CN219227996U

CN219227996U - Multilayer flexible circuit board base plate overlaps pressurization heating device

Info

Publication number: CN219227996U
Application number: CN202320104229.4U
Authority: CN
Inventors: 胡立存
Original assignee: Shenzhen Lihua New Circuit Board Co ltd
Current assignee: Shenzhen Lihua New Circuit Board Co ltd
Priority date: 2023-02-03
Filing date: 2023-02-03
Publication date: 2023-06-20
Anticipated expiration: 2033-02-03

Abstract

The utility model discloses a multilayer flexible circuit board substrate overlapping pressurizing and heating device, which relates to the field of flexible circuit boards and comprises a heating box and a heating base, wherein a pressurizing assembly for uniformly pressurizing is arranged in the middle of the upper end of the heating box, the pressurizing assembly comprises a hydraulic cylinder, a connecting plate, a pressurizing plate and a heating rod, the connecting plate is arranged at the lower end of the hydraulic cylinder, the pressurizing plate is arranged at the lower end of the connecting plate, the heating rod is arranged on the inner surface of the connecting plate, and weighting blocks are arranged at the left and right of the upper end of the connecting plate. This multilayer flexible line way board base plate overlap pressurization heating device adopts the setting of clean subassembly can clean its inside after the inside use of heating cabinet is finished, avoids the residue to adsorb on flexible line way board base plate when using like this, and pressurization subassembly, heating base and heating backing plate's setting can make flexible line way board base plate be heated more evenly when the heating simultaneously, avoids the phenomenon that the flexible line way board base plate damaged to appear in the heating process.

Description

Multilayer flexible circuit board base plate overlaps pressurization heating device

Technical Field

The utility model relates to the technical field of flexible circuit boards, in particular to a multilayer flexible circuit board substrate overlapping pressurizing and heating device.

Background

The flexible circuit board is also called a flexible circuit board, a flexible printed circuit board and the like, has the characteristics of high wiring density, light weight and the like, and can be divided into a single-layer board, a double-layer board, a multi-layer board, a double-layer board and the like, wherein the multi-layer flexible circuit board is formed by firmly bonding and superposing a plurality of layers of single-layer flexible circuit boards through adding adhesive between the single-layer flexible circuit boards and then through compound hot pressing generated by a heating device.

The multilayer flexible circuit board base plate in the market is in the inhomogeneous phenomenon of being heated easily appears in each part of flexible circuit board in the heating process, easily leads to the flexible circuit board to appear the damage in the heating process like this, reduces flexible circuit board's production quality and production efficiency.

Accordingly, in view of the above, an improvement has been made in view of the conventional structure and defects, and a multilayer flexible wiring board substrate laminating and pressurizing heating device is provided.

Disclosure of Invention

The utility model aims to provide a multilayer flexible circuit board substrate overlapping pressurizing and heating device so as to solve the problems in the background technology.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a multilayer flexible line way board base plate overlap pressurization heating device, includes heating cabinet and heating base, the upper end middle part of heating cabinet is provided with the pressurization subassembly that is used for even pressurization, and the pressurization subassembly includes hydraulic cylinder, joint board, pressurization board and heating rod, hydraulic cylinder's lower extreme is provided with the joint board, and the lower extreme of joint board is provided with the pressurization board, the internal surface of joint board is provided with the heating rod, be provided with the weight about the upper end of joint board, and the upper end of weight is provided with electric telescopic handle, the heating base sets up in the inside lower extreme of heating cabinet, and the internal surface of heating base is provided with the heating backing plate, the upper end of heating base is provided with places the board, and places the inside left and right sides of board and be provided with the auxiliary assembly that is used for smoothing superimposed sheet.

Further, the auxiliary assembly comprises a motor, a sliding rod and a sliding block, wherein the sliding rod is arranged at the output end of the motor, and the sliding block is arranged on the surface of the sliding rod.

Further, the auxiliary assembly further comprises a moving rod and a pacifying plate, the moving rod is arranged between the two sliding blocks, and the pacifying plate is arranged on the surface of the moving rod.

Further, the front end surface of the heating box is provided with a box door, and the left side of the heating box is provided with a cleaning component for cleaning the heating box.

Further, clean subassembly includes dust storage tank, air pump, transmission pipeline and dust absorption portion, the internal surface of dust storage tank is provided with the air pump, and the upper end of dust storage tank is connected with dust absorption portion through transmission pipeline.

Further, the right side of hydraulic cylinder is provided with the refrigeration subassembly that is used for rapid cooling, the front end surface of chamber door is provided with the visual window.

Further, the refrigeration assembly comprises a water storage tank, a connecting pipeline and a liquid pump, wherein the connecting pipeline is arranged on the right side of the water storage tank, and the liquid pump is arranged on the surface of the connecting pipeline.

