depth camera, and Chinese patent ZL202220696577.0 discloses a depth imaging module which is mainly used for being installed on a face recognition door lock; at present, in the assembly process, each single module is firstly installed on a photoelectric support in a dispensing mode, then each module is respectively connected with a main control circuit board by using an FPC, and then outgoing lines of the FPC are straightened, so that the photoelectric support and a rear cover are fixed. Therefore, the existing depth imaging module needs to use a plurality of accessories such as FPC (flexible printed circuit), connectors and the like during assembly, and meanwhile, wires of each FPC need to be straightened during the assembly process, the whole assembly process is complex, more materials need to be managed and controlled, and the manufacturing cost is high.

Disclosure of Invention

In order to solve the problem that exists among the above-mentioned prior art, this application provides a degree of depth imaging module, including installation mechanism, formation of image subassembly and master control circuit board, master control circuit board is connected with installation mechanism, and formation of image subassembly is attached on master control circuit board, and formation of image subassembly and master control circuit board electric connection, and the corresponding position punishment with formation of image subassembly on the installation mechanism do not is provided with the trompil, and the up end of formation of image subassembly stretches out the trompil that corresponds respectively.

As a further improvement of this application, the installation mechanism includes photoelectric support and back lid, and photoelectric support is connected with the back lid, has reserved between photoelectric support and the back lid and holds the cavity, and master control circuit board and imaging module set up respectively in holding the cavity, and master control circuit board and photoelectric support connection, trompil setting are on photoelectric support.

As a further improvement of the application, a connecting piece is arranged on the main control circuit board and is respectively connected with the main control circuit board and the photoelectric support; the connecting piece comprises a first foam rubber, and the upper end face and the lower end face of the first foam rubber are respectively bonded with the main control circuit board and the photoelectric support.

As a further improvement of the application, a positioning column is arranged on the photoelectric support, a first positioning hole is formed in the position, corresponding to the positioning column, of the rear cover, a second positioning hole is formed in the main control circuit board, and the positioning column can sequentially penetrate through the corresponding second positioning hole and the corresponding first positioning hole; the number of the positioning columns, the number of the first positioning holes and the number of the second positioning holes are two respectively.

As a further improvement of the application, a protection mechanism is arranged on the surface of one side of the photoelectric support, which is far away from the main control circuit board, and the protection mechanism is used for being connected with an external structure; the protection mechanism comprises a second foam rubber and a black film, and the black film is respectively connected with the second foam rubber and the photoelectric support.

As a further improvement of the application, the imaging assembly comprises a projection module, an imaging module and a light supplementing module, wherein the light supplementing module is arranged between the projection module and the imaging module, and the light supplementing module, the projection module and the imaging module are respectively attached to the main control circuit board; the imaging module comprises an infrared camera, the light supplementing module comprises a floodlight, and the projection module, the infrared camera and the floodlight are respectively and electrically connected with the main control circuit board.

Compared with the prior art, the beneficial effects of this application are:

1. the imaging component is attached to the main control circuit board, and the main control circuit board is integrally connected with the mounting mechanism to limit, so that the trouble that FPC wires are required to be straightened out when FPC connection is used in the prior art is omitted, and the difficulty of assembly is reduced.

2. This application need not to use FPC to connect, saves multiple material, for example: and a plurality of FPCs, connectors (male and female seats) and the like, so that the overall material cost is reduced.

3. The imaging component is integrally attached to the main control circuit board, and each module is not required to be manufactured independently, so that manufacturing process steps are saved, and the overall manufacturing cost can be effectively reduced.

Drawings

For a clearer description of the present application or of the solutions of the prior art, a brief introduction will be given below to the drawings used in the description of the embodiments or of the prior art, it being apparent that the drawings in the description below are some embodiments of the present application, from which other drawings can be obtained, without the inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of the overall structure of an embodiment of the present application;

FIG. 2 is an exploded view of an embodiment of the present application;

fig. 3 is a schematic view of the structure of an optoelectronic bracket in an embodiment of the present application.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.

In order to better understand the technical solutions of the present application, the following description will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings.

