CN219213660U - Diamond cutter head for cutting stone - Google Patents

Diamond cutter head for cutting stone Download PDF

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Publication number
CN219213660U
CN219213660U CN202223375085.0U CN202223375085U CN219213660U CN 219213660 U CN219213660 U CN 219213660U CN 202223375085 U CN202223375085 U CN 202223375085U CN 219213660 U CN219213660 U CN 219213660U
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China
Prior art keywords
layer
cutting
diamond
grinding
cutter head
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Active
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CN202223375085.0U
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Chinese (zh)
Inventor
王其辉
赵云红
杨波
刘鑫
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Quanzhou Xingrui Diamond Tools Co ltd
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Quanzhou Xingrui Diamond Tools Co ltd
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Priority to CN202223375085.0U priority Critical patent/CN219213660U/en
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P40/00Technologies relating to the processing of minerals
    • Y02P40/50Glass production, e.g. reusing waste heat during processing or shaping
    • Y02P40/57Improving the yield, e-g- reduction of reject rates

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  • Polishing Bodies And Polishing Tools (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

The utility model discloses a diamond cutter head for cutting stone, which comprises a cutting layer, wherein a buffer layer is arranged in the cutting layer, a reinforcing layer is arranged in the buffer layer, a cutting and grinding layer is arranged below the cutting layer, a welding layer is arranged below the cutting and grinding layer and the reinforcing layer, the cutting layer, the buffer layer, the reinforcing layer, the cutting and grinding layer and the welding layer are sintered into a whole, an M-shaped cutter edge is adopted, the cutting area is increased under the condition that the transverse cutting distance is unchanged, the cutting speed is further improved, the cutting and grinding layer is arranged below the inclined surface of the cutting layer, the thinning and grinding of the cutting surface are conveniently carried out after the cutting layer is fed and cut, the cutting surfaces at two sides of the stone are not easy to clamp a blade, the cutting feeding and the flattening of the cutting surface are facilitated, the subsequent processing is facilitated, the integral strength of the cutter head is further improved by the reinforcing layer, the toughness of the cutter head can be increased while the cutter head is connected with the buffer layer between the cutting layer, and the cutter head is prevented from being broken due to the excessively high feeding speed.

