CN219253526U

CN219253526U - Dynamic sealing structure and plasma cleaning machine with same

Info

Publication number: CN219253526U
Application number: CN202220300369.4U
Authority: CN
Inventors: 高友浪; 张翔; 李钟玲
Original assignee: Shenzhen Axxon Automation Co Ltd
Current assignee: Shenzhen Axxon Automation Co Ltd
Priority date: 2022-02-15
Filing date: 2022-02-15
Publication date: 2023-06-27
Anticipated expiration: 2032-02-15

Abstract

The utility model discloses a dynamic sealing structure and a Plasma cleaning machine with the same, comprising a cover plate, a bottom plate, a sealing cavity, an exhaust pipe and a sealing box, wherein the sealing cavity is arranged on the bottom plate, the cover plate is arranged on the sealing cavity, one end of the exhaust pipe is connected and arranged in the middle of the lower surface of the bottom plate, the sealing box is arranged in the sealing cavity and is arranged on the bottom plate, a Plasma head is arranged in the middle of the upper surface of the cover plate, a sealing cylinder and a sealing port are respectively arranged on one side surface of the sealing cavity, the sealing cylinder is arranged below the sealing port, a sealing baffle is arranged on the output end of the sealing cylinder and is used for blocking the sealing port, a second connector and a pressure sensor are respectively arranged on the other side surface of the sealing cavity, the second connector and the pressure sensor are arranged in parallel, the automatic cleaning is high in efficiency, the cost is low, the poor yield is low, and meanwhile, the oxygen concentration of a production cavity is 300ppm, and the good market application value is realized.

Description

Dynamic sealing structure and plasma cleaning machine with same

Technical Field

The utility model relates to the technical field of dynamic sealing structures, in particular to a dynamic sealing structure and a plasma cleaning machine with the same.

Background

With the development of technology, more and more electronic devices need to use chips, and more semiconductor demands are being made on the market, and the demands of devices in the semiconductor field are rapidly exploded. The wafer is used as a basis for manufacturing chips, and in the process of manufacturing finished chips, the wafer needs to be cleaned before a plurality of processes are performed. The existing cleaning process is to place the wafer in a vacuum cavity for offline plasma cleaning, for example, the structure in CN202023019785 which relates to vacuum plasma cleaning is only carried out after oxygen is completely removed, the low oxygen concentration value cannot be realized structurally, the wafer is not oxidized in the cleaning process, and therefore the wafer cannot be effectively combined with other processes, and the cleaning process has the advantages of low efficiency, high cost and high reject ratio.

The prior art has defects and needs improvement.

Disclosure of Invention

In order to solve the defects in the prior art, the utility model provides a dynamic sealing structure and a plasma cleaning machine with the same.

The utility model provides a dynamic sealing structure and a Plasma cleaning machine with the same, and the dynamic sealing structure comprises a cover plate, a bottom plate, a sealing cavity, an exhaust pipe and a sealing box, wherein the sealing cavity is arranged on the bottom plate, the cover plate is arranged on the sealing cavity, one end of the exhaust pipe is connected and arranged in the middle of the lower surface of the bottom plate, the sealing box is arranged in the sealing cavity and is arranged on the bottom plate, a Plasma head is arranged in the middle of the upper surface of the cover plate, a sealing cylinder and a sealing port are respectively arranged on one side surface of the sealing cavity, the sealing cylinder is arranged below the sealing port, a sealing baffle is arranged on the output end of the sealing cylinder and is used for blocking the sealing port, and a second connector and a pressure sensor are respectively arranged on the other side surface of the sealing cavity and are arranged in parallel.

Preferably, a flow regulating plate is arranged at the other end of the exhaust pipe.

Preferably, the seal box comprises a movable shaft, a cleaning cavity, a depressurization cavity and a first joint, wherein the movable shaft is arranged on the bottom plate, the cleaning cavity is arranged on the movable shaft, the depressurization cavity is arranged on one side of the cleaning cavity, and the first joint is arranged on the depressurization cavity.

Preferably, the inner wall of the cleaning cavity is provided with a first adjusting plate and a second adjusting plate respectively, the depressurization cavity and the second adjusting plate are arranged oppositely, and one side of the inner wall of the cleaning cavity is provided with an exhaust port.

