CN219265531U - Temperature sensor device - Google Patents

Abstract

The utility model discloses a temperature sensor device, which comprises n groups of sensors, m pcie boards, n relay modules and a host computer; the sensors in each group of sensors are connected in series to a relay module; each relay module Connect to the corresponding pcie board to receive data; m pcie boards are inserted into the host computer to transmit the received data to the host computer; the sensor includes a sensor body, a data wire, and a sensor probe connected to one end of the sensor body , where the data wires are multi-segment and connected by air-to-air joints; the probe is used to sense the temperature change of the contact point to generate a change in resistance value; the sensor body is used to collect the change in resistance value and determine the collected temperature according to the change in resistance value. The temperature sensor device provided by the utility model realizes multi-point temperature collection in a wide range, and can be applied to various types of numerical control platforms and various equipment for extended connection and networking applications.

Description

A temperature sensor device

technical field

The utility model relates to the field of sensors, in particular to a temperature sensor device.

Background technique

Temperature is a physical quantity that characterizes the degree of coldness and heat of an object. It is one of the basic detection parameters in industries such as industrial automation, household appliances, environmental protection, safety production and automobile industry. Temperature is the most basic and core measurement index in the temperature monitoring system, and it is also the most important controlled parameter in the temperature measurement system. Therefore, accurate monitoring of temperature has always been an important research topic. Therefore, the instrument for measuring temperature occupies a crucial position in the temperature measurement system. The temperature sensor has a wide range of applications and a large number, ranking first among all kinds of sensors.

People hope to centrally monitor and control all temperatures in a large area, such as the entire workshop and the entire building, through automated equipment. However, under the premise of such a large range, how to quickly and accurately monitor the temperature is an urgent problem to be solved.

Utility model content

Aiming at the technical problems raised by the above-mentioned background technology, the utility model provides a temperature sensor device.

The utility model provides following scheme:

A temperature sensor device, the device includes n groups of sensors, m pcie boards and n relay modules and a host computer; each group of sensors includes at least 1 sensor;

All the sensors in each group of the sensors are connected in series and connected to a corresponding relay module to transmit the data to the relay module;

Each relay module is connected to the corresponding pcie board, and each of the pcie boards is correspondingly connected to at least one of the relay modules to receive the data transmitted from the relay module;

The m pcie boards are inserted into the host computer for transmitting the data received from slave to the host computer;

The sensor includes a sensor body, a data wire connected to both ends of the sensor body, and a sensor probe connected to the data wire at one end of the sensor body, wherein the data wire is multi-segment and connected through an air-to-air joint;

The probe is used to sense the temperature change of the contact point to generate a resistance value change;

The sensor body is used to collect the change of the resistance value, determine the collected temperature according to the change of the resistance value, and send it to the corresponding relay module.

In one of the preferred embodiments, the probe includes a thermistor, and the sensor body includes a temperature acquisition module, an isolation 485 communication module and a power supply;

The temperature collection module is used to collect the change of the resistance value of the resistance and determine the collected temperature according to the change of the resistance value of the resistance;

The isolation 485 communication module is used to receive the data of the temperature acquisition module and send it to the relay module after photoelectric isolation;

The power supply is used to supply power to other parts of the sensor body.

In one of the preferred embodiments, the temperature acquisition module includes a temperature acquisition bridge, an operational amplifier, an analog-to-digital converter, and a microcontroller;

The temperature acquisition bridge is connected to the thermistor, and is used to convert the resistance value change of the thermistor into a voltage signal, which is sequentially amplified by the operational amplifier, converted by the analog-to-digital converter, and processed by the microcontroller to determine the acquisition temperature. temperature.

In one of the preferred embodiments, the temperature acquisition bridge is a Wheatstone bridge.

In one of the preferred embodiments, the power supply includes:

a reference power supply, a total power supply, and an isolated power supply module for isolating the reference power supply and the total power supply;

The reference power supply is used to independently power the operational amplifier.

In one of the preferred embodiments, the isolation 485 communication module transmits the data to the host computer through twisted-pair shielded wires;

The sensor body also includes a low dropout linear regulator;

The main power supply, the power isolation module, and the low-dropout linear voltage regulator are sequentially arranged on the twisted-pair shielded wire between the isolation 485 communication module and the host computer.

In one of the preferred embodiments, the sensor body also includes an EMC filter;

The main power supply, the power isolation module, the low dropout linear voltage regulator, and the EMC filter are sequentially arranged on the twisted-pair shielded wire between the isolation 485 communication module and the host computer.

In one of the preferred embodiments, the sensor probe further includes a magnetic adsorption component, which is used for magnetic adsorption to the temperature measurement point of the device under test.

