CN219276283U

CN219276283U - Wafer cutting device

Info

Publication number: CN219276283U
Application number: CN202320146696.3U
Authority: CN
Inventors: 寇立选; 刘盛浦
Original assignee: Zhejiang Boda Photoelectric Co ltd
Current assignee: Zhejiang Boda Photoelectric Co ltd
Priority date: 2023-02-08
Filing date: 2023-02-08
Publication date: 2023-06-30
Anticipated expiration: 2033-02-08

Abstract

The utility model discloses a wafer cutting device which comprises a workbench, wherein the top end of the workbench is provided with a box body, the outer side wall of the box body is provided with a driving motor, the output end of the driving motor is connected with a screw rod, the screw rod is connected with a sliding block in a threaded manner, the bottom end of the sliding block is provided with a connecting rod, the bottom end of the connecting rod is provided with an electric push rod, the output end of the electric push rod is connected with a cutting mechanism, and the workbench is provided with a clamping mechanism which is in sliding connection with the workbench through a pulley assembly. Compared with the prior art, the utility model is convenient for adjusting the position of the cutting knife and the position of the wafer in real time and cutting wafers with various specifications.

Description

Wafer cutting device

Technical Field

The present disclosure relates to wafer dicing devices, and particularly to a wafer dicing device.

Background

Cutting devices are required in the production of wafers, however, conventional cutting devices are generally not capable of adjusting or moving the wafers to be cut, thereby making it inconvenient for a worker to adjust the cutting size of the wafers.

Through searching, the utility model with the Chinese patent application number of CN202022177094.3 discloses a wafer chip processing device, which comprises a case, a step table and a cutting machine, wherein the step table is arranged on one side of the bottom of an inner cavity of the case, the cutting machine is arranged at the top of the inner cavity of the case, a gear crawler is arranged at the bottom of the inner cavity of the step table, a fixed cylinder is slidably arranged at the top of the gear crawler, and a tooth slot is formed in the bottom of the fixed cylinder. Although the wafer can be cut, the position of the cutting knife cannot be adjusted in real time, and the position of the wafer cannot be adjusted, so that the wafer with various specifications can be cut conveniently.

Disclosure of Invention

The utility model aims to provide a wafer cutting device, which solves the problems that the position of a cutting knife cannot be adjusted in real time and the position of a wafer cannot be adjusted in the prior art, and is inconvenient for cutting wafers with various specifications.

The technical scheme adopted by the utility model is as follows:

the utility model provides a wafer cutting device, includes the workstation, the top of workstation is provided with the box, the lateral wall of box is provided with driving motor, driving motor's output is connected with the screw rod, threaded connection slider on the screw rod, the bottom of slider is provided with the connecting rod, the bottom of connecting rod is provided with electric putter, electric putter's output is connected with cutting mechanism, be provided with fixture on the workstation, fixture pass through pulley assembly with workstation sliding connection.

Further, cutting mechanism includes the diaphragm, two risers of bottom fixed connection of diaphragm, two rotate between the riser and be connected with the pivot, the cover is equipped with the cutting knife in the pivot, the one end of pivot runs through the right side the riser extends to the right side the riser is connected with driven gear outward, the right side fixedly connected with motor on the riser, the output of motor is connected with the driving gear, the driving gear with driven gear meshing is connected.

Further, fixture includes the loading board, the top of loading board is close to lateral wall fixedly connected with a plurality of fixed block, vertical sliding connection has the grip block on the fixed block, the grip block is L type, the grip block is located the below cover of fixed block is equipped with the spring, the top of grip block still fixedly connected with stopper.

Further, the pulley assembly comprises a sliding groove arranged on the workbench, a pulley is movably connected in the sliding groove, and the pulley is fixedly connected with the bottom end of the clamping mechanism.

Further, the bottom fixedly connected with motor case of workstation, motor incasement fixedly connected with step motor, step motor pivot is connected to step motor's output, step motor pivot's the other end runs through the workstation and extends to in the box with fixture's bottom fixed connection.

Further, a plurality of supporting legs are further arranged at the bottom end of the workbench.

The beneficial effects of the utility model are as follows: through the driving motor drive screw that sets up rotation, the screw rod drives cutting mechanism and removes the size that conveniently adjusts the needs cutting wafer, and the wafer centre gripping is on fixture, and fixture and workstation pass through pulley assembly and can slide on the workstation, and the disposable cutting of completion can be realized to slide fixture when cutting the wafer, need not to readjust the position and cut again, compares in prior art, and convenient real-time adjustment cutting knife's position and the position of adjusting the wafer are convenient for cut out the wafer of multiple specification.

Drawings

FIG. 1 is a schematic diagram of a wafer dicing apparatus according to the present utility model;

fig. 2 is an enlarged side view of a wafer dicing apparatus of the utility model.

Description of the reference numerals

The device comprises a 1-workbench, a 11-motor box, a 12-stepping motor, a 13-stepping motor rotating shaft, a 14-supporting leg, a 2-box body, a 3-driving motor, a 4-screw rod, a 5-sliding block, a 6-connecting rod, a 7-electric push rod, an 8-cutting mechanism, a 81-transverse plate, a 82-vertical plate, a 83-rotating shaft, a 84-cutting knife, a 85-driven gear, a 86-motor, a 87-driving gear, a 9-clamping mechanism, a 91-bearing plate, a 92-fixed block, a 93-clamping block, 931-limiting blocks, a 94-spring, a 10-pulley assembly, a 101-sliding groove and 102-pulley.

