CN219294143U - Semiconductor cutting machine - Google Patents
Semiconductor cutting machine Download PDFInfo
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- CN219294143U CN219294143U CN202223278527.XU CN202223278527U CN219294143U CN 219294143 U CN219294143 U CN 219294143U CN 202223278527 U CN202223278527 U CN 202223278527U CN 219294143 U CN219294143 U CN 219294143U
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- fixedly connected
- rotating shaft
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
The utility model is applicable to the technical field of semiconductor processing, and provides a semiconductor cutting machine, which comprises: the driven frame is fixedly connected with the telescopic piece; the cutting assembly is fixedly connected with the driven frame; the air inducing component is movably connected with the cutting component and is movably connected with the driven frame; the collecting assembly is fixedly connected with the driven frame; the heat dissipation assembly is movably connected with the cutting assembly, and the heat dissipation assembly is movably connected with the driven frame; the movable module cooperates the extensible member to drive the driven frame to move and then drive the cutting assembly to move to the preset position, and when the cutting assembly cuts the product, the cutting assembly drives the induced air assembly, and the induced air assembly drives the air to flow according to the preset direction, and the air with dust that will cut is sent into the collection subassembly, simultaneously for the cutting assembly cooling, the cutting assembly drives the radiator unit simultaneously, and the radiator unit drives the air to flow according to the preset direction, takes away the heat that the cutting assembly produced, has the advantage that the dust is collected effectually and the cooling is effectual.
Description
Technical Field
The utility model belongs to the technical field of semiconductor processing, and particularly relates to a semiconductor cutting machine.
Background
The semiconductor refers to a material with conductivity between a conductor and an insulator at normal temperature, and the semiconductor has application in the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like, for example, a diode is a device manufactured by using the semiconductor, and the semiconductor finished product is very small in size, is manufactured into a disc during normal reprocessing, and is segmented after the processing is completed.
When the existing semiconductor cutting machine is used for scribing or cutting processing operation of semiconductors, dust generated during cutting needs to be cleaned continuously to avoid the influence of the dust on the purity of the semiconductors, however, most cutting devices cannot clean the dust thoroughly and comprehensively, and further cutting accuracy is reduced.
Disclosure of Invention
The embodiment of the utility model aims to provide a semiconductor cutting machine and aims to solve the problems in the background art.
The embodiment of the utility model is realized in that the semiconductor cutting machine comprises: cutting bench, be equipped with the mount pad on the cutting bench, be equipped with the removal module on the cutting bench, remove module fixedly connected with extensible member still includes:
the driven frame is fixedly connected with the telescopic piece;
the cutting assembly is fixedly connected with the driven frame;
the air inducing assembly is movably connected with the cutting assembly and is movably connected with the driven frame;
the collecting assembly is fixedly connected with the driven frame;
the heat dissipation assembly is movably connected with the cutting assembly, and is movably connected with the driven frame.
As a further scheme of the utility model, the driven frame comprises a frame body, a first partition plate and a second partition plate, the frame body is fixedly connected with the first partition plate, the frame body is fixedly connected with the second partition plate, the cutting assembly comprises a motor, a first rotating shaft and a cutting blade, the motor is fixedly connected with the frame body, the motor is fixedly connected with the first rotating shaft, the rotating shaft penetrates through the first partition plate and the second partition plate, the first rotating shaft is fixedly connected with the cutting blade, and the cutting blade is positioned between the first partition plate and the second partition plate.
As a further scheme of the utility model, the induced draft assembly comprises a first bevel gear, a second rotating shaft and a first fan blade, wherein the first bevel gear is fixedly connected with the first rotating shaft, the first bevel gear is meshed with the second bevel gear, the second bevel gear is fixedly connected with the second rotating shaft, the second rotating shaft is rotatably connected with the frame body, and the second rotating shaft is fixedly connected with the first fan blade.
As a further scheme of the utility model, the collecting assembly comprises a suction head, branch pipes, a main pipe, communicating pipes and dust collecting bags, wherein the dust collecting bags are detachably connected with the frame body, the dust collecting bags are communicated with the communicating pipes, the communicating pipes are fixedly connected with the frame body, the communicating pipes are communicated with the frame body, the frame body is fixedly connected with the main pipe, the main pipe is fixedly connected with a plurality of the branch pipes, the branch pipes are fixedly connected with the suction head, and the suction head is rotatably connected with the frame body.
As a further scheme of the utility model, the heat dissipation assembly comprises a first gear, a second gear, a third rotating shaft and a second fan blade, wherein a plurality of through holes are formed in the frame body, a plurality of through holes are formed in the partition plate I, heat dissipation holes are formed in the frame body, the first gear is fixedly connected with the first rotating shaft, the first gear is meshed with the second gear, the second gear is fixedly connected with the third rotating shaft, the third rotating shaft is rotatably connected with the frame body, and the third rotating shaft is fixedly connected with the second fan blade.
