CN219266364U

CN219266364U - Integrated circuit test positioner

Info

Publication number: CN219266364U
Application number: CN202320117707.5U
Authority: CN
Inventors: 徐振
Original assignee: Hangzhou Langxun Integrated Circuit Co ltd
Current assignee: Hangzhou Langxun Integrated Circuit Co ltd
Priority date: 2023-02-06
Filing date: 2023-02-06
Publication date: 2023-06-27
Anticipated expiration: 2033-02-06

Abstract

The utility model discloses an integrated circuit test positioner, which belongs to the technical field of positioners, and particularly relates to an integrated circuit test positioner, wherein a buffer plate is arranged at the top of a bottom plate, a positioning bottom plate is arranged at the top of the buffer plate, an inner panel is connected with a buckle at the bottom of an inner cavity of the buffer plate, a slide bar is connected with the top of the inner panel in a sliding manner, the top of the slide bar is connected with a test rack in a threaded manner, a test placing groove is connected with the buckle at the top of the test rack, the integrated circuit test positioner is provided with a bottom plate with the buffer plate and the positioning bottom plate through the combined application of accessories, an embedded frame carrying the slide bar is arranged in the buffer plate, the top of the slide bar is provided with a test rack, the positioning top plate of a built-in test assembly corresponding to a chassis is conveniently used for carrying out the placement and the whole position movement of an integrated circuit, the primary positioning is realized, the secondary positioning is realized, and the positioning stability in the integrated circuit test process is ensured.

Description

Integrated circuit test positioner

Technical Field

The utility model relates to the technical field of positioners, in particular to an integrated circuit test positioner.

Background

An integrated circuit is a type of microelectronic device or component. The components such as transistors, resistors, capacitors, inductors and the like and wiring needed in a circuit are interconnected by adopting a process, are manufactured on a small or a few small semiconductor wafers or dielectric substrates, and are then packaged in a tube shell to form the microstructure with the needed circuit function.

Integrated circuit testing technology is one of three major support technologies for developing the integrated circuit industry, and thus, integrated circuit testers are highly valued by many countries as a testing category. With the development of integrated circuits, integrated circuit testers have also evolved from initially testing small-scale integrated circuits to testing medium-scale, large-scale and very large-scale integrated circuits, and by the eighties, very large-scale integrated circuit testers have entered a full-scale period, and lack a prompt mode when anomalies occur in integrated circuit testing.

Aiming at the problems, the patent numbers are: 201922186813.5, patent name: the integrated circuit testing device with the alarm function provides: including box body and circuit testing arrangement body, be provided with a plurality of slots and switch on the circuit testing arrangement body, be connected with the display screen on the circuit testing arrangement body, rotate on the box body and install the flip lid, the display screen is embedded on the inner wall of flip lid, be connected with the alarm on the circuit testing arrangement body, fixed mounting has vertical board on the bottom inner wall of box body in order to reach portable, the purpose of suggestion warning, but in actual use, the integrated circuit locate mode is comparatively simple when testing, and all take one time location as the priority, this has just influenced the accuracy of location, the improper test misinformation can not only appear in the location, the damage that more probably leads to the integrated circuit.

Disclosure of Invention

The utility model aims to provide an integrated circuit test positioner, which solves the problems that the positioning mode of an integrated circuit in the background technology is simpler and the positioning is mainly performed at one time, thus affecting the positioning accuracy and causing the damage of the integrated circuit due to incorrect positioning.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an integrated circuit test fixture, comprising:

the bottom plate, the top of bottom plate is provided with the buffer board, set up in the location bottom plate at buffer board top, the inner chamber bottom buckle of buffer board is connected with interior panel, the top sliding connection of interior panel has the slide bar;

the top of the sliding rod is in threaded connection with the test rack, and a test placing groove is connected with a top buckle of the test rack;

the device comprises a positioning top plate, wherein the top of the positioning bottom plate is in buckling connection with the positioning top plate, a test groove is reserved at the bottom of the positioning top plate, a test assembly matched with the test placing groove is embedded in the test groove, a driver is arranged between the positioning top plate and the positioning bottom plate, and the top of the positioning top plate is embedded with a controller which is electrically connected with the test assembly and the driver in series.

Preferably, the buffer is pre-buried in the inner chamber bottom of buffer board, the top of buffer has cup jointed the expansion bend, the inner chamber of expansion bend has cup jointed the spring, the bottom of spring with the inner chamber bottom welding of buffer, the top welding of spring has the contact stake.

Preferably, a positioning hole is formed in the top of the positioning bottom plate, and a limiting rubber ring is sleeved on the inner circumferential wall of the positioning hole.

Preferably, the top of the positioning top plate is connected with a combined bolt in a threaded manner, and the bottom of the combined bolt is connected with a combined block in a threaded manner.

Preferably, the bottom of the positioning top plate is in threaded connection with a positioning column, and the installation position and the length of the positioning column are matched with those of the positioning hole.