Detailed Description

The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the utility model, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-2, a wafer cutting device comprises a workbench 1, the top of workbench 1 is provided with box 2, the lateral wall of box 2 is provided with driving motor 3, driving motor 3's output is connected with screw rod 4, threaded connection slider 5 on the screw rod 4, the bottom of slider 5 is provided with connecting rod 6, the bottom of connecting rod 6 is provided with electric putter 7, electric putter 7's output is connected with cutting mechanism 8, be provided with fixture 9 on the workbench 1, fixture 9 pass through pulley assembly 10 with workbench 1 sliding connection.

The cutting mechanism 8 comprises a transverse plate 81, two vertical plates 82 are fixedly connected to the bottom end of the transverse plate 81, a rotating shaft 83 is rotatably connected between the two vertical plates 82, a cutting knife 84 is sleeved on the rotating shaft 83, one end of the rotating shaft 83 penetrates through the right side of the vertical plates 82 and extends to the right side of the vertical plates 82, a driven gear 85 is connected to the outside of the vertical plates 82, a motor 86 is fixedly connected to the vertical plates 82, a driving gear 87 is connected to the output end of the motor 86, and the driving gear 87 is in meshed connection with the driven gear 85.

The fixture 9 includes the loading board 91, the top of loading board 91 is close to lateral wall fixedly connected with a plurality of fixed block 92, vertical sliding connection has grip block 93 on the fixed block 92, grip block 93 is L type, grip block 93 is located the below cover of fixed block 92 is equipped with spring 94, the top of grip block 93 still fixedly connected with stopper 931.

The pulley assembly 10 comprises a chute 101 arranged on the workbench 1, a pulley 102 is movably connected in the chute 101, and the pulley 102 is fixedly connected with the bottom end of the clamping mechanism 9.

The bottom fixedly connected with motor case 11 of workstation 1, fixedly connected with step motor 12 in the motor case 11, step motor pivot 13 is connected to step motor 12's output, step motor pivot 13's the other end runs through workstation 1 and extends to in the box 2 with fixture 9's bottom fixed connection.

The bottom end of the workbench 1 is also provided with a plurality of support legs 14.

The working process of the utility model is described in detail below: when the utility model is used, the limiting block 931 is pulled, the clamping block 93 slides on the fixed block 92, a wafer to be cut is placed on the bearing plate 91, the limiting block 931 is loosened, the spring 94 has a reaction force to press the clamping block 93 on the wafer to prevent the wafer from moving, the driving motor 3 drives the screw 4 to rotate, the sliding block 5 on the screw 4 moves, the transverse position of the cutting mechanism 8 is regulated, the longitudinal position of the cutting mechanism 8 is regulated by the electric push rod 7, the size to be cut is cut, the motor 86 on the right vertical plate 82 is started, the motor 86 drives the driving gear 87 to rotate, the driving gear 87 drives the driven gear 85 in meshed connection to rotate, and the driven gear 85 drives the cutter 84 on the rotating shaft 83 to cut; the stepping motor 12 drives the stepping motor rotating shaft 13 to rotate, drives the bearing plate 91 to rotate on the workbench 1, and the bearing plate 91 slides on the sliding groove 101 on the workbench 1 through the fixedly connected pulley 102, so that the cutting is realized while the rotation is realized, and the cutting is finished at one time. The utility model can adjust the position of the cutting mechanism 8 and adjust the position of the wafer in real time, thereby being convenient for cutting wafers with various specifications

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides a wafer cutting device, includes workstation (1), its characterized in that, the top of workstation (1) is provided with box (2), the lateral wall of box (2) is provided with driving motor (3), the output of driving motor (3) is connected with screw rod (4), threaded connection slider (5) on screw rod (4), the bottom of slider (5) is provided with connecting rod (6), the bottom of connecting rod (6) is provided with electric putter (7), the output of electric putter (7) is connected with cutting mechanism (8), be provided with fixture (9) on workstation (1), fixture (9) pass through pulley assembly (10) with workstation (1) sliding connection.

2. A wafer cutting device according to claim 1, characterized in that the cutting mechanism (8) comprises a transverse plate (81), two risers (82) are fixedly connected to the bottom end of the transverse plate (81), a rotating shaft (83) is rotatably connected between the two risers (82), a cutting knife (84) is sleeved on the rotating shaft (83), one end of the rotating shaft (83) penetrates through the right side of the riser (82) and extends to the right side of the riser (82) to be externally connected with a driven gear (85), a motor (86) is fixedly connected to the right side of the riser (82), and an output end of the motor (86) is connected with a driving gear (87), and the driving gear (87) is in meshed connection with the driven gear (85).

3. The wafer cutting device according to claim 1, wherein the clamping mechanism (9) comprises a bearing plate (91), a plurality of fixing blocks (92) are fixedly connected to the top end of the bearing plate (91) close to the outer side wall, clamping blocks (93) are longitudinally and slidably connected to the fixing blocks (92), the clamping blocks (93) are L-shaped, springs (94) are sleeved below the fixing blocks (92) and located on the clamping blocks (93), and limiting blocks (931) are fixedly connected to the top ends of the clamping blocks (93).

4. A wafer cutting device according to claim 1, characterized in that the pulley assembly (10) comprises a chute (101) arranged on the workbench (1), a pulley (102) is movably connected in the chute (101), and the pulley (102) is fixedly connected with the bottom end of the clamping mechanism (9).

5. The wafer cutting device according to claim 1, wherein the bottom end of the workbench (1) is fixedly connected with a motor box (11), a stepping motor (12) is fixedly connected in the motor box (11), the output end of the stepping motor (12) is connected with a stepping motor rotating shaft (13), and the other end of the stepping motor rotating shaft (13) penetrates through the workbench (1) and extends into the box (2) to be fixedly connected with the bottom end of the clamping mechanism (9).

6. A wafer cutting device according to claim 1, characterized in that the bottom end of the table (1) is further provided with a plurality of support legs (14).