CN219228233U - High-low temperature box for chip test - Google Patents
High-low temperature box for chip test Download PDFInfo
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- CN219228233U CN219228233U CN202223291120.0U CN202223291120U CN219228233U CN 219228233 U CN219228233 U CN 219228233U CN 202223291120 U CN202223291120 U CN 202223291120U CN 219228233 U CN219228233 U CN 219228233U
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Abstract
The utility model provides a high-low temperature box for chip test, wherein a first heat-conducting plate, a second heat-conducting plate and a central partition plate are arranged at the top of a bottom plate, the central partition plate is positioned between the first heat-conducting plate and the second heat-conducting plate, a first partition plate is arranged at one side of the top of the central partition plate, a heating or refrigerating electric element is started to generate corresponding gas according to the temperature in a collection device box, the gas in the device box is driven to flow through a ventilation device, the temperature in the device box is in a constant-temperature state, and the problem that the detection accuracy is affected when the box body of the traditional chip test device is in a high-temperature or low-temperature state is solved.
Description
Technical Field
The utility model relates to the technical field of chip testing equipment, in particular to a high-low temperature box for chip testing.
Background
One chip is finally finished on a terminal product, and generally needs to be subjected to links such as chip design, wafer manufacturing, wafer testing, packaging, finished product testing, board level packaging and the like. In the whole value chain, the dominant links required by chip companies are mainly chip design and test.
The existing chip test is to place a chip in a specified device for testing, the testing device of the chip adopts a box body, high temperature can be generated in the box body due to operation of an electric element in the process of chip test, the temperature in the box body of the testing device is too high, the temperature in the box body of the testing device can be reduced under the cold weather condition, the temperature in the testing device is too low, the temperature of the chip test can be influenced by the high temperature and the low temperature, and a high-low temperature box for chip test is developed for solving the problem.
Disclosure of Invention
The utility model aims to provide a high-low temperature box for chip test, which aims to solve the problem that the detection accuracy is affected when the box body of the conventional chip test device is in a high-temperature or low-temperature state.
The utility model provides a high-low temperature box for chip test, which comprises a first side wall, a top plate, a second side wall, a control device and a bottom plate, wherein one side of the top plate is connected with the first side wall, the second side wall is arranged on the other side of the top plate, and the bottom plate is arranged at the bottoms of the first side wall and the second side wall;
the bottom of the top plate is provided with a top vent hole, and the top vent hole comprises a first top vent hole, a second top vent hole and a third top vent hole;
the outer side wall of the first side wall is provided with a fresh air device;
the outer side wall of the second side wall is sequentially connected with a control device and a ventilation device in a screwed manner from top to bottom, and the top of the inner side wall of the second side wall is provided with a side wall ventilation hole;
the heat-conducting plate comprises a bottom plate, a first heat-conducting plate, a second heat-conducting plate and a central partition plate, wherein the first heat-conducting plate, the second heat-conducting plate and the central partition plate are arranged at the top of the bottom plate;
the first side wall, the top plate and the second side wall are internally provided with cavities, and the cavities in the first side wall, the top plate and the second side wall are inserted with a first guide pipe, a second guide pipe, a third guide pipe and a fourth guide pipe;
the first side wall inner side wall is positioned at the electric heating element and is provided with a second electric push rod baffle and a second connecting pipe, and the inlet end of the second connecting pipe is positioned at a vent after the second electric push rod baffle descends;
the inner side wall of the second side wall is positioned at the cold air device and is provided with a first electric push rod baffle plate and a first connecting pipe, and the inlet end of the first connecting pipe is positioned at a vent after the first electric push rod baffle plate descends;
the outlet end of the first connecting pipe is connected with the inlet end of a first conduit, the outlet end of the second connecting pipe is connected with the inlet end of a second conduit, the outlet end of the first conduit is connected with the first top vent hole, and the outlet end of the second conduit is connected with the third top vent hole;
the third conduit inlet end is connected with the fresh air device, the third conduit outlet end is connected with the second top vent hole, the fourth conduit inlet end is connected with the ventilation device, and the fourth conduit outlet end is connected with the side wall vent hole.
Further, a refrigerating device ventilating pipe is arranged at the position, opposite to the fresh air device, of the second side wall bottom.
Further, the second top vent is located in the middle of the top plate, and the third top vent and the first top vent are corresponding to each other with the second top vent as a middle.
Further, the first separator and the second separator are each provided with a vacuum layer.
