CN219213970U - Injection mold of mobile phone card support sealing ring and sealing ring - Google Patents
Injection mold of mobile phone card support sealing ring and sealing ring Download PDFInfo
- Publication number
- CN219213970U CN219213970U CN202223443605.7U CN202223443605U CN219213970U CN 219213970 U CN219213970 U CN 219213970U CN 202223443605 U CN202223443605 U CN 202223443605U CN 219213970 U CN219213970 U CN 219213970U
- Authority
- CN
- China
- Prior art keywords
- die
- sealing ring
- mobile phone
- lower die
- upper die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 69
- 238000002347 injection Methods 0.000 title claims abstract description 40
- 239000007924 injection Substances 0.000 title claims abstract description 40
- 238000000465 moulding Methods 0.000 claims abstract description 19
- 238000001746 injection moulding Methods 0.000 claims abstract description 15
- 239000004033 plastic Substances 0.000 claims abstract description 15
- 229920003023 plastic Polymers 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 10
- 235000000396 iron Nutrition 0.000 claims abstract description 8
- 239000002103 nanocoating Substances 0.000 claims abstract description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 26
- 239000003292 glue Substances 0.000 claims description 13
- 229910052742 iron Inorganic materials 0.000 claims description 13
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000007306 turnover Effects 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 230000000694 effects Effects 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The application discloses injection mold and sealing washer of cell-phone card support sealing washer relates to card support sealing washer technical field of moulding plastics, include: the mobile phone clamping support die comprises a base, square irons, lower die holders, an upper die holder and a material ejection assembly, wherein the square irons are arranged on the base, the lower die holders are arranged on the square irons, the upper die holders are connected with the lower die holders in an opening-closing mode, mounting grooves for positioning clamping supports are formed in the lower die holders, one ends of the mounting grooves are provided with lower die cores in an upward protruding mode, lower die cavities are formed in the lower die cores, upper die cores are arranged on the upper die cores, the upper die cavities and the lower die cavities form a molding die cavity of a sealing ring when the die is assembled, a nano coating is arranged on the inner surface of the molding die cavity, the material ejection assembly is arranged between the square irons and upwards penetrates through the mounting grooves, and the material ejection assembly is in contact with the lower bottom surface of the clamping supports so as to eject the mobile phone clamping supports of the injection molded sealing ring out of the molding die cavity. The mobile phone clamping support capable of facilitating injection molding of the sealing ring is demoulded from the die, and production efficiency is improved.
Description
Technical Field
The application relates to the technical field of injection molding of clamping and supporting sealing rings, in particular to an injection mold of a mobile phone clamping and supporting sealing ring and a sealing ring.
Background
In the related art, a mobile phone card support is a component for supporting and installing a mobile phone SIM card, and is generally divided into an all-metal structure, a metal chuck and a plastic card body structure and the like, in order to ensure that the tightness between the mobile phone card support inserted into a mobile phone and the mobile phone is better, a sealing ring is sleeved on the head of the mobile phone card support, and in order to ensure that the sealing effect is better, the sealing ring is directly injection molded on the mobile phone card support, the effect of tightly attaching the mobile phone card support is achieved, but the metal card support and the plastic card support is in a structure, and the card support is not easy to be demoulded from a mold when the sealing ring is directly injection molded on a related mold, so that the production efficiency is influenced.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides an injection mold and sealing ring of mobile phone card holds in palm sealing washer, and the mobile phone card that can be convenient for mould plastics and hold in palm and draw from the mould drawing of patterns, improves production efficiency.
In a first aspect, the application provides an injection mold of cell-phone card holds in palm sealing washer, is applied to the sealing washer that plastics card held in palm and moulds plastics, includes: the mobile phone clamping support device comprises a base, square iron, a lower die holder, an upper die holder and a material ejection assembly, wherein the square iron is arranged on the base, the lower die holder is arranged on the square iron, the upper die holder is connected with the lower die holder in an opening-closing mode, a mounting groove for positioning a clamping support is formed in the lower die holder, one end of the mounting groove is provided with a lower die core in an upward protruding mode, a lower die cavity is formed in the lower die core, an upper die core corresponding to the lower die core is arranged on the upper die holder, an upper die cavity corresponding to the lower die cavity is arranged on the upper die core, during die assembly, the upper die cavity and the lower die cavity are arranged on the front surface and the back surface of the clamping support in a surrounding mode to form a molding die cavity of a sealing ring, a nano coating is arranged on the inner surface of the molding die cavity, the material ejection assembly is arranged between the square iron and penetrates through the mounting groove in an upward mode, and is in contact with the lower bottom surface of the clamping support so as to eject the molding die cavity of the mobile phone clamping support of the injection molding sealing ring.