In one of the preferred embodiments, the upper computer is used as a master, and each of the sensors is used as a slave, and all the slaves have a unique communication network address, and the slave receives the broadcast address sent by the master, according to The address size is answered in turn.

In one of the preferred embodiments, the device further includes a conversion box, and each of the conversion boxes is provided with the sensor.

According to the technical solution provided by the utility model, the utility model discloses the following technical effects: the temperature sensor device provided by the utility model can One-time transmission to the host computer realizes multi-point temperature collection in a wide range, and can be applied to various types of CNC platforms and various equipment for extended connection and networking applications. Moreover, the damage of a single sensor does not affect the temperature measurement of other sensors, thus improving the accuracy of temperature measurement.

Further, the application adopts a low-dropout linear voltage regulator, which can play the role of isolating the power supply, and consumes a small part of the power of the total power supply to maintain the output terminal (power stability, and can also filter useless conversion signals in EMC filtering) .

Furthermore, the EMC filter plays the role of electromagnetic compatibility, which can suppress strong electromagnetic interference and spark interference on site. So as to ensure the stability and reliability of RS485 communication when working on site.

Furthermore, the probe of the present application has a magnetic adsorption part, which can be conveniently installed on any part of the platform and equipment for temperature measurement after magnetic adsorption.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings required in the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only the present invention. For some embodiments of the present invention, those of ordinary skill in the art can also obtain other drawings based on these drawings on the premise of not paying creative efforts.

Fig. 1 is a circuit diagram of a temperature sensor provided by an embodiment of the present invention.

Fig. 2 is a structural diagram of a temperature sensor device provided by an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. example. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments of the present invention belong to the protection scope of the present invention.

It should be noted that, in the description of the utility model, unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two elements. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present utility model in specific situations.

Aiming at the technical problems raised by the above-mentioned background technology, as shown in Figures 1 and 2, the utility model provides a temperature sensor, the sensor includes a sensor body 11, a data wire 12 connected to both ends of the sensor body 11, and the The sensor probe 13 connected to the data wire at one end of the sensor body, wherein the data wire is multi-section and connected by an air-to-air joint 14;

The probe 13 is used to sense the temperature change of the contact point to generate a resistance change; the probe can specifically be a thermistor, more specifically a positive temperature coefficient thermistor PTC or a negative temperature coefficient thermistor NTC.

The sensor body is used for collecting the change of the resistance value of the resistance and determining the collected temperature according to the change of the resistance value of the resistance.

In one of the preferred embodiments, the sensor body includes a temperature acquisition module, an isolation 485 communication module 22 and a power supply; the temperature acquisition module is used to collect the change of the resistance resistance and determine the collected temperature according to the change of the resistance resistance ; The power supply is used to supply power to other parts of the sensor body. The isolation 485 communication module 22 is used to receive the data from the temperature acquisition module and send it to the host computer after photoelectric isolation. In this application, the 485 communication protocol is adopted, and the signal of the digital communication protocol adopts a differential transmission mode, and the cable adopts a twisted-pair shielded wire. The two cables transmit the logic signal "0" and the logic signal "1" respectively, and the voltage difference between the two lines is about 4V-12V. The twisted-pair shielded line is used to generate voltage at the same time when the two lines are affected by the signal. Changes can effectively reduce the interference of noise signals to a large extent. The longest wiring setting of the whole platform is about 100m (the longest direct line is 62m), which is far less than the actual maximum transmission distance of RS485 communication, which is 1200m.

Here, the isolation 485 communication module receives the data signal, and the upper computer reads and analyzes the data through the A-line and B-line double-shielded twisted pair transmission channel PCIE board.

The main function of the isolated 485 communication module is to effectively isolate the 485 bus devices to ensure the stability of the 485 network communication. Here, it can prevent electromagnetic interference and common mode interference during the process of data transmission from the microcontroller to the host computer. In this way, the entire communication circuit is prevented from being affected by high voltage, the distortion of the signal transmission process is prevented, and the circuit is protected.

In one of the preferred embodiments, the temperature acquisition module includes a temperature acquisition bridge 211, an operational amplifier 212, an analog-to-digital converter 213, and a microcontroller 214;

The temperature acquisition bridge 211 is connected with the probe 13, that is, the thermistor NTC, and is used to convert the resistance value change of the thermistor into a voltage signal, which is amplified by the operational amplifier 212, converted by the analog-to-digital converter 213, and The microcontroller 214 determines the collected temperature after processing. In one of the preferred embodiments, the temperature acquisition bridge is a Wheatstone bridge.