Preferably, the test component is a probe.

Compared with the prior art, the utility model has the beneficial effects that: this kind of integrated circuit test locator, through the combined application of accessory, set up the bottom plate that has buffer board and positioning bottom plate, have the embedded frame that carries the slide bar in the buffer board, the top of slide bar has the test frame, is convenient for utilize the test to put the groove and carries out integrated circuit put and overall position removal, realizes once location, and the location roof of the built-in test assembly corresponding with the chassis corresponds with the test and puts the groove and detect again, realizes the secondary location, guarantees the location stability in the integrated circuit test process.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the following detailed description of the embodiments of the present utility model will be given with reference to the accompanying drawings, which are to be understood as merely some embodiments of the present utility model, and from which other drawings can be obtained by those skilled in the art without inventive faculty. Wherein:

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is an exploded view of the structure of the present utility model;

FIG. 3 is a front exploded view of the present utility model;

FIG. 4 is a schematic diagram of a buffer according to the present utility model;

FIG. 5 is a schematic diagram of a test rack according to the present utility model;

FIG. 6 is a schematic view of an embodiment of a test rack according to the present utility model.

In the figure: 100 bottom plates, 110 buffer plates, 120 buffers, 121 retractors, 122 springs, 123 contact piles, 130 embedded frames, 140 sliding rods, 150 positioning bottom plates, 151 positioning holes, 160 drivers, 200 test frames, 210 test placing grooves, 300 positioning top plates, 310 controllers, 311 test grooves, 312 test assemblies, 320 combined bolts, 330 combined blocks and 340 positioning columns.

Detailed Description

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "configured to," "engaged with," "connected to," and the like are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

The utility model provides an integrated circuit test positioner, which is provided with a bottom plate provided with a buffer plate and a positioning bottom plate, wherein the buffer plate is internally provided with an embedded frame carrying a sliding rod, the top of the sliding rod is provided with a test frame, so that the integrated circuit is conveniently placed and moved in the whole position by utilizing a test placing groove to realize primary positioning, and then a positioning top plate of a built-in test assembly corresponding to a bottom frame is matched with the test placing groove to realize corresponding detection, so as to realize secondary positioning, ensure the positioning stability in the test process of the integrated circuit, and refer to fig. 1, 2, 3, 4, 5 and 6, and the integrated circuit test positioner comprises a bottom plate 100, a test frame 200 and a positioning top plate 300;

the top of the bottom plate 100 is provided with a buffer plate 110, specifically, the top of the bottom plate 100 is provided with the buffer plate 110, the positioning bottom plate 150 is arranged at the top of the buffer plate 110, the bottom of the inner cavity of the buffer plate 110 is in snap connection with an inner panel 130, the top of the inner panel 130 is in sliding connection with a slide bar 140, the buffer plate 110 is arranged to facilitate the matched buffer in the process of stressing the positioning bottom plate 150, and the buffer 120 in the buffer plate 110 can penetrate through the buffer plate 110, so that the top of the contact pile 123 is in contact with the positioning bottom plate 150;

the top of the positioning bottom plate 150 is provided with a slope which can be matched with the combined block 330, and can be combined with the slope in the falling process of the combined block 330 so as to achieve the guiding purpose, and the positioning column 340 can be stably inserted into the positioning bottom plate 150 for positioning;

it should be noted that, the bottom of the test rack 200 is connected with the slide bar 140, specifically, the top of the slide bar 140 is connected with the test rack 200 in a threaded manner, the top of the test rack 200 is connected with the test placement groove 210 in a fastening manner, and the test placement groove 210 needs to correspond to the position of the test groove 311 after one-time positioning of the integrated circuit;

in some embodiments, the structure of the test nest 210 may be adjusted as required to achieve the best fit effect according to the different shapes of the integrated circuits to be tested, as shown in fig. 6, and the corresponding test components 312 may be adjusted to achieve the best test fit purpose while the test nest 210 is adjusted.

Further, the bottom of the positioning top plate 300 is opposite to the position of the positioning bottom plate 150, specifically, the top of the positioning bottom plate 150 is in snap connection with the positioning top plate 300, a test slot 311 is reserved at the bottom of the positioning top plate 300, a test component 312 matched with the test placing slot 210 is pre-embedded in the test slot 311, a driver 160 is arranged between the positioning top plate 300 and the positioning bottom plate 150, the driver 160 can be a telescopic motor, the top of the telescopic motor is combined with the positioning top plate 300 through a conventional connecting piece, the positioning top plate 300 can be matched with the positioning top plate 300 to move downwards after being opened, an electric series test component 312 and a controller 310 of the driver 160 are embedded at the top of the positioning top plate 300, and the models of the driver 160 and the controller 310 can be directly selected from the models commonly used in the market so as to ensure stable use;

in some embodiments, in order to increase the control effect on the controller 310, a wireless transmitter, a battery, an alarm, etc. electrically connected in series may be disposed inside the controller 310, and a display screen is installed on the controller 310 to achieve the purpose of data display.

