CN219287819U

CN219287819U - Novel overlap joint keyboard module

Info

Publication number: CN219287819U
Application number: CN202223285250.3U
Authority: CN
Inventors: 石书炳
Original assignee: Suzhou Changli Rubber & Plastic Technology Co ltd
Current assignee: Suzhou Changli Rubber & Plastic Technology Co ltd
Priority date: 2022-12-08
Filing date: 2022-12-08
Publication date: 2023-06-30
Anticipated expiration: 2032-12-08

Abstract

The utility model relates to the technical field of computer keyboards, in particular to a novel lap joint keyboard module, which comprises an upper circuit, a lower circuit and a middle partition layer arranged between the upper circuit and the lower circuit, wherein welding area groups corresponding to each other are respectively arranged at the bottom of the upper circuit and the top of the lower circuit, lap joint circuit layers are respectively distributed in the two welding area groups, and electronic silver paste welding points for connecting the lap joint circuit layers are respectively arranged in the two welding area groups. According to the utility model, welding operation is performed on the lap joint area of the upper circuit, the middle interlayer and the lower circuit in a laser welding mode, so that the connection of the lap joint circuit layers can be ensured by the electronic silver paste or the conductive paste through the welding ports on the middle interlayer, the conductive effect of the keyboard module is enabled to be equal to that of the conductive adhesive, the lap joint mode is improved, the procedures and materials for attaching the conductive adhesive are reduced, the production cost is reduced, the production process is optimized, and the production efficiency of the keyboard is improved.

Description

Novel overlap joint keyboard module

Technical Field

The utility model relates to the technical field of computer keyboards, in particular to a novel lap joint keyboard module.

Background

After long-term development, the keyboard membrane switch is basically deposited and stable in mechanism, the functionality of the keyboard membrane switch is greatly improved through the continuously developed post-inspection process, and how the keyboard membrane switch can be innovatively simplified in material application and process becomes the focus of competition of various families at present.

At present, a membrane switch is divided into an upper layer circuit, a middle interlayer and a lower layer circuit, wherein the upper layer circuit and the lower layer circuit are all arranged, the upper layer circuit and the lower layer circuit are communicated in a folding mode at the earliest, namely, the upper layer circuit and the lower layer circuit are printed on the same layer of substrate firstly, the communicated circuits of the upper layer circuit and the lower layer circuit are concentrated to a plurality of positions, after the positions are folded, the superposition of the conducting points of the upper layer circuit and the lower layer circuit is realized, and the folding positions are welded and fixed by ultrasonic wave and other processes to reduce the tilting influence thickness of the upper layer circuit and the lower layer circuit; after later development, the upper and lower circuits are communicated through anisotropic conductive adhesive, which is called a lapping process, so that some defects of doubling are overcome; however, the existing doubling process is not beneficial to centralized typesetting of the circuit, space occupation at the doubling position affects keyboard functions, the lapping process needs to attach conductive adhesive on one layer of the circuit, the upper circuit and the lower circuit can achieve a conducting effect after being assembled through a hot pressing process, poor conduction can be generated due to variation of the hot pressing process, and accordingly risks of short circuit occur, and normal use of the keyboard module is affected.

Disclosure of Invention

The utility model provides a novel lap joint keyboard module for solving the problems in the background technology.

In order to solve the technical problems, the utility model adopts the following technical scheme:

the utility model provides a novel overlap joint keyboard module, includes upper circuit, lower floor's circuit and sets up the middle barrier between upper circuit and the lower floor's circuit, the bottom of upper circuit and the top of lower floor's circuit are provided with the welding area group that corresponds each other respectively, two the inside of welding area group distributes respectively has overlap joint circuit layer, and two be provided with the electron silver thick liquid welding point that is used for connecting overlap joint circuit layer respectively in the welding area group, the surface of middle barrier is provided with the welding mouth that corresponds overlap joint circuit layer.

Preferably, the electronic silver paste welding points on the upper layer circuit and the lower layer circuit are connected in a laser welding mode.

Preferably, one of the welding area groups includes a plurality of welding areas, and two of the welding areas are distributed on the surface of the upper layer circuit or the lower layer circuit according to the structure.

By adopting the technical scheme, the beneficial effects obtained by the utility model are as follows:

according to the utility model, the electronic silver paste or the conductive paste is arranged at the welding area group of the upper circuit and the lower circuit, and then the upper circuit, the middle layer and the lower circuit are sequentially distributed and assembled together, so that the welding operation at the lap joint area is performed in a laser welding mode, the connection of the lap joint circuit layer is ensured through the welding opening on the middle layer by the electronic silver paste or the conductive paste, the conductive effect of the keyboard module is enabled to be equal to that of the conductive adhesive, the lap joint mode after improvement is further realized, the process and the material for pasting the conductive adhesive are reduced, the production cost is reduced, the production process is optimized, and the production efficiency of the keyboard is improved.

