CN219267610U

CN219267610U - Dry etching equipment

Info

Publication number: CN219267610U
Application number: CN202320309080.3U
Authority: CN
Inventors: 朱焜
Original assignee: Yuexin Semiconductor Technology Co ltd
Current assignee: Yuexin Semiconductor Technology Co ltd
Priority date: 2023-02-24
Filing date: 2023-02-24
Publication date: 2023-06-27
Anticipated expiration: 2033-02-24

Abstract

The present utility model provides a dry etching apparatus comprising: the device comprises a cavity top wall, a spray disc and an air flow regulating device, wherein the spray disc is fixedly arranged on the cavity top wall, N spray holes are formed in the spray disc, and the larger the distance between the spray holes and the circle center of the spray disc is, the larger the aperture of the spray holes is; the airflow regulating device comprises a driving piece and a current limiting plate, wherein the driving piece is fixed on the top wall of the cavity, and the current limiting plate covers the opening position of any spray hole with the largest aperture; and the driving piece drives the spraying hole to rotate so as to adjust the opening size of the spraying hole. The dry etching equipment can solve the problems of high cost and low efficiency of the existing dry etching equipment when the process gas space distribution condition is adjusted.

Description

Dry etching equipment

Technical Field

The utility model relates to the field of semiconductor equipment, in particular to dry etching equipment.

Background

The etching uniformity is an important technical index of the etching process, the uniformity of the process temperature, the uniformity of the process gas supply, the structural structure of the cavity and the like can influence the etching uniformity, but the influence factors influence each other, the situation is complex, and the parameters need to be adjusted in real time according to different product models so as to make the etching uniform.

The analysis and control of the influence factor of the uniformity of the process gas supply can show that the gas spraying discs arranged in the process chamber are used for supplying the process gas to the process chamber, when etching is performed, the spraying discs are arranged above the wafer, a plurality of gas spraying holes with different sizes are distributed on the carrier disc, the uniformity of the process gas distribution is influenced by the opening sizes of the gas spraying holes, but in the existing equipment structure, if the opening sizes of the spraying holes are required to be adjusted, the spraying discs with different hole distributions are required to be replaced, so that the equipment is required to be subjected to cavity opening maintenance operation, the process is complicated, the utilization rate of the equipment is seriously influenced, and the maintenance cost is increased.

Disclosure of Invention

In view of the above-mentioned drawbacks of the prior art, an object of the present utility model is to provide a dry etching apparatus for solving the problems of high cost and low efficiency of the existing dry etching apparatus when adjusting the process gas space distribution.

To achieve the above and other related objects, the present utility model provides a dry etching apparatus comprising: the top wall of the cavity, a spray disc and an airflow adjusting device, wherein,

the spraying disc is fixedly arranged on the top wall of the cavity, N spraying holes are formed in the spraying disc, the larger the distance between the spraying holes and the circle center of the spraying disc is, the larger the hole diameter is, the N spraying holes are divided into M groups of spraying holes according to the hole diameter, the spraying holes in each group of spraying holes are arranged at equal-angle intervals around the circle center of the spraying disc, and N and M are positive integers;

the airflow regulating device comprises a driving piece and a current limiting plate, wherein the driving piece is fixed on the top wall of the cavity, and the current limiting plate covers the opening position of any spray hole with the largest aperture; simultaneously, the current limiting plate is connected with the driving piece, and the driving piece drives the current limiting plate to rotate so as to adjust the size of the covered opening of the spraying hole.

Optionally, the airflow adjusting device further comprises a torque sensor fixed on the top wall of the cavity and connected with the driving piece.

Optionally, the airflow adjusting device further comprises a rotating shaft, the rotating shaft is connected with the current limiting plate, and the driving piece drives the rotating shaft to rotate and drives the current limiting plate to rotate.

Optionally, the flow limiting plate is circular, and the rotation axis is offset from the center of the flow limiting plate.

Optionally, the air flow adjusting device further comprises an annular guide rail, the annular guide rail is annularly arranged on the periphery of the spraying disc, a sliding block is arranged on the lower side of the flow limiting plate, the sliding block is embedded in the annular guide rail, and the driving piece is connected with the annular guide rail to drive the sliding block to slide.