When the integrated circuit positioning device is specifically used, firstly, the carrying buffer 120 is arranged on the bottom plate 100, the buffer 120 is provided with a buffer structure consisting of the telescopic device 121, the spring 122 and the contact pile 123, so that pressure generated on the positioning bottom plate 150 can be buffered, meanwhile, the embedded frame 130 carrying the slide rod 140 is arranged in the buffer 120, the top of the slide rod 140 is provided with the test frame 200, the test frame 200 is connected with the test placing groove 210, one-time positioning of the integrated circuit placing can be realized, the integrated circuit is slid to a proper position and aligned with the test groove 311 below the positioning top plate 300, the test assembly 312 is arranged in the test groove 311, the controller 310 is connected with the test assembly 312, the driver 160 is started by the controller 310, the driver 160 drives the positioning top plate 300 to move downwards, the positioning top plate 300 is also provided with the positioning column 340, and the positioning column 340 can be inserted into the positioning hole 151 in the downward movement, so that the purpose of positioning and matching are achieved.

It should be noted that, in order to increase the cushioning property of the cushioning plate 110, specifically, the bottom of the inner cavity of the cushioning plate 220 is pre-embedded with the bumper 120, the top of the bumper 120 is sleeved with the telescopic device 121, the inner cavity of the telescopic device 121 is sleeved with the spring 122, the bottom of the spring 122 is welded with the bottom of the inner cavity of the bumper 120, and the top of the spring 122 is welded with the contact pile 123.

In addition, in order to improve the positioning matching effect of the positioning bottom plate 150 and the positioning top plate 300, specifically, the top of the positioning bottom plate 150 is provided with a positioning hole 151, and the circumferential inner wall of the positioning hole 151 is sleeved with a limiting rubber ring.

Meanwhile, in order to facilitate the assembly and disassembly of the positioning top plate 300 and the assembly block 330, specifically, the top of the positioning top plate 300 is screwed with the assembly pin 320, and the bottom of the assembly pin 320 is screwed with the assembly block 330.

Further, in order to increase the positioning effect, ensure the positioning stability and perform effective test, specifically, the bottom threaded connection of the positioning top plate 300 is provided with a positioning column 340, the installation position and the length of the positioning column 340 are matched with the installation position and the depth of the positioning hole 151, and the test component is a probe.

In addition, the present utility model relates to circuits, electronic components and modules in the prior art, and those skilled in the art can fully implement the present utility model, and needless to say, the protection of the present utility model does not relate to improvement of the internal structure and method.

Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner so long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of brevity and resource saving. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. An integrated circuit test fixture, characterized by: comprising the following steps:

the bottom plate (100), the top of bottom plate (100) is provided with buffer board (110), set up in location bottom plate (150) at buffer board (110) top, the inner chamber bottom buckle of buffer board (110) is connected with interior panel (130), the top sliding connection of interior panel (130) has slide bar (140);

the top of the sliding rod (140) is in threaded connection with the test rack (200), and a test placing groove (210) is in buckle connection with the top of the test rack (200);

the device comprises a positioning top plate (300), wherein the top of the positioning bottom plate (150) is connected with the positioning top plate (300) in a buckled mode, a test groove (311) is reserved at the bottom of the positioning top plate (300), a test component (312) matched with the test placing groove (210) is embedded in the test groove (311), a driver (160) is arranged between the positioning top plate (300) and the positioning bottom plate (150), and a controller (310) electrically connected with the test component (312) in series is embedded at the top of the positioning top plate (300).

2. An integrated circuit test fixture as recited in claim 1, wherein: the buffer plate is characterized in that a buffer (120) is pre-buried at the bottom of an inner cavity of the buffer plate (110), a telescopic device (121) is sleeved at the top of the buffer (120), a spring (122) is sleeved at the inner cavity of the telescopic device (121), the bottom of the spring (122) is welded with the bottom of the inner cavity of the buffer (120), and a contact pile (123) is welded at the top of the spring (122).

3. An integrated circuit test fixture as recited in claim 2, wherein: the top of locating bottom plate (150) has seted up locating hole (151), the circumference inner wall of locating hole (151) cup joints spacing rubber circle.

4. An integrated circuit test fixture as recited in claim 3, wherein: the top of the positioning top plate (300) is connected with a combined bolt (320) in a threaded mode, and the bottom of the combined bolt (320) is connected with a combined block (330) in a threaded mode.

5. An integrated circuit test fixture as recited in claim 4, wherein: the bottom of the positioning top plate (300) is connected with a positioning column (340) in a threaded mode, and the installation position and the length of the positioning column (340) are matched with those of the positioning hole (151).

6. An integrated circuit test fixture as recited in claim 5, wherein: the test assembly is a probe.