Drawings

Fig. 1 is a schematic diagram of the overall structure of the present utility model.

In the figure: 1. an upper layer line; 2. a lower layer circuit; 3. a middle interlayer; 4. a welding region group; 5. overlapping the circuit layers; 6. and (5) welding the mouth.

Detailed Description

In order that the above objects, features and advantages of the utility model will be more clearly understood, a further description of the utility model will be rendered by reference to the appended drawings and examples. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments may be combined with each other.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, however, the present utility model may be practiced otherwise than as described herein, and therefore the present utility model is not limited to the specific embodiments of the disclosure that follow.

Example 1

As shown in fig. 1, the utility model provides a novel lap joint keyboard module, which comprises an upper circuit 1, a lower circuit 2 and a middle partition layer 3 arranged between the upper circuit 1 and the lower circuit 2, wherein welding area groups 4 corresponding to each other are respectively arranged at the bottom of the upper circuit 1 and the top of the lower circuit 2, lap joint circuit layers 5 are respectively distributed in the two welding area groups 4, one welding area group 4 comprises a plurality of welding areas, the two welding areas are structurally distributed on the surface of the upper circuit 1 or the lower circuit 2, electronic silver paste welding points for connecting the lap joint circuit layers 5 are respectively arranged in the two welding area groups 4, and welding ports 6 corresponding to the lap joint circuit layers 5 are respectively arranged on the surface of the middle partition layer 3.

In this embodiment, the electronic silver paste soldering points on the upper layer circuit 1 and the lower layer circuit 2 are connected by adopting a laser soldering mode.

Specifically, after the upper layer circuit 1, the lower layer circuit 2 and the middle partition layer 3 are processed and molded by the external prior art, the upper layer circuit 1, the lower layer circuit 2 and the middle partition layer 3 are distributed and assembled together in sequence, and then the welding operation of the lap joint area is performed by utilizing the laser welding mode, so that the same conduction effect as that of the existing conductive adhesive is achieved, the conductive adhesive attaching process and materials are reduced, the production cost is reduced, the production process is optimized, and the production efficiency is improved.

The working principle and the using flow of the utility model are as follows: when the keyboard module is used, electronic silver paste or conductive paste is arranged at the welding area group 4 of the upper circuit 1 and the lower circuit 2, so that the upper circuit 1, the middle layer 3 and the lower circuit 2 are sequentially distributed and assembled together, and finally, the welding operation at the lap joint area is performed in a laser welding mode, so that the electronic silver paste or conductive paste can be connected with the lap joint circuit layer 5 through the welding port 6 on the middle layer 3 after laser welding, the conductive effect of the keyboard module is enabled to be equal to that of the conductive adhesive, the lap joint mode after improvement is achieved, the procedures and materials for pasting the conductive adhesive are reduced, the production cost is reduced, the production process is optimized, and the production efficiency of the keyboard is improved.

In the present utility model, the term "plurality" means two or more, unless explicitly defined otherwise. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items. The terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; "coupled" may be directly coupled or indirectly coupled through intermediaries. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It will be understood that when an element is referred to as being "mounted," "secured" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.

In the description of the present specification, the terms "one embodiment," "some embodiments," "particular embodiments," and the like, mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims

1. Novel overlap joint keyboard module, including upper circuit (1), lower floor's circuit (2) and set up intermediate barrier (3) between upper circuit (1) and lower floor's circuit (2), its characterized in that: the bottom of upper circuit (1) and the top of lower floor's circuit (2) are provided with welding area group (4) that corresponds each other respectively, two the inside of welding area group (4) distributes respectively has overlap joint circuit layer (5), and two be provided with respectively in welding area group (4) and be used for connecting the electronic silver thick liquid welding point of overlap joint circuit layer (5), the surface of intermediate barrier (3) is provided with welding mouthful (6) corresponding to overlap joint circuit layer (5).

2. The novel lap joint keyboard module of claim 1, wherein the electronic silver paste welding points on the upper layer circuit (1) and the lower layer circuit (2) are connected in a laser welding mode.

3. The novel lap joint keyboard module according to claim 1, wherein one welding area group (4) comprises a plurality of welding areas, and the welding areas are distributed on the surface of an upper layer circuit (1) or a lower layer circuit (2) according to a structure.