CN219287854U - Electronic device protection structure, circuit board and display module - Google Patents
Electronic device protection structure, circuit board and display module Download PDFInfo
- Publication number
- CN219287854U CN219287854U CN202221261431.XU CN202221261431U CN219287854U CN 219287854 U CN219287854 U CN 219287854U CN 202221261431 U CN202221261431 U CN 202221261431U CN 219287854 U CN219287854 U CN 219287854U
- Authority
- CN
- China
- Prior art keywords
- substrate
- layer
- protective
- adhesive tape
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model discloses an electronic device protection structure, a circuit board and a display module, which are used for solving the problem that the electromagnetic and electrostatic protection effect is poor due to the fact that the attached adhesive tape is wrinkled and is in virtual adhesion when the electronic device is attached to the protection adhesive tape in the prior art. The circuit board comprises: the device comprises a substrate, a component group positioned at one side of the substrate, a first protective adhesive tape positioned at one side of the component group away from the substrate, and a second protective adhesive tape positioned at one side of the first protective adhesive tape away from the component group; the first protective tape includes: a cover part covering the component group and a lap joint part extending from at least one side of the cover part to the substrate contact; the second protective adhesive tape is attached to the periphery of the component group and is electrically overlapped with the overlap joint part.
Description
Technical Field
The present utility model relates to the field of semiconductor technologies, and in particular, to an electronic device protection structure, a circuit board, and a display module.
Background
Because of the folding characteristic of the folding mobile phone, a gap exists between the whole screen and the middle frame, and the folding mobile phone cannot be waterproof through the shell, so that the waterproof performance of the folding mobile phone is poor. In the prior art, the point-coating waterproof glue mode generally causes the problem that the electrostatic shielding effect of the protective adhesive tape is poor.
Disclosure of Invention
The utility model provides an electronic device protection structure, a circuit board, a display module and a manufacturing method, which are used for solving the problem that in the prior art, when a protective adhesive tape is attached to an electronic device, the attached adhesive tape is wrinkled and is in virtual adhesion, so that the electromagnetic and electrostatic protection effects are poor.
The embodiment of the utility model provides an electronic device protection structure, which comprises: the device comprises a substrate, a component group positioned at one side of the substrate, a first protective adhesive tape positioned at one side of the component group away from the substrate, and a second protective adhesive tape positioned at one side of the first protective adhesive tape away from the component group;
the first protective tape includes: a cover part covering the component group and a lap joint part extending from at least one side of the cover part to be in contact with the substrate;
the second protective adhesive tape is attached to the periphery of the component group and is electrically overlapped with the overlap joint part.
In one possible embodiment, the second protective tape has a gap between the component group and the second protective tape.
In one possible embodiment, the overlap comprises: a first overlap portion, a second overlap portion connecting the first overlap portion and the cover portion;
the first overlap portion is in contact with the substrate, and the overlap portion is electrically overlapped with the second protective adhesive tape at the first overlap portion.
In one possible embodiment, the first protective tape includes a first insulating layer, a first conductive layer, and a second insulating layer stacked sequentially away from the substrate; the second protective adhesive tape comprises a third insulating layer, a second conductive layer and a fourth insulating layer which are sequentially far away from the substrate stack;
the first protective adhesive tape faces one surface of the second protective adhesive tape and the area corresponding to the first lap joint part exposes the first conductive layer, and the second protective adhesive tape faces one surface of the first protective adhesive tape and the area corresponding to the first lap joint part exposes the second conductive layer, so that the first conductive layer of the first protective adhesive tape and the second conductive layer of the second protective adhesive tape are electrically overlapped.
In one possible embodiment, the substrate includes a third conductive layer including a wire, the wire being grounded;
the second protective adhesive tape is also electrically overlapped with part of the wires.
In one possible embodiment, a surface of the second protective tape facing the substrate has an opening in a region corresponding to the conductive line at the joint, exposing the second conductive layer so that the second conductive layer of the second protective tape is electrically joined to the conductive line.
