CN219293633U

CN219293633U - Semiconductor diode pin polishing device

Info

Publication number: CN219293633U
Application number: CN202320706521.3U
Authority: CN
Inventors: 刘迁
Original assignee: Shanghai Bier Semiconductor Technology Co ltd
Current assignee: Shanghai Bier Semiconductor Technology Co ltd
Priority date: 2023-04-03
Filing date: 2023-04-03
Publication date: 2023-07-04
Anticipated expiration: 2033-04-03

Abstract

The utility model discloses a semiconductor diode pin polishing device, and belongs to the technical field of semiconductor diodes. The device comprises a supporting rotating shaft, wherein the outer surface of the supporting rotating shaft is fixedly connected with a rotary positioning wheel and two bevel gears, the outer surface of the rotary positioning wheel is provided with semiconductor placing grooves which are distributed equidistantly, the outer surface of the supporting rotating shaft is rotated with two transmission short cylinders, one ends of the transmission short cylinders, which are close to each other, are fixedly connected with round rotary brushes, arc friction blocks, the rotary positioning wheel and other parts, and the rotary positioning wheel part can drive a semiconductor through the semiconductor placing grooves through the mutual matching relation between the round rotary brush part and the arc friction block part, so that the effect that the device polishes pins of a semiconductor through the round rotary brush and the arc friction block is achieved, automatic polishing and automatic discharging of equipment are achieved, and the production efficiency of a diode is improved.

Description

Semiconductor diode pin polishing device

Technical Field

The utility model relates to a semiconductor diode pin polishing device, and belongs to the technical field of semiconductor diodes.

Background

Diodes are one of the earliest emerging semiconductor devices and are very widely used. In particular, in various electronic circuits, diodes, resistors, capacitors, inductors and other components are reasonably connected to form circuits with different functions, so that the functions of rectifying alternating current, detecting modulated signals, limiting amplitude, clamping, stabilizing power supply voltage and the like can be realized.

Through retrieving, a semiconductor diode pin burnishing device is disclosed in chinese patent publication No. CN215617291U, and its technical essential lies in: the polishing device comprises a bottom plate, wherein a T-shaped sliding groove is formed in the upper portion of the bottom plate along the middle position of the length direction of the bottom plate, one end of the T-shaped sliding groove is vertically and slidably provided with a T-shaped sliding pin, the upper end of the T-shaped sliding pin is horizontally welded with a fixed disc, the upper portion of the fixed disc is rotationally provided with a gear, a placement table is coaxially inserted into the gear, a first fixed plate is vertically welded at the middle position of the bottom plate far away from one end of the fixed disc, a driving mechanism for driving the fixed disc to slide along the T-shaped sliding groove is arranged on the first fixed plate, a placement groove is formed in the upper portion of the placement table, and a polishing system is further arranged on the upper portion of the bottom plate.

The processing length or the depth of the diode pins can not be adjusted, and one stroke can only process one pin and can not meet the requirements of people, so that the semiconductor diode pin polishing device is provided, but the manual feeding and discharging of the processed diode are adopted, the automatic feeding and discharging of the diode are difficult, and the problem of low diode production efficiency is caused.

There is therefore a need to propose a new solution to this problem.

Disclosure of Invention

The technical problems to be solved by the utility model are as follows: the utility model provides a semiconductor diode pin burnishing device, it has solved among the prior art adopt the manual work to carry out material loading and unloading to the diode of processing, is difficult to automatic material loading to the diode and unloads, leads to the problem that diode production efficiency is low.

The technical problems to be solved by the utility model are realized by adopting the following technical scheme:

the utility model provides a semiconductor diode pin burnishing device, includes the support pivot, the surface fixedly connected with rotary positioning wheel and two bevel gears of support pivot are three, the semiconductor standing groove that the equidistance was distributed has been seted up to the surface of rotary positioning wheel, the surface rotation of support pivot has two transmission short barrels, two the one end that the transmission short barrels are close to each other is equal fixedly connected with circular rotatory brush, two the one end that the transmission short barrels kept away from each other is equal fixedly connected with drive gear two, the surface of support pivot is equal to rotate and is connected with drive gear one, two the equal fixedly connected with bevel gear one of face that drive gear one kept away from each other, the outer surface of bevel gear one cup joints at the support pivot, rotary positioning wheel's surface cup joints protective housing one and protective housing two, the inner wall fixedly connected with arc clutch blocks of protective housing two, the equal fixedly connected with supporting shoe of surface of protective housing one and protective housing two the joint has the collecting box between the supporting shoe.

