CN219296567U - Transfer mechanism and general semiconductor processing equipment - Google Patents
Transfer mechanism and general semiconductor processing equipment Download PDFInfo
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- CN219296567U CN219296567U CN202223529528.7U CN202223529528U CN219296567U CN 219296567 U CN219296567 U CN 219296567U CN 202223529528 U CN202223529528 U CN 202223529528U CN 219296567 U CN219296567 U CN 219296567U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The application relates to the technical field of semiconductor devices, in particular to a transfer mechanism and semiconductor processing equipment. The transfer mechanism comprises a first connecting piece, a first gripper assembly and a second gripper assembly, wherein the first connecting piece is suitable for rotating around a first direction; the first handle assembly is mounted on the first connecting piece; the second handle assembly is arranged on the first connecting piece, the rotation center of the first connecting piece is located between the first handle assembly and the second handle assembly, and the first handle assembly and the second handle assembly are arranged in a central symmetry mode. This application is through first handle subassembly and the second handle subassembly that is central symmetry setting for first handle subassembly or second handle subassembly is snatching the processing position that the product can be faster transporting processingequipment, has reduced processingequipment's processing platform and has adjusted the time, secondly, rotates along first direction through first connecting piece, makes the position of first handle subassembly and second handle subassembly switch the material loading, can reduce transfer mechanism's volume effectively.
Description
Technical Field
The utility model relates to the technical field of semiconductor processing, in particular to a transfer mechanism and semiconductor processing equipment.
Background
When the wafer is fed and discharged, the wafer is generally transferred between the material box and the laser processing equipment by adopting the transfer mechanism, but the existing transfer mechanism is large in size and long in travel, the space occupancy rate of the transfer mechanism is too high, the transfer mechanism can only move in the straight line direction generally, the processing platform of the laser processing equipment needs to move to the end point of the transfer mechanism to realize discharging, and the whole working efficiency of the transfer mechanism cannot be ensured.
Disclosure of Invention
The utility model solves the problem that the whole machining efficiency of equipment caused by the existing transfer mechanism is lower.
In one aspect, to solve the above-mentioned problems, the present utility model provides a transfer mechanism, which includes a first connector, a first gripper assembly and a second gripper assembly, where the first connector is adapted to rotate around a first direction; the first gripper assembly is mounted on the first connecting piece; the second gripper assembly is installed on the first connecting piece, the first gripper assembly and the second gripper assembly are used for grabbing products, the rotation center of the first connecting piece is located between the first gripper assembly and the second gripper assembly, and the first gripper assembly and the second gripper assembly are arranged in a central symmetry mode.
Optionally, the first handle assembly includes a first driving mechanism, a first adsorption component and a second adsorption component, the first driving mechanism is installed on the first connector, the first driving mechanism is respectively in driving connection with the first adsorption component and the second adsorption component, and the first driving mechanism is suitable for driving the first adsorption component and the second adsorption component to approach or separate.
Optionally, the first adsorption component comprises a second connecting piece and a suction nozzle structure, the first driving mechanism is in driving connection with the second connecting piece, the suction nozzle structure is movably mounted on the second connecting piece, and the position of the suction nozzle structure relative to the second connecting piece is adjustable.
Optionally, the second connecting piece includes first section and second section, first section with the second section is the contained angle setting, first section install in first actuating mechanism's drive end, the suction nozzle structure install respectively in the relative both ends of second section, just first section is located two between the suction nozzle structure.
Optionally, the second connecting piece is provided with a reinforcing rib.
Optionally, the transfer mechanism further includes a third connecting piece, the third connecting piece is installed on the first connecting piece, a waist-shaped hole is formed in the third connecting piece, and a bolt is suitable for penetrating through the waist-shaped hole and is connected with the first driving mechanism.
Optionally, the second handle assembly includes a second driving mechanism, a third adsorption component and a fourth adsorption component, the second driving mechanism is installed on the first connector, the second driving mechanism is respectively in driving connection with the third adsorption component and the fourth adsorption component, and the second driving mechanism is suitable for driving the third adsorption component and the fourth adsorption component to approach or separate.
Optionally, the transfer mechanism further comprises a rotation mechanism, wherein the rotation mechanism is in driving connection with the first connecting piece, and the rotation mechanism is suitable for driving the first connecting piece to rotate around the first direction.