According to some embodiments of the present application, a fixed mold core is disposed on the upper mold base downward corresponding to the mounting groove, and when the mold is closed, the fixed mold core is abutted to the upper surface of the clamping support in the mounting groove.
According to some embodiments of the application, the mounting groove bottom is equipped with the boss, vertical protruding being equipped with the reference column on the boss, the card hold in the palm the bottom surface be equipped with the locating hole of reference column adaptation, the reference column is thin thick round platform down, the card hold in the palm when placing on the boss, the round platform card is gone into in the locating hole.
According to some embodiments of the present application, the ejector assembly comprises a bottom plate, a top plate and a plurality of ejector rods, the bottom plate is arranged between the square irons, the top plate is stacked on the bottom plate, and the ejector rods are fixed on the top plate and extend upwards to penetrate through the bottom of the mounting groove.
According to some embodiments of the present application, the ejector pins are provided with a plurality of ejector pins around the boss, and two of the ejector pins penetrate out of the lower mold core and contact with the lower edge of the head of the clamping support.
According to some embodiments of the present application, the lower mold core is provided with a plurality of lower mold cores at intervals on the lower mold base, the upper mold base is provided with an upper mold core corresponding to the lower mold cores one by one, and four lower mold cores share one inlet and four outlet channels.
According to some embodiments of the application, further comprising: the upper die seat, the upper die plate, the top die plate and the top die seat are sequentially arranged on the lower die seat from bottom to top, a glue injection port is downwards formed in the top die seat, an I-shaped shunt groove is formed in the top die plate corresponding to the glue injection port, four corners of the I-shaped shunt groove downwards sequentially penetrate through the upper die plate and the upper die seat to form a shunt tube, and the shunt tube is communicated with inlets of one inlet runner and one outlet runner.
In a second aspect, the application provides a sealing ring, the sealing ring is made of plastic injection in a molding cavity of an injection mold of the mobile phone card support sealing ring, and a parylene coating is arranged on the surface of the sealing ring.
Compared with the prior art, the utility model has at least the following beneficial effects: the mobile phone card support of the semi-metal semi-plastic after injection molding is placed in the mounting groove for positioning, the situation that the injection molding fails or damages a die due to the reverse placement is avoided, the upper die base and the lower die base are clamped, the injection molding area of the sealing ring of the mobile phone card support is wrapped by the upper die cavity and the lower die cavity, a circle of silica gel is injected at the position, close to the head, of the mobile phone card support to obtain a sealing ring tightly attached to the mobile phone card support, the inner surface of the molding die cavity of the sealing ring is provided with a nano coating, smooth demolding of the mobile phone card support of the injection molded sealing ring can be guaranteed, the ejector die of the ejector component is matched, the demolding is efficient, the production efficiency can be effectively improved, the accurate matching between the sealing ring and the mobile phone card support is guaranteed by directly injecting the sealing ring on the mobile phone card support, the filling between the sealing ring and the mobile phone is more tight, and the sealing effect is better.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
Additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
fig. 1 is an isometric view of an injection mold for a mobile phone card holder seal ring according to some embodiments of the present application;
FIG. 2 is a schematic top view of a lower die holder according to some embodiments of the present application;
fig. 3 is a schematic exploded view of an upper mold core exposed out of an injection mold for a mobile phone card support seal ring according to some embodiments of the present application;
FIG. 4 is an enlarged partial schematic view of portion A of FIG. 3 according to some embodiments of the present application;
fig. 5 is a schematic exploded view of an exposed lower die holder of an injection mold for a mobile phone card support seal ring according to some embodiments of the present application;
FIG. 6 is a schematic top view of a top form according to some embodiments of the present application;
fig. 7 is an axial schematic view of an injection mold for a mobile phone card support seal ring exposing a shunt tube according to some embodiments of the present application.
The reference numerals are as follows:
a base 100; square iron 200; a lower die holder 300; a mounting groove 310; a boss 311; a positioning post 312; a lower mold core 320; one inlet and four outlet flow channels 330; an upper die holder 400; an upper mold core 410; a fixed mold core 420; an upper template 500; a top template 600; a shunt channel 610; a shunt 620; a top die holder 700; a glue injection port 710; a liftout assembly 800; a base plate 810; a top plate 820; ejector pins 830.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, head of a bed, tail of a bed, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the description of the first and second is only for the purpose of distinguishing technical features, and should not be construed as indicating or implying relative importance or implying the number of technical features indicated or the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical solution.
