CN219265531U

CN219265531U - Temperature sensor device

Info

Publication number: CN219265531U
Application number: CN202223597398.0U
Authority: CN
Inventors: 金晓雯
Original assignee: Suzhou Transient Semiconductor Technology Co ltd
Current assignee: Suzhou Transient Semiconductor Technology Co ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-27
Anticipated expiration: 2032-12-30

Abstract

The utility model discloses a temperature sensor device, which comprises n groups of sensors, m pcie boards, n relay modules and an upper computer, wherein the n groups of sensors are arranged on the same plane; the sensors in each group of sensors are connected in series and then connected to a relay module; each relay module is connected with a corresponding pcie board card to receive data; m pc ie board cards are inserted in the upper computer and used for transmitting the received data to the upper computer; the sensor comprises a sensor body, a data wire and a sensor probe connected with one end of the sensor body, wherein the data wire is multi-section and is connected through an air-to-air joint; the probe is used for sensing the temperature change of the contact point to generate resistance change; the sensor body is used for collecting resistance value changes and determining collected temperature according to the resistance value changes. The temperature sensor device provided by the utility model realizes multi-site temperature acquisition in a large range, and can be applied to various types of numerical control platforms and various devices for expansion connection and networking application.

Description

Temperature sensor device

Technical Field

The utility model relates to the field of sensors, in particular to a temperature sensor device.

Background

The temperature is a physical quantity representing the cold and hot degree of an object, and is one of basic detection parameters in industries such as industrial automation, household appliances, environmental protection, safe production, automobile industry and the like. The temperature is the most basic and core measurement index in the temperature monitoring system and is also the most important controlled parameter in the temperature measuring system, so accurate monitoring of the temperature is always an important research topic. Therefore, the instrument for measuring temperature plays a vital role in the temperature measuring system. The temperature sensor has wide application range and large quantity, and is the first sensor of various sensors.

It is desirable to centrally monitor and control all temperatures throughout a wide range, such as throughout a plant, throughout a building, by automated equipment. However, on the premise of such a large range, how to rapidly and accurately monitor the temperature is a problem to be solved.

Disclosure of Invention

The present utility model provides a temperature sensor device, which aims at the technical problems of the background technology.

The utility model provides the following scheme:

the temperature sensor device comprises n groups of sensors, m pc ie boards, n relay modules and an upper computer; each set of said sensors comprises at least 1 sensor;

all sensors in each group of sensors are connected in series and then connected to a corresponding relay module to transmit the data to the relay module;

each relay module is connected with the corresponding pcie board card, and each pcie board card is correspondingly connected with at least one relay module so as to receive the data transmitted from the relay module;

the m pc ie board cards are inserted into the upper computer and are used for transmitting the received data to the upper computer;

the sensor comprises a sensor body, data wires connected with two ends of the sensor body, and a sensor probe connected with the data wires at one end of the sensor body, wherein the data wires are multi-section and are connected through an air-to-air joint;

the probe is used for sensing the temperature change of the contact point to generate resistance value change;

the sensor body is used for collecting the resistance change, determining the collected temperature according to the resistance change and then sending the collected temperature to the corresponding relay module.

In one preferred embodiment, the probe comprises a thermistor, and the sensor body comprises a temperature acquisition module, an isolation 485 communication module and a power supply;

the temperature acquisition module is used for acquiring the resistance change of the resistor and determining the acquired temperature according to the resistance change of the resistor;

the isolation 485 communication module is used for receiving the data of the temperature acquisition module, performing photoelectric isolation and then sending the data to the relay module;

the power supply is used for supplying power to other parts of the sensor body.

In one preferred embodiment, the temperature acquisition module comprises a temperature acquisition bridge, an operational amplifier, an analog-to-digital converter and a microcontroller;

the temperature acquisition bridge is connected with the thermistor, and is used for converting the resistance change of the thermistor into a voltage signal, and determining the acquired temperature after the voltage signal is amplified by the operational amplifier, converted by the analog-to-digital converter and processed by the microcontroller.

In one preferred embodiment, the temperature acquisition bridge is a wheatstone bridge.

In one preferred embodiment, the power supply includes:

a reference power supply, a total power supply, and an isolation power supply module for isolating the reference power supply and the total power supply;

the reference power supply is used to individually power the operational amplifier.