Further, the refrigeration subassembly still includes refrigeration case, linking pipeline, receiving frame and fan, the right side of connecting pipeline is provided with the refrigeration case, and the right side of refrigeration case is connected with the receiving frame through linking pipeline, the surface of receiving frame is provided with the fan.

The utility model provides a multilayer flexible circuit board substrate overlapping pressurizing and heating device, which has the following beneficial effects: this multilayer flexible line way board base plate overlaps pressurization heating device adopts clean subassembly's setting to clean its inside after the inside use of heating cabinet is finished, avoids the residue to adsorb on flexible line way board base plate like this when using, and the flexible line way board base plate is heated more evenly when heating to the setting of pressurization subassembly, heating base and heating backing plate simultaneously, avoids the phenomenon that flexible line way board base plate damaged to appear in the heating process, then the setting of refrigeration subassembly is used and is needed to come out it when carrying out it after the heating, avoids the waste heat to cause it to appear scalding.

1. The pressurizing assembly can be adjusted by driving the connecting plate through the electric telescopic rod when the flexible circuit board substrate is placed on the heating base plate, when the pressurizing plate contacts the heating base plate, the connecting plate is contacted with the heating base, then the weight is added to improve the bonding degree between the connecting plate and the heating base, then the circuit board can be heated through the arrangement of the heating base and the heating rod, and the acting force generated by the hydraulic cylinder can promote the pressurizing plate to form downward acting force, so that the flexible circuit board substrate is uniformly heated, and the phenomenon of uneven heating is avoided.

2. According to the utility model, the auxiliary assembly drives the sliding rod to rotate through the motor when the flexible circuit board substrate is placed on the heating backing plate in the using process, the sliding block drives the moving rod to slide along the sliding rod in the rotating process, and then the smoothing plate is regulated in the sliding process, so that the smoothing plate can smooth the flexible circuit board substrate, the later heating of a user is facilitated, the using efficiency of the device is improved, the cleaning assembly can promote the dust suction part to absorb dust inside after the heating box is used, and thus the dust can be transmitted into the dust storage box along the transmission pipeline, the dust inside the heating box is processed for cleaning, and the dust can be effectively prevented from adhering to the flexible circuit board substrate, so that the processing of the flexible circuit board substrate is influenced.

3. The water resource in the water storage tank can be transmitted to the inside of the refrigerating box through the liquid pump after the flexible circuit board substrate is processed, cold air generated during refrigerating can be transmitted to the inside of the receiving frame through the fan after the water resource passes through the inside of the refrigerating box, and then the receiving frame transmits the cold air to the inside of the heating box, so that the temperature in the heating box is reduced, and the phenomenon that a user scalds when taking the water resource is avoided.

Drawings

FIG. 1 is a schematic diagram of the overall structure of a multilayer flexible circuit board substrate overlapping pressurizing and heating device according to the present utility model;

FIG. 2 is a schematic diagram of the internal structure of a heating box of the multilayer flexible circuit board substrate overlapping pressurizing and heating device;

fig. 3 is a schematic top view of a placement board of the multilayer flexible circuit board substrate overlapping pressurizing and heating device according to the present utility model.

Fig. 4 is a schematic perspective view of a smoothing plate of a multilayer flexible circuit board substrate overlapping pressurizing and heating device.

In the figure: 1. a heating box; 2. a door; 3. a cleaning assembly; 301. a dust storage box; 302. an air pump; 303. a transmission pipeline; 304. a dust collection part; 4. a visual window; 5. a refrigeration assembly; 501. a water storage tank; 502. a connecting pipe; 503. a liquid pump; 504. a refrigeration box; 505. connecting pipelines; 506. a receiving frame; 507. a fan; 6. a pressurizing assembly; 601. a hydraulic cylinder; 602. a splice plate; 603. a pressurizing plate; 604. a heating rod; 7. an electric telescopic rod; 8. weighting blocks; 9. heating the base; 10. placing a plate; 11. an auxiliary component; 1101. a motor; 1102. a slide bar; 1103. a slide block; 1104. a moving rod; 1105. a pacifying plate; 12. and heating the backing plate.

Description of the embodiments

Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.

