CN219224907U - Alloy bar test probe structure - Google Patents

Alloy bar test probe structure Download PDF

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Publication number
CN219224907U
CN219224907U CN202223363677.0U CN202223363677U CN219224907U CN 219224907 U CN219224907 U CN 219224907U CN 202223363677 U CN202223363677 U CN 202223363677U CN 219224907 U CN219224907 U CN 219224907U
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wall
probe
alloy
cover
sleeve
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CN202223363677.0U
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李越
王俊
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Jiaxing Weigou Electronic Technology Co ltd
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Jiaxing Weigou Electronic Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E30/00Energy generation of nuclear origin
    • Y02E30/30Nuclear fission reactors

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Abstract

The utility model relates to the field of alloy rod bodies, in particular to an alloy rod test probe structure, which comprises a sleeve, a probe, an alloy rod body, a heat dissipation mechanism and a buffer mechanism, wherein the buffer mechanism comprises balls and an elastic telescopic component, the bottom of the sleeve is in threaded connection with a pipe cover, a baffle ring is fixedly arranged on the outer wall of the bottom of the sleeve, the alloy rod body is inserted into the pipe cover, the probe is fixedly arranged at the bottom of the alloy rod body, a sliding column is in threaded connection with the top of the alloy rod body, the balls are rotatably arranged at the top of the sliding column, the elastic telescopic component is arranged in the sleeve, the heat dissipation mechanism comprises a silica gel sleeve and a mounting component, and the mounting component is sleeved on the outer wall of the silica gel sleeve.