Optionally, the transfer mechanism further includes a third driving mechanism, the third driving mechanism is mounted on the driving end of the rotating mechanism, the third driving mechanism is in driving connection with the first connecting piece, and the third driving mechanism is suitable for driving the first connecting piece to move along the first direction.
Optionally, the first connecting piece is provided with a plurality of holes.
On the other hand, the embodiment of the utility model also provides general semiconductor processing equipment, which comprises the transfer mechanism.
Compared with the prior art, the transfer mechanism provided by the embodiment of the utility model has the beneficial effects that:
through first tongs subassembly and the second tongs subassembly that is central symmetry and set up for first tongs subassembly or second tongs subassembly are snatching the processing position that the product can be faster transporting processingequipment, have reduced processingequipment's processing platform and have adjusted the time, secondly, rotate along first direction through first connecting piece, make the position of first tongs subassembly and second tongs subassembly carry out the switching material loading, can reduce transfer mechanism's volume effectively, avoid the waste of too much material.
Drawings
FIG. 1 is a schematic structural diagram of a transfer mechanism according to an embodiment of the present utility model;
FIG. 2 is a schematic structural view of another embodiment of a transfer mechanism according to the present utility model;
FIG. 3 is a schematic structural view of another embodiment of the transfer mechanism of the present utility model;
fig. 4 is a partial enlarged view at a in fig. 3.
Reference numerals illustrate:
1-a first connector; 11-opening holes; 2-a first gripper assembly; 21-a first drive mechanism; 22-a first adsorbent member; 221-a second connector; 222-suction nozzle configuration; 223-reinforcing ribs; 23-a second adsorbent member; 3-a second gripper assembly; 31-a second drive mechanism; 32-a third adsorbent member; 33-a fourth adsorption member; 4-a third connector; 5-a third drive mechanism; 6-a rotation mechanism.
Detailed Description
The terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly coupled, detachably coupled, or rotatably coupled; may be a mechanical connection; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.
The coordinate system XYZ is provided in the drawings of the embodiments of the present utility model, in which the forward direction of the X axis represents the right direction, the reverse direction of the X axis represents the left direction, the forward direction of the Z axis represents the upper direction, the reverse direction of the Z axis represents the lower direction, the forward direction of the Y axis represents the front direction, and the reverse direction of the Y axis represents the rear direction, and the directions or positional relationships indicated by the terms "upper", "lower", "front", "rear", "left", and "right", etc. are based on the directions or positional relationships shown in the drawings, only for convenience of description and simplification of description, but do not indicate or imply that the device referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model.
The terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
As shown in fig. 1 and 2, an embodiment of the present utility model provides a transfer mechanism. The transfer mechanism comprises a first connecting piece 1, a first handle assembly 2 and a second handle assembly 3, wherein the first connecting piece 1 is suitable for rotating around a first direction; the first gripper assembly 2 is mounted on the first connecting piece 1; the second gripper assembly 3 is mounted on the first connecting piece 1, the first gripper assembly 2 and the second gripper assembly 3 are used for grabbing products, the rotation center of the first connecting piece 1 is located between the first gripper assembly 2 and the second gripper assembly 3, and the first gripper assembly 2 and the second gripper assembly 3 are arranged in a central symmetry mode.
The product can be a wafer, in the production and processing process of the wafer, the wafer needs to be taken out from a feeding station and transferred to a processing station for processing, and the processed wafer also needs to be uniformly recovered and fed, and the first direction can be the direction of a Z axis in the figure.
For example, the wafers may be sequentially placed on a loading platform on which the material is to be taken, and the first gripper assembly 2 may first grip the first wafer. And after the first gripper assembly 2 fixes the first wafer, the first connecting piece 1 may be rotated in the Z-axis direction, so that the first gripper assembly 2 moves to be close to the processing device. The first gripper assembly 2 can now place a wafer on the processing platform of the processing device, while the second gripper assembly 3 is now located close to the loading platform due to the rotation of the first connecting piece 1, and at this time, the second wafer is placed on the loading platform continuously.