Through adopting above-mentioned technical scheme, drive rotatory positioning wheel when supporting the pivot and rotate, make rotatory positioning wheel drive the semiconductor that semiconductor standing groove inside was placed, at this moment two pins of semiconductor get into between two circular rotatory brushes and the arc friction block that corresponds, protective housing two has the effect that prevents the semiconductor from sliding out from the semiconductor standing groove, the rotatory circular rotatory brush that drives that corresponds simultaneously of transmission short section of thick bamboo rotates and carries out fast rotation, make circular rotatory brush and arc friction block carry out fast brush to two pins of semiconductor, when rotatory positioning wheel drives the semiconductor and rotate the below, do not have the barrier of protective housing two, under the effect of gravity, the semiconductor falls into the inside of collecting box.

The utility model is further provided with: the surface of protective housing one and protective housing two all fixedly connected with stock guide, fixedly connected with consolidates the piece between stock guide and the corresponding protective housing one or protective housing two.

By adopting the technical scheme, the semiconductor diodes are orderly arranged and fed between the two material guiding plates, and then fall into the corresponding semiconductor placing grooves along the grooves between the two material guiding plates, and one semiconductor placing groove can only be used for placing one semiconductor diode.

The utility model is further provided with: the left side and the right side of rotary positioning wheel all are equipped with the brace table, one of them the inside fixedly connected with motor of brace table, the output shaft and the support pivot fixed connection of motor.

By adopting the technical scheme, the motor is started, so that the output shaft of the motor drives the supporting rotating shaft to rotate, and the supporting rotating shaft drives the bevel gear III and the rotary positioning wheel to rotate.

The utility model is further provided with: the other end of the supporting rotating shaft is rotationally connected with a corresponding supporting table, and the opposite surfaces of the two supporting tables are fixedly connected with supporting short blocks.

Through adopting above-mentioned technical scheme, the supporting bench of setting has the effect of supporting the support pivot.

The utility model is further provided with: the opposite surfaces of the two support short blocks are respectively and rotatably connected with a support shaft, and the outer surfaces of the support shafts are fixedly connected with a pinion and a large gear.

By adopting the technical scheme, when the bevel gear III drives the bevel gear II to rotate, the bevel gear II drives the bevel gear I to rotate.

The utility model is further provided with: each small gear is meshed with a corresponding first transmission gear, and each large gear is meshed with a corresponding second transmission gear.

By adopting the technical proposal, when the bevel gear I rotates, the transmission gear I is driven to rotate, the transmission gear I drives the pinion to rotate rapidly, the pinion drives the bull gear to rotate, the bull gear drives the transmission gear II to rotate,

the utility model is further provided with: the front face of the support short block is rotatably connected with a bevel gear II which is meshed with a corresponding bevel gear III and a corresponding bevel gear I.

By adopting the technical scheme, the bevel gear III drives the bevel gear I to rotate through the bevel gear II, and the rotation directions of the bevel gear III and the bevel gear I are opposite.

The beneficial effects of the utility model are as follows:

1. according to the utility model, by arranging the circular rotating brush, the arc-shaped friction block, the rotating positioning wheel and other parts, the rotating positioning wheel part can drive the semiconductor through the semiconductor placing groove through the mutual matching relationship between the circular rotating brush part and the arc-shaped friction block part, so that the effect that the device can polish pins of the semiconductor through the circular rotating brush and the arc-shaped friction block is achieved, the equipment can automatically polish and polish, the material is automatically discharged, and the production efficiency of the diode is improved;

2. according to the utility model, the first transmission gear, the pinion, the large gear, the transmission gear and the like are arranged, and the first transmission gear can drive the large gear through the pinion through the mutual matching relationship between the pinion and the large gear, so that the device can drive the second transmission gear through the large gear, and the effect of increasing the rotation speed of the second transmission gear is achieved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

Fig. 2 is a schematic cross-sectional structure of a second protective case and a first protective case according to the present utility model.

Fig. 3 is a schematic view of a three-dimensional rotating positioning wheel structure according to the present utility model.

Fig. 4 is a schematic elevational view of the present utility model.

Fig. 5 is a schematic top view of the present utility model.

In the figure: 1. supporting a rotating shaft; 2. rotating the positioning wheel; 3. a semiconductor placement groove; 4. a transmission short cylinder; 5. a circular rotating brush; 6. a first protective shell; 7. a second protective shell; 8. arc friction blocks; 9. a material guide plate; 10. a support block; 11. a collection box; 12. a transmission gear II; 13. bevel gears III; 14. supporting the short block; 15. bevel gears II; 16. a support table; 17. bevel gears I; 18. a first transmission gear; 19. a support shaft; 20. a pinion gear; 21. a large gear; 22. and a motor.