The utility model has the following beneficial effects: the utility model provides a high-low temperature box for chip test, wherein a first heat-conducting plate, a second heat-conducting plate and a central partition plate are arranged at the top of a bottom plate, the central partition plate is positioned between the first heat-conducting plate and the second heat-conducting plate, a first partition plate is arranged at one side of the top of the central partition plate, a second partition plate is arranged at the other side of the top of the central partition plate, an electric heating element is arranged at the top of the first heat-conducting plate, a cold air device is arranged at the top of the second heat-conducting plate, when the temperature is higher than the preset temperature, a controller starts the cold air device, cold air generated by the cold air device enters the box through a first conduit, then a ventilation device is started by the controller, and the ventilation device drives air in the device to flow in an air suction way, through the temperature in the flow reduction device case that drives the air conditioning, when the temperature is less than the default, the controller starts the electric heating element, the steam that the electric heating element produced enters into the box through the second pipe, then the controller starts breather, breather drives the hot gas flow in the device through the mode of induced drafting, through the temperature in the flow promotion device case that drives hot gas, temperature sensor gathers temperature data transmission and stops the operation of above-mentioned electrical components after the controller accords with the default, use the temperature in the device case to be in constant temperature state, the problem that current chip testing arrangement box influences the detection accuracy under the state that is in high temperature or low temperature has been solved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic view of the appearance structure of the front view of a high-low temperature box for chip test.
Fig. 2 is a schematic structural diagram of a front view section of a high-low temperature box for chip testing according to the present utility model.
Fig. 3 is a schematic structural diagram of the high-low temperature box in fig. 1 a for chip test according to the present utility model.
Fig. 4 is a schematic structural diagram of the high-low temperature box for chip test shown in fig. 1 b.
Fig. 5 is a schematic structural diagram of the high-low temperature box for chip test in fig. 1 c.
Illustration of: 1. the first side wall, 2, top plate, 3, second side wall, 4, control device, 5, bottom plate, 6, fresh air device, 601, fresh air device housing, 602, fresh air device fan, 603, air filter tank, 7, first heat-conducting plate, 8, second heat-conducting plate, 9, test device, 10, first partition, 11, center partition, 12, second partition, 13, vacuum layer, 14, ventilator, 15, temperature sensor, 16, humidity sensor, 17, cold air device, 18, electric heating element, 19, first conduit, 20, top vent, 201, first top vent, 202, second top vent, 203, third top vent, 21, second conduit, 22, third conduit, 23, side wall vent, 24, fourth conduit, 25, refrigeration device vent, 26, first electric push rod baffle, 27, first connecting tube, 28, second connecting tube, 29, second electric push rod baffle.
Detailed Description
As shown in fig. 1 to 5, an embodiment of the present utility model provides a high-low temperature box for chip testing, which includes a first side wall 1, a top plate 2, a second side wall 3, a control device 4, and a bottom plate 5, wherein one side of the top plate 2 is connected with the first side wall 1, the second side wall 3 is mounted on the other side of the top plate 2, and the bottom plates 5 are mounted at the bottoms of the first side wall 1 and the second side wall 3;
a top vent hole 20 is installed at the bottom of the top plate 2, and the top vent hole 20 includes a first top vent hole 201, a second top vent hole 202, and a third top vent hole 203;
the new trend device 6 is installed to 1 lateral wall of first lateral wall, new trend device 6 is located 1 lateral wall of first lateral wall and adopts the mode of spiro union to be connected with first lateral wall 1, new trend device 6 is used for transporting new air flow in to the box, including new trend device shell 601 in the new trend device 6, new trend device fan 602 and air filter tank 603 are located new trend device shell 601, new trend device fan 602 brings new air into new trend device shell 601, new air filters through the filter material in the air filter tank 603, impurity such as dust in the air filters.
The outer side wall of the second side wall 3 is sequentially connected with a control device 4 and a ventilation device 14 in a screwed manner from top to bottom, and a side wall ventilation hole 23 is formed in the top of the inner side wall of the second side wall 3; the ventilator 14 includes a suction fan therein, and the ventilator 14 is configured to suck out air in the device box.
The top of the bottom plate 5 is provided with a first heat-conducting plate 7, a second heat-conducting plate 8 and a central partition plate 11, the central partition plate 11 is positioned between the first heat-conducting plate 7 and the second heat-conducting plate 8, one side of the top of the central partition plate 11 is provided with a first partition plate 10, the other side of the top of the central partition plate 11 is provided with a second partition plate 12, the top of the first heat-conducting plate 7 is provided with an electric heating element 18, and the top of the second heat-conducting plate 8 is provided with a cold air device 17; the central partition 11 is located in the first heat-conducting plate 7 and the second heat-conducting plate 8, the central partition 11 divides the device box into two separate space areas, the electric heating element 18 is used for generating heat, and the cold air device 17 is used for spraying cold air. The first heat-conducting plate 7 transfers heat generated by the electric heating element 18 to the base plate 5, the second heat-conducting plate 8 transfers heat generated by the cold air device 17 to the base plate 5, the bottom of the base plate 5 is in contact with air, and the base plate 5 radiates heat from the bottom.