Optionally, the airflow adjusting device comprises a plurality of flow limiting plates, and the plurality of flow limiting plates are arranged around the spraying disc at equal angle intervals.

Optionally, a group of spray holes at the outermost side of the spray disc are provided with K spray holes, the airflow adjusting device comprises K flow limiting plates, the K flow limiting plates are respectively attached to outlets of the K spray holes, and K is more than or equal to 2.

Alternatively, k=8.

Optionally, the airflow adjusting device includes K driving members, and the K driving members drive K flow limiting plates to rotate separately.

As described above, the dry etching equipment of the utility model is provided with the air flow adjusting device capable of adjusting the size of the spraying holes on the spraying disc, and the size of the spraying holes can be flexibly adjusted by controlling the rotation of the flow limiting plate in the air flow adjusting device, i.e. the adjustment of the process air uniformity can be completed without cavity opening maintenance operation, and the efficiency is high and the cost is low.

Drawings

Fig. 1 is a schematic view showing the structure of a dry etching apparatus not provided with an air flow regulating device.

Fig. 2 shows a schematic structure of the spray disk with four groups of spray holes.

Fig. 3 shows a schematic structure of the spray disk with five groups of spray holes.

Fig. 4 is a schematic view showing a partial structure of the dry etching apparatus provided with 1 flow restricting plate.

Fig. 5 shows a schematic structure of the air flow regulating device provided with 8 flow limiting plates.

Fig. 6 shows a schematic structural view of the air flow regulating device for covering the two spray holes for the 1 flow limiting plates at the same time.

Fig. 7 shows a schematic view of the structure of the air flow regulating device with the annular track.

Description of element reference numerals

10. Dry etching equipment

11. Gas access channel

12. Wafer bearing table

100. Chamber top wall

200. Spraying disc

210. Spray hole

300. Air flow regulating device

310. Driving piece

320. Flow limiting plate

330. Circular rail

340. Sliding block

Detailed Description

Other advantages and effects of the present utility model will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present utility model with reference to specific examples. The utility model may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present utility model.

Please refer to fig. 1 to 7. It should be understood that the structures, proportions, sizes, etc. shown in the drawings are for illustration purposes only and should not be construed as limiting the utility model to the extent that it can be practiced, since modifications, changes in the proportions, or otherwise, used in the practice of the utility model, are not intended to be critical to the essential characteristics of the utility model, but are intended to fall within the spirit and scope of the utility model. Also, the terms such as "upper," "lower," "left," "right," "middle," and "a" and the like recited in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model, but are intended to provide relative positional changes or modifications without materially altering the technical context in which the utility model may be practiced.

Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The present embodiment provides a dry etching apparatus 10, the dry etching apparatus 10 including:

the device comprises a cavity top wall 100 and a spraying disc 200, wherein the spraying disc 200 is fixedly arranged on the cavity top wall 100, the spraying disc 200 is provided with N spraying holes 210, the larger the distance between the spraying holes 210 and the circle center of the spraying disc is, the larger the hole diameter is, the N spraying holes 210 are divided into M groups of spraying holes according to the hole diameter, the spraying holes 210 in each group of spraying holes are arranged around the circle center of the spraying disc at equal-angle intervals, and N and M are positive integers.

In this embodiment, as shown in fig. 1, a chamber top wall 100 is provided with a gas access channel 11; the spraying disc is used for supplying process gas to the chamber, is fixed on the lower side of the gas access channel 11 and is connected with the gas access channel, a wafer bearing table 12 (usually a rotatable bearing table) is arranged on the lower side of the spraying disc, the central axis of the wafer bearing table is overlapped with the central axis of the spraying disc, and the spraying holes distributed at equal angle intervals can spray the process gas more uniformly, so that the wafer is etched uniformly. And the spray holes having the same distance from the center of the circle can be divided into the same group, and the spray holes in the same group have the same diameter, so that the larger the distance between the spray holes 210 and the center of the spray disk, the larger the diameter of the holes is, which is beneficial to the uniformity distribution of the process gas, because the process gas sprayed from the spray holes located at the periphery of the spray disk 200 can diffuse to the periphery of the chamber.