As shown in fig. 1-3, a depth imaging module comprises an installation mechanism, an imaging assembly and a main control circuit board 1, wherein the main control circuit board 1 is installed on the installation mechanism, and the main control circuit board 1 is used for controlling the imaging assembly to work and receiving image data acquired by the imaging assembly to process so as to acquire depth information; the imaging component is attached to the main control circuit board 1, and is electrically connected with the main control circuit board 1 and used for acquiring image data and transmitting the image data to the main control circuit board 1; the corresponding positions of the mounting mechanism and the imaging component are respectively provided with an opening, the upper end face of the imaging component can extend out of the corresponding opening, and the imaging component protrudes out of the opening to enable the imaging component to emit or receive light outwards, so that imaging work is facilitated.

In this embodiment, the imaging component is attached to the surface of the main control circuit board 1, so that no additional FPC is required to be inserted during assembly, the trouble of straightening out the wires of the FPC is avoided while the material is saved, the difficulty of assembly is reduced, and the processing and assembling efficiency is improved. In other embodiments, the imaging assembly may be fixed to the main control circuit board 1 in other manners, for example: dispensing, bonding, screw fixation, etc., without limitation.

As shown in fig. 2, the mounting mechanism is used as a specific accommodating mechanism of the depth imaging module, and comprises a photoelectric support 2 and a rear cover 3, wherein the photoelectric support 2 is fixedly connected with the rear cover 3 through a connecting screw 4, and the connecting screw 4 is used for facilitating later disassembly and maintenance; specifically, the connecting studs 21 are respectively arranged at the corners of the lower end surface 4 of the photoelectric support 2, the connecting holes 31 are respectively arranged at the corresponding positions of the rear cover 3 and the connecting studs 21, the connecting screws 4 penetrate through the connecting holes 31 and then are connected with the connecting studs 21, and after the connecting screws 4 are screwed, the photoelectric support 2 and the rear cover 3 are limited and fixed. An accommodating cavity for accommodating the main control circuit board 1 and the imaging component is reserved between the photoelectric support 2 and the rear cover 3, the main control circuit board 1 and the imaging component are respectively arranged in the accommodating cavity, the main control circuit board 1 is connected with the photoelectric support 2, and the holes in the corresponding positions of the mounting mechanism and the imaging component are formed in the photoelectric support 2.

In this embodiment, the upper surface of the main control circuit board 1 is attached with the first foam rubber 5, the upper and lower two end surfaces of the first foam rubber 5 are both sticky, the upper and lower two end surfaces of the first foam rubber 5 are respectively adhered and fixed with the inner side surfaces of the main control circuit board 1 and the photoelectric support 2, so that the main control circuit board 1 is fixedly connected with the photoelectric support 2, and the first foam rubber 5 has a certain elasticity, so that the main control circuit board 1 and the photoelectric support 2 are in a flexible connection state, the influence on an imaging assembly when the photoelectric support 2 is impacted by external force can be reduced, and the working stability of the depth imaging module is ensured, for example: in the process of assembling the face recognition lockset, the depth imaging module is required to be installed in the shell of the door lock, and at the moment, the photoelectric support 2 is easy to be pressed or extruded by an operator.

In other embodiments, the first foam 5 may be replaced with other devices or structures, such as: the main control circuit board 1 is fixed with the photoelectric support 2 by using screws, the photoelectric support 2 is bonded with the main control circuit board 1 by using glue, the main control circuit board 1 is packaged and fixed with the photoelectric support 2 by glue filling, and the like.

Compared with the prior art, the main control circuit board 1 and the rear cover 3 are fixed in a screw fixing manner, the main control circuit board 1 and the photoelectric support 2 are connected and fixed by the depth imaging module, and the flexible connection manner is adopted, so that the main control circuit board 1 and the rear cover 3 are suspended, the assembly process of the main control circuit board 1 and the rear cover 3 or the assembly process of the rear cover 3 and other external mechanisms can be prevented, the imaging precision of an imaging assembly is prevented from being influenced by the stress of the main control circuit board 1, the working precision of the depth imaging module is improved, and the processing quality is ensured.

In this embodiment, the imaging module includes projection module 6, imaging module 7 and light supplementing module 8, wherein, light supplementing module 8 sets up between projection module 6 and imaging module 7, and projection module 6, imaging module 7 and light supplementing module 8 three are attached respectively on the surface of main control circuit board 1, and respectively with main control circuit board 1 electric connection, trompil on the photoelectric support 2 include 3 hole sites that correspond with projection module 6, imaging module 7 and light supplementing module 8 respectively. The imaging module 7 is used for collecting images or video information, and the imaging module 7 can be an infrared camera or an RGB camera; the projection module 6 is used for providing a light source, and the auxiliary imaging module 7 is used for collecting images or video information; the light supplementing module 8 may be a floodlight, both the floodlight and the projection module 6 are used for projecting an active beam to a target, and when the imaging module 7 images, the infrared floodlight or the projection module 6 can be independently turned on according to different needs, for example, the floodlight is turned on when the infrared floodlight image needs to be acquired, and the projection module 6 is turned on when the depth image needs to be acquired. In some embodiments, the floodlight and the projection module 6 may also be turned on simultaneously. Of course, in other embodiments, the light supplementing module 8 may have a plurality of floodlights, and may be arranged in a circular array and on the periphery of the imaging module 7 or arranged in a matrix array on one side of the imaging module 7.