The testing device 9 is arranged on the first heat-conducting plate 7, the second heat-conducting plate 8 and the central partition plate 11, the testing device 9 is electrically connected with the control device 4, the control device 4 is electrically connected with the fresh air device 6, the ventilation device 14, the air conditioning device 17, the electric heating element 18, the first electric push rod baffle 26 and the second electric push rod baffle 29, and a controller in the control device 4 is electrically connected with the temperature sensor 15 and the humidity sensor 16;
the temperature sensor 15 and the humidity sensor 16 transmit the collected temperature data and humidity data in the box to a controller in the control device 4.
The first side wall 1, the top plate 2 and the second side wall 3 are internally provided with cavities, and the cavities in the first side wall 1, the top plate 2 and the second side wall 3 are inserted with a first guide pipe 19, a second guide pipe 21, a third guide pipe 22 and a fourth guide pipe 24;
the inner side wall of the first side wall 1 is provided with a second electric push rod baffle 29 and a second connecting pipe 28 at the position of the electric heating element 18, and the inlet end of the second connecting pipe 28 is positioned at a vent after the second electric push rod baffle 29 descends; the second electric push rod baffle 29 is lowered under the drive of the electric push rod, hot air generated by the electric heating element 18 passes through the second electric push rod baffle 29 and generates a channel to enter the second guide pipe 21 after the electric push rod is lowered, and the hot air generated by the electric heating element 18 is transmitted to the second top vent hole 202 through the second guide pipe 21 and enters the device;
the cold air generated by the cold air device 17 enters the first duct 19 from the channel generated by the first electric push rod baffle 26 after being lowered, and the first duct 19 enters the cold air generated by the cold air device 17 into the device box through the first top vent 201.
The inner side wall of the second side wall 3 is provided with a first electric push rod baffle 26 and a first connecting pipe 27 at the position of the air conditioner 17, and the inlet end of the first connecting pipe 27 is positioned at a vent after the first electric push rod baffle 26 descends;
the outlet end of the first connecting pipe 27 is connected with the inlet end of the first conduit 19, the outlet end of the second connecting pipe 28 is connected with the inlet end of the second conduit 21, the outlet end of the first conduit 19 is connected with the first top vent 201, and the outlet end of the second conduit 21 is connected with the third top vent 203;
the inlet end of the third duct 22 is connected with the fresh air device 6, the outlet end of the third duct 22 is connected with the second top ventilation hole 202, the inlet end of the fourth duct 24 is connected with the ventilation device 14, and the outlet end of the fourth duct 24 is connected with the side wall ventilation hole 23. The gas in the device box is sucked out of the device box by the ventilator 14 through the fourth conduit 24.
Specifically, a refrigerating device ventilating pipe 25 is installed at a position where the bottom of the second side wall 3 is located opposite to the air conditioner 17 and the fresh air device 6. One end of the refrigerating device ventilating pipe 25 is positioned in the box body, the other end of the refrigerating device ventilating pipe 25 is positioned outside the box body, and the refrigerating device ventilating pipe 25 plays a role in ventilation.
Specifically, the second top vent 202 is located in the middle of the top plate 2, and the third top vent 203 and the first top vent 201 correspond to each other with the second top vent 202 therebetween.
Specifically, the first separator 10 and the second separator 12 are each provided with a vacuum layer 13. The vacuum layer 13 is used for playing a sound insulation effect, and the vacuum layer 13 is used for isolating noise generated by the air conditioner 17 and the electric heating element 18 at the bottom in the box body.
In embodiment 1, the temperature sensor 15 transmits the collected temperature data in the box to the controller in the control device 4, when the temperature is higher than the preset temperature, the controller starts the air conditioner 17, the air conditioner 17 generates cold air to enter the box through the first conduit 19, then the controller starts the air interchanger 14, the air interchanger 14 drives the air in the device to flow in an induced draft mode, the temperature in the box is reduced by driving the flow of the cold air, the temperature sensor 15 collects the temperature data and transmits the temperature data to the controller to meet the preset value, then the operation of the electrical components is stopped, and the temperature in the box is in a constant temperature state.
In embodiment 2, when the temperature is lower than the preset value, the controller starts the electric heating element 18, the hot air generated by the electric heating element enters the box body through the second conduit 21, then the controller starts the ventilation device 14, the ventilation device 14 drives the hot air in the device to flow in an induced draft mode, the temperature in the box body is lifted by driving the flow of the hot air, the temperature sensor 15 acquires temperature data and transmits the temperature data to the controller to meet the preset value, then the operation of the electric heating element is stopped, and the temperature in the box body of the device is in a constant temperature state.