Referring to fig. 1 to 7, in a first aspect, the application provides an injection mold of a mobile phone card support sealing ring, including: be applied to sealing washer that plastics card held in palm and mould plastics includes: the mobile phone mold comprises a base 100, square iron 200, a lower die holder 300, an upper die holder 400, an upper die plate 500, a top die plate 600, a top die holder 700 and a material ejection assembly 800, wherein the square iron 200 is arranged on the base 100, the lower die holder 300 is arranged on the square iron 200, the upper die holder 400, the upper die plate 500, the top die plate 600 and the top die holder 700 are sequentially arranged on the lower die holder 300 from bottom to top, the upper die holder 400 is connected with the lower die holder 300 in an opening-closing mode, a mounting groove 310 for positioning a clamping support is arranged on the lower die holder 300, one end of the mounting groove 310 is provided with a lower die core 320 in an upward protruding mode, a lower die cavity is arranged in the lower die core 320, an upper die cavity 410 corresponding to the lower die core 320 is arranged on the upper die core 410, when the dies are clamped, the upper die cavity and the lower die cavity are arranged on the front and back sides of the clamping support in a surrounding mode to form a molding die cavity of a sealing ring, a nano coating is arranged on the inner surface of the molding die cavity, the material ejection assembly 800 is arranged between the square iron 200 and penetrates through the mounting groove 310 upwards, and the material ejection assembly 800 is contacted with the lower bottom surface of the clamping support to eject the sealing ring after the mobile phone is subjected to injection molding.
Therefore, the mobile phone card support of the semi-metal semi-plastic after injection molding is placed in the mounting groove 310 to be positioned, the situation that the injection molding fails or damages a die due to the reverse placement is avoided, the upper die holder 400 and the lower die holder 300 are matched, the injection molding area of the sealing ring of the mobile phone card support is wrapped by the upper die cavity and the lower die cavity, a circle of silica gel is injected at the position close to the head of the mobile phone card support to obtain a sealing ring tightly attached to the mobile phone card support, the inner surface of the molding die cavity of the sealing ring is provided with a nano coating, smooth demolding of the mobile phone card support of the injection molded sealing ring can be ensured, the ejector die of the ejector component 800 is matched, the demolding is efficient, the production efficiency can be effectively improved, the accurate matching between the sealing ring and the mobile phone card support is ensured by directly injecting the sealing ring on the mobile phone card support, the filling is more tight with the mobile phone, and the sealing effect is better.
It can be understood that referring to fig. 3, the upper die holder 400 is provided with a fixed die core 420 corresponding to the mounting groove 310 downward, and the fixed die core 420 abuts against the upper surface of the clamping bracket in the mounting groove 310 when the die is closed. In some embodiments, the fixing mold core 420 is arranged downwards on the upper surface of the mobile phone card holder body, so that the front and back sides of the mobile phone card holder body are both abutted and fixed, and the mobile phone card holder is more stable in injection molding.
It can be understood that referring to fig. 4, the bottom of the mounting groove 310 is provided with a boss 311, a positioning column 312 is vertically and convexly arranged on the boss 311, a positioning hole matched with the positioning column 312 is arranged on the bottom surface of the clamping support, the positioning column 312 is a round table with thin upper part and thick lower part, and when the clamping support is placed on the boss 311, the round table is clamped into the positioning hole. In some embodiments, the positioning posts 312 are disposed on the boss 311, so as to ensure that the mobile phone holder is placed in the mounting slot 310 in a correct orientation.
Further, referring to fig. 1, the ejector assembly 800 includes a bottom plate 810, a top plate 820, and a plurality of ejector pins 830, the bottom plate 810 is disposed between the square irons 200, the top plate 820 is stacked on the bottom plate 810, and the ejector pins 830 are fixed on the top plate 820 and extend upward out of the bottom of the installation groove 310. In some embodiments, after injection molding is completed, the upper die holder 400 and the lower die holder 300 are separated from each other, the external ejection roller extends into the space between the square irons 200 from the bottom end of the base 100 to jack up the bottom plate 810, the top plate 820 and the ejector 830, the ejector 830 ejects the mobile phone clamping support with the injection molded sealing ring out of the molding cavity and the mounting groove 310, and the manipulator clamps the mobile phone clamping support, so that complete actions are completed.