The second gripper assembly 3 may grasp the second wafer after the processing device processes the first wafer, and the first gripper assembly 2 may grasp the first wafer processed by the processing device when the second gripper assembly 3 grasps the second wafer. At this time, after the first connecting piece 1 rotates around the Z-axis direction, the second wafer is transferred to the processing platform by the second gripper assembly 3, and the first processed wafer can be placed back onto the loading platform by the first gripper assembly 2, and the processed first wafer is removed from the loading platform to be stored uniformly. After the first wafer is removed from the loading platform, a third wafer may continue to be placed on the loading platform.
When the processing device finishes processing a second wafer, the first gripper assembly 2 can grab the third wafer, the second gripper assembly 3 can grab the processed second wafer, and after grabbing, the first connecting piece 1 rotates along the Z-axis direction, so that the third wafer is transferred to the processing platform by the first gripper assembly 2, the processed second wafer can be placed back to the feeding platform by the second gripper assembly 3, and the processed second wafer is removed from the feeding platform to be uniformly stored.
And under the general circumstances, loading platform and processing platform are not in on a straight line, probably have certain dislocation between the two, although processing platform can follow X axle and Y axle direction and remove, but all need to remove processing platform to the same straight line with the loading platform before processing at every turn and lead to holistic process time to increase, have influenced efficiency. Therefore, through setting up dislocation first tongs subassembly 2 and second tongs subassembly 3 for first connecting piece 1 is rotated 180 after, and first tongs subassembly 2 or second tongs subassembly 3 can be faster transport the wafer to the processing platform on, perhaps take off by the processing platform, have greatly improved holistic production machining efficiency.
Through being the first tongs subassembly 2 and the second tongs subassembly 3 that central symmetry set up for first tongs subassembly 2 or second tongs subassembly 3 snatch the processing position that the product can be faster transport processingequipment, reduced processingequipment's processing platform and adjusted time, secondly, rotate along first direction through first connecting piece 1, make the position of first tongs subassembly 2 and second tongs subassembly 3 switch the material loading, can reduce transfer mechanism's volume effectively, avoid the waste of too much material.
As shown in fig. 1 and 2, the first gripper assembly 2 includes a first driving mechanism 21, a first adsorption member 22 and a second adsorption member 23, the first driving mechanism 21 is mounted on the first connector 1, the first driving mechanism 21 is respectively in driving connection with the first adsorption member 22 and the second adsorption member 23, and the first driving mechanism 21 is suitable for driving the first adsorption member 22 and the second adsorption member 23 to approach or separate.
The first driving mechanism 21 may be a bidirectional cylinder, the bidirectional cylinder may be provided with two ejector rods, the first adsorption component 22 and the second adsorption component 23 are respectively installed on one of the ejector rods, and along with the air flow flowing in the cylinder body of the cylinder, the ejector rods on the cylinder can drive the first adsorption component 22 and the second adsorption component 23 to gradually approach or separate from each other, so that the effect of adjusting the distance is achieved, and wafers with different sizes can be compatible.
As shown in fig. 1 and 2, the first suction member 22 includes a second connection member 221 and a suction nozzle structure 222, the first driving mechanism 21 is in driving connection with the second connection member 221, the suction nozzle structure 222 is movably mounted on the second connection member 221, and a position of the suction nozzle structure 222 relative to the second connection member 221 is adjustable.
The second connector 221 may be provided with a waist-shaped hole, in which the suction nozzle structure 222 may be adjusted and viewed, and the opening direction of the waist-shaped hole may be the moving direction of the first suction member 22 or the second suction member 23. Since the first suction member 22 and the second suction member 23 are driven by the air cylinder, there is a certain error in accuracy, and thus fine adjustment of the position of the suction nozzle structure 222 can be achieved by adjusting the position of the suction nozzle structure 222 with respect to the second connection member 221.
As shown in fig. 1 and 2, the second connecting piece 221 includes a first section and a second section, the first section and the second section are disposed at an included angle, the first section is mounted on the driving end of the first driving mechanism 21, the suction nozzle structures 222 are respectively mounted on two opposite ends of the second section, and the first section is located between the two suction nozzle structures 222.