The temperature sensor 15 transmits acquired temperature data in the box body to the controller in the control device 4, when the temperature is higher than a preset temperature, the controller starts the cold air device 17, cold air generated by the cold air device 17 enters the box body through the first conduit 19, then the controller starts the ventilation device 14, the ventilation device 14 drives gas in the box body to flow in an induced draft mode, the temperature in the box body is reduced by driving the flow of the cold air, when the temperature is lower than a preset value, the controller starts the electric heating element 18, hot gas generated by the electric heating element enters the box body through the second conduit 21, then the controller starts the ventilation device 14, the ventilation device 14 drives hot gas in the box body to flow in an induced draft mode, the temperature in the box body is lifted by driving the flow of the hot gas, the temperature sensor 15 acquires the temperature data to be transmitted to the controller to accord with the preset value, then the operation of the electric appliance element is stopped, and the temperature in the box body is in a constant temperature state, so that the temperature in the box body of the traditional chip testing device is in a constant temperature state or in a low temperature state, and the problem that the box body of the traditional chip testing device is in a high temperature or low temperature state is influenced is solved.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (4)
1. The high-low temperature box for chip test is characterized by comprising a first side wall (1), a top plate (2), a second side wall (3), a control device (4) and a bottom plate (5), wherein one side of the top plate (2) is connected with the first side wall (1), the second side wall (3) is arranged on the other side of the top plate (2), and the bottom plate (5) is arranged at the bottoms of the first side wall (1) and the second side wall (3);
a top vent (20) is arranged at the bottom of the top plate (2), and the top vent (20) comprises a first top vent (201), a second top vent (202) and a third top vent (203);
the outer side wall of the first side wall (1) is provided with a fresh air device (6);
the outer side wall of the second side wall (3) is sequentially connected with a control device (4) and a ventilation device (14) in a screwed manner from top to bottom, and a side wall ventilation hole (23) is formed in the top of the inner side wall of the second side wall (3);
the heat-conducting device comprises a base plate (5), a first heat-conducting plate (7), a second heat-conducting plate (8) and a central partition plate (11), wherein the central partition plate (11) is positioned between the first heat-conducting plate (7) and the second heat-conducting plate (8), a first partition plate (10) is arranged on one side of the top of the central partition plate (11), a second partition plate (12) is arranged on the other side of the top of the central partition plate (11), an electric heating element (18) is arranged on the top of the first heat-conducting plate (7), and a cold air device (17) is arranged on the top of the second heat-conducting plate (8);
the first side wall (1), the top plate (2) and the second side wall (3) are internally provided with cavities, and the cavities in the first side wall (1), the top plate (2) and the second side wall (3) are inserted with a first guide pipe (19), a second guide pipe (21), a third guide pipe (22) and a fourth guide pipe (24);
the inner side wall of the first side wall (1) is positioned at the electric heating element (18) and is provided with a second electric push rod baffle (29) and a second connecting pipe (28), and the inlet end of the second connecting pipe (28) is positioned at a vent after the second electric push rod baffle (29) descends;
the inner side wall of the second side wall (3) is positioned at the cold air device (17) and is provided with a first electric push rod baffle (26) and a first connecting pipe (27), and the inlet end of the first connecting pipe (27) is positioned at a vent after the first electric push rod baffle (26) descends;
the outlet end of the first connecting pipe (27) is connected with the inlet end of a first conduit (19), the outlet end of the second connecting pipe (28) is connected with the inlet end of a second conduit (21), the outlet end of the first conduit (19) is connected with the first top vent hole (201), and the outlet end of the second conduit (21) is connected with the third top vent hole (203);
the inlet end of the third conduit (22) is connected with the fresh air device (6), the outlet end of the third conduit (22) is connected with the second top ventilation hole (202), the inlet end of the fourth conduit (24) is connected with the ventilation device (14), and the outlet end of the fourth conduit (24) is connected with the side wall ventilation hole (23).
2. The high-low temperature box for chip testing according to claim 1, wherein the bottom of the second side wall (3) is located at a position opposite to the cold air device (17) and the fresh air device (6), and a ventilating pipe (25) of the refrigerating device is installed.
3. The high-low temperature box for chip testing according to claim 1, wherein the second top vent hole (202) is located in the middle of the top plate (2), and the third top vent hole (203) and the first top vent hole (201) correspond to each other with the second top vent hole (202) as a middle.
4. The high-low temperature box for chip testing according to claim 1, wherein the first partition board (10) and the second partition board (12) are provided with a vacuum layer (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223291120.0U CN219228233U (en) | 2022-12-08 | 2022-12-08 | High-low temperature box for chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223291120.0U CN219228233U (en) | 2022-12-08 | 2022-12-08 | High-low temperature box for chip test |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219228233U true CN219228233U (en) | 2023-06-20 |
Family
ID=86758857
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223291120.0U Active CN219228233U (en) | 2022-12-08 | 2022-12-08 | High-low temperature box for chip test |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219228233U (en) |
-
2022
- 2022-12-08 CN CN202223291120.0U patent/CN219228233U/en active Active
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