As shown in FIG. 1, a multilayer flexible circuit board substrate overlapping pressurization heating device, including heating cabinet 1 and heating base 9, the front end surface of heating cabinet 1 is provided with chamber door 2, and the left side of heating cabinet 1 is provided with the clean subassembly 3 that is used for cleaning heating cabinet 1, clean subassembly 3 includes dust storage tank 301, air pump 302, transmission pipeline 303 and dust absorption portion 304, the internal surface of dust storage tank 301 is provided with air pump 302, and the upper end of dust storage tank 301 is connected with dust absorption portion 304 through transmission pipeline 303, clean subassembly 3 is after using in heating cabinet 1, can promote dust absorption portion 304 to absorb inside through air pump 302, so that the dust can be along transmission pipeline 303 to dust storage tank 301, make its inside dust of processing heating cabinet 1 clean, so can effectively avoid the dust adhesion on flexible circuit board substrate, thereby influence the processing of flexible circuit board substrate, the right side of hydraulic cylinder 601 is provided with refrigeration subassembly 5 that is used for rapid cooling, refrigeration subassembly 5 includes 501, connecting pipeline 502 and pump 503, the right side of connecting pipeline 502 is provided with connecting pipeline 502, and pump 506 connecting pipeline 502, and fan 506 connecting the surface of cooling box 506 is provided with cooling box 506, which can be connected with water storage tank 502 through fan 506, the inside cooling box 506 is provided with cooling box surface 506, and fan 506 is connected to the inside cooling box 502, which can be connected with cooling box surface 506, which is connected with cooling box 5, can be connected with cooling box surface 506 through fan 506, and fan 506 is provided in the inside cooling box, and cooling box 506 is connected with cooling box, and refrigerating box 506, can be connected with a cooling box 506, and refrigerating box 506, and 506 is provided. After passing through the inside of the refrigerating box 504, the cooling air generated during refrigeration can be transmitted to the inside of the receiving frame 506 along the connecting pipeline 505, and then the receiving frame 506 transmits the cooling air to the inside of the heating box 1, so that the temperature inside the heating box 1 is reduced, and the phenomenon that a user scalds during taking is avoided.

As shown in fig. 2, 3 and 4, a pressurizing assembly 6 for uniformly pressurizing is provided in the middle of the upper end of the heating box 1, and the pressurizing assembly 6 includes a hydraulic cylinder 601, a joint plate 602, a pressurizing plate 603 and a heating rod 604, the lower end of the hydraulic cylinder 601 is provided with a joint plate 602, the lower end of the joint plate 602 is provided with a pressurizing plate 603, the inner surface of the joint plate 602 is provided with a heating rod 604, the upper end of the joint plate 602 is provided with a weighting block 8 on the left and right sides, the upper end of the weighting block 8 is provided with an electric telescopic rod 7, a heating base 9 is provided at the inner lower end of the heating box 1, and the inner surface of the heating base 9 is provided with a heating pad 12, the pressurizing assembly 6 can be adjusted by driving the joint plate 602 through the electric telescopic rod 7 when the flexible circuit board substrate is placed on the heating pad 12, the joint plate 602 and the heating base 9 are contacted when the pressurizing plate 603 contacts the heating pad 12, then the weight 8 is added to improve the bonding degree between the two, then the circuit board can be heated through the arrangement of the heating base 9 and the heating rod 604, at this time, the acting force generated by the hydraulic cylinder 601 can promote the pressing plate 603 to form downward acting force so as to uniformly heat the circuit board, the phenomenon of uneven heating is avoided, the upper end of the heating base 9 is provided with the placing plate 10, the left side and the right side of the interior of the placing plate 10 are provided with the auxiliary components 11 for flattening the overlapped plate, the auxiliary components 11 comprise a motor 1101, a slide bar 1102 and a slide block 1103, the output end of the motor 1101 is provided with the slide bar 1102, the surface of the slide bar 1102 is provided with the slide block 1103, the auxiliary components 11 also comprise a moving rod 1104 and a flattening plate 1105, the moving rod 1104 is arranged between the two slide blocks 1103, the surface of the moving rod 1104 is provided with the flattening plate 1105, the auxiliary assembly 11 drives the sliding rod 1102 to rotate through the motor 1101 when the flexible circuit board substrate is placed on the heating base plate 12 in the using process, the sliding rod 1104 is driven by the sliding block 1103 to slide along the sliding rod 1102 in the rotating process, and then the sliding plate 1105 is regulated in the sliding process, so that the flexible circuit board substrate can be smoothed by the smoothing plate 1105, the later heating of a user is facilitated, and the using efficiency of the device is improved.