During the specific work, the thermistor collects real-time temperature changes, and the temperature changes affect the size of the resistance. According to the principle of the Wheatstone bridge, the change of the resistance is used to measure the change of the voltage at both ends of the bridge. After the voltage is amplified by the operational amplifier according to a certain ratio, it is input to the high-precision analog-to-digital converter. The analog-to-digital converter converts the current voltage value into a digital signal and transmits it to the microcontroller MCU of the temperature measurement module through I2C. The MCU then decodes internally to obtain the current temperature value. When the temperature value is obtained, according to the communication protocol between the conversion module and the control device, the current temperature value is transmitted to the control device through RS485 serial port communication for the device to collect data.

The voltage and power of the industrial computer or PC cannot meet the requirements. Generally, the industrial computer does not have an output voltage or the output voltage is small. If the sensor communication mode adopts the hand-in-hand series mode, the load is large and the cable is long, which requires at least 15V or 3A If the power supply is insufficient, the end sensor will have no signal output, so an independent power supply is required.

Specifically, the power supply includes: a reference power supply 231, a total power supply 232, and an isolated power supply module 233 for isolating the reference power supply and the total power supply;

The reference power supply 231 is used to supply power to the operational amplifier 212 alone, and the general power supply 232 is used to supply power to other components. The operational amplifier works stably under the power supply of the reference power supply, and accurately amplifies the voltage of the temperature acquisition bridge.

The isolated power supply module 233 here can separate the two power supplies and work independently of each other. The reference power supply and the main power supply can be powered separately to prevent the main power supply from being discharged by high voltage and thus affect the power supply of the reference power supply. In addition, it can also isolate ground noise and common-mode voltage.

In one of the preferred embodiments, the isolation 485 communication module 22 transmits the data to the host computer or a board in the host computer through twisted shielded wires 24 (the twisted pair shielded wires A and B are shown in the figure).

The sensor body also includes a low-dropout linear voltage regulator LDO25; the total power supply, the power isolation module, and the low-dropout linear voltage regulator are sequentially arranged between the isolated 485 communication module and the host computer. The twisted-pair shielded wire.

LDO is a low-dropout linear voltage regulator, which can play the role of isolating power supply here, and consumes a small part of the power of the total power supply to maintain the power stability of the output terminal (isolated 485 communication module), and can also filter subsequent EMC filtering Useless transform signal in .

In one of the preferred embodiments, the sensor body also includes an EMC filter 26 and a fuse 27; the main power supply, the power isolation module, the low dropout linear voltage regulator, the EMC filter, and the fuse The twisted-pair shielded wires are sequentially arranged between the isolation 485 communication module and the host computer. The EMC filter mainly plays the role of electromagnetic compatibility, where it can suppress strong electromagnetic interference and spark interference on the platform site. In order to ensure the stability and reliability of RS485 communication in the field, high insertion loss is exchanged for low current leakage.

In one of the preferred embodiments, each sensor probe has a magnetic adsorption component that is adsorbed to the temperature measurement point. The shape of the sensor probe is preferably a cylindrical magnet. By adopting the above technical solution, the close correspondence between the sensor probe and the temperature measurement point can be facilitated.

In one of the preferred embodiments, the device further includes a conversion box, and each of the conversion boxes is provided with the sensor body. The upper end of the sensor body is connected with two data wires, and the lower end of the sensor body is connected with a sensor probe, the front and rear ends of the conversion box are fixed with fixing plates, and the two fixing plates are provided with mounting holes, so The sensor body is installed inside the conversion box. The mounting hole on the fixed plate of the conversion box is connected with the platform track, the sensor of the conversion box is installed in the inner channel of the platform track, and the mounting hole is connected with the inner side of the platform track by screws.

The protection level of the conversion box is IP67, which can effectively prevent liquids such as engine oil on the platform from penetrating into the conversion box body.

In the factory environment, there are many platform devices that need to be monitored. In order to realize fast and high-precision temperature detection, the device of the present application is shown in Figure 2, including n groups of sensors 31 (1 group is shown), m pcie boards 33 (1 shown) and n relay modules 32 (1 shown) and upper computer (not shown); each group of sensors includes at least 1 sensor;

All the sensors in each group of the sensors 31 are connected in series through an adapter and then connected to a corresponding relay module 32 to transmit the data to the relay module 32;

Each relay module is connected to the corresponding pcie board 33, and each of the pcie boards 33 is correspondingly connected to at least one relay module 32 to receive the data transmitted from the relay module 32 ;

The m pcie boards 33 are inserted into the host computer for transmitting the data received from slave to the host computer.

For example, in the case of preventing the work of the platform from affecting the wiring, the temperature measurement points of the platform within 50 can be divided into 8 groups of wiring, each line is connected to 3-10 sensors, and the sensors on each group of lines transmit the temperature data to the On the corresponding relay module, 8 sets of data are transmitted to 2 PCIE boards with 4 interfaces through 8 relay modules, and then the board is inserted into the host computer to realize one-time transmission to the host computer for data processing.