In one possible embodiment, the first insulating layer includes: the first insulating layer is positioned on one side of the first insulating layer away from the first conductive layer;
the first conductive layer includes: a first sub-conductive layer and a first conductive adhesive layer positioned on one side of the first sub-conductive layer facing the first insulating layer;
the second insulating layer includes: the second insulating layer is positioned on one side of the second insulating layer facing the first conductive layer.
In one possible embodiment, the third insulating layer includes: a third sub-insulating layer and a third insulating adhesive layer which are positioned on one side of the third sub-insulating layer away from the second conductive layer;
the second conductive layer includes: a second sub-conductive layer and a second conductive adhesive layer positioned on one side of the second sub-conductive layer facing the third insulating layer;
the fourth insulating layer includes: and a fourth insulating sub-layer and a fourth insulating adhesive layer positioned on one side of the fourth insulating sub-layer facing the second conductive layer.
In one possible implementation manner, the material of the first sub-insulating layer is the same as that of the third sub-insulating layer, and the material of the first insulating adhesive layer is the same as that of the third insulating adhesive layer;
the material of the first sub-conductive layer is the same as that of the second sub-conductive layer, and the material of the first conductive adhesive layer is the same as that of the second conductive adhesive layer;
the material of the second sub-insulating layer is the same as that of the fourth sub-insulating layer, and the material of the second insulating adhesive layer is the same as that of the fourth insulating adhesive layer.
In one possible embodiment, the width of the projection of the first overlap onto the substrate is greater than the width of the projection of the cover onto the substrate;
the width of the projection of the covering part on the substrate is larger than the width of the projection of the second lap joint part on the substrate.
In one possible embodiment, the projection length of the first overlap on the substrate is smaller than the projection length of the cover on the substrate;
the projection length of the first lap joint part on the substrate is the same as the projection length of the second lap joint part on the substrate.
In one possible embodiment, the projection of the component group onto the substrate falls within the projection of the cover portion onto the substrate.
The embodiment of the utility model also provides a circuit board, which comprises the first protective adhesive tape, the substrate and the component group.
The embodiment of the utility model also provides a display module, which comprises a display panel, a circuit board and the second protective adhesive tape.
Drawings
FIG. 1A is a schematic top view of a prior art protective tape attached thereto;
FIG. 1B is a schematic cross-sectional view of FIG. 1A along the dashed line A1B 1;
FIG. 1C is a schematic cross-sectional view taken along the dashed line C1D1 in FIG. 1A;
FIG. 2A is a schematic top view of a circuit board without the first protective tape and the second protective tape attached;
FIG. 2B is a schematic cross-sectional view taken along the dashed line A1B1 in FIG. 2A;
FIG. 3A is a schematic top view of the circuit board with the first protective tape applied;
FIG. 3B is a schematic cross-sectional view taken along the dashed line A1B1 in FIG. 3A;
FIG. 3C2 is a schematic cross-sectional view of FIG. 3A along the dashed line A2B2 when attached by a transfer film;
FIG. 3C1 is a schematic cross-sectional view of FIG. 3A with the first protective tape applied along the dashed line A2B 2;
FIG. 4A is a schematic top view of a transfer film corresponding to a second protective tape;
FIG. 4B is a schematic top view of a second protective tape;
FIG. 4C is a schematic top view of the second protective tape after the second protective tape is attached;
FIG. 5A is a schematic top view of the circuit board after the first protective tape and the second protective tape are attached;
FIG. 5B is a schematic cross-sectional view taken along the dashed line A1B1 in FIG. 5A;
fig. 6 is a schematic diagram of a manufacturing process of a display device according to an embodiment of the utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present disclosure. It will be apparent that the described embodiments are some, but not all, of the embodiments of the present disclosure. All other embodiments, which can be made by one of ordinary skill in the art without the need for inventive faculty, are within the scope of the present disclosure, based on the described embodiments of the present disclosure.