In one preferred embodiment, the isolated 485 communication module transmits the data to the upper computer through a twisted pair shielded wire;

the sensor body further comprises a low dropout linear regulator;

the main power supply, the power supply isolation module and the low-dropout linear voltage regulator are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer.

In one preferred embodiment, the sensor body further comprises an EMC filter;

the main power supply, the power supply isolation module, the low dropout linear voltage regulator and the EMC filter are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer.

In one preferred embodiment, the sensor probe further comprises a magnetic adsorption component for magnetically adsorbing the sensor probe to a temperature measuring point of the device to be measured.

In one preferred embodiment, the host computer is used as a master computer, each sensor is used as a slave computer, all the slave computers have unique communication network addresses, and the slave computers receive broadcast addresses sent by the master computer and sequentially answer according to the address sizes.

In a preferred embodiment, the device further comprises a conversion box, each conversion box having the sensor disposed therein.

According to the technical scheme provided by the utility model, the utility model discloses the following technical effects: the temperature sensor device provided by the utility model can be transmitted to an upper computer at one time after the sensors in each group are connected in series and the sensor data of different groups are transmitted to the relay module, so that multi-site temperature acquisition in a large range is realized, and the temperature sensor device can be applied to various types of numerical control platforms and various devices for expansion connection and networking application. And the damage of the single sensor does not affect the temperature measurement of other sensors, so that the accuracy of temperature measurement is improved.

Furthermore, the low dropout linear voltage regulator can play a role of isolating a power supply, consumes a small part of the power of the total power supply, and maintains an output end (the power is stable, and useless conversion signals in EMC filtering can be filtered).

Furthermore, the EMC filter plays a role in electromagnetic compatibility, and can inhibit strong electromagnetic interference and spark interference on site. Thereby guaranteeing the stability and reliability of RS485 communication in the field operation.

Further, the probe has the magnetic adsorption component, and can be conveniently installed on any part of the platform and equipment to perform magnetic adsorption and then temperature measurement.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a circuit diagram of a temperature sensor according to an embodiment of the present utility model.

Fig. 2 is a block diagram of a temperature sensor device according to an embodiment of the present utility model.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which are derived by a person skilled in the art based on the embodiments of the utility model, fall within the scope of protection of the utility model.

It should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In view of the above-mentioned technical problems, as shown in fig. 1 and 2, the present utility model provides a temperature sensor, which includes a sensor body 11, data wires 12 connected to two ends of the sensor body 11, and a sensor probe 13 connected to the data wires at one end of the sensor body, wherein the data wires are multi-segmented and are connected by an air-to-air connector 14;

the probe 13 is used for sensing the temperature change of the contact point to generate resistance change; the probe may specifically be a thermistor, more specifically a positive temperature coefficient thermistor PTC or a negative temperature coefficient thermistor NTC.

The sensor body is used for collecting the resistance change and determining the collected temperature according to the resistance change.

In one preferred embodiment, the sensor body comprises a temperature acquisition module, an isolation 485 communication module 22 and a power supply; the temperature acquisition module is used for acquiring the resistance change of the resistor and determining the acquired temperature according to the resistance change of the resistor; the power supply is used for supplying power to other parts of the sensor body. The isolation 485 communication module 22 is used for receiving the data of the temperature acquisition module, performing photoelectric isolation, and then sending the data to the upper computer. 485 communication protocol is adopted in the application, differential transmission mode is adopted for digital communication protocol signals, and twisted pair shielding wires are adopted for cables. The two cables respectively transmit logic signals 0 and 1, the voltage difference of the two wires is about 4V-12V, and the twisted pair shielding wires are adopted so that the two wires can generate voltage change simultaneously when being affected by signals, and the interference of noise signals can be effectively reduced to a great extent. The longest wiring of the whole platform is set to be about 100m (the direct longest wiring is 62 m), and the longest wiring is far smaller than the actual maximum transmission distance of RS485 communication by 1200m.

Here, the isolated 485 communication module receives the data signal, and reads and analyzes the data through the upper computer in the PCIE board card of the a-line and B-line double-shielded twisted line transmission channel.

The isolation 485 communication module is mainly used for effectively and electrically isolating 485 bus equipment, guaranteeing the stability of 485 network communication, and preventing electromagnetic interference and common mode interference from being generated in the process of transmitting data from the microcontroller to the upper computer. Therefore, the whole communication circuit is prevented from being influenced by high voltage, distortion in the signal transmission process is prevented, and the effect of protecting the circuit is achieved.