In one embodiment, as shown in fig. 3, a positioning column 22 is disposed on an end surface of the photoelectric support 2 near one side of the main control circuit board 1, a first positioning hole 32 is disposed on the rear cover 3 corresponding to the positioning column 22, when the depth imaging module is assembled, the positioning column 22 of the photoelectric support 2 is inserted into the first positioning hole 32 in a aligned manner, then a connecting screw 4 is used to pass through the connecting hole 31 and then connected with the connecting stud 21, and then the connecting screw 4 is screwed down, so that the photoelectric support 2 and the rear cover 3 are limited and fixed. By arranging the positioning column 22 and the first positioning hole 32, the photoelectric support 2 and the rear cover 3 can be pre-connected and positioned during assembly, and the assembly efficiency is improved; the photoelectric support 2 and the rear cover 3 can be prevented from deviating in the assembly process, so that the processing yield and the installation accuracy are improved.

In order to facilitate assembly of the main control circuit board 1 and the photoelectric support 2, second positioning holes 11 are respectively formed in the positions, corresponding to the positioning columns 22, of the main control circuit board 1, when the main control circuit board 1 is mounted on the photoelectric support 2, an operator firstly sticks the first foam rubber 5 to the upper surface of the main control circuit board 1, then passes through the second positioning holes 11 and the positioning columns 22 in a counterpoint mode, passes the positioning columns 22 through the second positioning holes 11, and then is fixedly bonded to the inner side surfaces of the main control circuit board 1 and the photoelectric support 2. Through the cooperation of second locating hole 11 and reference column 22 for main control circuit board 1 can realize the preconnection location when equipment with photoelectric support 2, improved efficiency and the precision of equipment, ensure projection module 6, imaging module 7 and moisturizing module 8 can bulge 3 trompils that correspond on the photoelectric support 2.

In this embodiment, the number of the positioning posts 22, the first positioning holes 32 and the second positioning holes 11 is two, and the positions of the positioning posts 22 and the first positioning holes 32 are in one-to-one correspondence, and the two positioning posts 22 are respectively arranged on the left side and the right side of the lower end surface of the photoelectric support 2; in other embodiments, the number of positioning posts 22, first positioning holes 32, and second positioning holes 11 may be any other number.

Further, as shown in fig. 2, a protection mechanism is arranged on the surface of the photoelectric support 2, which is far away from one side of the main control circuit board 1, and the protection mechanism can prevent the photoelectric support 2 from being mistakenly touched to generate stains or abrasion in the use process, and can effectively protect the photoelectric support 2; meanwhile, the protection mechanism is also used for installing and fixing the photoelectric support 2 and the front shell of the door lock when the face recognition door lock is assembled. The protection mechanism comprises a second foam rubber 9 and a black film 10, wherein the black film 10 is arranged between the photoelectric support 2 and the second foam rubber 9, and the black film 10 is respectively adhered and fixed with the second foam rubber 9 and the photoelectric support 2. The black film 10 is made of PET material, has good black uniformity, does not have the risk of decoloring and layering, and can well protect the surface of the inner photoelectric support 2 from corrosion; the second foam rubber 9 is arranged, so that the abrasion caused by the direct contact of an external object with the surface of the photoelectric support 2 can be avoided, and the second foam rubber 9 has certain elasticity, so that the shockproof and anti-impact properties of the photoelectric support 2 are improved; when the depth imaging module is installed on the face recognition door lock, the second foam glue 9 is bonded and sealed with the front shell of the door lock, so that the waterproof and dustproof effects of the surface of the photoelectric support 2 are ensured.