Unless defined otherwise, technical or scientific terms used in this disclosure should be given the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The terms "first," "second," and the like, as used in this disclosure, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.
"about" or "approximately the same" as used herein includes the stated values and means within an acceptable deviation of the particular values as determined by one of ordinary skill in the art in view of the measurements in question and the errors associated with the measurement of the particular quantities (i.e., limitations of the measurement system). For example, "substantially the same" may mean that the difference relative to the stated values is within one or more standard deviations, or within ±30%, 20%, 10%, 5%.
In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. Exemplary embodiments are described herein with reference to cross-sectional illustrations that are schematic illustrations of idealized embodiments. In this way, deviations from the shape of the figure as a result of, for example, manufacturing techniques and/or tolerances, will be expected. Thus, the embodiments described herein should not be construed as limited to the particular shapes of regions as illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an area illustrated or described as flat may typically have rough and/or nonlinear features. Furthermore, the sharp corners illustrated may be rounded. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the precise shape of a region and are not intended to limit the scope of the claims.
In order to keep the following description of the embodiments of the present disclosure clear and concise, the present disclosure omits detailed description of known functions and known components.
In order to improve the waterproof performance of the whole folding product, the waterproof structure can only be designed from inside to outside. Generally, waterproof glue is dispensed around a component group area when the display screen is assembled, which requires that the periphery of the component group 02 cannot be covered when a protective Tape (EMI Tape) for static and electromagnetic protection is attached in the production process of the display screen, a glue dispensing reserved space is reserved around the component group 02, but the protective Tape 03 on the surfaces of the components and the circuit board is mutually isolated, the protective Tape 03 on the surface of the component group 02 cannot be grounded, in order to realize grounding, the conventional design is shown in fig. 1A-1C, wherein fig. 1B is a schematic cross-sectional view along a broken line A1B1 in fig. 1A, fig. 1C is a schematic cross-sectional view along a broken line C1D1 in fig. 1A, when the protective Tape 03 is attached, the integrated design is adopted, namely the surface of the component group 02 and the surface of the circuit board are an integral Tape, after the circuit board is bound, the integral transfer film 05 is adopted, the component group 02 surface protection adhesive Tape 03 and the circuit board surface protection adhesive Tape 03 are connected into a whole through small areas on the sides, so that grounding can be achieved, but problems existing in the integrated design are shown in fig. 1C, wherein the right side of fig. 1C is a schematic diagram when the integrated circuit board surface protection adhesive Tape is attached through a transfer film 05, the left side of fig. 1C is a final attached schematic diagram of the circuit board surface protection adhesive Tape 03 after the transfer film 05 is removed, three sides of the component group 02 surface protection adhesive Tape 03 and the circuit board surface protection adhesive Tape 03 are in a broken state, the side edges of the component group 02 present a slope shape when the integrated circuit board surface protection adhesive Tape is attached, and the protection adhesive Tape 03 in the slope area is narrower and longer (for example, the width is 2-3 mm, the length is about 20 mm), wrinkles and virtual attachment problems are necessarily existing when the integrated circuit board surface protection adhesive Tape is attached, and the electromagnetic and electrostatic protection effects are poor.