Compared with the prior art, the utility model has the beneficial effects that: the movable module cooperates the extensible member to drive the driven frame to move and then drive the cutting assembly to move to the preset position, and when the cutting assembly cuts the product, the cutting assembly drives the induced air assembly, and the induced air assembly drives the air to flow according to the preset direction, and the air with dust that will cut is sent into the collection subassembly, simultaneously for the cutting assembly cooling, the cutting assembly drives the radiator unit simultaneously, the radiator unit drives the air to flow according to the preset direction, takes away the heat that the cutting assembly produced, has the advantage that the dust is collected effectually and the cooling is effectual.
Drawings
Fig. 1 is a schematic structural diagram of a semiconductor cutting machine according to an embodiment of the present utility model;
FIG. 2 is a schematic cross-sectional view of a driven frame according to an embodiment of the present utility model;
fig. 3 is a schematic structural diagram of a suction head according to an embodiment of the present utility model.
In the accompanying drawings: 1-cutting table, 2-mount, 3-movable module, 4-expansion piece, 5-driven frame, 51-frame, 52-division board one, 53-division board two, 54-through hole one, 55-through hole two, 56-heat dissipation hole, 6-cutting assembly, 61-motor, 62-pivot one, 63-cutting blade, 7-induced draft assembly, 71-bevel gear one, 72-bevel gear two, 73-pivot two, 74-flabellum one, 8-collection assembly, 81-suction head, 82-branch pipe, 83-main pipe, 84-communicating pipe, 85-dust collecting bag, 9-heat dissipation assembly, 91-gear one, 92-gear two, 93-pivot three, 94-flabellum two.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Specific implementations of the utility model are described in detail below in connection with specific embodiments.
As shown in fig. 1 to 3, which are one embodiment of the present utility model, a semiconductor cutting machine includes: cutting table 1, be equipped with mount pad 2 on the cutting table 1, be equipped with on the cutting table 1 and remove module 3, remove module 3 fixedly connected with extensible member 4 still includes:
the driven frame 5 is fixedly connected with the telescopic piece 4;
the cutting assembly 6 is fixedly connected with the driven frame 5;
the induced air component 7 is movably connected with the cutting component 6, and the induced air component 7 is movably connected with the driven frame 5;
the collecting assembly 8 is fixedly connected with the driven frame 5;
the heat dissipation assembly 9 is movably connected with the cutting assembly 6, and the heat dissipation assembly 9 is movably connected with the driven frame 5.
In this embodiment, a fixture is disposed on the mounting base 2, a product is fixed by the fixture, the moving module 3 drives the telescopic member 4 to linearly move back and forth or left and right to a preset position, and the moving module 3 is a conventional mature technology, so that details are not described, the telescopic member 4 may be an electric telescopic rod, and the telescopic member 4 is used for driving the driven frame 5 to lift; the driven frame 5 comprises a frame body 51, a first partition plate 52 and a second partition plate 53, the frame body 51 is fixedly connected with the first partition plate 52, the frame body 51 is fixedly connected with the second partition plate 53, the cutting assembly 6 comprises a motor 61, a first rotating shaft 62 and a cutting blade 63, the motor 61 is fixedly connected with the frame body 51, the motor 61 is fixedly connected with the first rotating shaft 62, the first rotating shaft 62 penetrates through the first partition plate 52 and the second partition plate 53, the first rotating shaft 62 is fixedly connected with the cutting blade 63, and the cutting blade 63 is positioned between the first partition plate 52 and the second partition plate 53; the wind-guiding assembly 7 comprises a first bevel gear 9171, a second bevel gear 9272, a second rotating shaft 73 and a first fan blade 74, wherein the first bevel gear 9171 is fixedly connected with the first rotating shaft 62, the first bevel gear 9171 is meshed with the second bevel gear 9272, the second bevel gear 9272 is fixedly connected with the second rotating shaft 73, the second rotating shaft 73 is rotatably connected with the frame 51, and the second rotating shaft 73 is fixedly connected with the first fan blade 74; the collecting assembly 8 comprises a suction head 81, branch pipes 82, a main pipe 83, communicating pipes 84 and a dust collecting bag 85, wherein the dust collecting bag 85 is detachably connected with the frame body 51, the dust collecting bag 85 is communicated with the communicating pipes 84, the communicating pipes 84 are fixedly connected with the frame body 51, the communicating pipes 84 are communicated with the frame body 51, the frame body 51 is fixedly connected with the main pipe 83, the main pipe 83 is fixedly connected with a plurality of the branch pipes 82, the branch pipes 82 are fixedly connected with the suction head 81, and the suction head 81 is rotatably connected with the frame body 51; the motor 61 rotates the electric cutting blade 63 through the first rotating shaft 62 to cut products, meanwhile, the first rotating shaft 62 drives the second rotating shaft 73 to rotate through the first bevel gear 9171 and the second bevel gear 9272 to drive the first fan blade 74 to rotate, the first fan blade 74 rotates to drive air to flow in a preset direction, air at the suction head 81 is sucked into the branch pipe 82 and is sent into the collecting bag through the main pipe 83, the frame 51 and the communicating pipe 84, dust is collected by the collecting bag, meanwhile, the flowing air can cool the cutting blade 63, and good dust collecting and cooling effects are achieved.