The included angle between the first section and the second section may be 90 °, and the suction nozzle structure 222 mounted at the opposite ends of the second section may effectively increase the fixing range of the first suction member 22 to the wafer. The second adsorption component 23 may also include a second connecting piece 221 and a suction nozzle structure 222, two suction nozzle structures 222 may be installed on each second connecting piece 221, four suction nozzle structures 222 are disposed on the first gripper assembly 2 or the second gripper assembly 3, and the four suction nozzle structures 222 may adsorb the wafer at the same time, so as to ensure the stability of wafer adsorption.
As shown in fig. 3 and 4, the second connection member 221 is provided with a reinforcing rib 223. The reinforcing rib 223 may play a role in increasing the overall strength of the second connection member 221, and secure the reliability of the second connection member 221 in long-term use.
The transfer mechanism further comprises a third connecting piece 4, the third connecting piece 4 is arranged on the first connecting piece 1, a waist-shaped hole is formed in the third connecting piece 4, and a bolt is suitable for penetrating through the waist-shaped hole and being connected with the first driving mechanism 21.
The third connecting piece 4 may include a first bending section, a second bending section and a third bending section, where the first bending section is perpendicular to the second bending section, the second bending section is perpendicular to the third bending section, the first bending section is parallel to the third bending section, the first driving mechanism 21 is fixed on the first bending section, and the third bending section is installed on the first connecting piece 1. By arranging the third connecting piece 4, on one hand, the function of shortening the length of the transfer mechanism along the Z-axis direction can be achieved, and excessive loss of materials is reduced. On the other hand, since the positions of the openings 11 formed in the air cylinders are set before leaving the factory, the positions of the openings 11 of the air cylinders with different sizes are different, so that the air cylinders with different sizes can be compatible through the waist-shaped holes in the third connecting piece 4, and the first driving mechanism 21 can be fixed by using bolts conveniently.
As shown in fig. 1 and 2, the second handle assembly 3 includes a second driving mechanism 31, a third adsorption member 32 and a fourth adsorption member 33, the second driving mechanism 31 is mounted on the first connector 1, the second driving mechanism 31 is respectively in driving connection with the third adsorption member 32 and the fourth adsorption member 33, and the second driving mechanism 31 is suitable for driving the third adsorption member 32 and the fourth adsorption member 33 to approach or separate.
The second driving mechanism 31 may be a bidirectional cylinder, the bidirectional cylinder may be provided with two ejector rods, the third adsorption component 32 and the fourth adsorption component 33 are respectively installed on one of the ejector rods, and along with the air flow flowing in the cylinder body of the cylinder, the ejector rods on the cylinder can drive the third adsorption component 32 and the fourth adsorption component 33 to gradually approach or separate from each other, so that the effect of adjusting the distance is achieved, and wafers with different sizes can be compatible.
As shown in fig. 1 and 3, the transfer mechanism further comprises a rotation mechanism 6, the rotation mechanism 6 being in driving connection with the first connection member 1, the rotation mechanism 6 being adapted to drive the first connection member 1 to rotate about the first direction. The rotation mechanism 6 may be a rotation cylinder, and the first direction may be a direction of the Z axis, and an effect of rotating the first connection member 1 around the Z axis direction may be achieved by the rotation cylinder.
As shown in fig. 1 and 3, the transfer mechanism further comprises a third driving mechanism 5, the third driving mechanism 5 is mounted on the driving end of the rotating mechanism 6, the third driving mechanism 5 is in driving connection with the first connecting piece 1, and the third driving mechanism 5 is suitable for driving the first connecting piece 1 to move along the first direction.
The third driving mechanism 5 may be a linear motor, an electric cylinder, a cylinder, etc., and the cylinder may be a double-acting cylinder, for example, on which two air holes are respectively provided, and the air flows through the two air holes, so that the piston rod may extend or retract from the body of the cylinder. The end of the piston rod far away from the cylinder body can be connected with the first connecting piece 1, the first connecting piece 1 can extend or retract along with the piston rod so as to move, and the moving direction of the first connecting piece 1 can be the direction of the Z axis in the figure.