Detailed Description

The utility model will be further described with reference to the following detailed drawings, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

As shown in fig. 1-5, a semiconductor diode pin polishing device comprises a supporting rotating shaft 1, wherein the outer surface of the supporting rotating shaft 1 is fixedly connected with a rotary positioning wheel 2 and two bevel gears III 13, the left side and the right side of the rotary positioning wheel 2 are respectively provided with a supporting table 16, the inside of one supporting table 16 is fixedly connected with a motor 22, the output shaft of the motor 22 is fixedly connected with the supporting rotating shaft 1, the motor 22 is started, the output shaft of the motor 22 drives the supporting rotating shaft 1 to rotate, and the supporting rotating shaft 1 drives the bevel gears III 13 and the rotary positioning wheel 2 to rotate.

The outer surface of the rotary positioning wheel 2 is provided with semiconductor placing grooves 3 which are distributed equidistantly, the outer surface of the support rotating shaft 1 rotates to form two transmission short cylinders 4, one ends, close to each other, of the two transmission short cylinders 4 are fixedly connected with round rotary brushes 5, one ends, far away from each other, of the two transmission short cylinders 4 are fixedly connected with transmission gears II 12, the outer surface of the support rotating shaft 1 is rotationally connected with transmission gears I18, the other end of the support rotating shaft 1 is rotationally connected with a corresponding support table 16, opposite surfaces of the two support tables 16 are fixedly connected with support short blocks 14, the front surface of the support short blocks 14 is rotationally connected with bevel gears II 15, the bevel gears II 15 are meshed with corresponding bevel gears III 13 and 17, the arranged bevel gears III 13 drive the bevel gears I17 to rotate through the bevel gears II 15, and the rotation directions of the bevel gears III 13 and the bevel gears I17 are opposite.

The opposite surfaces of the two support short blocks 14 are respectively and rotatably connected with a support shaft 19, the outer surface of the support shaft 19 is fixedly connected with a pinion 20 and a large gear 21, each pinion 20 is meshed with a corresponding first transmission gear 18, each large gear 21 is meshed with a corresponding second transmission gear 12, when the first bevel gear 17 rotates, the first transmission gear 18 is driven to rotate, the first transmission gear 18 drives the pinion 20 to rotate rapidly, the pinion 20 drives the large gear 21 to rotate, and the large gear 21 drives the second transmission gear 12 to rotate.

When the bevel gear III 13 drives the bevel gear II 15 to rotate, the bevel gear II 15 drives the bevel gear I17 to rotate, and the supporting table 16 has the function of supporting the rotating shaft 1.

The face that two drive gears one 18 kept away from each other is all fixedly connected with bevel gear one 17, bevel gear one 17 cup joints the surface at supporting shaft 1, rotary positioning wheel 2's surface cup joints protective housing one 6 and protective housing two 7, the surface of protective housing one 6 and protective housing two 7 is all fixedly connected with stock guide 9, fixedly connected with reinforcing block between stock guide 9 and the corresponding protective housing one 6 or protective housing two 7, through neatly sending into semiconductor diode arrangement between two stock guide 9, then fall into corresponding semiconductor standing groove 3 inside along the groove between two stock guide 9, a semiconductor diode can only be placed to a semiconductor standing groove 3.

The inner wall fixedly connected with arc friction block 8 of protective housing two 7, the equal fixedly connected with supporting shoe 10 of surface of protective housing one 6 and protective housing two 7, joint has collecting box 11 between two supporting shoes 10, drive rotatory positioning wheel 2 when supporting pivot 1 rotates, make rotatory positioning wheel 2 drive the semiconductor that semiconductor standing groove 3 inside was placed, at this moment two pins of semiconductor get into between two circular rotatory brushes 5 and the corresponding arc friction block 8, protective housing two 7 has the effect that prevents the semiconductor from sliding out in the semiconductor standing groove 3, the rotatory corresponding circular rotatory brush 5 of drive of transmission short section of thick bamboo 4 carries out fast rotation simultaneously, make circular rotatory brush 5 and arc friction block 8 carry out the quick brush to two pins of semiconductor, when rotatory positioning wheel 2 drives the semiconductor and rotate the below, do not have the barrier of protective housing two 7, under the effect of gravity, the semiconductor falls into collecting box 11's inside.

