CN219212925U - Automatic negative pressure adsorption fixing structure of chip and chip processing system - Google Patents

Abstract

The application relates to a chip automatic negative pressure adsorption fixing structure and a chip processing system, wherein a chip fixing platform is arranged on an XY linear motion module in a sliding manner and is provided with a receiving position and a fixing position; the chip fixing platform applies force to the chip compressing mechanism at a fixed position to push the chip compressing mechanism to generate parallel displacement, so that the chip compressing mechanism forms vertical displacement vertical to a motion plane to position and compress the chip on the chip fixing platform, and the chip fixing platform adsorbs the chip under negative pressure; the chip pressing mechanism is also used for resetting in a state that the chip fixing platform leaves the fixing position. The automatic positioning of the chip and the automatic negative pressure adsorption fixation of the accurate position are facilitated, and the influence of uncertain factors of manual operation is avoided; the efficiency and the consistency of chip loading operation are improved; the manual positioning and manual negative pressure adsorption fixation of compatible chips are facilitated, so that the debugging scene requirement is met; the device has the advantages of simple structure, high space utilization rate and high cost performance.

Description

Automatic negative pressure adsorption fixing structure of chip and chip processing system

Technical Field

The application relates to the field of accurate chip positioning, in particular to a fixing structure for automatic negative pressure adsorption of chips and a chip processing system.

Background

The sequencer can realize the reading of DNA (deoxyribonucleic Acid) and RNA (ribonucleic Acid) base sequences, and has important significance for species genetic evolution, individual physiological variation research and disease diagnosis. With decades of development, a situation of coexistence of third-generation sequencers has been formed on the market. Because of the slow speed of the first generation sequencers and the high sequencing cost of the third generation sequencers, the mainstream sequencers are also second generation sequencers (Next-Generation Sequence, NGS) based on sequencing-by-synthesis technology (Sequence By Synthesis, SBS). NGS has the characteristics of high throughput, short read length, and the short sequences measured need to be reduced to DNA long sequences by splicing.

Currently, gene sequencing analysis systems mainly include: the system comprises a fluorescence detection optical system, a mobile platform, a chip fixing platform, a liquid path system, a reagent storage and refrigeration system, a control and algorithm hardware system. The chip fixing platform is used for positioning the chip and firmly fixing the chip on the chip carrier. Before the sequencing is carried out, the chip is manually loaded on the chip carrier, and after the chip is positioned and fixed, the subsequent sequencing process can be carried out. The relative position requirement of the chip and the chip carrier is higher, and the liquid path centering and sealing are directly influenced, so that the sequencing result is influenced.

In order to realize chip fixation, the traditional mode is to manually push the chip to be positioned by 3 pins, wherein the length direction of the chip is 2, and the width direction of the chip is 1. Simultaneously, the negative pressure adsorption switch is turned on, the chip 5s is manually pressed to complete the chip adsorption, and then the hand is loosened.

However, such a chip mounting stage requires manual chip positioning by an operator and establishment of negative pressure to adsorb and mount the chip. The chip is manually loaded, and the positions of the chip relative to the carrier are possibly different due to different operators or different operation methods of the same operator, so that great uncertainty is brought to the sequencing result, and the labor cost is high.

Disclosure of Invention

Based on this, it is necessary to provide a fixing structure for automatic negative pressure adsorption of chips and a chip processing system.

In one embodiment, a fixing structure for automatic negative pressure adsorption of a chip comprises a chip compressing mechanism, an XY linear motion module and a chip fixing platform;

the chip fixing platform is arranged on the XY linear motion module in a sliding manner, so that the chip fixing platform has a bearing position and a fixing position relative to the chip pressing mechanism;

the chip fixing platform is used for placing a chip at the receiving position, applying force to the chip compressing mechanism at the fixing position, pushing the chip compressing mechanism to generate parallel displacement in the direction parallel to the movement plane of the XY linear movement module, and enabling the chip compressing mechanism to form vertical displacement perpendicular to the movement plane through the parallel displacement so as to position and compress the chip on the chip fixing platform, and carrying out negative pressure adsorption on the chip by the chip fixing platform;

The chip pressing mechanism is also used for resetting in a state that the chip fixing platform is away from the fixing position.

The fixing structure for the automatic negative pressure adsorption of the chip is beneficial to realizing the automatic positioning of the chip and the automatic negative pressure adsorption fixing of the accurate position, and avoids the influence of uncertain factors of manual operation; on the other hand, the efficiency and the consistency of the chip loading operation are improved; on the other hand, the manual positioning and manual negative pressure adsorption fixation of the compatible chip are facilitated, so that the debugging scene requirement is met; on the other hand, the device has the advantages of simple structure, high space utilization rate and high cost performance.

