CN219233894U - Transfer case shell mold with beryllium copper cooling device - Google Patents

Transfer case shell mold with beryllium copper cooling device Download PDF

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Publication number
CN219233894U
CN219233894U CN202320011964.0U CN202320011964U CN219233894U CN 219233894 U CN219233894 U CN 219233894U CN 202320011964 U CN202320011964 U CN 202320011964U CN 219233894 U CN219233894 U CN 219233894U
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China
Prior art keywords
beryllium copper
water
cooling
copper frame
transfer case
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CN202320011964.0U
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Chinese (zh)
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李建忠
曲政国
刘贤龙
刘志浩
林政�
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Yantai Shengong Moulding Co ltd
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Yantai Shengong Moulding Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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Abstract

The utility model relates to the technical field of mold cooling, in particular to a transfer case shell mold with a beryllium copper cooling device, which comprises a cooling water tank, wherein the cooling water tank is fixed on a bottom plate through a bolt, a return pipe is connected below the cooling water tank, the right side of the return pipe is connected below a water pump, an upper hose is arranged above a connecting head, the upper end of the side hose is connected with a side water cooling cavity, a valve is arranged on a water inlet pipe, a transverse water cooling cavity is arranged above an upper beryllium copper frame, the side surface of the upper beryllium copper frame is provided with four side water cooling cavities, the distribution patterns on the side wall of the upper beryllium copper frame are the same, the shape of the transverse water cooling cavity is in a cross shape, a connecting pipe is arranged on each arm of the transverse water cooling cavity, the water inlet pipe is connected to the right side of the transverse water cooling cavity, the water collecting pipe surrounds the periphery of a lower beryllium copper frame, supports are arranged on the left side and the right side of the lower beryllium copper frame, the supports are provided with four, and the supports are respectively arranged on the left and the right sides of the lower beryllium copper frame; the transfer case shell mold with the beryllium copper cooling device has the advantages of convenience in use and excellent cooling effect.