In view of this, refer to fig. 2A-5B, where fig. 2A is a schematic top view of a circuit board when a first protective tape and a second protective tape are not attached, fig. 2B is a schematic top view of a circuit board along a dotted line A1B1 in fig. 2A, fig. 3A is a schematic top view of a circuit board after the first protective tape is attached, fig. 3B is a schematic top view of a circuit board along a dotted line A1B1 in fig. 3A, fig. 3C2 is a schematic top view of a transfer film attached along a dotted line A2B2 in fig. 3A, fig. 3C1 is a schematic top view of a transfer film corresponding to the second protective tape in fig. 3A, fig. 4B is a schematic top view of a second protective tape, fig. 4C is a schematic top view of a circuit board along a dotted line A1B1 after the first protective tape is attached, fig. 5B is a schematic top view of a circuit board along a dotted line A1B1 in fig. 5A, and an embodiment of the present utility model provides a structure comprising: the device comprises a substrate 1, a component group 2 positioned on one side of the substrate 1, a first protective adhesive tape 3 positioned on one side of the component group 2 away from the substrate 1, and a second protective adhesive tape 4 positioned on one side of the first protective adhesive tape 3 away from the component group 2; specifically, the component group 2 may include one or more components, where the components may include, for example, a control chip IC, a capacitor C, and/or a resistor R;
the first protective tape 3 includes: a cover portion 31 covering the component group 2, and a lap joint portion 32 extending from at least one side of the cover portion 31 to contact with the substrate 1;
the second protective tape 4 is attached to the periphery of the component set 2 and electrically overlaps the overlapping portion 32. Specifically, the periphery of the component group 2 may be understood as a part or all of the area other than the area where the component group 2 is located.
In the embodiment of the utility model, the electronic device protection structure comprises a first protection adhesive tape 3 and a second protection adhesive tape 4 positioned on one side of the first protection adhesive tape 3 away from the component group 2; the first protective tape 3 includes: a cover portion 31 covering the component group 2, and a lap joint portion 32 extending from at least one side of the cover portion 31 to contact with the substrate 1; the second protective adhesive tape 4 is attached to the periphery of the component group 2 and is electrically lapped with the lap joint part 32, that is, in the embodiment of the utility model, the first protective adhesive tape 3 on the surface of the component group 2 is designed to be separated from the second protective adhesive tape 4 on the periphery of the component group 2 through the structural design of the lap joint protective adhesive tape, and then the protective adhesive tapes in two areas are connected through the lap joint mode, so that the first protective adhesive tape 3 on the surface of the component group 2 can be grounded through the second protective adhesive tape 4 on the periphery of the component group 2, and because the cover part 31 on the surface of the component group 2 is integrated with the lap joint part 32 which extends and is designed to be separated from the second protective adhesive tape 4 on the periphery of the component group 2, no fold and virtual adhesion exist in the attaching process of the integrated design, and the problem of poor electromagnetic and electrostatic protection effect caused by the existence of the attached adhesive tapes in the attaching protective adhesive tapes in the prior art can be further improved.
In one possible embodiment, as shown in connection with fig. 5A, the second protective tape 4 has a gap P between the component group 2. Specifically, the gap P may be used to set a waterproof glue for waterproofing the component set 2, that is, by dispensing the component set 2 and the peripheral gap P, so as to strengthen waterproofing of the component set 2, and improve the problem that when the circuit board is applied to a folding display device (for example, a folding mobile phone), due to the folding characteristic, a gap exists between a whole machine screen and a middle frame, and the waterproof performance is poor because the whole machine screen cannot be waterproof through a casing.
In one possible embodiment, as shown in connection with fig. 3A, 3B and 5B, the overlap 32 comprises: a first overlap 321, a second overlap 322 connecting the first overlap 321 and the cover 31; the first overlap 321 contacts the substrate 1, and the overlap 32 is electrically overlapped with the second protective tape 4 at the first overlap 321. Specifically, the second lap portion 322 is used to connect the cover portion 31 and the first lap portion 321, and may be partially in contact with the substrate 1, and partially disposed at an angle to the substrate 1.