In one preferred embodiment, the temperature acquisition module includes a temperature acquisition bridge 211, an operational amplifier 212, an analog-to-digital converter 213, and a microcontroller 214;

the temperature acquisition bridge 211 is connected with the probe 13, i.e. the thermistor NTC, and is configured to convert the resistance change of the thermistor into a voltage signal, and sequentially determine the acquired temperature after amplification by the operational amplifier 212, conversion by the analog-to-digital converter 213, and processing by the microcontroller 214. In one preferred embodiment, the temperature acquisition bridge is a wheatstone bridge.

When the thermistor specifically works, the thermistor collects real-time temperature change, the temperature change affects the size of the resistor, and the voltage change at two ends of the bridge is measured by utilizing the resistor change according to the principle of a Wheatstone bridge. The voltage is amplified according to a certain proportion by an operational amplifier and then is input into a high-precision analog-to-digital converter, the analog-to-digital converter converts the current voltage value into a digital signal, and the digital signal is transmitted to a micro controller MCU of the temperature measuring module in an I2C mode. The MCU obtains the current temperature value through internal decoding. When the temperature value is obtained, the current temperature value is transmitted to the control equipment in a RS485 serial port communication mode according to a communication protocol of the conversion module and the control equipment, so that the equipment can acquire data.

The voltage and the power of the industrial personal computer or the PC can not meet the requirements, the industrial personal computer does not have output voltage or has smaller output voltage, if the sensor communication mode adopts a hand-in-hand serial mode, the load is more, the cable is longer, the output voltage or the current of at least 15V or 3A is needed, and if the power supply is insufficient, the end sensor has no signal output, so that an independent power supply is needed.

Specifically, the power supply includes: a reference power supply 231, a total power supply 232, and an isolation power supply module 233 for isolating the reference power supply and the total power supply;

the reference power supply 231 is used to supply power to the operational amplifier 212 alone, and the total power supply 232 supplies power to the remaining components. The operational amplifier works stably under the power supply of the reference power supply and accurately amplifies the voltage of the temperature acquisition bridge.

The isolated power module 233 is here capable of isolating two power sources from each other and operating independently of each other. The reference power supply and the total power supply can be independently powered, the total power supply is prevented from being subjected to high-voltage discharge, the power supply of the reference power supply is further influenced, and in addition, the effects of isolating ground wire noise and common-mode voltage are achieved.

In one preferred embodiment, the isolated 485 communication module 22 transmits the data to an upper computer or a board card within the upper computer via a twisted pair shielded wire 24 (twisted pair shielded wire A, B is shown).

The sensor body further comprises a low dropout linear regulator LDO25; the main power supply, the power supply isolation module and the low-dropout linear voltage regulator are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer.

The LDO is a low dropout linear voltage regulator, can play a role of isolating a power supply, consumes a small part of the power of the total power supply, maintains the stable power of an output end (an isolated 485 communication module), and can also filter useless conversion signals in subsequent EMC filtering.

In one preferred embodiment, the sensor body further comprises an EMC filter 26 and a protective tube 27; the main power supply, the power supply isolation module, the low-dropout linear voltage regulator, the EMC filter and the safety tube are sequentially arranged on the twisted pair shielding wire between the isolation 485 communication module and the upper computer. The EMC filter mainly plays a role in electromagnetic compatibility, where strong electromagnetic interference and spark interference on the platform site can be suppressed. Thus, the stability and the reliability of the RS485 communication in field operation are ensured, and the low current leakage is replaced by the high insertion loss.

In one preferred embodiment, each sensor probe has a magnetically attractable member attached to the temperature measurement site. The sensor probe is preferably in the shape of a cylindrical magnet. By adopting the technical scheme, the sensor probe and the temperature measuring point can be conveniently and closely corresponding.

In a preferred embodiment, the device further comprises a conversion box, each of which has the sensor body disposed therein. The upper end of sensor body links there are two data wires, and the lower extreme of sensor body is connected with sensor probe, both ends all are fixed with the fixed plate around the conversion box, and all are provided with the mounting hole on 2 fixed plates, the sensor body is equipped with to the conversion box inside. The mounting holes on the conversion box fixing plates are connected with the platform track, the conversion box sensors are mounted on the inner side channels of the platform track, and the mounting holes are connected with the inner side of the platform track through screws.