Preferably, the moving shaft is respectively provided with a transverse moving track and a longitudinal moving track, the transverse moving track is arranged on the bottom plate, the longitudinal moving track is arranged on the transverse moving track, and the cleaning cavity is arranged on the longitudinal moving track.

Preferably, the cover plate is provided in plurality.

Preferably, a sealing gap between the sealing baffle and the sealing opening is 1mm.

Compared with the prior art, the utility model has the beneficial effects of realizing automatic cleaning, high efficiency, low cost and low reject ratio, simultaneously realizing the production chamber oxygen concentration of 300ppm, small volume, ensuring the wafer cleaning effect, avoiding polluting the environment, adjusting the open space of the sealed cavity, reducing the open area, saving the argon gas consumption and having good market application value.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic diagram of the overall internal structure of the present utility model;

FIG. 3 is a schematic view of the internal structure of the seal box of the present utility model.

Detailed Description

The above-described features are continuously combined with each other to form various embodiments not listed above, and are regarded as the scope of the present utility model described in the specification; and, it will be apparent to those skilled in the art from this disclosure that modifications and variations can be made without departing from the scope of the utility model defined in the appended claims.

In order that the utility model may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The present utility model will be described in detail with reference to the accompanying drawings.

An embodiment as in fig. 1-3: a dynamic sealing structure and a Plasma cleaning machine with the same, comprising a cover plate, a bottom plate 8, a sealing cavity 7, an exhaust pipe 9 and a sealing box, wherein the sealing cavity 7 is arranged on the bottom plate 8, the sealing cavity 7 is provided with the cover plate, one end of the exhaust pipe 9 is connected and arranged in the middle of the lower surface of the bottom plate 8, the sealing box is arranged in the sealing cavity 7 and is arranged on the bottom plate 8, a Plasma head 4 is arranged in the middle of the cover plate, a sealing cylinder 6 and a sealing port are respectively arranged on one side surface of the sealing cavity 7, the sealing cylinder 6 is arranged below the sealing port, a sealing baffle 5 is arranged on the output end of the sealing cylinder 6, the sealing baffle 5 is used for blocking the sealing port, a second joint 16 and a pressure sensor 18 are respectively arranged on the other side surface of the sealing cavity 7, a flow regulating plate 17 is arranged on the other end of the exhaust pipe 9, the sealing box comprises a moving shaft 10, a cleaning cavity 11, a pressure reducing cavity 14 and a first joint 15, the moving shaft 10 is arranged on the bottom plate 8, the pressure reducing shaft 10 is arranged on the cleaning cavity 11 and the cleaning cavity 11, a first rail 14 is arranged on the inner wall of the cleaning cavity 11 and the cleaning cavity is arranged on the side of the cleaning cavity, a first rail 14 is arranged on the side of the cleaning cavity, a moving rail 11 is arranged on the side of the cleaning cavity, a moving rail is arranged on the first rail, a moving rail is arranged on the side of the cleaning cavity, a side of the cleaning cavity is arranged on the cleaning cavity is a side of the cleaning cavity, and the cleaning cavity is arranged on the side, a side of the cleaning cavity is a side, a moving rail is arranged, a side, a moving rail is respectively, and a moving rail is arranged on the side, and a moving rail is respectively, and a moving rail is arranged, and a moving the cleaning rail is respectively, and is arranged, and a moving the cleaning rail is and a moving side. The cover plates are arranged in a plurality, the sealing gap between the sealing baffle plate 5 and the sealing port is 1mm, and the working principle of the utility model is as follows: after the cleaning machine is started, the exhaust pipe 9 is blocked by the flow regulating plate 17, the sealing air cylinder 6 pushes the sealing baffle plate 5 to move upwards to relatively block the opening of the sealing cavity 7, the sealing baffle plate 5 and the side wall of the large sealing cavity 7 are in a gap of 1mm to form relative sealing, the gaps between the first regulating plate 12 and the second regulating plate 13 and the lower surface of the cover plate are regulated, the gaps are ensured to be about 1mm, the upper ends of the first regulating plate 12 and the second regulating plate 13 arranged on the cleaning cavity 11 are ensured not to rub against the lower surface of the cover plate 1 when the movable shaft 10 moves, meanwhile, only one surface of the cleaning cavity 11 is ensured to be opened, the surface is used for removing oxygen in the cleaning cavity 11, then argon fills argon into the sealing cavity 7 and the cleaning cavity 11 through the first connector 15 and the second connector 16 respectively, the pressure and the flow rate of the argon in the first connector 15 are reduced through the pressure reducing cavity 14 before the argon in the first connector 15 enters the cleaning cavity 11, then evenly introducing the cleaning chamber 11 to ensure that oxygen in the sealing chamber 7 is removed, at the moment, the oxygen in the sealing chamber 7 and the oxygen in the cleaning chamber 11 are reduced, the oxygen in the cleaning chamber 11 is discharged to the sealing chamber 7 through the opening of the sealing chamber 7, the oxygen in the sealing chamber 7 is removed through the exhaust pipe 9, when the oxygen concentration in the cleaning chamber 11 is reduced to the concentration required by cleaning, the gas is continuously conveyed to the sealing chamber 7 and the cleaning chamber 11 at the same time, at the moment, the whole machine starts to operate, the sealing cylinder 6 pulls the sealing baffle 5 to move downwards to open the opening of the sealing chamber 7, a wafer is placed in the cleaning chamber 11 through the opening, then the sealing cylinder 6 pushes the sealing baffle 5 to move upwards to relatively block the opening of the sealing chamber 7, the wafer starts to be cleaned, the cleaning chamber 11 carries the wafer to move on the lower plane of the Plasma head 4, after the cleaning is completed, the sealing cylinder 6 pulls the sealing baffle 5 to move downwards to open the opening of the sealing chamber 7, the wafer leaves the cleaning chamber 11 and the sealing chamber 7 through the opening, whereby the wafer exchange is achieved.