Description

Transfer case shell mold with beryllium copper cooling device
Technical Field
The utility model relates to the technical field of mold cooling, in particular to a transfer case shell mold with a beryllium copper cooling device.
Background
A mold is a tool that uses its particular shape to form an article having a certain shape, size, and surface finish. The method is mainly applied to mass production, and the cost of each product is greatly reduced due to mass production although the production and manufacturing cost of the die are relatively high, so that the method is widely used; the method can be divided into a plastic die, a casting die, a stamping die, a forging die and a graphite electrode grinding female die according to functional purposes; the casting mould adopts a method of pouring molten metal liquid into a mould for forming, and the casting mould needs to be cooled in the casting process of the mould so as to achieve the purpose of rapid forming.
The existing transfer case shell mould with the beryllium copper cooling device has the problems of poor cooling effect and inconvenient use, and the transfer case shell mould with the beryllium copper cooling device has the advantages that the existing transfer case shell mould with the beryllium copper cooling device adopts air cooling to cool the mould, the effect is inferior to that of water cooling, and the disassembly and assembly of the cooling device are more troublesome.
Therefore, the utility model provides a transfer case shell mould with a beryllium copper cooling device.
Disclosure of Invention
The utility model aims to provide a transfer case shell mold with a beryllium copper cooling device, which has the advantages of convenience in use and excellent cooling effect, and solves the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the transfer case shell mold with the beryllium copper cooling device comprises a bottom plate, a cooling water tank is arranged on the bottom plate, a connector is arranged on the cooling water tank, a water outlet pipe is arranged on the right side of the connector, a return pipe is arranged in the bottom plate, a lower beryllium copper frame is arranged on the right side of the cooling water tank, a transverse water cooling cavity is arranged in the lower beryllium copper frame, a connecting pipe is arranged on one side of the transverse water cooling cavity, a side water cooling cavity is arranged above the connecting pipe, a boss is arranged at the upper end of the lower beryllium copper frame, a fixing bolt is arranged on the boss, a transfer case shell mold is arranged on the inner side of the lower beryllium copper frame, an upper beryllium copper frame is arranged on the transfer case shell mold, a mounting interface is arranged on the mounting interface, a hose above the mounting interface, a water collecting pipe is connected on the right side of the water outlet pipe, a water inlet pipe is arranged on the right side of the lower beryllium copper frame, a shunt head is arranged on the water inlet pipe, a side hose is arranged on the shunt head, and the water inlet pipe is connected with a water pump through the water cooling cavity on the side of the shunt head, and an overflow support is arranged on the water collecting pipe.
Preferably, the cooling water tank is fixed on the bottom plate through a bolt, a return pipe is connected below the cooling water tank, and the right side of the return pipe is connected below the water pump.
Preferably, an upper hose is arranged above the connecting head, the upper end of the side hose is connected to the side water cooling cavity, and the valve is arranged on the water inlet pipe.
Preferably, a transverse water cooling cavity is arranged above the upper beryllium copper frame, side water cooling cavities are arranged on the side face of the upper beryllium copper frame, and four side water cooling cavities are arranged and are identical in distribution pattern on the side wall of the upper beryllium copper frame.
Preferably, the shape of the transverse water cooling cavity is cross-shaped, each arm of the transverse water cooling cavity is provided with a connecting pipe, and the water inlet pipe is connected to the right side of the transverse water cooling cavity.
Preferably, the water collecting pipe surrounds the periphery of the lower beryllium copper frame, the supports are arranged on the left side and the right side of the lower beryllium copper frame, four supports are arranged, and two supports are respectively arranged on the left side and the right side of the lower beryllium copper frame.
Compared with the prior art, the utility model has the beneficial effects that:
1. the utility model has reasonable structural design, and is a transfer case shell mold with a beryllium copper cooling device, which comprises a water inlet pipe arranged on the right side of a lower beryllium copper frame, a shunt head arranged on the water inlet pipe, a side hose arranged above the shunt head, a valve arranged on the right side of the shunt head, a water pump arranged on the right side of the water inlet pipe, a water collecting pipe connected with the side water cooling cavity through an overflow pipe, a support arranged on the water collecting pipe, which is beneficial to ensuring the rationality of the device, and a cooling water tank fixed on a bottom plate through bolts, a return pipe connected below the cooling water tank, the right side of the return pipe connected below the water pump, an upper hose arranged above the connector, the upper end of the side hose connected with the side water cooling cavity, a valve arranged on the water inlet pipe, which is beneficial to the smooth circulation of cooling water, a transverse water cooling cavity arranged above the upper beryllium copper frame, a side water cooling cavity arranged on the side surface of the upper beryllium copper frame, four side water cooling cavities distributed in the same pattern on the side wall of the upper beryllium copper frame, the transverse water cooling cavity is in a cross shape, each arm of the transverse water cooling cavity is provided with a connecting pipe, the water inlet pipe is connected with the right side of the transverse water cooling cavity, the water inlet pipe surrounds the lower beryllium copper frame, the support is arranged on the left side of the lower beryllium copper frame, and the left side of the support is arranged on the right side of the lower beryllium copper frame, and the support is provided with four supports arranged on the left side and right sides of the support, which are beneficial to ensure the convenience of disassembly and assembly.