Description

Diamond cutter head for cutting stone
Technical Field
The utility model relates to the technical field of diamond tool bits, in particular to a diamond tool bit for cutting stone.
Background
The diamond tool bit is the working main body of the diamond saw blade. The tool bit of the diamond saw blade consists of diamond and matrix binder, wherein the diamond is a superhard material, plays a role of a cutting edge, and the matrix binder plays a role of fixing the diamond and consists of metal simple substance powder or metal alloy powder.
According to the diamond tool bit (publication No. CN 212666411U) for cutting granite marble and various stones, a diamond tool bit body comprises diamond particles, a composite metal layer, a buffer layer and a welding metal layer, the diamond particles are inlaid on the composite metal layer and the buffer layer, the buffer layer is laminated and adhered to the lower end of the composite metal layer, the welding metal layer is laminated and adhered to the surface of one side, far away from the composite metal layer, of the buffer layer, flow grooves are formed in two ends of the welding metal layer, oblique-line connecting layers are laminated and adhered to two ends of the oblique side of the diamond tool bit body, the contact area between the diamond tool bit and an object to be cut can be reduced by the flow grooves formed in the oblique-line connecting layers and the two ends of the welding metal layer, reverse impact on the cut material is reduced by the porous metal material in the buffer layer, and edge breakage phenomenon is reduced.
Disclosure of Invention
The technical problem to be solved by the utility model is to overcome the difficulty and provide the diamond tool bit for cutting stone.
In order to solve the technical problems, the technical scheme provided by the utility model is as follows: the utility model provides a diamond tool bit for cutting stone material, includes the cutting layer, the cutting layer in be equipped with the buffer layer, the buffer layer in be equipped with the enhancement layer, the cutting layer below be equipped with and cut the grinding layer, cut grinding layer and enhancement layer below be equipped with the welding layer, cutting layer, buffer layer, enhancement layer, cut and grind and weld and sinter as an organic wholely between the layer.
As an improvement: the cutting layer section is of an M-shaped structure, a groove is formed in the top of the cutting layer section, the cutting layer is composed of coarse diamond particles and a first matrix, the coarse diamond particles are embedded in the first matrix, the coarse diamond particles comprise 60/70-granularity diamond and 70/80-granularity diamond, and the mass percentage of the coarse diamond particles is 50% -70% of the 60/70-granularity diamond and 30% -50% of the 70/80-granularity diamond.
As an improvement: the cutting and grinding layer is composed of fine diamond particles and a second matrix, wherein the fine diamond particles are impregnated in the second matrix, the fine diamond particles comprise 40/50-granularity diamond and 50/60-granularity diamond, and the mass percentage of the fine diamond particles is 30% -60% of the diamond with 40/50-granularity and 40% -70% of the diamond with 50/60-granularity.
As an improvement: the reinforcing layer is an alloy of Fe, ni, cu, sn, zn and Mn, and comprises 30.5-31.5wt% of Cu, 5.5-7.0wt% of Sn, 9.5-10.2wt% of Ni, 5.0-7.5wt% of Zn, 4.2.5-6.5wt% of Mn and the balance of Fe.
As an improvement: the buffer layer is made of porous soft metal material.
Compared with the prior art, the utility model has the advantages that: adopt "M" shape edge of a knife, under the unchangeable circumstances of horizontal tangential distance, increase the cutting area, make cutting speed further improve, be equipped with the cutting grinding layer under the cutting layer inclined plane, be convenient for cut the face and refine the cutting grinding after feeding cutting at the cutting layer, make stone material both sides tangent plane be difficult to clamp the blade, do benefit to cutting feeding and make the tangent plane level, be convenient for follow-up processing, the enhancement layer makes tool bit bulk strength further improve, the buffer layer between enhancement layer and the cutting layer is playing the linking effect, can increase the toughness of tool bit, avoid the tool bit to feed fast and collapse.
Drawings
Fig. 1 is a schematic view of a diamond bit for cutting stone according to the present utility model.
Fig. 2 is a schematic view of a diamond bit cutting layer for cutting stone according to the present utility model.
Fig. 3 is a schematic view of a diamond bit cutting and grinding layer for cutting stone according to the present utility model.
As shown in the figure: 1. cutting the layer; 2. a buffer layer; 3. a reinforcing layer; 4. cutting and grinding the layers; 5. a welding layer; 11. coarse diamond particles; 12. a first carcass; 13. a groove; 41. fine diamond particles; 42. and a second carcass.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, a diamond bit for cutting stone material, including cutting layer 1, cutting layer 1 in be equipped with buffer layer 2, buffer layer 2 be porous soft metal material and make, buffer layer 2 in be equipped with enhancement layer 3, cutting layer 1 below be equipped with and cut grinding layer 4, cutting grinding layer 4 and enhancement layer below be equipped with weld layer 5, cutting layer 1, buffer layer 2, enhancement layer 3, cut grinding layer 4 and weld layer 5 between the sintering as an organic whole.
Referring to fig. 1 and 2, the cutting layer 1 has an M-shaped section, a groove 13 is formed in the top of the cutting layer 1, the cutting layer 1 is composed of coarse diamond particles 11 and a first body 12, the coarse diamond particles 11 are impregnated in the first body 12, the coarse diamond particles 11 comprise 60/70-sized diamond and 70/80-sized diamond, and the mass percentage of the coarse diamond particles 11 is 50% -70% of the 60/70-sized diamond and 30% -50% of the 70/80-sized diamond.
Referring to fig. 3, the cutting and grinding layer 4 is composed of fine diamond particles 41 and a second matrix 42, wherein the fine diamond particles 41 are impregnated in the second matrix 42, and the fine diamond particles 41 comprise 40/50-sized diamond and 50/60-sized diamond, and the mass percentage of the fine diamond particles 41 is 30% -60% of the diamond particles with 40/50-sized diamond and 40% -70% of the diamond particles with 50/60-sized diamond.
As shown in fig. 2 and 3, the first carcass 12 and the second carcass 42 are made of Cu-Ni-Mu-based alloy.
As shown in the accompanying figure 1, the reinforcing layer 3 is an alloy of Fe, ni, cu, sn, zn and Mn, and has a ratio of 30.5-31.5wt% of Cu, 5.5-7.0wt% of Sn, 9.5-10.2wt% of Ni, 5.0-7.5wt% of Zn, 4.2.5-6.5wt% of Mn and the balance of Fe.
When the utility model is embodied, the M-shaped tool bit is fed, the bulges at the two sides of the top end are longitudinally cut, the M-shaped inclined planes are obliquely cut and longitudinally fed, the action area of diamond is increased, the diamond can participate in the cutting action more, the cutting and grinding layer further refines the stone tangent plane, the reinforcing layer improves the strength of the tool bit, the buffer layer improves the toughness of the tool bit, and the welding layer is connected with the tool bit and the tool bit.
The utility model and its embodiments have been described above with no limitation, and the actual construction is not limited to the embodiments of the utility model as shown in the drawings. In summary, if one of ordinary skill in the art is informed by this disclosure, a structural manner and an embodiment similar to the technical solution should not be creatively devised without departing from the gist of the present utility model.

Claims (2)

1. Diamond tool bit for cutting stone material, including cutting layer (1), its characterized in that: cutting layer (1) in be equipped with buffer layer (2), buffer layer (2) in be equipped with enhancement layer (3), cutting layer (1) below be equipped with and cut grinding layer (4), cutting grinding layer (4) and enhancement layer below be equipped with weld layer (5), cutting layer (1), buffer layer (2), enhancement layer (3), cutting grinding layer (4) and weld layer (5) between sinter as an organic whole, cutting layer (1) tangent plane be "M" column structure, the top is equipped with recess (13), cutting layer (1) constitute by coarse diamond granule (11) and first matrix (12), coarse diamond granule (11) pregnant to inlay in first matrix (12), cutting grinding layer (4) constitute by fine diamond granule (41) and second matrix (42), fine diamond granule (41) impregnated in second matrix (42).
2. A diamond tip for cutting stone material according to claim 1, wherein: the buffer layer (2) is made of porous soft metal material.
CN202223375085.0U 2022-12-15 2022-12-15 Diamond cutter head for cutting stone Active CN219213660U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202223375085.0U CN219213660U (en) 2022-12-15 2022-12-15 Diamond cutter head for cutting stone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202223375085.0U CN219213660U (en) 2022-12-15 2022-12-15 Diamond cutter head for cutting stone

Publications (1)

Publication Number Publication Date
CN219213660U true CN219213660U (en) 2023-06-20

Family

ID=86752736

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202223375085.0U Active CN219213660U (en) 2022-12-15 2022-12-15 Diamond cutter head for cutting stone

Country Status (1)

Country Link
CN (1) CN219213660U (en)

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