In one embodiment, the chip fixing platform is provided with a negative pressure adsorption base, a chip pressing push rod and a spring plunger fixing plate;

the negative pressure adsorption base is fixed on the XY linear motion module and can move relative to the chip pressing mechanism through the XY linear motion module, and the negative pressure adsorption base is used for placing the chip at the receiving position;

the chip pressing push rod and the spring plunger fixing plate are both fixed on the negative pressure adsorption base, and the chip pressing push rod is arranged adjacent to the chip pressing mechanism or a chip pressing push rod stop block of the chip pressing mechanism;

The chip pressing push rod is used for applying force to the chip pressing mechanism at the fixed position;

the spring plunger fixing plate is provided with a limit groove, the outline of the limit groove is larger than that of the chip, the limit groove is used for accommodating the chip, and the negative pressure adsorption base is used for carrying out negative pressure adsorption on the chip in the limit groove under the state that the chip is positioned and compressed;

the chip fixing platform is arranged on the spring plunger fixing plate or the negative pressure adsorption base and surrounds the limiting groove, and at least three first spring plungers are arranged on the chip fixing platform and respectively abutted against the chip to fix the chip.

In one embodiment, the chip fixing platform is provided with at least two chip positioning pins protruding on the negative pressure adsorption base, each chip positioning pin is protruding on the negative pressure adsorption base and located in the limiting groove, and each first spring plunger abuts against the spring plunger fixing plate and/or each chip positioning pin to fix the chip.

In one embodiment, the chip pressing mechanism is provided with a second spring plunger, a second spring plunger fixing seat, a chip pressing push rod stop block, a linear guide rail and a movement direction changing mechanism;

The chip pressing push rod stop block is arranged under the linear guide rail in a sliding manner and is in inclined contact with the movement direction changing mechanism;

the linear guide rail is parallel to the motion plane, so that the sliding direction of the chip pressing push rod stop block is parallel to the motion plane;

the second spring plunger is fixed on the second spring plunger fixing seat and abuts against the chip compression push rod stop block;

the chip pressing push rod stop block is abutted to compress the second spring plunger and drives the movement direction conversion mechanism to form vertical displacement perpendicular to the movement plane under the condition of receiving the acting force of the chip fixing platform so as to position and press the chip on the chip fixing platform;

the chip pressing push rod stop block is pushed by the second spring plunger to slide along the linear guide rail to reset in a state of no longer receiving the acting force of the chip fixing platform, and the movement direction changing mechanism elastically resets.

In one embodiment, the movement direction changing mechanism comprises an elastic inclined top mechanism, a lever mechanism and an axle mechanism.

In one embodiment, the movement direction changing mechanism is an elastic oblique pushing mechanism, and the chip pressing push rod stop block comprises a contact part, a sliding part and an oblique pushing part;

The sliding part is arranged under the linear guide rail in a sliding way, and two ends of the sliding part are respectively connected with the contact part and the inclined pushing part;

the contact part is abutted against the second spring plunger and is used for abutting against the chip fixing platform or the chip pressing push rod of the chip fixing platform at the fixing position;

the inclined pushing part is provided with an inclined pushing position, and the inclined pushing part drives the elastic inclined pushing mechanism or an inclined pushing roller or a deflector rod of the elastic inclined pushing mechanism to form vertical displacement vertical to the movement plane at the inclined pushing position.

In one embodiment, the elastic inclined ejection mechanism comprises an inclined ejection mechanism support, a chip pinch roller, a deflector rod and a deflector rod reset spring;

the chip pressing push rod stop block is in a state of obliquely abutting against the deflector rod;

the deflector rod reset spring is arranged in the inclined ejection mechanism support and sleeved outside the deflector rod, the deflector rod is at least partially arranged in the inclined ejection mechanism support and is abutted against the inclined ejection mechanism support through the deflector rod reset spring, and one end of the deflector rod, far away from the chip pressing push rod stop block, of the deflector rod is connected with the chip pressing wheel;

the chip pressing push rod stop block drives the deflector rod to overcome the elastic force of the deflector rod reset spring to move under the condition that the chip pressing push rod stop block is subjected to the acting force of the chip fixing platform, so that the chip pressing wheel forms vertical displacement perpendicular to the movement plane, and the chip is positioned and pressed on the chip fixing platform;

And in a state of no acting force of the chip pressing push rod stop block, the deflector rod reset spring drives the deflector rod to reset relative to the inclined pushing mechanism support, so that the chip pressing wheel is reset.

