CN219228240U

CN219228240U - Heat dissipation structure

Info

Publication number: CN219228240U
Application number: CN202223364435.3U
Authority: CN
Inventors: 陈永昌; 吴绍文; 黄忆洪; 谢宇佳; 陈小霞
Original assignee: Foshan Runhong Metal Products Co ltd
Current assignee: Foshan Runhong Metal Products Co ltd
Priority date: 2022-12-15
Filing date: 2022-12-15
Publication date: 2023-06-20
Anticipated expiration: 2032-12-15

Abstract

The utility model relates to the technical field of radiators and discloses a radiating structure which comprises a base, wherein a plurality of radiating monomers are fixedly arranged on the outer wall of one side of the base, an installation groove for placing a heat source is formed in the outer wall of one side of the base, the radiating monomers and the installation groove are positioned on the same side of the base, the radiating monomers are positioned on the periphery of the installation groove, and the radiating monomers extend upwards of the installation groove. When the heat radiation structure disclosed by the utility model is used, the heat source in the mounting groove transmits the heat to the bottom plate, the bottom plate transmits the heat to the plurality of heat radiation monomers, the heat radiation monomers are positioned at the side edges of the heat source, and the lamp panel body of the heat source can not block the air heated by the heat radiation monomers from rising, so that the problem that the lamp panel body is positioned right above the heat radiation monomers to block the rising of the hot air when the traditional heat radiation device is used is solved, and the heat radiation structure has the technical effect of better heat radiation.

Description

Heat dissipation structure

Technical Field

The present disclosure relates to heat dissipation devices, and particularly to a heat dissipation device.

Background

At present, any electronic product has more or less energy conversion efficiency problems, and most useless energy is converted into heat energy, which brings trouble to the application of the electronic product. In general, the lower the efficiency of an electronic device, the higher its use temperature, and the shorter its lifetime. For the current rapidly developed LED products, the service life is prolonged by 2 times when the service temperature is reduced by 10 ℃. The CPU and other processors also require a temperature reduction to greatly improve product performance and lifetime.

Patent document of application number 201720891861.2 discloses a heat radiation structure, the heat radiation structure contains the base, and base one side links to each other with the heat source, and the opposite side is equipped with a plurality of independent heat dissipation monomer each other, just the heat dissipation monomer stretches out to deviating from the heat source direction, dispels the heat through increase heat radiating area.

In the actual use process, hot air rises and cold air sinks, but when the traditional heat dissipation structure is used for heat dissipation of a heat source, if the heat dissipation surface of the heat source faces upwards, namely the heat dissipation unit extends upwards, the air heated by the heat dissipation structure can rise smoothly at the moment; if the heat radiation surface of the heat source is downward, i.e. the heat radiation unit extends downward, the air heated by the heat radiation structure is blocked by the heat source body when rising, and the heat radiation effect is poor, for example, the heat source is a spotlight panel body irradiated upward, the heat radiation structure is arranged below the spotlight panel body, the heat radiation unit is concentrated under the spotlight panel body, the spotlight panel body can block the hot air flow in the center of the base to rise, the heat radiation effect can be reduced, and the problem of poor heat radiation effect exists.

Disclosure of Invention

The utility model discloses a heat radiation structure, which aims to solve the technical problems that when the traditional heat radiation structure radiates heat for a device with a downward radiating surface, the rising of air heated by the heat radiation structure is blocked by a heat source body, and the heat radiation effect is poor.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

the utility model provides a heat radiation structure, includes the base, a plurality of heat dissipation monomers of a side outer wall fixed mounting of base, the mounting groove that is used for placing the heat source has been seted up to a side outer wall of base, the heat dissipation monomer with the mounting groove is located the same side of base, the heat dissipation monomer is located the mounting groove is peripheral, the heat dissipation monomer is towards the top extension of mounting groove.

When the heat source lamp panel body in the installation groove transfers heat to the bottom plate, the bottom plate transfers heat to the heat dissipation monomers, the heat dissipation monomers are located on the side edges of the heat source, the lamp panel body of the heat source cannot block the air heated by the heat dissipation monomers to rise, so that the problem that the lamp panel body is located right above the heat dissipation monomers to block the hot air to rise when the traditional heat dissipation device is used is solved, and the heat dissipation effect is better.

In a preferred scheme, a plurality of mounting holes are formed in the bottoms of the inner walls of the heat source and the mounting grooves, and the mounting holes are reserved holes, so that the base and the heat source can be conveniently mounted on the shell for protecting the heat source in the later period.