The conversion box protection level is IP67, can effectively protect liquid infiltration conversion box body such as engine oil on the platform.

In a factory environment, more platform devices need to be monitored, and in order to realize rapid and high-precision temperature detection, the device of the application is shown in fig. 2, and comprises n groups of sensors 31 (1 group is shown), m pc ie boards 33 (1 is shown), n relay modules 32 (1 is shown) and an upper computer (not shown); each set of said sensors comprises at least 1 sensor;

all sensors of each group of the sensors 31 are connected in series through an adapter and then connected to a corresponding one of the relay modules 32 to transmit the data to the relay modules 32;

each relay module is connected to a corresponding pc ie board 33, and each pc ie board 33 is correspondingly connected to at least one relay module 32, so as to receive the data transmitted from the relay module 32;

the m pc ie cards 33 are inserted into the host computer, and are used for transmitting the received data to the host computer.

For example, under the condition that the platform work is prevented from influencing wiring, the temperature measuring points of the platform can be divided into 8 groups of wiring, each line is connected with 3-10 sensors, the sensors on each group of lines transmit temperature data to corresponding relay modules, 8 groups of data are transmitted to 2 PCIE boards with 4 interfaces through the 8 relay modules, and then the boards are inserted into an upper computer, so that the data processing is realized by transmitting the boards to the upper computer at one time.

By adopting the technical scheme, a series of sensor data single items can be transmitted to the repeater at one end, and then the sensor data single items are transmitted to the upper computer at one time.

When the upper computer and the temperature sensor are communicated, the application adopts a master-slave communication mode, a host (the upper computer or the control main board) is allowed in the system, and the address is set to 0 (adjustable). 10 slaves (temperature detection sensors), all of which are used as a communication node, have unique communication network addresses, and the address setting range is 1-10 (adjustable). And 0FFH is used as a destination address in broadcast transmission, all slaves receive the broadcast address sent by the host, and the slaves respond in sequence according to the address size. The host computer and each slave computer communicate in a bus polling mode, and in normal operation, the slave computers are in a communication receiving waiting state, if the information sent by the host computer is received, the control command address is consistent with the local address, the running state of the host computer is controlled according to the received information content, the host computer frame is used as bus time synchronization, and corresponding execution state information is returned to the host computer at corresponding time to complete a communication process.

The above description of the technical solution provided by the present utility model has been provided in detail, and specific examples are applied to illustrate the structure and implementation of the present utility model, and the above examples are only used to help understand the method and core idea of the present utility model; also, it is within the scope of the present utility model to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the utility model.

Claims

1. The temperature sensor device is characterized by comprising n groups of sensors, m pc ie boards, n relay modules and an upper computer; each set of said sensors comprises at least 2 sensors;

all sensors in each group of sensors are connected in series and then connected to a corresponding relay module to transmit data to the relay module;

each pcie board card is correspondingly connected with at least one relay module so as to receive the data transmitted from the relay module;

2. The temperature sensor device of claim 1, wherein the probe comprises a thermistor and the sensor body comprises a temperature acquisition module, an isolation 485 communication module, and a power supply;

the power supply is used for supplying power to the temperature acquisition module and the isolation 485 communication module.

3. The temperature sensor device of claim 2, wherein the temperature acquisition module comprises a temperature acquisition bridge, an operational amplifier, an analog-to-digital converter, and a microcontroller;

4. A temperature sensor arrangement according to claim 3, wherein the temperature acquisition bridge is a wheatstone bridge.

5. A temperature sensor device according to claim 3, wherein the power supply comprises:

6. The temperature sensor device of claim 5, wherein the isolated 485 communication module transmits the data to the host computer via a twisted pair shielded wire;

the sensor body further comprises a low dropout linear regulator;

7. The temperature sensor device of claim 6, wherein the sensor body further comprises an EMC filter;

8. The temperature sensor apparatus of claim 1 wherein the sensor probe further comprises a magnetically attractive element for magnetically attracting to a temperature measurement point of the device under test.

9. The temperature sensor device according to claim 1, wherein the host computer is a master computer, each of the sensors is a slave computer, and all the slave computers have unique communication network addresses, and the slave computers receive broadcast addresses sent from the master computer and respond in sequence according to the address sizes.

10. The temperature sensor device of claim 1, further comprising conversion boxes, each of the conversion boxes having the sensor disposed therein.