Description

Alloy bar test probe structure
Technical Field
The utility model relates to the field of alloy rod bodies, in particular to an alloy rod test probe structure.
Background
The test probe, K-50-QG wireless router test, is a test connection electronic element applied to test PCBA in electronic test. The types of the test probes include PCB probes, ICT function test probes (automobile harness test probes, battery pins, current-voltage pins, switch pins, capacitance polarity pins, high-frequency pins), BGA test probes, and the like. Depending on the place of production, there are classified into a U.S. QA probe, a U.S. ECT probe, a U.S. IDI probe, etc., a Germany INGUN probe, a Germany PTR probe, etc., a Korean LEENON probe, a Taiwan CCP Chinese probe, a Taiwan UC blessing probe, etc.
The existing probe structure has the following defects:
1. the needle tube of the probe is of a sealed shell structure, heat can be generated in the testing process of the probe, the heat cannot be dissipated through the probe to the needle tube, faults are easy to occur, and therefore the service life of the probe is reduced.
2. Most of the existing probe ends are of sharp structures, and chips are easily scratched during testing, so that loss is caused.
Disclosure of Invention
The utility model aims to provide an alloy bar test probe structure.
To achieve the purpose, the utility model adopts the following technical scheme:
the utility model provides an alloy rod test probe structure, which comprises a sleeve, still include the probe, the alloy stick body, heat dissipation mechanism and buffer gear, buffer gear establishes in sheathed tube inside, buffer gear includes ball and elastic expansion assembly, sheathed tube bottom threaded connection has the tube cap, fixed being equipped with the baffle ring on sheathed tube bottom outer wall, the alloy stick body inserts the inside of establishing at the tube cap, the probe is fixed to be established in the bottom of closing tight stick body, the top threaded connection of alloy stick body has the traveller, the ball rotates the top of setting at the traveller, elastic expansion assembly establishes in sheathed tube inside, heat dissipation mechanism establishes in the bottom of tube cap, heat dissipation mechanism includes silica gel cover and installation component, the silica gel cover is established on the outer wall of alloy stick body, the installation component cover is established on the outer wall of silica gel cover.
Preferably, the elastic telescopic component comprises a buffer spring, a mounting cover and a limiting cap, wherein the limiting cap is attached to the top of the ball, a through hole is formed in the sleeve, the mounting cover is fixedly arranged on the inner wall of the through hole, and the buffer spring is arranged between the mounting cover and the limiting cap.
Preferably, the top of the sliding column is symmetrically provided with two sliding blocks, the inner wall of the through hole is symmetrically provided with two sliding grooves, each sliding block is in sliding connection with one sliding groove, the bottom of the sliding column is of an oblique angle structure, and the inner wall of the pipe cover is provided with a chute attached to the oblique angle structure.
Preferably, the installation component includes spacing post and needle tubing, and the bottom at the tube cap is established to spacing post is fixed, and alloy stick body and spacing post grafting, the needle pipe cover is established on the outer wall of spacing post.
Preferably, the outer wall of the limit post is provided with a positioning hole, the outer wall of the needle tube is provided with a positioning bolt, and the positioning bolt is in threaded connection with the positioning hole.
Preferably, a plurality of heat dissipation holes are arranged on the outer wall of the needle tube at equal intervals.
Preferably, the probe is of a cylindrical structure, and the bottom end of the probe is of a round corner structure.
Preferably, the top of the sleeve is provided with an interface, and the inner wall of the sliding column is provided with a round hole for the lead to pass through.
The utility model has the beneficial effects that:
1. according to the utility model, the outer wall of the alloy rod body is sleeved with the silica gel sleeve, and the outer wall of the needle tube is provided with the plurality of heat dissipation holes, so that in the process of testing the chip by the probe, heat generated by the end part of the probe is transferred to the alloy rod body.
2. According to the utility model, the elastic telescopic assembly is designed, namely the buffer spring, the mounting cover and the limiting cap, when the probe is driven to ascend once through the tight-closing rod body, the ball at the top of the sliding column is abutted against the limiting cap, and the buffer spring is arranged between the mounting cover and the limiting cap, so that the buffer spring is contracted once under the limiting effect of the mounting cover, a buffer effect is achieved, and the chip is prevented from being fractured due to overlarge contact force of the probe.
3. According to the utility model, the probe is designed into a cylindrical structure, and the bottom end of the probe is designed into a round corner structure, so that the contact area between the end of the probe and a chip is increased, the pressure intensity is reduced, the chip can be effectively prevented from being scratched, and the product is protected during testing.
4. According to the alloy bar test probe structure, each part such as the sealing cover, the needle tube, the sleeve and the alloy bar body is designed to be of a detachable structure, so that on one hand, the alloy bar test probe structure is convenient and quick to install, and on the other hand, when a part is damaged, the whole probe can be timely detached and replaced without discarding the whole probe, the maintenance efficiency is improved, and the use cost is reduced.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present utility model, the following description briefly describes the drawings in the embodiments of the present utility model.