Further, a plurality of ejector rods 830 are arranged around the boss 311, and two of the ejector rods 830 penetrate out of the lower mold core 320 to contact with the lower edge of the head of the clamping bracket. In some embodiments, the ejector rods 830 are arranged around the boss 311, so that the ejector rods 830 can be propped against the periphery of the mobile phone card holder, the mobile phone card holder is uniformly stressed, and the mobile phone card holder can be ejected out of the die more stably.
It can be understood that referring to fig. 2, a plurality of lower mold cores 320 are arranged on the lower mold base 300 at intervals, each four lower mold cores 320 are arranged in a group, four groups are arranged on the lower mold base 300, the upper mold base 400 is provided with upper mold cores 410 corresponding to the four groups of lower mold cores 320 one by one, in some embodiments, 16 lower mold cavities are arranged on the lower mold base 300 in a group, and each four lower mold cavities are arranged in a group, so that the number of sealing rings which are molded at one time is increased, and the production efficiency is higher.
Further, referring to fig. 1 and 7, a glue injection port 710 is formed in the top die holder 700 in a downward direction, an "i" type splitter box 610 is formed in the top die plate 600 corresponding to the glue injection port 710, split-tubes 620 are formed in four corners of the "i" type splitter box 610 by penetrating through the upper die plate 500 and the upper die holder 400 in sequence, the split-tubes 620 are formed in the upper die plate 500 and the upper die holder 400 in a penetrating manner, four lower die cavities of each group on the lower die holder 300 share one four inlet and four outlet channels 330, four one inlet and four outlet channels 330 are formed in the lower die holder 300, and the four split-tubes 620 are respectively communicated with inlets of the corresponding one inlet and four outlet channels 330. Through the shunting effect of "worker" type splitter box 610, divide the glue that is poured into from glue injection mouth 710 into four shunt tubes 620 through "worker" type splitter box 610 to by four shunt tubes 620 supply glue to four one business turn over runner 330 on the die holder 300, four business turn over runner 330 divide into four in the shaping die cavity that comprises lower die cavity and last die cavity again with glue, realize the moulding plastics of every sealing rubber ring, through realizing twice reposition of redundant personnel to glue, slowed down the impact and the pressure that glue held in the palm to the cell-phone card in the shaping die cavity, avoided the cell-phone card to hold in the palm to warp, can improve the yield of finished product.
In a second aspect, the application provides a sealing ring, the sealing ring is made of plastic injection in a molding cavity of an injection mold of the mobile phone card support sealing ring, and a parylene coating is arranged on the surface of the sealing ring. By adding parylene, the wear resistance and the service life of the injection molded sealing ring are better, and the sealing ring of the second aspect is made of the injection mold of the first aspect, so that the injection molded sealing ring has the beneficial effects of any one of the embodiments of the first aspect.
The embodiments of the present application have been described in detail above with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application.
Claims (8)
1. Injection mold of cell-phone card holds in palm sealing washer, its characterized in that is applied to the sealing washer injection molding that plastics card held in palm includes: the mobile phone clamping support device comprises a base, square iron, a lower die holder, an upper die holder and a material ejection assembly, wherein the square iron is arranged on the base, the lower die holder is arranged on the square iron, the upper die holder is connected with the lower die holder in an opening-closing mode, a mounting groove for positioning a clamping support is formed in the lower die holder, one end of the mounting groove is provided with a lower die core in an upward protruding mode, a lower die cavity is formed in the lower die core, an upper die core corresponding to the lower die core is arranged on the upper die holder, an upper die cavity corresponding to the lower die cavity is arranged on the upper die core, during die assembly, the upper die cavity and the lower die cavity are arranged on the front surface and the back surface of the clamping support in a surrounding mode to form a molding die cavity of a sealing ring, a nano coating is arranged on the inner surface of the molding die cavity, the material ejection assembly is arranged between the square iron and penetrates through the mounting groove in an upward mode, and is in contact with the lower bottom surface of the clamping support so as to eject the molding die cavity of the mobile phone clamping support of the injection molding sealing ring.
2. The injection mold of the mobile phone clamping sealing ring according to claim 1, wherein a fixed mold core is arranged on the upper mold base downwards corresponding to the mounting groove, and the fixed mold core is abutted with the upper surface of the clamping support in the mounting groove during mold closing.
3. The injection mold of the mobile phone card support sealing ring according to claim 1, wherein a boss is arranged at the bottom of the mounting groove, a positioning column is vertically arranged on the boss in a protruding mode, a positioning hole matched with the positioning column is formed in the bottom surface of the card support, the positioning column is a round table with a thin upper part and a thick lower part, and when the card support is placed on the boss, the round table is clamped into the positioning hole.