Drawings
FIG. 1 is a schematic elevational cross-sectional view of a transfer case housing mold with a beryllium copper cooling device of the present utility model;
FIG. 2 is a schematic top view of a transfer case housing mold with a beryllium copper cooling device of the present utility model;
FIG. 3 is a schematic top cross-sectional view of a transfer case housing mold cooling apparatus with a beryllium copper cooling apparatus of the present utility model;
fig. 4 is a schematic top view of a transfer case housing mold cooling device with a beryllium copper cooling device according to the present utility model.
In the figure: 1. a bottom plate; 2. a cooling water tank; 3. a connector; 4. a return pipe; 5. a side water cooling cavity; 6. a horizontal water cooling cavity; 7. a lower beryllium copper frame; 8. a connecting pipe; 9. a water collecting pipe; 10. a water pump; 11. a valve; 12. a shunt head; 13. a side hose; 14. a fixing bolt; 15. a boss; 16. a beryllium copper frame is arranged on the upper part; 17. transfer case housing mold; 18. installing an interface; 19. an upper hose; 20. a water outlet pipe; 21. a water inlet pipe; 22. an overflow pipe; 23. and (5) a support.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making creative efforts based on the embodiments of the present utility model are included in the protection scope of the present utility model.
In the description of the present utility model, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "top," "bottom," "inner," "outer," and the like indicate or are based on the orientation or positional relationship shown in the drawings, merely to facilitate description of the present utility model and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Example 1:
referring to fig. 1-4, a transfer case mold with a beryllium copper cooling device, comprising a bottom plate 1, is characterized in that: the bottom plate 1 is provided with a cooling water tank 2, the cooling water tank 2 is provided with a connector 3, the right side of the connector 3 is provided with a water outlet pipe 20, a return pipe 4 is arranged in the bottom plate 1, the right side of the cooling water tank 2 is provided with a lower beryllium copper frame 7, a horizontal water cooling cavity 6 is arranged in the lower beryllium copper frame 7, one side of the horizontal water cooling cavity 6 is provided with a connecting pipe 8, a side water cooling cavity 5 is arranged above the connecting pipe 8, the upper end of the lower beryllium copper frame 7 is provided with a boss 15, the boss 15 is provided with a fixing bolt 14, the inner side of the lower beryllium copper frame 7 is provided with a transfer case mould 17, the transfer case mould 17 is provided with an upper beryllium copper frame 16, a mounting interface 18 is arranged above the upper beryllium copper frame 16, an upper hose 19 is arranged on the mounting interface 18, the right side of the water outlet pipe 20 is connected with a water collecting pipe 9, the right side of the lower beryllium copper frame 7 is provided with a water inlet pipe 21, the water inlet pipe 21 is provided with a shunt head 12, the shunt head 12 is provided with a side hose 13, the right side of the shunt head 12 is provided with a valve 11, the right side of the water inlet pipe 21 is provided with a water pump 10, the water inlet pipe 9 is connected with the side water cooling cavity 5 through the overflow pipe 22, and a support 23 is arranged on the water collecting pipe 9, which is beneficial to ensuring the rationality of a user;
the cooling water tank 2 is fixed on the bottom plate 1 through bolts, the return pipe 4 is connected below the cooling water tank 2, the right side of the return pipe 4 is connected below the water pump 10, the upper hose 19 is arranged above the connector 3, the upper end of the side hose 13 is connected on the side water cooling cavity 5, and the valve 11 is arranged on the water inlet pipe 21, so that the smooth circulation of cooling water is facilitated;
the upper beryllium copper frame 16 is provided with a transverse water cooling cavity 6 above, the side surface of the upper beryllium copper frame 16 is provided with side water cooling cavities 5, the side water cooling cavities 5 are provided with four and are identical in distribution pattern on the side wall of the upper beryllium copper frame 16, the shape of the transverse water cooling cavity 6 is cross-shaped, each arm of the transverse water cooling cavity 6 is provided with a connecting pipe 8, a water inlet pipe 21 is connected to the right side of the transverse water cooling cavity 6, a water collecting pipe 9 surrounds the periphery of the lower beryllium copper frame 7, a support 23 is arranged on the left side and the right side of the lower beryllium copper frame 7, the support 23 is provided with four, and the support 23 is respectively provided with two on the left side and the right side of the lower beryllium copper frame 7, so that the disassembly and assembly convenience of the device can be guaranteed.
Working principle: the utility model relates to a transfer case shell mould with a beryllium copper cooling device, which is characterized in that the device is placed on a plane to be used when in use, firstly, a cast transfer case shell mould 17 is placed in a lower beryllium copper frame 7, an upper beryllium copper frame 16 is buckled on the lower beryllium copper frame 7, the transfer case shell mould is tightly fixed by using a fixing bolt 14, and a water pump 10 is started, so that cooling water circulates in the device, and the cooling effect is achieved.
While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof; the present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (6)