FIG. 1 is a schematic perspective view of the present utility model;
fig. 2 is an enlarged view at a in fig. 1;
FIG. 3 is a plan cross-sectional view of the present utility model;
FIG. 4 is an enlarged view at B in FIG. 3;
FIG. 5 is an enlarged view at C in FIG. 3;
in the figure: the device comprises a sleeve 1, a probe 2, an alloy rod body 3, a heat dissipation mechanism 4, a buffer mechanism 5, a ball 6, an elastic telescopic assembly 7, a pipe cover 8, a baffle ring 9, a sliding column 10, a silica gel sleeve 11, a mounting assembly 12, a buffer spring 13, a mounting cover 14, a limit cap 15, a sliding block 16, a sliding chute 17, a limit column 18, a needle tube 19, a positioning hole 20, a positioning bolt 21, a heat dissipation hole 22 and an interface 23.
Detailed Description
The technical scheme of the utility model is further described below by the specific embodiments with reference to the accompanying drawings.
Wherein the drawings are for illustrative purposes only and are shown in schematic, non-physical, and not intended to be limiting of the present patent; for the purpose of better illustrating embodiments of the utility model, certain elements of the drawings may be omitted, enlarged or reduced in size and do not represent the actual product dimensions.
Referring to the alloy rod test probe structure shown in fig. 1-5, including sleeve 1, still include probe 2, alloy body 3, cooling body 4 and buffer body 5, buffer body 5 establishes in the inside of sleeve 1, buffer body 5 includes ball 6 and elastic telescopic assembly 7, sleeve 1's bottom threaded connection has tube cap 8, fixed baffle ring 9 that is equipped with on sleeve 1's the bottom outer wall, alloy body 3 inserts and establishes in tube cap 8's inside, probe 2 is fixed to be established in closing tight body's bottom, alloy body 3's top threaded connection has slide column 10, ball 6 rotates the top that sets up at slide column 10, elastic telescopic assembly 7 establishes in sleeve 1's inside, cooling body 4 establishes in tube cap 8's bottom, cooling body 4 includes silica gel cover 11 and installation component 12, silica gel cover 11 cover is established on alloy body 3's outer wall, installation component 12 cover is established on silica gel cover 11's outer wall.
The elastic telescopic assembly 7 comprises a buffer spring 13, a mounting cover 14 and a limiting cap 15, wherein the limiting cap 15 is attached to the top of the ball 6, a through hole is formed in the sleeve 1, the mounting cover 14 is fixedly arranged on the inner wall of the through hole, the buffer spring 13 is arranged between the mounting cover 14 and the limiting cap 15, when the probe 2 is driven to rise once through the tight rod body, the ball 6 at the top of the sliding column 10 is abutted to the limiting cap 15, and the buffer spring 13 is arranged between the mounting cover 14 and the limiting cap 15, the mounting cover 14 is fixedly connected with the inner wall of the through hole, so that the buffer spring 13 is contracted once under the limiting effect of the mounting cover 14, a buffer effect is achieved, and the contact force of the probe 2 is prevented from being excessively large to fracture a chip.
The top of the slide column 10 is symmetrically provided with two sliding blocks 16, the inner wall of the through hole is symmetrically provided with two sliding grooves 17, each sliding block 16 is in sliding connection with one sliding groove 17, the bottom of the slide column 10 is of an oblique angle structure, the inner wall of the pipe cover 8 is provided with a chute attached to the oblique angle structure, in the test process of the probe 2, when the probe 2 is extruded by a chip, the probe 10 is in threaded connection with the other end of the tight rod body due to the fact that the bottom of the probe 2 is fixedly connected with the bottom of the alloy rod body 3, and because the top of the slide column 10 is fixedly provided with two sliding blocks 16, each sliding block 16 is in sliding connection with one sliding groove 17, and under the limiting effect of the chute, the probe 2 is driven to rise once through the tight rod body.
The installation component 12 includes spacing post 18 and needle tubing 19, spacing post 18 is fixed to be established in the bottom of tube cap 8, alloy barred body 3 and spacing post 18 grafting, the needle tubing 19 cover is established on the outer wall of spacing post 18, when this probe 2 is installed, firstly, insert the inside of buffer spring 13 makes its overhang in the through-hole inside with the upper end of installation lid 14, then insert the bottom inner circle of buffer spring 13 with the top of spacing cap 15, then insert two sliders 16 along its top in two spouts 17 on the through-hole inner wall with the smooth post 10, and make ball 6 outer wall and the bottom of spacing cap 15 paste tightly, thereby realize peg graft of smooth post 10 and sleeve 1, then pack it into the bottom periphery of sleeve 1 through rotatory tube cap 8, until the top of tube cap 8 is laminated with baffle ring 9 and is promptly showing tube cap 8 to put into place, then with the vertical inside of inserting the needle tubing 19 of silica gel cover 11, then on the outer wall of spacing post 18 is overlapped to needle tubing 19, then screw in the inside of locating bolt 21 into locating hole 20 and realize 19, because the bottom thread connection of closing the smooth post 10 and finally, close the body and pass through tube cap 8, and the whole bottom of tube cap 2 and the whole probe that is screwed in proper order.