The second embodiment is different from the above in that the cover plate may be provided as a cover plate 1, a cover plate 2 and a cover plate 3.

The third embodiment is different from the above embodiments in that the first adjusting plates 12 disposed on the inner wall of the cleaning chamber 11 are disposed on two sides of the cleaning chamber 11, the second adjusting plates 13 are disposed on the rear side of the cleaning chamber 11, and an exhaust port is disposed on the front side of the cleaning chamber 11.

Embodiment IV differs from the above in that the oxygen concentration in the cleaning chamber 11 is 300ppm.

Claims

1. The utility model provides a dynamic seal structure and have its Plasma cleaning machine, its characterized in that, including apron, bottom plate, seal chamber, blast pipe and seal box, the seal chamber set up in on the bottom plate, set up on the seal chamber the apron, bottom plate lower surface middle part connect and set up blast pipe one end, the seal box set up in seal intracavity and install in on the bottom plate, the middle part sets up the Plasma head on the apron, set up seal cylinder and seal mouth on the seal chamber side respectively, seal cylinder set up in seal mouth below, install sealing baffle on seal cylinder's the output, sealing baffle is used for blockking the seal mouth, set up second joint and pressure sensor on the seal chamber another side respectively, second joint and pressure sensor parallel arrangement.

2. The dynamic sealing structure and the plasma cleaning machine with the same according to claim 1, wherein a flow adjusting plate is arranged at the other end of the exhaust pipe.

3. The dynamic sealing structure and the plasma cleaning machine with the same according to claim 1, wherein the sealing box comprises a moving shaft, a cleaning cavity, a depressurization cavity and a first joint, the moving shaft is arranged on the bottom plate, the cleaning cavity is arranged on the moving shaft, the depressurization cavity is arranged on one side of the cleaning cavity, and the first joint is arranged on the depressurization cavity.

4. The dynamic seal structure and the plasma cleaning machine with the same according to claim 3, wherein a first adjusting plate and a second adjusting plate are respectively arranged on the inner wall of the cleaning cavity, the depressurization cavity is opposite to the second adjusting plate, and an exhaust port is arranged on one side of the inner wall of the cleaning cavity.

5. The dynamic seal structure and the plasma cleaning machine with the same according to claim 4, wherein the moving shaft is respectively provided with a transverse moving rail and a longitudinal moving rail, the transverse moving rail is arranged on the bottom plate, the longitudinal moving rail is arranged on the transverse moving rail, and the cleaning cavity is arranged on the longitudinal moving rail.

6. The dynamic seal structure and the plasma cleaning machine with the same according to claim 1, wherein a plurality of cover plates are provided.

7. The dynamic seal structure and the plasma cleaning machine with the same according to claim 1, wherein a seal gap between the seal baffle and the seal opening is 1mm.