The first connecting piece 1 is driven to move along the Z-axis direction through the air cylinder, so that the effect of adsorbing the alignment wafer can be realized. When the wafer needs to be grasped, the air cylinder drives the first connecting piece 1 to move towards the direction close to the wafer until the first connecting piece contacts the surface of the wafer. The suction nozzle structure 222 can adsorb the wafer, and the cylinder drives the first connecting piece 1 to move towards the direction away from the loading platform, so that the wafer leaves the surface of the loading platform. And through the rotation of the first connecting piece 1, the surface of the wafer is prevented from being scratched in the rotation process, so that the wafer can be safely moved to the processing platform.
The first connecting piece 1 is provided with a plurality of openings 11. The opening 11 formed in the first connecting piece 1 can effectively reduce the weight of the first connecting piece 1, reduce the load weight of the third driving mechanism 5, the rotating mechanism 6 and the like, and ensure the long-term use reliability of the equipment.
Another embodiment of the present utility model provides a general semiconductor processing apparatus including the transfer mechanism as above. The general semiconductor processing apparatus has the same advantageous effects as the transfer mechanism and will not be described here again.
Although the present application is disclosed above, the scope of protection of the present application is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the present application, and such changes and modifications would fall within the scope of the utility model.
Claims (11)
1. A transfer mechanism, comprising:
a first link adapted to rotate about a first direction;
a first gripper assembly mounted on the first connector;
the second tongs subassembly, the second tongs subassembly install in on the first connecting piece, first tongs subassembly with the second tongs subassembly is used for snatching the product, the rotation center of first connecting piece is located first tongs subassembly with between the second tongs subassembly, first tongs subassembly with second tongs subassembly central symmetry sets up.
2. The transfer mechanism of claim 1, wherein the first handle assembly comprises a first drive mechanism, a first suction member, and a second suction member, the first drive mechanism being mounted on the first connector, the first drive mechanism being drivingly connected to the first suction member and the second suction member, respectively, the first drive mechanism being adapted to drive the first suction member and the second suction member toward and away from each other.
3. The transfer mechanism of claim 2, wherein the first suction member comprises a second connector and a nozzle structure, the first drive mechanism is drivingly connected to the second connector, the nozzle structure is movably mounted to the second connector, and a position of the nozzle structure relative to the second connector is adjustable.
4. The transfer mechanism of claim 3, wherein the second connector comprises a first section and a second section, the first section and the second section are disposed at an included angle, the first section is mounted on the driving end of the first driving mechanism, the first adsorption members are respectively mounted on two opposite ends of the second section, and the first section is located between the two first adsorption members.
5. A transfer mechanism according to claim 3, wherein the second connector is provided with a reinforcing bar.
6. The transfer mechanism of claim 2, further comprising a third connector mounted to the first connector, the third connector having a waist-shaped aperture formed therein, a bolt adapted to pass through the waist-shaped aperture and connect with the first drive mechanism.
7. The transfer mechanism of claim 1, wherein the second handle assembly comprises a second drive mechanism, a third suction member, and a fourth suction member, the second drive mechanism being mounted on the first connector, the second drive mechanism being drivingly connected to the third suction member and the fourth suction member, respectively, the second drive mechanism being adapted to drive the third suction member and the fourth suction member toward and away from each other.
8. The transfer mechanism of claim 1, further comprising a rotation mechanism drivingly connected to the first link, the rotation mechanism adapted to drive the first link to rotate about the first direction.
9. The transfer mechanism of claim 8, further comprising a third drive mechanism mounted to the drive end of the rotary mechanism, the third drive mechanism drivingly coupled to the first link, the third drive mechanism adapted to drive the first link to move in the first direction.
10. The transfer mechanism of claim 1, wherein the first connector has a plurality of openings.
11. A general semiconductor processing apparatus comprising a transfer mechanism as claimed in any one of claims 1 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223529528.7U CN219296567U (en) | 2022-12-23 | 2022-12-23 | Transfer mechanism and general semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223529528.7U CN219296567U (en) | 2022-12-23 | 2022-12-23 | Transfer mechanism and general semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219296567U true CN219296567U (en) | 2023-07-04 |
Family
ID=86950195
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223529528.7U Active CN219296567U (en) | 2022-12-23 | 2022-12-23 | Transfer mechanism and general semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219296567U (en) |
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2022
- 2022-12-23 CN CN202223529528.7U patent/CN219296567U/en active Active
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