The outer wall of the limit post 18 is provided with a positioning hole 20, the outer wall of the needle tube 19 is provided with a positioning bolt 21, and the positioning bolt 21 is in threaded connection with the positioning hole 20.
The equidistant a plurality of louvres 22 that are provided with on needle tubing 19's the outer wall, in probe 2 carries out the test procedure to the chip, on the alloy stick body 3 of heat transfer that probe 2 tip produced, because silica gel cover 11 is direct the cover on closing tight stick body outer wall, again because silica gel cover 11 has good heat conductivity and insulativity, so can be when preventing the electric leakage will close the heat on the tight stick body and follow a plurality of louvres 22 and export, play the radiating effect, and then reduce probe 2's working heat, prevent that it from producing the trouble because of the heat is too high, and then be favorable to prolonging its life.
The probe 2 is of a cylindrical structure, the bottom end of the probe 2 is of a round corner structure, the end part of the existing probe 2 is of a sharp structure, a chip is scratched easily during testing, loss is caused, the probe 2 is designed into the cylindrical structure, the bottom end of the probe 2 is designed into the round corner structure, the contact area between the end part of the probe 2 and the chip is increased, the pressure intensity is reduced, the chip can be effectively prevented from being scratched, and the effect of protecting the product is achieved during testing.
The interface 23 has been seted up at the top of sleeve pipe 1, is equipped with the round hole that supplies the wire to pass on the inner wall of traveller 10, and interface 23 conveniently is to the inside switch-on wire of sleeve pipe 1, and the round hole makes things convenient for the wire to pass traveller 10 to the circular telegram of alloy stick body 3 to probe 2 circular telegram reaches the effect of detecting the chip.
The working principle of the utility model is as follows: when the probe 2 is installed, firstly, the upper end of the buffer spring 13 is inserted into the installation cover 14 to enable the buffer spring to hang in a through hole, then the top of the limit cap 15 is inserted into the bottom inner ring of the buffer spring 13, then the sliding column 10 is inserted into two sliding grooves 17 on the inner wall of the through hole along two sliding blocks 16 at the top of the sliding column, the outer wall of the ball 6 is tightly attached to the bottom of the limit cap 15, so that the sliding column 10 and the sleeve 1 are inserted, then the pipe cover 8 is installed on the periphery of the bottom of the sleeve 1 through rotation, until the top of the pipe cover 8 is attached to the baffle ring 9, the pipe cover 8 is installed in place, then the silica gel sleeve 11 is vertically inserted into the needle tube 19, then the needle tube 19 is sleeved on the outer wall of the limit column 18, then the positioning bolt 21 is screwed into the positioning hole 20 to fix the needle tube 19, and finally the closing rod body sequentially passes through the silica gel sleeve 11, the limit column 18 and the bottom of the pipe cover 8 and the sliding column 10 due to the fact that the top of the closing rod body is screwed tightly.
In the test process of the probe 2, when the probe 2 is extruded by a chip, the probe 2 is fixedly connected with the bottom of the alloy rod body 3, the sliding column 10 is in threaded connection with the other end of the tight rod body, and two sliding blocks 16 are fixedly designed at the top of the sliding column 10, each sliding block 16 is in sliding connection with one sliding groove 17, and the probe 2 is driven to rise once through the tight rod body under the limiting effect of the sliding groove.
When the probe 2 is driven to rise once through the tight rod body, the ball 6 at the top of the sliding column 10 is abutted against the limit cap 15, and the buffer spring 13 is arranged between the mounting cover 14 and the limit cap 15, so that the mounting cover 14 is fixedly connected with the inner wall of the through hole, the buffer spring 13 is contracted once under the limit action of the mounting cover 14, a buffer effect is achieved, and the chip is prevented from being broken due to overlarge contact force of the probe 2.
In the process of testing the chip by the probe 2, heat generated at the end part of the probe 2 is transferred to the alloy rod body 3, and because the silica gel sleeve 11 is directly sleeved on the outer wall of the tight rod body, and because the silica gel sleeve 11 has good heat conductivity and insulativity, the heat on the tight rod body can be led out from the plurality of heat dissipation holes 22 while electric leakage is prevented, the heat dissipation effect is achieved, the working heat of the probe 2 is further reduced, faults caused by overhigh heat are prevented, and the service life of the probe is further prolonged.
In the process of testing the chip by the probe 2, heat generated at the end part of the probe 2 is transferred to the alloy rod body 3, and because the silica gel sleeve 11 is directly sleeved on the outer wall of the tight rod body, and because the silica gel sleeve 11 has good heat conductivity and insulativity, the heat on the tight rod body can be led out from the plurality of heat dissipation holes 22 while electric leakage is prevented, the heat dissipation effect is achieved, the working heat of the probe 2 is further reduced, faults caused by overhigh heat are prevented, and the service life of the probe is further prolonged.
The interface 23 facilitates the connection of wires into the sleeve 1, and the round holes facilitate the wires to pass through the slide column 10 to electrify the alloy rod body 3, so that the probe 2 is electrified, and the effect of detecting a chip is achieved.