In one possible embodiment, as shown in conjunction with fig. 3B and fig. 5B, wherein the lower diagram in fig. 3B is an enlarged schematic view of fig. 3B at a position corresponding to a dashed box in the upper diagram, and the lower diagram in fig. 5B is an enlarged schematic view of fig. 5B at a position corresponding to a dashed box in the upper diagram, the first protective tape 3 includes a first insulating layer 33, a first conductive layer 35, and a second insulating layer 34 stacked in order away from the substrate 1; the second protective tape 4 includes a third insulating layer 41, a second conductive layer 43, and a fourth insulating layer 42 stacked in this order on the side away from the substrate 1; the first conductive layer 35 is exposed on the area of the first protective adhesive tape 3 facing the second protective adhesive tape 4 corresponding to the first overlap portion 321, and the second conductive layer 43 is exposed on the area of the second protective adhesive tape 4 facing the first protective adhesive tape 3 corresponding to the first overlap portion 321, so that the first conductive layer 35 of the first protective adhesive tape 3 and the second conductive layer 43 of the second protective adhesive tape 4 are electrically overlapped.
In one possible embodiment, as shown in connection with fig. 5B, the substrate 1 comprises a third conductive layer comprising wires 5; the second protective tape 4 is also electrically overlapped with a part of the wires 5. Thus, the circuit board is led out by external static electricity or electromagnetic interference signals. Specifically, the material of the wire 5 may be copper, for example.
In one possible embodiment, as shown in connection with fig. 5B, the landing 32 may extend to the side of the circuit board where the conductors 5 are provided.
Specifically, as shown in fig. 5B, the surface of the second protective tape 4 facing the substrate 1 has an opening 40 in a region corresponding to the conductive line at the joint, and the second conductive layer 43 is exposed, so that the second conductive layer 43 of the second protective tape 4 is electrically joined to the conductive line 5.
In one possible embodiment, as shown in connection with fig. 5B, the first insulating layer 33 includes: the first sub-insulating layer 331 and the first insulating adhesive layer 332 on the side of the first sub-insulating layer 331 facing away from the first conductive layer 35; the first conductive layer 35 includes: a first sub-conductive layer 351 and a first conductive adhesive layer 352 positioned on a side of the first sub-conductive layer 351 facing the first insulating layer 33; the second insulating layer 34 includes: the second sub-insulating layer 341 and the second insulating adhesive layer 342 are disposed on a side of the second sub-insulating layer 341 facing the first conductive layer 35.
In one possible embodiment, as shown in connection with fig. 5B, the third insulating layer 41 includes: a third sub-insulating layer 411 and a third insulating adhesive layer 412 on a side of the third sub-insulating layer 411 facing away from the second conductive layer 43; the second conductive layer 43 includes: a second sub-conductive layer 431 and a second conductive adhesive layer 432 on a side of the second sub-conductive layer 431 facing the third insulating layer 41; the fourth insulating layer 42 includes: the fourth sub-insulating layer 421 and the fourth insulating adhesive layer 422 on the side of the fourth sub-insulating layer 421 facing the second conductive layer 43.
In one possible embodiment, as shown in fig. 5B, the material of the first sub-insulating layer 331 is the same as that of the third sub-insulating layer 411, and the material of the first insulating adhesive layer 332 is the same as that of the third insulating adhesive layer 412; specifically, the material of the first sub-insulating layer 331 and the material of the third sub-insulating layer 411 may be, for example, polyethylene terephthalate (Polyethylene terephthalate, PET), and specifically, for example, the material of the first insulating adhesive layer 332 and the material of the third insulating adhesive layer 412 may be both insulating pressure-sensitive adhesives (Pressure Sensitive Adhesive, PSA);
the material of the first sub-conductive layer 351 is the same as that of the second sub-conductive layer 431, and the material of the first conductive adhesive layer 352 is the same as that of the second conductive adhesive layer 432; specifically, the material of the first conductive adhesive layer 352 and the material of the second conductive adhesive layer 432 may be, for example, conductive cloth, or may be, for example, copper layer, or may be, for example, electrostatic spinning; specifically, the material of the first conductive adhesive layer 352 and the material of the second conductive adhesive layer 432 may be, for example, conductive pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA);
the material of the second sub-insulating layer 341 is the same as that of the fourth sub-insulating layer 421, and the material of the second insulating layer 342 is the same as that of the fourth insulating layer 422, and specifically, the material of the second sub-insulating layer 341 and that of the fourth sub-insulating layer 421 may be Mylar (Mylar), for example; the material of the second insulating adhesive layer 342 and the material of the fourth insulating adhesive layer 422 may be, for example, insulating pressure sensitive adhesive (Pressure Sensitive Adhesive, PSA).