In summary, when the multi-layer flexible circuit board substrate overlapping pressurizing and heating device is used, firstly, according to the structures shown in fig. 1, 2, 3 and 4, a user can hold the box door 2 to open the heating box 1 in the pressurizing process of production, after opening, the user places the flexible circuit board substrate on the heating pad 12, then when the flexible circuit board substrate is placed above, the control terminal can be used for promoting the motor 1101 (model is YE 2) to work, the motor 1101 can be used for promoting the sliding rod 1102 to operate, the sliding rod 1102 can be used for driving the moving rod 1104 to slide up and down through the sliding block 1103 in the operating process, meanwhile, the sliding block 1103 and the moving rod 1104 are in bolt connection, at the moment, when the user continuously stacks the flexible circuit board substrate, the user can smooth the flexible circuit board substrate through the smoothing plate 1105, after the door 2 is smoothed, the user can close the door 2, then the user can drive the electric telescopic rod 7 to drive the joint plate 602 to downwards adjust through the control terminal, in the downwards adjust process, the joint plate 602 and the heating base 9 can be combined and contacted, thus the weight 8 can drive the joint plate 602 and the heating base 9 to be more attached, then after the joint plate 602 and the heating base 9 are attached, the user can drive the hydraulic cylinder 601 to work through the control terminal, the acting force generated by the hydraulic cylinder 601 can drive the pressing plate 603 to downwards pressurize, then the uniformly distributed heating rods 604 in the pressurizing process can drive the flexible circuit board substrate to heat more uniformly, meanwhile, in the heating process, the control terminal can drive the air pump 302 to work, the acting force generated by the air pump 302 in working can be transmitted to the dust collection part 304 along the transmission pipeline 303, at this moment, the dust collection part 304 can transmit the dust inside the heating box 1 to the inside of the dust storage box 301 along the transmission pipeline 303, thereby effectively avoiding the dust inside from adhering to the flexible circuit board substrate in the heating process, thereby causing disqualification in production, then when the flexible circuit board substrate needs to be taken out by a user after heating, the water resource inside the water storage box 501 can be transmitted to the inside of the refrigerating box 504 along the connection pipeline 502 by the liquid pump 503 (model A816), at this moment, the control terminal can prompt the refrigerating block inside the refrigerating box 504 to cool down and agglomerate the water, so that the cold air generated in the agglomerating process can be transmitted to the receiving frame 506 along the connection pipeline 505 by the fan 507, at this moment, the pipeline transmits the cold air inside the receiving frame 506 to the heating box 1, thereby realizing rapid cooling, and avoiding the scalding phenomenon.

The embodiments of the utility model have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

Claims

1. The utility model provides a multilayer flexible line way board base plate overlap pressurization heating device, includes heating cabinet (1) and heating base (9), its characterized in that, the upper end middle part of heating cabinet (1) is provided with pressurization subassembly (6) that are used for even pressurization, and pressurization subassembly (6) are including hydraulic cylinder (601), linking board (602), pressurization board (603) and heating rod (604), the lower extreme of hydraulic cylinder (601) is provided with linking board (602), and the lower extreme of linking board (602) is provided with pressurization board (603), the internal surface of linking board (602) is provided with heating rod (604), the upper end of linking board (602) is provided with weight (8) about, and the upper end of weighting piece (8) is provided with electric telescopic handle (7), heating base (9) set up in the inside lower extreme of heating cabinet (1), and the internal surface of heating base (9) is provided with heating backing plate (12), the upper end of heating base (9) is provided with places board (10), and places the inside left and right sides of board (10) and is provided with auxiliary assembly (11) that are used for the flat stack.

2. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 1, wherein the auxiliary assembly (11) comprises a motor (1101), a sliding rod (1102) and a sliding block (1103), the output end of the motor (1101) is provided with the sliding rod (1102), and the surface of the sliding rod (1102) is provided with the sliding block (1103).

3. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 2, wherein the auxiliary assembly (11) further comprises a moving rod (1104) and a smoothing plate (1105), the moving rod (1104) is arranged between the two sliding blocks (1103), and the smoothing plate (1105) is arranged on the surface of the moving rod (1104).

4. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 1, wherein a front end surface of the heating box (1) is provided with a box door (2), and a cleaning assembly (3) for cleaning the heating box (1) is provided on the left side of the heating box (1).

5. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 4, wherein the cleaning assembly (3) comprises a dust storage box (301), an air pump (302), a transmission pipeline (303) and a dust collection part (304), the air pump (302) is arranged on the inner surface of the dust storage box (301), and the upper end of the dust storage box (301) is connected with the dust collection part (304) through the transmission pipeline (303).

6. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 4, wherein a refrigerating component (5) for rapid cooling is arranged on the right side of the hydraulic cylinder (601), and a visual window (4) is arranged on the front end surface of the box door (2).

7. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 6, wherein the refrigerating assembly (5) comprises a water storage tank (501), a connecting pipeline (502) and a liquid pump (503), the connecting pipeline (502) is arranged on the right side of the water storage tank (501), and the liquid pump (503) is arranged on the surface of the connecting pipeline (502).

8. The multilayer flexible circuit board substrate overlapping pressurizing and heating device according to claim 7, wherein the refrigerating assembly (5) further comprises a refrigerating box (504), a connecting pipeline (505), a receiving frame (506) and a fan (507), the refrigerating box (504) is arranged on the right side of the connecting pipeline (502), the receiving frame (506) is connected to the right side of the refrigerating box (504) through the connecting pipeline (505), and the fan (507) is arranged on the surface of the receiving frame (506).