Referring to fig. 1 to 3, in an embodiment of the utility model, the heat dissipation assembly 9 includes a first gear 91, a second gear 92, a third rotating shaft 93 and a second fan blade 94, the first frame 51 is provided with a plurality of through holes 54, the first partition plate 52 is provided with a plurality of second through holes 55, the first frame 51 is provided with a heat dissipation hole 56, the first gear 91 is fixedly connected with the first rotating shaft 62, the first gear 91 is meshed with the second gear 92, the second gear 92 is fixedly connected with the third rotating shaft 93, the third rotating shaft 93 is rotatably connected with the first frame 51, and the third rotating shaft 93 is fixedly connected with the second fan blade 94.
In this embodiment, the second through hole 55 is processed into an inclined hole with a certain angle with respect to the horizontal plane, when the first rotating shaft 62 drives the cutting blade 63 to cut a product, the first rotating shaft 62 drives the first gear 91 to rotate, the first gear 91 drives the second gear 92 to rotate, the second gear 92 drives the second fan blade 94 to rotate through the third rotating shaft 93, the second fan blade 94 drives air to flow in a preset direction, that is, the air enters the frame 51 through the first through hole 54 and then is sent to the cutting blade 63 through the second through hole 55 to cool the cutting blade 63, and then heat is taken away through the heat dissipation hole 56, so that a good cooling effect is achieved.
Working principle:
the movable module 3 cooperates the extensible member 4 to drive the driven frame 5 to move and then drive the cutting assembly 6 to move to preset position, and when the cutting assembly 6 cuts the product, the cutting assembly 6 drives the induced air assembly 7, and induced air assembly 7 drives the air and flows according to preset direction, and the air that has dust that will cut is sent into collection subassembly 8, simultaneously for the cooling of cutting assembly 6, the cutting assembly 6 drives radiator unit 9 simultaneously, radiator unit 9 drives the air and flows according to preset direction, takes away the heat that cutting assembly 6 produced, has the effectual advantage of dust collection and cooling effect.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (5)
1. A semiconductor dicing machine comprising: cutting bench, be equipped with the mount pad on the cutting bench, be equipped with the removal module on the cutting bench, remove module fixedly connected with extensible member, its characterized in that still includes:
the driven frame is fixedly connected with the telescopic piece;
the cutting assembly is fixedly connected with the driven frame;
the air inducing assembly is movably connected with the cutting assembly and is movably connected with the driven frame;
the collecting assembly is fixedly connected with the driven frame;
the heat dissipation assembly is movably connected with the cutting assembly, and is movably connected with the driven frame.
2. The semiconductor cutting machine according to claim 1, wherein the driven frame comprises a frame body, a first partition plate and a second partition plate, the frame body is fixedly connected with the first partition plate, the frame body is fixedly connected with the second partition plate, the cutting assembly comprises a motor, a first rotating shaft and a cutting blade, the motor is fixedly connected with the frame body, the motor is fixedly connected with the first rotating shaft, the rotating shaft penetrates through the first partition plate and the second partition plate, the first rotating shaft is fixedly connected with the cutting blade, and the cutting blade is located between the first partition plate and the second partition plate.
3. The semiconductor cutting machine according to claim 2, wherein the induced draft assembly comprises a first bevel gear, a second rotating shaft and a first fan blade, wherein the first bevel gear is fixedly connected with the first rotating shaft, the first bevel gear is meshed with the second bevel gear, the second bevel gear is fixedly connected with the second rotating shaft, the second rotating shaft is rotatably connected with the frame, and the second rotating shaft is fixedly connected with the first fan blade.
4. The semiconductor cutting machine according to claim 2, wherein the collecting assembly comprises a suction head, branch pipes, a main pipe, a communicating pipe and a dust collecting bag, wherein the dust collecting bag is detachably connected with the frame body, the dust collecting bag is communicated with the communicating pipe, the communicating pipe is fixedly connected with the frame body, the communicating pipe is communicated with the frame body, the frame body is fixedly connected with the main pipe, the main pipe is fixedly connected with a plurality of the branch pipes, the branch pipes are fixedly connected with the suction head, and the suction head is rotatably connected with the frame body.
5. The semiconductor cutting machine according to claim 2, wherein the heat dissipation assembly comprises a first gear, a second gear, a third rotating shaft and a second fan blade, a plurality of through holes are formed in the frame, a plurality of through holes are formed in the first partition plate, heat dissipation holes are formed in the frame, the first gear is fixedly connected with the first rotating shaft, the first gear is meshed with the second gear, the second gear is fixedly connected with the third rotating shaft, the third rotating shaft is rotatably connected with the frame, and the third rotating shaft is fixedly connected with the second fan blade.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223278527.XU CN219294143U (en) | 2022-12-07 | 2022-12-07 | Semiconductor cutting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223278527.XU CN219294143U (en) | 2022-12-07 | 2022-12-07 | Semiconductor cutting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219294143U true CN219294143U (en) | 2023-07-04 |
Family
ID=86956919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223278527.XU Active CN219294143U (en) | 2022-12-07 | 2022-12-07 | Semiconductor cutting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219294143U (en) |
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2022
- 2022-12-07 CN CN202223278527.XU patent/CN219294143U/en active Active
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