In one possible embodiment, as shown in connection with fig. 3A, the projected width d1 of the first lap portion 321 on the substrate 1 is larger than the projected width d2 of the cover portion 31 on the substrate 1 in a direction perpendicular to the direction from the cover portion 31 to the lap portion 32; in a direction perpendicular to the direction from the cover 31 to the overlap 32, the projected width d2 of the cover 31 on the substrate 1 is greater than the projected width d3 of the second overlap 322 on the substrate 1.
In one possible embodiment, as shown in connection with fig. 3A, in a direction from the cover 31 to the overlap 32, a projection length a1 of the first overlap 321 on the substrate 1 is smaller than a projection length a2 of the cover 31 on the substrate 1; the projected length a1 of the first lap portion 321 on the substrate 1 is the same as the projected length a3 of the second lap portion 322 on the substrate 1 in the direction from the cover portion 31 to the lap portion 32.
In one possible embodiment, as shown in connection with fig. 2A and 3A, the front projection of the component group 2 on the substrate 1 falls within the front projection of the cover 31 on the substrate 1. Specifically, the front projection of the cover 31 on the substrate 1 and the front projection of the component group 2 on the substrate 1 may overlap each other.
Based on the same inventive concept, the embodiment of the utility model also provides a circuit board, which comprises the first protective adhesive tape, the substrate and the component group provided by the embodiment of the disclosure.
In one possible embodiment, the circuit board is a flexible circuit board FPC.
Based on the same inventive concept, the embodiment of the utility model also provides a display module, which comprises a display panel, and the circuit board and the second protective adhesive tape provided by the embodiment of the utility model. Specifically, the display module of the embodiment of the utility model may be a folding display device, for example, may be any product or component with a display function, such as a folding mobile phone, a folding tablet computer, a folding television, a folding display, a folding notebook computer, a folding digital photo frame, a folding navigator, and the like. Other essential components of the display device are those of ordinary skill in the art and will not be described in detail herein, nor should they be considered as limiting the present disclosure.
Based on the same inventive concept, the embodiment of the present utility model further provides a manufacturing method for manufacturing the display module provided by the embodiment of the present utility model, as shown in fig. 6, where the manufacturing method includes:
step S100, providing a substrate, wherein one side of the substrate is provided with a component group;
step 200, attaching a first protective adhesive tape on one side of the component group, which is away from the substrate, wherein the first protective adhesive tape comprises: a cover part covering the component group, and a lap joint part extending from at least one side of the cover part to be contacted with the substrate;
and step S300, attaching a second protective adhesive tape to one side, away from the component group, of the first protective adhesive tape, wherein the second protective adhesive tape is attached to the periphery of the component group and is electrically overlapped with the overlap joint part.
In one possible implementation manner, regarding step S200, attaching a first protective tape on a side of the component group facing away from the substrate includes:
step S201, providing a circuit board, wherein one side of the circuit board is provided with a component group;
step S202, attaching a first protective adhesive tape on one side of a circuit board;
step S203, binding the circuit board attached with the first protective adhesive tape with the display panel.
In the embodiment of the utility model, the first protective adhesive tape can be attached after the manufacture of the circuit board supplier is completed, so that the function of protecting static electricity can be achieved when the circuit board is singly manufactured, and the process steps of a module factory are not increased.