1. Transfer case shell mold with beryllium copper cooling device, comprising a bottom plate (1), and characterized in that: be equipped with coolant tank (2) on bottom plate (1), be equipped with connector (3) on coolant tank (2), connector (3) right side is equipped with outlet pipe (20), be equipped with back flow (4) in bottom plate (1), coolant tank (2) right side is equipped with down beryllium copper frame (7), be equipped with horizontal water cooling chamber (6) in lower beryllium copper frame (7) frame, horizontal water cooling chamber (6) one side is equipped with connecting pipe (8), connecting pipe (8) top is equipped with side water cooling chamber (5), lower beryllium copper frame (7) upper end is equipped with boss (15), be equipped with gim peg (14) on boss (15), lower beryllium copper frame (7) inboard is equipped with transfer case shell mould (17), be equipped with on transfer case shell mould (17) beryllium copper frame (16), be equipped with installation interface (18) above, be equipped with upper hose (19) on installation interface (18), outlet pipe (20) right side is connected with collector tube (9), lower beryllium copper frame (7) upper end is equipped with boss (15), be equipped with gim peg (14) on boss (15), be equipped with on transfer case (17) side (17), be equipped with water inlet tube (12) on the side of shunting (12), the water inlet pipe (21) right side is equipped with water pump (10), water collecting pipe (9) are through overflow pipe (22) connection side water-cooling chamber (5), be equipped with support (23) on water collecting pipe (9).
2. A transfer case housing die with a beryllium copper cooling device as set forth in claim 1 wherein: the cooling water tank (2) is fixed on the bottom plate (1) through bolts, a return pipe (4) is connected below the cooling water tank (2), and the right side of the return pipe (4) is connected below the water pump (10).
3. A transfer case housing die with a beryllium copper cooling device as set forth in claim 1 wherein: the upper hose (19) is arranged above the connector (3), the upper end of the side hose (13) is connected to the side water cooling cavity (5), and the valve (11) is arranged on the water inlet pipe (21).
4. A transfer case housing die with a beryllium copper cooling device as set forth in claim 1 wherein: a transverse water cooling cavity (6) is arranged above the upper beryllium copper frame (16), a side water cooling cavity (5) is arranged on the side face of the upper beryllium copper frame (16), and four side water cooling cavities (5) are arranged and are identical in distribution pattern on the side wall of the upper beryllium copper frame (16).
5. A transfer case housing die with a beryllium copper cooling device as set forth in claim 1 wherein: the shape of the transverse water cooling cavity (6) is cross-shaped, a connecting pipe (8) is arranged on each arm of the transverse water cooling cavity (6), and the water inlet pipe (21) is connected to the right side of the transverse water cooling cavity (6).
6. A transfer case housing die with a beryllium copper cooling device as set forth in claim 1 wherein: the water collecting pipe (9) surrounds the periphery of the lower beryllium copper frame (7), the supports (23) are arranged on the left side and the right side of the lower beryllium copper frame (7), four supports (23) are arranged, and two supports (23) are respectively arranged on the left side and the right side of the lower beryllium copper frame (7).
CN202320011964.0U 2023-01-04 2023-01-04 Transfer case shell mold with beryllium copper cooling device Active CN219233894U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202320011964.0U CN219233894U (en) 2023-01-04 2023-01-04 Transfer case shell mold with beryllium copper cooling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202320011964.0U CN219233894U (en) 2023-01-04 2023-01-04 Transfer case shell mold with beryllium copper cooling device

Publications (1)

Publication Number Publication Date
CN219233894U true CN219233894U (en) 2023-06-23

Family

ID=86804041

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202320011964.0U Active CN219233894U (en) 2023-01-04 2023-01-04 Transfer case shell mold with beryllium copper cooling device

Country Status (1)

Country Link
CN (1) CN219233894U (en)

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