As one example, as shown in fig. 2, the spray disk 200 includes 19 spray holes 210, divided into four groups, with the spray holes 210 located at the center position having the smallest aperture and the group of spray holes 210 located at the largest distance from the center having the largest aperture.

As another example, as shown in fig. 3, the shower plate 200 includes 27 shower holes 210, divided into five groups in total, the shower holes 210 located at the center position having the smallest aperture and the group of shower holes 210 having the largest aperture at the distance from the center.

The airflow adjusting device 300 comprises at least one driving piece 310 and at least one flow limiting plate 320, wherein the driving piece 310 is fixed on the top wall 100 of the cavity, the flow limiting plate 320 is attached to the spraying holes 210 attached to the outermost side of the spraying disc 200, and covers the spraying holes 210; meanwhile, the flow limiting plate 320 is connected to the driving member 310, and is rotated by the driving member 310 to adjust the size of the shower holes 210 to be covered.

In this embodiment, as shown in fig. 2 and 4, the hole diameter of a group of spray holes 210 located at the outermost side of the spray disc is the largest, the flow limiting plate 320 covers the spray holes with the largest hole diameter to cover the outlets thereof, meanwhile, the flow limiting plate can adjust the opening sizes of the spray holes 210 covered by the flow limiting plate according to different rotation angles, that is, adjust the distribution of process gas according to different rotation angles, and through the air flow adjusting device 300, an operator can flexibly adjust the opening sizes of the spray holes to change the gas distribution in the process chamber, meanwhile, the adjustment operation of the operator can be completed by directly controlling the rotation angles of the flow limiting plate through holes without opening the chamber, so that the operation is simple.

The number of the flow-limiting plates may be only one, or may be plural, and at the same time, one flow-limiting plate may cover only one spraying hole, or may cover plural spraying holes at the same time, and specifically, the following examples are provided.

As a first example thereof, as shown in fig. 3 and 4, a case in which the number of the flow-limiting plates 320 is 1, the shape is circular, and the flow-limiting plates 320 can mask one of the group of the spray holes 210 located at the outermost side of the spray disk 200 is shown, and as shown in fig. 2, the flow-limiting plates 320 are fixed to the spray disk 200 by the rotation shaft 310, and the opening sizes of the masked spray holes 210 can be adjusted by adjusting the angles of the flow-limiting plates 320.

As a second example thereof, as shown in fig. 5, there is shown a case in which the number of the flow-limiting plates 320 is 8 (the number of the group of spray holes located at the outermost side of the spray disk is 8), the shape is circular, each flow-limiting plate 320 is capable of covering one of the group of spray holes 210 located at the outermost side of the spray disk 200, and as shown, each flow-limiting plate 320 is fixed to the cavity sidewall 100 located at the periphery of the spray disk through the rotation shaft 310, and the opening size of the covered spray hole 210 can be adjusted by adjusting the angle of the flow-limiting plate 320; and each current limiting plate can respectively regulate and control the size of the spraying holes covered by the current limiting plates, and can also simultaneously rotate the same angle and synchronously regulate the size of the spraying holes covered by the current limiting plates.

As a third example thereof, as shown in fig. 6, there is shown a case where the number of the flow-limiting plates is 1 (the number of the set of spray holes located at the outermost side of the spray disk is 8), and the flow-limiting plates can mask one of the set of spray holes located at the outermost side of the spray disk and one of the set of spray holes located at the next outer side of the spray disk simultaneously, and as shown in fig. 5, the flow-limiting plates are fixed to the spray disk through the rotation shaft, and the opening sizes of the two masked spray holes can be adjusted simultaneously by adjusting the angle of the flow-limiting plates.