The embodiment of the utility model has the following beneficial effects: in the embodiment of the utility model, the electronic device protection structure comprises a first protection adhesive tape 3 and a second protection adhesive tape 4 positioned on one side of the first protection adhesive tape 3 away from the component group 2; the first protective tape 3 includes: a cover portion 31 covering the component group 2, and a lap joint portion 32 extending from at least one side of the cover portion 31 to contact with the substrate 1; the second protective adhesive tape 4 is attached to the periphery of the component group 2 and is electrically lapped with the lap joint part 32, that is, in the embodiment of the utility model, the first protective adhesive tape 3 on the surface of the component group 2 is designed to be separated from the second protective adhesive tape 4 on the periphery of the component group 2 through the structural design of the lap joint protective adhesive tape, and then the protective adhesive tapes in two areas are connected through the lap joint mode, so that the first protective adhesive tape 3 on the surface of the component group 2 can be grounded through the second protective adhesive tape 4 on the periphery of the component group 2, and because the cover part 31 on the surface of the component group 2 is integrated with the lap joint part 32 which extends and is designed to be separated from the second protective adhesive tape 4 on the periphery of the component group 2, no fold and virtual adhesion exist in the attaching process as an integrated design, and further the problem that the electromagnetic and electrostatic protection effect is poor in the attaching protective adhesive tape of the circuit board in the prior art can be solved.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (14)
1. An electronic device protection structure, comprising: the device comprises a substrate, a component group positioned at one side of the substrate, a first protective adhesive tape positioned at one side of the component group away from the substrate, and a second protective adhesive tape positioned at one side of the first protective adhesive tape away from the component group;
the first protective tape includes: a cover part covering the component group and a lap joint part extending from at least one side of the cover part to be in contact with the substrate;
the second protective adhesive tape is attached to the periphery of the component group and is electrically overlapped with the overlap joint part.
2. The electronic device protection structure of claim 1, wherein a gap is provided between the second protective tape and the component group.
3. The electronic device protection structure according to claim 1 or 2, wherein the lap joint portion includes: a first overlap portion, a second overlap portion connecting the first overlap portion and the cover portion;
the first overlap portion is in contact with the substrate, and the overlap portion is electrically overlapped with the second protective adhesive tape at the first overlap portion.
4. The electronic device protection structure of claim 3, wherein the first protective tape comprises a first insulating layer, a first conductive layer, a second insulating layer stacked sequentially away from the substrate; the second protective adhesive tape comprises a third insulating layer, a second conductive layer and a fourth insulating layer which are sequentially far away from the substrate stack;
the first protective adhesive tape faces one surface of the second protective adhesive tape and the area corresponding to the first lap joint part exposes the first conductive layer, and the second protective adhesive tape faces one surface of the first protective adhesive tape and the area corresponding to the first lap joint part exposes the second conductive layer, so that the first conductive layer of the first protective adhesive tape and the second conductive layer of the second protective adhesive tape are electrically overlapped.
5. The electronic device protection structure of claim 4, wherein the substrate comprises a third conductive layer comprising a wire, the wire being grounded;
the second protective adhesive tape is also electrically overlapped with part of the wires.
6. The electronic device protection structure of claim 5, wherein a side of the second protective tape facing the substrate has an opening in a region corresponding to the conductive line at the joint, exposing the second conductive layer such that the second conductive layer of the second protective tape is electrically joined to the conductive line.
7. The electronic device protection structure of any one of claims 4-6, wherein the first insulating layer comprises: the first insulating layer is positioned on one side of the first insulating layer away from the first conductive layer;
the first conductive layer includes: a first sub-conductive layer and a first conductive adhesive layer positioned on one side of the first sub-conductive layer facing the first insulating layer;
the second insulating layer includes: the second insulating layer is positioned on one side of the second insulating layer facing the first conductive layer.