In a preferred scheme, the bottom outer wall fixed mounting of base has the heat conduction spare, the heat conduction spare is wide in the upper and lower narrow form to this forms the inclined plane at the side of heat conduction spare, and during the heat dissipation, the air of being heated by the inclined plane can not gather on the surface of inclined plane, is favorable to heat dissipation of heat conduction spare surface.

In a preferred scheme, the bottom of the heat conducting piece is provided with a plane, and the plane at the bottom of the heat conducting piece is convenient to contact with the inner wall of the shell which needs to be installed at a later stage.

From the above, a heat dissipation structure comprises a base, a plurality of heat dissipation monomers are fixedly arranged on the outer wall of one side of the base, a mounting groove for placing a heat source is formed in the outer wall of one side of the base, the heat dissipation monomers and the mounting groove are located on the same side of the base, the heat dissipation monomers are located on the periphery of the mounting groove, and the heat dissipation monomers extend towards the upper side of the mounting groove. When the heat radiation structure provided by the utility model is used, the lamp panel body of the heat source in the mounting groove transfers heat to the bottom plate, the bottom plate transfers heat to the plurality of heat radiation monomers, the heat radiation monomers are positioned at the side edges of the heat source, and the lamp panel body of the heat source can not block the air heated by the heat radiation monomers from rising, so that the problem that the lamp panel body is positioned right above the heat radiation monomers to block the rising of hot air when the traditional heat radiation device is used is solved, and the heat radiation structure has the technical effect of better heat radiation.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipation structure according to the present utility model.

Fig. 2 is a side view of a heat dissipation structure according to the present utility model.

Fig. 3 is a schematic diagram of a side support assembly of a heat dissipation structure according to the present utility model.

In the accompanying drawings: 1. a base; 2. a wire passing port; 3. a heat dissipation monomer; 4. a nut; 5. fixing the column; 6. a mounting hole; 7. a mounting groove; 8. a lamp panel body; 9. a lamp bead; 10. a heat conductive member; 11. a plane; 12. and (5) an inclined plane.

Detailed Description

The following description of the embodiments of the present application will be made clearly and completely with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are only some embodiments of the present application, not all embodiments. The components of the embodiments of the present application, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, as provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to be within the scope of the present application.

The heat radiation structure disclosed by the utility model is mainly applied to the scene that the heat radiation effect is poor because the rising of air heated by the heat radiation structure is blocked by the heat source body when the traditional heat radiation structure radiates heat for the device with the downward heat radiation surface.

Referring to fig. 1 and 3, a heat dissipation structure comprises a base 1, wherein a plurality of heat dissipation monomers 3 are fixedly installed on the outer wall of one side of the base 1, a mounting groove 7 for placing a heat source is formed in the outer wall of one side of the base 1, the heat dissipation monomers 3 and the mounting groove 7 are located on the same side of the base 1, the heat dissipation monomers 3 are located on the periphery of the mounting groove 7, and the heat dissipation monomers 3 extend towards the upper side of the mounting groove 7.

The heat source includes a lamp panel body 8 and a plurality of lamp beads 9 mounted on the lamp panel body 8, and the irradiation direction of the lamp beads 9 is the same as the heat conduction direction of the heat dissipation monomer 3, for example, the lamp beads 9 irradiate upwards, and the air heated by the heat dissipation monomer 3 rises upwards.

When the heat source lamp panel body 8 in the mounting groove 7 transfers heat to the bottom plate, the bottom plate transfers heat to the plurality of heat dissipation monomers 3, the heat dissipation monomers 3 exchange heat with air, as the heat dissipation monomers 3 extend towards the upper side of the mounting groove 7, namely the heat dissipation direction of the heat dissipation monomers 3 is the same as the illumination direction of the heat source, the heat dissipation monomers 3 are positioned on the side edge of the heat source, the heat source lamp panel body 8 cannot block the air heated by the heat dissipation monomers 3 from rising, so that the problem that the heat dissipation effect is better when the traditional heat dissipation device is used because the heat source lamp panel body 8 is positioned right above the heat dissipation monomers 3 to block the rising of hot air is solved.

In a preferred embodiment, the plurality of heat dissipation monomers 3 are distributed in an array with the heat source as the center, wherein the array distribution can be matrix distribution or circumferential array distribution, and the shape of the lamp panel body 8 is specific, for example, the lamp panel body 8 is circular, and then the heat dissipation monomers 3 are distributed in a circumferential array; if the lamp panel body 8 is rectangular, the heat dissipation monomers 3 are distributed in a matrix.

Referring to fig. 1, in a preferred embodiment, the heat dissipation unit 3 is in an arc plate shape, and the top of the base 1 is provided with a wire passing opening 2, that is, the arc plate-shaped heat dissipation unit 3 is not in a closed ring structure, and the wire passing opening 2 is arranged to facilitate the lead of the heat source to be led out from the side of the heat source.