As a fourth example, as shown in fig. 7, the number of the flow limiting plates 320 is 8 (the number of a group of spray holes positioned at the outermost side of the spray disk is 8), the 8 flow limiting plates are respectively covered up to the 8 spray holes positioned at the outermost side of the spray disk, as shown in fig. 6, the 8 flow limiting plates are engaged with the circular track 330 through the sliding blocks 340 arranged below the 8 flow limiting plates, the circular track 330 is arranged at the periphery of the spray disk 200, and the driving shaft (not shown) drives the sliding blocks 340 to move, drives the flow limiting plates 320 to rotate, and adjusts the opening sizes of the covered spray holes.

Specifically, the airflow regulator 300 further includes a torque sensor (not shown) that is fixed to the top wall of the cavity and is connected to the driving member.

In this embodiment, the driving member adopts a motor, for example, the motor may be directly connected to the current-limiting plate to control the movement of the driving member, or may be connected to the current-limiting plate through the driving shaft, or may further drive the sliding block to move, so as to drive the current-limiting plate to move. Meanwhile, a torque sensor is arranged beside the driving piece and is connected with a control system of the dry etching equipment, and the opening size of the spraying hole is measured by measuring the rotation angle of the driving piece.

In summary, according to the dry etching apparatus of the present utility model, the airflow adjusting device capable of adjusting the size of the spraying holes is disposed on the spraying disc, and the size of the spraying holes can be flexibly adjusted by controlling the rotation of the flow limiting plate in the airflow adjusting device, that is, the adjustment of the process gas uniformity can be completed without the maintenance operation of opening the cavity, which is high in efficiency and low in cost.

The above embodiments are merely illustrative of the principles of the present utility model and its effectiveness, and are not intended to limit the utility model. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the utility model. Accordingly, it is intended that all equivalent modifications and variations of the utility model be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims

1. A dry etching apparatus, characterized in that the dry etching apparatus comprises: the top wall of the cavity, a spray disc and an airflow adjusting device, wherein,

the spray disc is fixedly arranged on the top wall of the cavity, the spray disc is provided with N spray holes, the larger the distance between the spray holes and the circle center of the spray disc is, the larger the aperture is, the N spray holes are divided into M groups of spray holes according to the aperture size, the same aperture as the spray holes in the groups are arranged at equal angle intervals around the circle center of the spray disc,

n and M are positive integers;

the airflow regulating device comprises a driving piece and a current limiting plate, wherein the driving piece is fixed on the top wall of the cavity, and the current limiting plate covers the opening position of any spray hole with the largest aperture; simultaneously, the current limiting plate is connected with the driving piece, and the driving piece drives the current limiting plate to rotate so as to adjust the opening size of the spraying hole.

2. The dry etching apparatus according to claim 1, wherein the gas flow regulating device further comprises a torque sensor fixedly provided on the chamber top wall and connected to the driving member.

3. The dry etching apparatus according to claim 1, wherein the air flow adjusting means further comprises a rotation shaft connected to the flow limiting plate, and the driving member drives the rotation shaft to rotate and drives the flow limiting plate to rotate.

4. A dry etching apparatus according to claim 3, wherein the flow restricting plate is circular, and the rotation axis is disposed offset from a center of the flow restricting plate.

5. The dry etching apparatus according to claim 1, wherein the air flow adjusting device further comprises an annular guide rail, the annular guide rail is annularly arranged on the periphery of the spraying disc, a sliding block is arranged on the lower side of the flow limiting plate, the sliding block is embedded in the annular guide rail, and the driving piece is connected with the annular guide rail and drives the sliding block to slide.

6. The dry etching apparatus according to claim 1, wherein the air flow regulating means comprises a plurality of the flow restricting plates disposed at equal angular intervals around the shower disk.

7. The dry etching device according to claim 1, wherein a group of spray holes positioned at the outermost side of the spray disc is provided with K spray holes, the airflow adjusting device comprises K flow limiting plates, and the K flow limiting plates are respectively attached to outlets of the K spray holes, wherein K is more than or equal to 2.

8. Dry etching apparatus according to claim 7, wherein k=8.

9. The dry etching apparatus according to claim 7, wherein the air flow adjusting means includes K driving members, the K driving members individually driving the K flow restricting plates, respectively.