4. The injection mold of the mobile phone card support sealing ring according to claim 3, wherein the ejector component comprises a bottom plate, a top plate and a plurality of ejector rods, the bottom plate is arranged between the square irons, the top plate is stacked on the bottom plate, and the ejector rods are fixed on the top plate and extend upwards to penetrate through the bottom of the mounting groove to be abutted with the card support.
5. The injection mold of the mobile phone clamping seal ring according to claim 4, wherein a plurality of ejector rods are arranged around the boss, and two of the ejector rods penetrate out of the lower mold core to contact with the lower edge of the head of the clamping support.
6. The injection mold of the mobile phone card holds in palm sealing washer according to claim 1, characterized in that, lower mold core is equipped with a plurality ofly on the die holder interval, be equipped with on the upper die base with a plurality of lower mold core one-to-one's upper mold core, every four lower mold core shares a business turn over four runner.
7. The injection mold of a mobile phone card holder sealing ring of claim 6, further comprising: the upper die seat, the upper die plate, the top die plate and the top die seat are sequentially arranged on the lower die seat from bottom to top, the top die seat is provided with a glue injection port downwards, the top die plate corresponds the lower part of the glue injection port is provided with an I-shaped shunt groove, four corners of the I-shaped shunt groove downwards sequentially penetrate through the upper die plate and the upper die seat to form a shunt tube, and the shunt tube is communicated with inlets of one inlet runner and one outlet runner.
8. A sealing ring, characterized in that the sealing ring is made by injection molding plastic in a molding cavity of an injection mold of the mobile phone card support sealing ring according to any one of claims 1-7, and the surface of the sealing ring is provided with a parylene coating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223443605.7U CN219213970U (en) | 2022-12-22 | 2022-12-22 | Injection mold of mobile phone card support sealing ring and sealing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223443605.7U CN219213970U (en) | 2022-12-22 | 2022-12-22 | Injection mold of mobile phone card support sealing ring and sealing ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219213970U true CN219213970U (en) | 2023-06-20 |
Family
ID=86752809
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223443605.7U Active CN219213970U (en) | 2022-12-22 | 2022-12-22 | Injection mold of mobile phone card support sealing ring and sealing ring |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219213970U (en) |
-
2022
- 2022-12-22 CN CN202223443605.7U patent/CN219213970U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN208020657U (en) | Encapsulation die | |
| CN219213970U (en) | Injection mold of mobile phone card support sealing ring and sealing ring | |
| CN212266524U (en) | Double-layer keycap injection mold | |
| CN217319005U (en) | Automatic change bearing rubber coating injection mold | |
| CN215619793U (en) | Injection mold with cooling and blowing functions | |
| CN211251166U (en) | Automobile vent shell mold | |
| CN112959617A (en) | One-outlet two-lead-acid battery box injection mold | |
| CN218139581U (en) | Light guide column forming structure | |
| CN220720155U (en) | Lower cover injection mold for circuit board | |
| CN216966239U (en) | Hardware mould who moulds plastics in mould | |
| CN218576865U (en) | Injection mold for gear machining | |
| CN213227274U (en) | Combined die of different models | |
| CN216579054U (en) | Center turret type double-color die | |
| CN216831920U (en) | Three-color mold for automotive interior trim parts | |
| CN217434891U (en) | Bottom cover plate, forming die thereof and molecular sieve drum applying bottom cover plate | |
| CN219522887U (en) | Linkage multicolor rubber coating mould | |
| CN214266494U (en) | Injection mold for molding plastic shell | |
| CN212097367U (en) | Smooth-ejecting LED lamp packaging body forming die | |
| CN217346453U (en) | Injection molding mold for helmet liner | |
| CN212072677U (en) | Injection mold for injection molding of aluminum alloy mobile phone front shell in mold | |
| CN218700865U (en) | Injection mold convenient to drawing of patterns | |
| CN214926340U (en) | Strong demoulding tool for plastic product with clamping hook | |
| CN212707807U (en) | Thin glue position winding framework injection mold | |
| CN211221885U (en) | Ejecting injection mold structure of secondary | |
| CN211640799U (en) | Water gauge upper cover injection mold |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240508 Address after: No. 9 Zhen'an West Road, Chang'an Town, Dongguan City, Guangdong Province, 523000 Patentee after: Canton Road Daohe Intelligent Electronic Technology Co.,Ltd. Country or region after: China Address before: 523000 second floor, No. 8, Xing'an Road, Zhen'an Science Park, Xiagang community, Chang'an Town, Dongguan City, Guangdong Province Patentee before: Guangdong Miwa Technology Co.,Ltd. Country or region before: China |