Referring to fig. 1 and 3, in a preferred embodiment, a plurality of fixing posts 5 are fixedly installed at the bottom of the inner wall of the installation groove 7, nuts 4 are screwed at the top ends of the fixing posts 5, through holes corresponding to the fixing posts 5 are formed in the outer wall of the top of the lamp panel body 8, and when the lamp panel is used, the nuts 4 are removed, the fixing posts 5 penetrate through the through holes in the lamp panel body 8, and then the nuts 4 are screwed, and at the moment, the nuts 4 are located above the lamp panel body 8, so that the lamp panel body 8 is fixedly connected with the base 1.

Referring to fig. 1 and 3, in a preferred embodiment, the heat source and the bottom of the inner wall of the mounting groove 7 are provided with a plurality of mounting holes 6, and the mounting holes 6 are reserved holes, so that the base 1 and the heat source can be conveniently mounted on a housing for protecting the heat source in a later period, and specifically, the mounting holes 6 on the heat source are provided on the lamp panel body 8.

Referring to fig. 2, in a preferred embodiment, a heat conducting member 10 is fixedly installed on the bottom outer wall of a base 1, and the heat conducting member 10 is in a shape of being wider at the top and narrower at the bottom, so that an inclined surface 12 is formed at the side edge of the heat conducting member 10, and when heat is dissipated, air heated by the inclined surface 12 rises along the surface of the inclined surface 12, but does not gather on the surface of the inclined surface 12, namely, the heat dissipation of the surface of the heat conducting member 10 is facilitated; the heat conducting piece 10 is arranged to radiate heat from the center of the bottom of the lamp panel body 8.

Referring to fig. 2, in a preferred embodiment, the bottom of the heat conducting member 10 is provided with a plane 11, at this time, the heat conducting member 10 is in the shape of a truncated cone or a truncated pyramid with a large top and a small bottom, and the plane 11 at the bottom of the heat conducting member 10 is convenient to contact with the inner wall of the housing to be installed later; if the bottom of the heat conductive member 10 is tapered, the inner wall of the housing to be mounted in the later stage is easily scratched.

Wherein, the shell is the shell structure of lamps and lanterns outside that plays the inside lamp plate body 8 of protection effect.

Working principle: when the heat source lamp panel body 8 in the mounting groove 7 transfers heat to the bottom plate, the bottom plate transfers heat to the plurality of heat dissipation monomers 3, and the heat dissipation monomers 3 exchange heat with air, because the heat dissipation monomers 3 extend towards the upper side of the mounting groove 7, namely the heat dissipation direction of the heat dissipation monomers 3 is the same as the illumination direction of the heat source, and the heat dissipation monomers 3 are positioned on the side edge of the heat source, the heat source lamp panel body 8 cannot block the air heated by the heat dissipation monomers 3 from rising.

The above description is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto. The substitutions may be partial structures, devices, or method steps, or may be a complete solution. The technical proposal and the utility model concept are equivalent to or changed in accordance with the utility model, and the utility model is covered in the protection scope of the utility model.

Claims

1. The utility model provides a heat radiation structure, includes base (1), one side outer wall fixed mounting of base (1) has a plurality of heat dissipation monomer (3), a serial communication port, one side outer wall of base (1) has been seted up and has been used for placing mounting groove (7) of heat source, heat dissipation monomer (3) with mounting groove (7) are located the same side of base (1), heat dissipation monomer (3) are located mounting groove (7) are peripheral, heat dissipation monomer (3) are towards the top extension of mounting groove (7).

2. A heat dissipating structure according to claim 1, wherein a plurality of said heat dissipating monomers (3) are distributed in an array centered on said heat source.

3. The heat dissipation structure as defined in claim 1, wherein the heat dissipation unit (3) is in an arc plate shape, and the top of the base (1) is provided with a wire passing port (2).

4. A heat dissipation structure according to claim 1, wherein the bottom of the inner wall of the mounting groove (7) is fixedly provided with a plurality of fixing columns (5), and the top ends of the fixing columns (5) are in threaded connection with nuts (4).

5. A heat dissipation structure according to claim 4, wherein the heat source and the bottom of the inner wall of the mounting groove (7) are provided with a plurality of mounting holes (6).

6. A heat dissipation structure according to claim 1, wherein the bottom outer wall of the base (1) is fixedly provided with a heat conducting member (10), and the heat conducting member (10) is in a shape of being wider at the top and narrower at the bottom.

7. A heat dissipating structure according to claim 6, wherein the bottom of the heat conducting member (10) is provided with a flat surface (11).