The assembly process of the depth imaging module is as follows:

firstly, aligning a projection module 6, an imaging module 7 and a light supplementing module 8 to preset welding positions on a main control circuit board 1, and respectively welding and attaching the projection module 6, the imaging module 7 and the light supplementing module 8 to the main control circuit board 1; then attaching the first foam rubber 5 to the upper surface of the main control circuit board 1, aligning the second positioning holes 11 on the main control circuit board 1 with the positioning columns 22 on the photoelectric support 2, penetrating the positioning columns 22 through the second positioning holes 11, and then adhering and fixing the first foam rubber 5 to the inner side surface of the photoelectric support 2 to ensure that the photoelectric support 2 is adhered and fixed with the main control circuit board 1; positioning the positioning column 22 and the first positioning hole 32, respectively penetrating the positioning column 22 through the first positioning hole 32 to enable the photoelectric support 2 and the rear cover 3 to finish the pre-positioning, penetrating the connecting hole 31 through the connecting screw 4 to be connected with the connecting stud 21, and then screwing the connecting screw 4 to enable the photoelectric support 2 and the rear cover 3 to be limited and fixed; finally, a black film 10 and a second foam glue 9 are sequentially attached to the upper surface of the photoelectric support 2.

When the depth imaging module is installed in the face recognition door lock, the depth imaging module is integrally installed on the front shell of the door lock, so that the second foam rubber 9 is bonded and sealed with the front shell of the door lock, and then the rear cover 3 is installed and fixed with other mechanisms of the door lock.

It is apparent that the embodiments described above are only some embodiments of the present application, but not all embodiments, the preferred embodiments of the present application are given in the drawings, but not limiting the patent scope of the present application. This application may be embodied in many different forms, but rather, embodiments are provided in order that the present disclosure may be more fully understood. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing, or equivalents may be substituted for elements thereof. All equivalent structures made by the specification and the drawings of the application are directly or indirectly applied to other related technical fields, and are also within the protection scope of the application.

Claims (10)

1. The utility model provides a degree of depth formation of image module, includes installation mechanism, formation of image subassembly and master control circuit board, its characterized in that: the main control circuit board is connected with the mounting mechanism, the imaging assembly is attached to the main control circuit board, the imaging assembly is electrically connected with the main control circuit board, holes are respectively formed in the corresponding positions of the mounting mechanism and the imaging assembly, and the upper end faces of the imaging assembly extend out of the corresponding holes respectively.

2. The depth imaging module of claim 1, wherein: the mounting mechanism comprises a photoelectric support and a rear cover, the photoelectric support is connected with the rear cover, a containing cavity is reserved between the photoelectric support and the rear cover, the main control circuit board and the imaging component are respectively arranged in the containing cavity, the main control circuit board is connected with the photoelectric support, and the opening is formed in the photoelectric support.

3. The depth imaging module of claim 2, wherein: the main control circuit board is provided with a connecting piece, and the connecting piece is respectively connected with the main control circuit board and the photoelectric support.

4. A depth imaging module according to claim 3, wherein: the connecting piece comprises first foam rubber, and the upper end face and the lower end face of the first foam rubber are respectively bonded with the main control circuit board and the photoelectric support.

5. The depth imaging module of any one of claims 2-4, wherein: the photoelectric support is provided with a positioning column, a first positioning hole is formed in the position, corresponding to the positioning column, of the rear cover, and the positioning column can be inserted into the first positioning hole.

6. The depth imaging module of claim 5, wherein: the main control circuit board is provided with a second positioning hole, and the positioning column can sequentially pass through the corresponding second positioning hole and the first positioning hole.

7. The depth imaging module of claim 6, wherein: the number of the positioning columns, the number of the first positioning holes and the number of the second positioning holes are two respectively.

8. The depth imaging module of claim 2, wherein: the surface of the photoelectric support, which is far away from one side of the main control circuit board, is provided with a protection mechanism, and the protection mechanism is used for being connected with an external structure;

the protection mechanism comprises a second foam rubber and a black film, and the black film is respectively connected with the second foam rubber and the photoelectric support.

9. The depth imaging module of any one of claims 1-4 or any one of claims 6-8, wherein: the imaging assembly comprises a projection module, an imaging module and a light supplementing module, wherein the light supplementing module is arranged between the projection module and the imaging module, and the light supplementing module, the projection module and the imaging module are respectively attached to the main control circuit board.

10. The depth imaging module of claim 9, wherein: the imaging module comprises an infrared camera, the light supplementing module comprises a floodlight, and the projection module, the infrared camera and the floodlight are respectively and electrically connected with the main control circuit board.

Images