By adopting the above technical solution, a series of sensor data can be individually transmitted to the repeater at one end, and then transmitted to the upper computer at one time.

When the host computer communicates with the temperature sensor, this application adopts a master-slave communication mode, and one host (host computer or control board) is allowed in the system, and the address is set to 0 (adjustable). 10 slave machines (temperature detection sensors), all temperature detection sensors are used as a communication node with a unique communication network address, and the address setting range is 1 to 10 (adjustable). 0FFH is used as the destination address when broadcasting, all slaves receive the broadcast address sent by the master, and the slaves respond in turn according to the size of the address. The master communicates with each slave by means of bus polling. During normal operation, the slave is in the waiting state for communication reception. If the information sent by the master is received and the address of the control command matches the address of the local machine, according to the content of the received information Control the running state of the machine, and use the host frame as the bus time synchronization, and return the corresponding execution status information to the host at the corresponding time to complete a communication process.

Above, the technical scheme provided by the utility model has been introduced in detail. In this paper, specific examples have been used to illustrate the structure and implementation of the utility model. The description of the above examples is only used to help understand the method and implementation of the utility model. Its core idea; at the same time, for those of ordinary skill in the art, according to the idea of the utility model, there will be changes in the specific implementation and application range. To sum up, the contents of this specification should not be understood as limiting the utility model.

Claims (10)

1. The temperature sensor device is characterized by comprising n groups of sensors, m pc ie boards, n relay modules and an upper computer; each set of said sensors comprises at least 2 sensors;

all sensors in each group of sensors are connected in series and then connected to a corresponding relay module to transmit data to the relay module;

each pcie board card is correspondingly connected with at least one relay module so as to receive the data transmitted from the relay module;

the m pc ie board cards are inserted into the upper computer and are used for transmitting the received data to the upper computer;

the sensor comprises a sensor body, data wires connected with two ends of the sensor body, and a sensor probe connected with the data wires at one end of the sensor body, wherein the data wires are multi-section and are connected through an air-to-air joint;

the probe is used for sensing the temperature change of the contact point to generate resistance value change;

the sensor body is used for collecting the resistance change, determining the collected temperature according to the resistance change and then sending the collected temperature to the corresponding relay module.

2. The temperature sensor device of claim 1, wherein the probe comprises a thermistor and the sensor body comprises a temperature acquisition module, an isolation 485 communication module, and a power supply;

the temperature acquisition module is used for acquiring the resistance change of the resistor and determining the acquired temperature according to the resistance change of the resistor;

the isolation 485 communication module is used for receiving the data of the temperature acquisition module, performing photoelectric isolation and then sending the data to the relay module;

the power supply is used for supplying power to the temperature acquisition module and the isolation 485 communication module.

3. The temperature sensor device of claim 2, wherein the temperature acquisition module comprises a temperature acquisition bridge, an operational amplifier, an analog-to-digital converter, and a microcontroller;

the temperature acquisition bridge is connected with the thermistor, and is used for converting the resistance change of the thermistor into a voltage signal, and determining the acquired temperature after the voltage signal is amplified by the operational amplifier, converted by the analog-to-digital converter and processed by the microcontroller.

4. A temperature sensor arrangement according to claim 3, wherein the temperature acquisition bridge is a wheatstone bridge.

5. A temperature sensor device according to claim 3, wherein the power supply comprises:

a reference power supply, a total power supply, and an isolation power supply module for isolating the reference power supply and the total power supply;

the reference power supply is used to individually power the operational amplifier.

6. The temperature sensor device of claim 5, wherein the isolated 485 communication module transmits the data to the host computer via a twisted pair shielded wire;

the sensor body further comprises a low dropout linear regulator;

the main power supply, the power supply isolation module and the low-dropout linear voltage regulator are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer.

7. The temperature sensor device of claim 6, wherein the sensor body further comprises an EMC filter;

the main power supply, the power supply isolation module, the low dropout linear voltage regulator and the EMC filter are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer.

8. The temperature sensor apparatus of claim 1 wherein the sensor probe further comprises a magnetically attractive element for magnetically attracting to a temperature measurement point of the device under test.

9. The temperature sensor device according to claim 1, wherein the host computer is a master computer, each of the sensors is a slave computer, and all the slave computers have unique communication network addresses, and the slave computers receive broadcast addresses sent from the master computer and respond in sequence according to the address sizes.

10. The temperature sensor device of claim 1, further comprising conversion boxes, each of the conversion boxes having the sensor disposed therein.

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