Claims (8)

1. The utility model provides an alloy rod test probe structure, includes sleeve pipe (1), its characterized in that: still include probe (2), alloy body (3), cooling body (4) and buffer gear (5), the inside at sleeve pipe (1) is established in buffer gear (5), buffer gear (5) are including ball (6) and elastic expansion assembly (7), the bottom threaded connection of sleeve pipe (1) has tube cap (8), fixed baffle ring (9) that are equipped with on the bottom outer wall of sleeve pipe (1), alloy body (3) are inserted and are established in the inside of tube cap (8), the bottom at closing tight body is fixedly established to probe (2), the top threaded connection of alloy body (3) has slide column (10), ball (6) rotate the top that sets up at slide column (10), elastic expansion assembly (7) are established in the inside of sleeve pipe (1), the bottom at tube cap (8) is established in heat dissipation mechanism (4), install on the outer wall of alloy body (3) including silica gel cover (11) and installation component (12), silica gel cover (11) cover is established on the outer wall of silica gel cover (11).
2. The alloy bar test probe structure of claim 1, wherein: the elastic telescopic assembly (7) comprises a buffer spring (13), a mounting cover (14) and a limiting cap (15), wherein the limiting cap (15) is attached to the top of the ball (6), a through hole is formed in the sleeve (1), the mounting cover (14) is fixedly arranged on the inner wall of the through hole, and the buffer spring (13) is arranged between the mounting cover (14) and the limiting cap (15).
3. The alloy bar test probe structure of claim 2, wherein: the top of the sliding column (10) is symmetrically provided with two sliding blocks (16), the inner wall of the through hole is symmetrically provided with two sliding grooves (17), each sliding block (16) is in sliding connection with one sliding groove (17), the bottom of the sliding column (10) is of an oblique angle structure, and the inner wall of the pipe cover (8) is provided with a chute attached to the oblique angle structure.
4. A test probe structure for alloy bar materials according to claim 3, wherein: the mounting assembly (12) comprises a limit column (18) and a needle tube (19), the limit column (18) is fixedly arranged at the bottom of the tube cover (8), the alloy rod body (3) is spliced with the limit column (18), and the needle tube (19) is sleeved on the outer wall of the limit column (18).
5. The alloy bar test probe structure according to claim 4, wherein: the outer wall of the limit post (18) is provided with a positioning hole (20), the outer wall of the needle tube (19) is provided with a positioning bolt (21), and the positioning bolt (21) is in threaded connection with the positioning hole (20).
6. The alloy bar test probe structure according to claim 5, wherein: a plurality of heat dissipation holes (22) are arranged on the outer wall of the needle tube (19) at equal intervals.
7. The alloy bar test probe structure of claim 6, wherein: the probe (2) is of a cylindrical structure, and the bottom end of the probe (2) is of a round corner structure.
8. The alloy bar test probe structure of claim 7, wherein: the top of the sleeve (1) is provided with an interface (23), and the inner wall of the sliding column (10) is provided with a round hole for a lead to pass through.
CN202223363677.0U 2022-12-14 2022-12-14 Alloy bar test probe structure Active CN219224907U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223363677.0U CN219224907U (en) 2022-12-14 2022-12-14 Alloy bar test probe structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223363677.0U CN219224907U (en) 2022-12-14 2022-12-14 Alloy bar test probe structure

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CN219224907U true CN219224907U (en) 2023-06-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117310234A (en) * 2023-11-30 2023-12-29 浙江金连接科技股份有限公司 Palladium alloy probe sleeve for semiconductor chip test and manufacturing method thereof
CN117805592A (en) * 2024-01-08 2024-04-02 安盈半导体技术(常州)有限公司 Flexible medium chip test interface

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117310234A (en) * 2023-11-30 2023-12-29 浙江金连接科技股份有限公司 Palladium alloy probe sleeve for semiconductor chip test and manufacturing method thereof
CN117310234B (en) * 2023-11-30 2024-03-01 浙江金连接科技股份有限公司 Palladium alloy probe sleeve for semiconductor chip test and manufacturing method thereof
CN117805592A (en) * 2024-01-08 2024-04-02 安盈半导体技术(常州)有限公司 Flexible medium chip test interface
CN117805592B (en) * 2024-01-08 2024-06-07 安盈半导体技术(常州)有限公司 Flexible medium chip test interface

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