8. The electronic device protection structure of claim 7, wherein the third insulating layer comprises: a third sub-insulating layer and a third insulating adhesive layer which are positioned on one side of the third sub-insulating layer away from the second conductive layer;
the second conductive layer includes: a second sub-conductive layer and a second conductive adhesive layer positioned on one side of the second sub-conductive layer facing the third insulating layer;
the fourth insulating layer includes: and a fourth insulating sub-layer and a fourth insulating adhesive layer positioned on one side of the fourth insulating sub-layer facing the second conductive layer.
9. The electronic device protection structure of claim 8, wherein the material of the first sub-insulating layer is the same as the material of the third sub-insulating layer, and the material of the first insulating adhesive layer is the same as the material of the third insulating adhesive layer;
the material of the first sub-conductive layer is the same as that of the second sub-conductive layer, and the material of the first conductive adhesive layer is the same as that of the second conductive adhesive layer;
the material of the second sub-insulating layer is the same as that of the fourth sub-insulating layer, and the material of the second insulating adhesive layer is the same as that of the fourth insulating adhesive layer.
10. The electronic device protection structure of claim 3, wherein a width of a projection of the first landing portion onto the substrate is greater than a width of a projection of the cover portion onto the substrate;
the width of the projection of the covering part on the substrate is larger than the width of the projection of the second lap joint part on the substrate.
11. The electronic device protection structure of claim 3, wherein a projected length of the first landing portion on the substrate is less than a projected length of the cover portion on the substrate;
the projection length of the first lap joint part on the substrate is the same as the projection length of the second lap joint part on the substrate.
12. The electronic device protection structure of claim 3, wherein a projection of the component group onto the substrate falls within a projection of the cover portion onto the substrate.
13. A circuit board comprising a substrate, further comprising the first protective tape of any one of claims 1-12, and the component group.
14. A display module comprising a display panel, the circuit board of claim 13, and the second protective tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221261431.XU CN219287854U (en) | 2022-05-24 | 2022-05-24 | Electronic device protection structure, circuit board and display module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221261431.XU CN219287854U (en) | 2022-05-24 | 2022-05-24 | Electronic device protection structure, circuit board and display module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219287854U true CN219287854U (en) | 2023-06-30 |
Family
ID=86930399
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221261431.XU Active CN219287854U (en) | 2022-05-24 | 2022-05-24 | Electronic device protection structure, circuit board and display module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219287854U (en) |
-
2022
- 2022-05-24 CN CN202221261431.XU patent/CN219287854U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110515499B (en) | Touch panel and touch display device | |
| WO2017133137A1 (en) | Display module and display device | |
| WO2019047151A1 (en) | Display module, display panel, display device and electronic device | |
| CN109116649B (en) | Display panel and display device | |
| CN214122615U (en) | Display module and display device | |
| CN111556648B (en) | Driving chip protective film and display device | |
| US20230164907A1 (en) | Flexible printed circuit board and display device | |
| CN105573557A (en) | Touch display panel and touch display device | |
| KR102520709B1 (en) | Protection tape for printed circuit board and display apparatus comprising the same | |
| CN113903260B (en) | Display module and display device | |
| CN113380785A (en) | Display module and display device | |
| CN219287854U (en) | Electronic device protection structure, circuit board and display module | |
| US20230008693A1 (en) | Display apparatus and electronic device | |
| TWM573019U (en) | Touch display device | |
| CN117156734A (en) | Electronic device protection structure, circuit board, display module and manufacturing method | |
| CN111610879A (en) | Touch panel, preparation method of touch panel, touch assembly and electronic equipment | |
| CN216773243U (en) | Display panel and display device | |
| CN113056720A (en) | Touch substrate and touch display device | |
| CN216487054U (en) | Display module and display device | |
| CN112558822B (en) | Touch device, electronic equipment and manufacturing method of touch device | |
| CN214201990U (en) | Touch display screen and display device | |
| US11765830B2 (en) | Flexible printed circuit and display device | |
| CN110517584B (en) | Display module, display device and preparation method of display module | |
| CN113407058A (en) | Touch control display panel | |
| CN215869385U (en) | Display module and display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |