CN219228265U - Vacuum cavity vapor chamber radiator - Google Patents

Abstract

The application provides a vacuum chamber vapor chamber radiator, include: an evaporation component, wherein an evaporation cavity is arranged at one side of the evaporation component along the vertical direction; the condensing part is arranged on one side of an evaporation cavity of the evaporation part, at least one condensing cavity is arranged in the condensing part, the condensing cavities are communicated with the evaporation cavity, and at least one reflux structure is arranged on one side, away from the evaporation cavity, of each condensing cavity so as to guide condensing working media to two sides, along the horizontal direction, of the condensing cavity. This application is through setting up the backward flow structure, guides the condensation working medium to the position with evaporation cavity both sides for the evaporation route is avoided to condensation backward flow route, avoids gaseous state working medium to hinder liquid working medium backward flow, is favorable to improving the radiating effect.

Description

Vacuum cavity vapor chamber radiator

Technical Field

The application relates to the technical field of heat dissipation equipment, in particular to a vacuum cavity vapor chamber radiator.

Background

In recent years, semiconductor and microelectronic technologies still follow moore's law, moving toward shrinking feature sizes, increasing transistor density, increasing circuit speed, and improving chip performance. The total power density of the electronic device is greatly increased, the physical size is smaller and smaller, and the heat flux density is also increased, so that the high-temperature environment tends to influence the performance of the electronic device, more efficient heat control is required, and the heating problem is related to the service life of the product and the energy required for playing the effect. The traditional single-phase fluid vacuum cavity vapor chamber radiator (air cooling or water cooling) can not meet the heat dissipation requirement of high heat flux electronic devices. The heat dissipation device adopting the two-phase fluid phase change heat exchange technology has strong adaptability to various electronic devices or devices, and can completely meet the heat dissipation requirement of the electronic devices under high heat flux. The existing heat dissipating device adopting the two-phase fluid phase change heat exchange technology is mainly divided into a heat pipe vacuum cavity Vapor Chamber radiator and a VC (vacuum cavity Vapor Chamber) radiator product, the heat pipe vacuum cavity Vapor Chamber radiator has the advantages of simple structure, convenient control and easy processing, and can transfer heat to a considerable distance with high heat transfer efficiency under extremely small temperature gradient, and the vacuum cavity Vapor Chamber radiator is the 'dimension raising technology' of the heat pipe vacuum cavity Vapor Chamber radiator, namely, unidirectional linear heat transfer of a heat pipe is upgraded into multidirectional two-dimensional heat dissipation. When the vacuum cavity vapor chamber radiator works, local heat is rapidly dispersed on the vacuum cavity vapor chamber radiator, and then the heat is transferred to the air through the radiating fins welded above the vacuum cavity vapor chamber radiator in a natural convection or forced convection mode, so that the temperature of an electronic device is reduced.

The vacuum cavity vapor chamber radiator in the industry mainly uses copper as a base material and is used for rapidly diffusing heat of a heat source on a two-dimensional plane, the heat radiation mode is gradually changed from two dimensions to three dimensions along with rapid increase of heat flux density in recent years, and accordingly research hotspots start to develop to a 3D vapor chamber. Because the movement directions of the vapor and the liquid in the vapor chamber radiator are opposite, when the vapor speed is high enough, the liquid in the capillary core is torn off and carried away by the vapor under the action of the shearing force on the vapor-liquid interface, and when the condensate flows back and cannot compensate the flow increase, the working medium at the heat source can be burned off, so that the vapor chamber radiator fails.

It should be noted that the information disclosed in the foregoing background section is only for enhancement of understanding of the background of the present application and thus may include information that does not form the prior art that is already known to those of ordinary skill in the art.

Disclosure of Invention

To the problem among the prior art, the aim at of this application provides a vacuum chamber vapor chamber radiator, through setting up the backward flow structure, with the condensation working medium guide to the position with evaporation cavity both sides for the evaporation route is avoided to condensation backward flow route, avoids gaseous state working medium to hinder liquid working medium backward flow.

The embodiment of the application provides a vacuum chamber vapor chamber radiator, include:

an evaporation component, wherein an evaporation cavity is arranged at one side of the evaporation component along the vertical direction;

the condensing part is arranged on one side of an evaporation cavity of the evaporation part, at least one condensing cavity is arranged in the condensing part, the condensing cavities are communicated with the evaporation cavity, and at least one reflux structure is arranged on one side, away from the evaporation cavity, of each condensing cavity so as to guide condensing working media to two sides of the condensing cavity along the horizontal direction.

In some embodiments, the condensation cavity is divided into a first condensation cavity and a second condensation cavity along the horizontal direction, the first condensation cavity and the second condensation cavity are respectively provided with a reflux structure, each reflux structure respectively comprises at least one drainage plate, and the extending direction of the drainage plate is inclined towards one side of the evaporation cavity relative to the horizontal direction.

In some embodiments, the return structures each comprise a plurality of rows of flow directing plates arranged parallel to each other, each row comprising at least one of the flow directing plates.

In some embodiments, each row comprises a plurality of the drainage plates arranged at intervals, and two adjacent rows on the same side are arranged in a staggered manner.

In some embodiments, a plurality of evaporation fins arranged in an array are arranged in the evaporation cavity, and two sides of the evaporation fins along the horizontal direction are respectively provided with a backflow area.

In some embodiments, each of the evaporation fins is a sheet structure or a cylinder structure.

In some embodiments, the outer side wall of the condensing part is provided with a plurality of heat radiating fins.

In some embodiments, the outer side wall of the condensation component is provided with a plurality of groups of the heat dissipation fins, and each group comprises a plurality of heat dissipation fins which are arranged at intervals and are arranged along the vertical direction.

In some embodiments, the heat radiating fin is made of an aluminum material or an aluminum alloy material.

In some embodiments, the heat radiating fin is made of copper or copper alloy material and is fixed to the condensation member by a copper plug process.

The vacuum cavity vapor chamber radiator provided by the application has the following advantages:

through adopting this application, upgrade two-dimensional heat exchange cavity into three-dimensional heat exchange cavity to increase the heat transfer limit of radiator self, set up reflux structure in the condensation cavity is inside, guide the condensation working medium to the position with evaporation cavity both sides, disperse gaseous state and liquid working medium, make condensation reflux path avoid evaporation path, avoid gaseous state working medium to hinder liquid working medium backward flow, and avoid gaseous state working medium and liquid working medium to respond to each other because of the shearing force in the inside flow field, thereby improve the radiating effect of radiator.

Drawings

Other features, objects and advantages of the present application will become more apparent upon reading of the detailed description of non-limiting embodiments, made with reference to the following drawings.

FIG. 1 is a schematic diagram of a vacuum chamber vapor chamber heat sink according to an embodiment of the present disclosure;

FIG. 2 is a top view of an evaporation member according to an embodiment of the present application;

FIG. 3 is a schematic view, partially in section, of a vacuum chamber vapor chamber heat sink in accordance with an embodiment of the present application;

fig. 4 is a schematic diagram of gas-liquid diversion of working medium in a vacuum chamber vapor chamber radiator according to an embodiment of the present application.

Reference numerals:

1. reflow structure of evaporation component 212

11. Evaporation cavity 2121 drainage plate

12. Evaporation fin 3 capillary tube

13. Reflow area 4 radiating fin

14. Reflux path of through holes a-c

2. Heat absorption path of evaporation cavity of condensation part M

21. Heat dissipation path is carried in condensation chamber N condensation chamber

211. Condensation channel

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus a repetitive description thereof will be omitted. "or", "or" in the specification may each mean "and" or ". Although the terms "upper", "lower", "between", etc. may be used in this specification to describe various example features and elements of the present application, these terms are used herein for convenience only, e.g., in terms of the orientation of the examples depicted in the drawings. Nothing in this specification should be construed as requiring a particular three-dimensional orientation of the structure to fall within the scope of this application. Although the terms "first" or "second" etc. may be used herein to describe certain features, these features should be interpreted in a descriptive sense only and not for purposes of limitation as to the number and importance of the particular features.

The application provides a vacuum chamber vapor chamber radiator, include: an evaporation component, wherein an evaporation cavity is arranged at one side of the evaporation component along the vertical direction; and the condensing part is arranged on one side of the evaporating cavity of the evaporating part, at least one condensing cavity is arranged in the condensing part, and the condensing cavity is communicated with the evaporating cavity. Therefore, the two-dimensional heat exchange cavity is upgraded into the three-dimensional heat exchange cavity, so that the heat transfer limit of the radiator is increased. Further, each one side of the condensation cavity, which is far away from the evaporation cavity, is provided with at least one backflow structure, so that the condensation working medium is guided to the two sides of the condensation cavity along the horizontal direction, namely, the liquid working medium is guided to the positions of the two sides of the evaporation cavity, and the gaseous working medium and the liquid working medium are dispersed, so that the condensation backflow path avoids the evaporation path, the gaseous working medium is prevented from obstructing the backflow of the liquid working medium, and the mutual response of the gaseous working medium and the liquid working medium in the internal flow field due to the shearing force is avoided, thereby improving the radiating effect of the radiator.

The structure of the vacuum chamber vapor chamber radiator in one embodiment is specifically described below with reference to fig. 1 to 4. It is understood that this embodiment is by way of example only and is not intended as a limitation on the scope of the present application.

As shown in fig. 1 to 3, in this embodiment, the vacuum chamber vapor chamber heat sink includes an evaporation part 1, a condensation part 2, and a capillary tube 3. The evaporation component 1 comprises an evaporation bottom plate, one side of the evaporation bottom plate along the vertical direction is provided with an evaporation cavity 11, and four corners of the outside of the evaporation component 1 are provided with through holes 14, so that the radiator and the heat source are conveniently fixed. The condensing unit 2 is disposed on one side of the evaporating cavity 11 of the evaporating unit 1, and includes at least one condensing cavity 21, where the condensing cavity 21 is communicated with the evaporating cavity 11 to form a vacuum phase-change chamber. The vacuum phase-change chamber is filled with working medium, preferably ethanol, methanol, propane or refrigerant medium such as R22 (difluoro-chloromethane), R134 (tetrafluoroethane) and the like. After the radiator is processed and molded, working medium is filled into the capillary tube 3 and vacuumized, the capillary tube 3 is compacted and welded to be dead after the filling and vacuumization are completed, and the surface of the capillary tube 3 is ground at the level of the evaporation part 1, so that the working medium is prevented from leaking and the radiator is convenient to install. The main body of the condensing part 2, the evaporating part 1 and the capillary 3 can be made of aluminum alloy metal. The evaporation member 1 and the condensation member 2 may be bonded by welding or other means, and the welding may use resistance welding, micro arc welding, spot welding, laser welding, etc.

In this embodiment, the x direction in fig. 3 is defined as a vertical direction, i.e., an up-down direction, the y direction is defined as a horizontal direction, i.e., a left-right direction, and the z direction is defined as a front-back direction, the three directions being perpendicular to each other. The evaporation component 1 is arranged at the bottom of the condensation component 2, and one side of the condensation cavity 21 away from the evaporation cavity 11 is the top of the condensation cavity 21.

As shown in fig. 1-3, the present application upgrades the two-dimensional heat exchange cavity to a three-dimensional heat exchange cavity, thereby increasing the heat transfer limit of the heat sink itself. The number of the condensation chambers 21 may be selected according to the need or according to the size of the radiator, and when a plurality of condensation chambers 21 are included, a plurality of condensation chambers 21 are disposed parallel to each other. For example, as shown in fig. 1, a plurality of groups of heat dissipation fins 4 are disposed outside the condensation component 2, and one condensation cavity 21 is disposed between two adjacent groups of heat dissipation fins 4, and a cross-sectional structure of one condensation cavity 21 is exemplarily shown in fig. 3. The number of condensation chambers 21 is only exemplary here and is not intended to limit the scope of the present application.

As shown in fig. 2 to 4, in this embodiment, a plurality of evaporation fins 12 are disposed in the evaporation cavity 11 and arranged in an array, and the evaporation fins 12 are preferably arranged in an array form with uniform spacing, but the application is not limited thereto. The spacing of the evaporation fins 12 between adjacent rows may be the same or different, and the spacing of the evaporation fins 12 between adjacent columns may be the same or different. The evaporation fins 12 are beneficial to increasing the contact area between the heat source and the internal working medium and accelerating the evaporation rate of the internal working medium. In this embodiment, each of the evaporation fins 12 may be a sheet structure or a column structure, for example, each of the evaporation fins 12 may be a rectangular sheet structure, a cylindrical structure, a square column structure, or the like, and is not limited to the sheet structure and the column structure. The evaporation fins 12 may be sized as desired and should not be too long to block the flow of vapor into the condensation chamber 21. The evaporation fins 12 and the through holes 14 at four corners of the evaporation component 1 may be manufactured by a CNC (computer numerical control precision machining) integrated molding process, while reserving a space through which the capillary tube 3 passes, and then welding the capillary tube 3 and the evaporation component 1.

Further, as shown in fig. 2 and 3, the evaporation chamber 11 is provided with a return region 13 at both sides in the horizontal direction. The recirculation zone 13 may be located entirely within the evaporation chamber 11, may be located partially within the evaporation chamber 11, or may be located entirely outside the evaporation chamber 11. Each condensation cavity 21 is kept away from one side of evaporation cavity 11 is equipped with at least one backward flow structure 212, so that will condense the working medium guide to condensation cavity 21 is followed the both sides of horizontal direction, will condense the working medium guide to with evaporation cavity 11 both sides backward flow regional 13 relative position, disperse gaseous state and liquid working medium for condensation backward flow route avoids the evaporation route, avoid gaseous state working medium to hinder liquid working medium backward flow, and avoid gaseous state working medium and liquid working medium to respond to each other because of the shearing force in the internal flow field, and with condensation cavity 21 and evaporation cavity 11 separation back, can more effectively utilize the space, thereby improve the radiating effect of radiator.

As shown in fig. 3 and 4, in this embodiment, the condensation chamber 21 includes a plurality of pipes, the condensation chamber 21 is divided into a plurality of elongated condensation channels 211 (a portion with a vertical rising arrow is shown in fig. 4) extending in a vertical direction, the gaseous working medium evaporated from the evaporation chamber 11 moves upward along the condensation channels 211, the loop of the condensation channels 211 and the main body of the condensation component 2 may be formed by adopting a CNC integral molding process, and then after welding the cover plate on the other side of the condensation component 2, the condensation component 2 is welded to the evaporation component 1. The condensation chamber 21 is divided into a first condensation chamber 21 and a second condensation chamber 21 along the horizontal direction. I.e. in the view of fig. 4, the condensation chamber 21 is divided into a first condensation chamber 21 in the left half and a second condensation chamber 21 in the right half. The first condensation chamber 21 and the second condensation chamber 21 are respectively provided with a backflow structure 212, each backflow structure 212 includes at least one flow guiding plate 2121, and the extending direction of the flow guiding plate 2121 is inclined towards one side of the evaporation chamber 11 relative to the horizontal direction, that is, in the view angle shown in fig. 4, the extending direction of the flow guiding plate 2121 on the right side is inclined downwards from left to right, and the extending direction of the flow guiding plate 2121 on the left side is inclined downwards from right to left. The condensed working medium can be well guided to the left side and the right side of the condensation cavity 21 through the action of the guide plate 2121, flows downwards and returns to the evaporation cavity 11 through the backflow area 13.

As shown in fig. 3 and 4, in this embodiment, each of the backflow structures 212 includes a plurality of the drainage plates 2121 arranged in two parallel rows, each row of the drainage plates 2121 includes a plurality of the drainage plates 2121 arranged at intervals, and the two rows of the drainage plates 2121 on the same side are staggered. When the gaseous working medium moves upwards to the reflux structure 212 along the condensation channel 211, the gaseous working medium is guided to move to two sides by the flow guiding plate 2121 and moves to two sides under the guiding action of the flow guiding plate 2121.

After reserving the recirculation zone 13 on the evaporation component 1 and providing the recirculation structure 212 on top of the condensation chamber 21, the circulation process of the working medium is shown by arrows in the condensation chamber 21 and the evaporation chamber 11 in fig. 4. In fig. 4, the arrow M indicates the direction of heat absorption from the heat source by the evaporation chamber 11, and the arrow N indicates the direction of heat dissipation from the condensation chamber 21. a. b and c represent reflux paths of condensed working media. After the evaporation cavity 11 absorbs heat from the heat source, the working medium absorbs heat and is evaporated into gaseous working medium, moves upwards along the condensation channel 211, moves to two sides under the action of the drainage plate 2121 after moving to the reflux structure 212, flows into the path b near the side through the inclined path a, gradually condenses into liquid working medium in the process, then flows back into the path c, returns to the reflux area 13 of the evaporation component 1, and returns to the evaporation cavity 11. As can be seen from fig. 4, the backflow paths of the liquid working medium are on both sides of the path where the working medium evaporates and rises, so that the two paths are prevented from responding to each other in the internal flow field due to the shearing force, thereby being beneficial to improving the heat dissipation effect of the radiator.

As shown in fig. 1 and 3, in this embodiment, the outer side wall of the condensing part 2 is provided with a plurality of heat radiating fins 4. Specifically, the outer side wall of the condensation component 2 is provided with a plurality of groups of heat dissipation fins 4, and each group of heat dissipation fins 4 comprises a plurality of heat dissipation fins 4 which are arranged at intervals and are arranged along the vertical direction. The heat dissipation fin 4 may be a plate structure extending along the z-axis, but the present application is not limited thereto, and the heat dissipation fin 4 may be a plate structure disposed obliquely or a plate structure extending vertically, or the like. In this embodiment, the heat dissipation efficiency of the radiator is advantageously improved by increasing the contact area of the heat dissipation fins 4 with the outer surface of the condensation member 2.

In this embodiment, the heat dissipation fins 4 may be made of an aluminum material or an aluminum alloy material, and the main body of the condensation component 2 and the heat dissipation fins 4 may be fixed by welding, gear shaping, CNC integral molding, or the like. Alternatively, the heat dissipation fin 4 may be made of copper or copper alloy according to power requirements. When the heat radiating fin 4 is made of copper or copper alloy, it is fixed to the condensation member 2 by a copper plug process. The copper plug process can greatly reduce the thermal resistance between the radiating fins 4 and the outer surface of the condensing part 2 because no third-party medium is used, thereby ensuring the compactness of copper-aluminum combination and fully utilizing the characteristics of quick heat dissipation and quick heat absorption of copper. The heat transfer rate of the vacuum chamber vapor chamber radiator to the outside is mainly limited by the contact thermal resistance of the condensing part 2 and the radiating fins 4. The copper plug process can effectively reduce contact thermal resistance at the position, and meanwhile, the heat transfer limit of the vacuum cavity vapor chamber radiator is increased, so that the heat radiation capacity of the vacuum cavity vapor chamber radiator can be greatly improved. The size and pitch of the heat dissipation fins 4 are not limited, and may be calculated and selected according to specific use conditions.

Therefore, in the radiator of this embodiment, by disposing a large number of evaporation fins 12 in the evaporation cavity 11, the internal working medium absorbs a large amount of latent heat of vaporization, efficiently transfers the heat at the heat source to the condensation cavity, and then releases the heat to the air through the heat dissipation fins 4, and the radiator structure has high integration level, so that the heat transfer limit and heat dissipation capability of the radiator can be greatly improved in a limited space.

In the above embodiment, the backflow structure 212 includes two parallel rows of the plurality of flow guiding plates 2121, respectively. It is to be understood that the present application is not limited thereto, and in other embodiments, the backflow structure 212 may also include one row of drainage plates or include three, four or more rows of drainage plates 2121, so as to achieve the purpose of the present application, and guide the condensed working medium to the positions on two sides of the evaporation cavity, so that the condensed backflow path avoids the evaporation path, and avoids the gaseous working medium from obstructing the backflow of the liquid working medium. When including multirow drainage plate 2121, every row includes a plurality of intervals setting drainage plate 2121, and two rows that same side is adjacent drainage plate 2121 crisscross the setting, perhaps drainage plate 2121 also can adopt other forms to arrange, all fall within the scope of protection of this application.

The foregoing is a further detailed description of the present application in connection with the specific preferred embodiments, and it is not intended that the practice of the present application be limited to such description. It should be understood that those skilled in the art to which the present application pertains may make several simple deductions or substitutions without departing from the spirit of the present application, and all such deductions or substitutions should be considered to be within the scope of the present application.

Claims (10)

1. A vacuum chamber vapor chamber heat sink, comprising:

an evaporation component, wherein an evaporation cavity is arranged at one side of the evaporation component along the vertical direction;

the condensing part is arranged on one side of an evaporation cavity of the evaporation part, at least one condensing cavity is arranged in the condensing part, the condensing cavities are communicated with the evaporation cavity, and at least one reflux structure is arranged on one side, away from the evaporation cavity, of each condensing cavity so as to guide condensing working media to two sides of the condensing cavity along the horizontal direction.

2. The vacuum chamber vapor chamber radiator according to claim 1, wherein the condensation chamber is divided into a first condensation chamber and a second condensation chamber along the horizontal direction, the first condensation chamber and the second condensation chamber are respectively provided with a reflux structure, each reflux structure respectively comprises at least one drainage plate, and the extension direction of the drainage plate is inclined towards one side of the evaporation chamber relative to the horizontal direction.

3. A vacuum chamber vapor chamber heat sink as recited in claim 2 wherein each of said return structures comprises a plurality of rows of flow directing plates disposed parallel to each other, each row comprising at least one of said flow directing plates.

4. A vacuum chamber vapor chamber radiator according to claim 3, wherein each row comprises a plurality of the flow guiding plates arranged at intervals, and two adjacent rows of the flow guiding plates on the same side are arranged in a staggered manner.

5. The vacuum chamber vapor chamber radiator according to claim 1, wherein a plurality of evaporation fins arranged in an array are arranged in the evaporation chamber, and two sides of the evaporation fins along the horizontal direction are respectively provided with a reflow area.

6. The vacuum chamber vapor chamber heat sink of claim 5, wherein each of the evaporation fins is a plate structure or a column structure.

7. The vacuum chamber vapor chamber radiator of claim 1, wherein the outer side wall of the condensing member is provided with a plurality of heat radiating fins.

8. The vacuum chamber vapor chamber radiator as recited in claim 7, wherein the outer side wall of the condensing member is provided with a plurality of groups of the heat radiating fins, each group including a plurality of heat radiating fins arranged at intervals and arranged in the vertical direction.

9. The vacuum chamber vapor chamber radiator as recited in claim 8, wherein said heat radiating fin is made of aluminum material or aluminum alloy material.

10. The vacuum chamber vapor chamber radiator according to claim 8, wherein the radiating fin is made of copper material or copper alloy material and is fixed to the condensing part by a copper plug process.

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