The implementation principle of the utility model is as follows:

the motor 22 is started, the output shaft of the motor 22 drives the supporting rotating shaft 1 to rotate, the supporting rotating shaft 1 drives the bevel gear three 13 and the rotating positioning wheel 2 to rotate, the bevel gear three 13 drives the bevel gear one 17 to rotate through the bevel gear two 15, the rotating directions of the bevel gear three 13 and the bevel gear one 17 are opposite, when the bevel gear one 17 rotates, the transmission gear one 18 drives the pinion 20 to rotate rapidly, the pinion 20 drives the bull gear 21 to rotate, the bull gear 21 drives the transmission gear two 12 to rotate, the transmission gear two 12 drives the corresponding transmission short cylinder 4 to rotate, the rotating positioning wheel 2 is driven when the supporting rotating shaft 1 rotates, the rotating positioning wheel 2 drives a semiconductor placed inside the semiconductor placing groove 3, at the moment, two pins of the semiconductor enter between the two circular rotating brushes 5 and the corresponding arc-shaped friction blocks 8, the protective shell two 7 has the effect of preventing the semiconductor from sliding out from the semiconductor placing groove 3, and meanwhile, the transmission short cylinder 4 rotates to drive the corresponding circular rotating brushes 5 to rotate rapidly, the two pins of the semiconductor rapidly brushes 2 are driven by the transmission short cylinder 4 to rotate, and the semiconductor placing box is blocked by the gravity of the semiconductor placing box under the protective shell 11 when the rotating under the driving force of the rotating positioning wheel 2 is not blocked by the semiconductor placing box.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, but is capable of various changes and modifications without departing from the spirit and scope of the utility model. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The utility model provides a semiconductor diode pin burnishing device, includes support pivot (1), its characterized in that: the utility model discloses a semiconductor device, including support pivot (1), surface fixedly connected with rotation positioning wheel (2) and two bevel gears (13), semiconductor standing groove (3) that equidistance was distributed have been seted up to the surface of rotation positioning wheel (2), the surface of support pivot (1) rotates has two transmission short drums (4), two the equal fixedly connected with circular rotatory brush (5) of one end that transmission short drum (4) are close to each other, two the equal fixedly connected with drive gear two (12) of one end that transmission short drum (4) kept away from each other, the equal rotation of surface of support pivot (1) is connected with drive gear one (18), two the equal fixedly connected with bevel gear one (17) of the surface that drive gear one (18) kept away from each other, the surface of rotation positioning wheel (2) cup joints at the surface of support pivot (1), the equal fixedly connected with arc friction block (8) of the surface of protective housing two (7), the equal fixedly connected with support block (10) of the surface of protective housing one (6) and protective housing two (7), two between the collecting box (10).

2. The semiconductor diode pin polishing apparatus as claimed in claim 1, wherein: the material guiding device is characterized in that the outer surfaces of the first protective shell (6) and the second protective shell (7) are fixedly connected with material guiding plates (9), and reinforcing blocks are fixedly connected between the material guiding plates (9) and the corresponding first protective shell (6) or the corresponding second protective shell (7).

3. The semiconductor diode pin polishing apparatus as claimed in claim 1, wherein: the left side and the right side of rotary positioning wheel (2) all are equipped with brace table (16), one of them the inside fixedly connected with motor (22) of brace table (16), the output shaft and the support pivot (1) fixed connection of motor (22).

4. A semiconductor diode pin polishing apparatus according to claim 3, wherein: the other end of the supporting rotating shaft (1) is rotationally connected with a corresponding supporting table (16), and the opposite surfaces of the two supporting tables (16) are fixedly connected with supporting short blocks (14).

5. The semiconductor diode pin polishing apparatus as claimed in claim 4, wherein: the opposite surfaces of the two support short blocks (14) are respectively and rotatably connected with a support shaft (19), and the outer surfaces of the support shafts (19) are fixedly connected with a pinion (20) and a large gear (21).

6. The semiconductor diode pin polishing apparatus as claimed in claim 5, wherein: each pinion (20) is meshed with a corresponding first transmission gear (18), and each bull gear (21) is meshed with a corresponding second transmission gear (12).

7. The semiconductor diode pin polishing apparatus as claimed in claim 6, wherein: the front face of the supporting short block (14) is rotatably connected with a bevel gear II (15), and the bevel gear II (15) is meshed with a bevel gear III (13) and a bevel gear I (17) which correspond to each other.