In one embodiment, the movement direction changing mechanism is an elastic oblique ejection mechanism, and the elastic oblique ejection mechanism further comprises a chip pressing plate, wherein the chip pressing plate is positioned below the oblique ejection mechanism support, and the deflector rod is connected with the chip pressing wheel through the chip pressing plate; and/or the number of the groups of groups,

the elastic inclined ejection mechanism further comprises a limiting pin, wherein the limiting pin is fixed in the inclined ejection mechanism support and is in limiting connection with the deflector rod so as to limit the limiting position of the deflector rod relative to the inclined ejection mechanism support; and/or the number of the groups of groups,

the elastic oblique ejection mechanism further comprises an oblique pushing roller, the deflector rod is connected with the oblique pushing roller in a shaft mode, the chip pressing push rod stop block is in an oblique abutting mode and is in an oblique pushing roller state, and the chip pressing push rod stop block drives the oblique pushing roller to rotate and enables the deflector rod to overcome the elastic force of the deflector rod reset spring to move along the direction perpendicular to the movement plane under the condition that the chip pressing push rod stop block receives the acting force of the chip fixing platform.

In one embodiment, the fixing structure for automatic negative pressure adsorption of the chip further comprises a frame, the XY linear motion module is fixed on the frame, and the chip pressing mechanism or the second spring plunger fixing seat and the linear guide rail of the chip pressing mechanism are also fixed on the frame.

In one embodiment, a chip handling system includes a chip transfer mechanism and a fixing structure for automatic negative pressure adsorption of chips according to any of the embodiments, where the chip transfer mechanism places chips on a chip fixing platform of the fixing structure for automatic negative pressure adsorption of chips at a receiving position.

Drawings

In order to more clearly illustrate the technical solutions of embodiments or conventional techniques of the present application, the drawings that are required to be used in the description of the embodiments or conventional techniques will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person of ordinary skill in the art.

Fig. 1 is a schematic structural diagram of an embodiment of a fixing structure for automatic negative pressure adsorption of a chip according to the present application before the automatic negative pressure adsorption fixing operation of the chip is performed.

Fig. 2 is a state diagram of the embodiment shown in fig. 1 during execution of the automatic negative pressure suction fixing operation of the chip.

Fig. 3 is a state diagram of the embodiment shown in fig. 2 after the execution of the automatic negative pressure suction fixing operation of the chip.

Fig. 4 is a top view of a chip fixing platform according to another embodiment of the fixing structure for automatic negative pressure adsorption of chips described in the present application.

Fig. 5 is a schematic diagram of an application of the embodiment shown in fig. 4.

Fig. 6 is an axial side view of a die pressing mechanism of another embodiment of a fixing structure for automatic negative pressure adsorption of a die according to the present application.

Fig. 7 is a front view of the die pressing mechanism of the embodiment of fig. 6.

Fig. 8 is a schematic diagram of the structure of the stopper of the pushing rod for chip pressing in the embodiment shown in fig. 6.

Fig. 9 is a schematic structural view of a chip pressing push rod stopper according to another embodiment.

Fig. 10 is a cross-sectional view of the die pressing mechanism of the embodiment shown in fig. 7.

Fig. 11 is an enlarged schematic view of a part of the structure of the embodiment shown in fig. 10.

Reference numerals:

100. a chip pressing mechanism;

200. an XY linear motion module;

300. a chip fixing platform;

400. a frame;

1. a first spring plunger;

2. a chip;

3. a chip positioning pin;

4. a spring plunger fixing plate;

5. a second spring plunger;

6. The second spring plunger fixing seat;

7. the chip compresses tightly the push rod stop block;

8. a linear guide rail;

9. a support of the inclined ejection mechanism;

10. a chip pressing plate;

11. a chip pinch roller;

12. a limiting pin;

13. pushing the roller obliquely;

14. a deflector rod;

15. an oilless bushing;

16. a deflector rod return spring;

17. the chip compresses tightly the push rod;

18. a limit groove;

19. a negative pressure adsorption base;

71. a contact portion;

72. a sliding part;

73. an inclined pushing part;

74. and (5) obliquely pushing the position.

Detailed Description

In order to make the above objects, features and advantages of the present application more comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is, however, susceptible of embodiment in many other forms than those described herein and similar modifications can be made by those skilled in the art without departing from the spirit of the application, and therefore the application is not to be limited to the specific embodiments disclosed below.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like are used in the description of the present application for purposes of illustration only and do not represent the only embodiment.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, such as two, three, etc., unless explicitly defined otherwise.

In this application, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be a direct contact of the first feature with the second feature, or an indirect contact of the first feature with the second feature via an intervening medium. Moreover, a first feature "above," "over" and "on" a second feature may be a first feature directly above or obliquely above the second feature, or simply indicate that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely under the second feature, or simply indicating that the first feature is less level than the second feature.

Unless defined otherwise, all technical and scientific terms used in the specification of this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the present application. The term "and/or" as used in the specification of this application includes any and all combinations of one or more of the associated listed items.

The application discloses a chip automatic negative pressure adsorption fixing structure and a chip processing system, wherein the chip automatic negative pressure adsorption fixing structure comprises a part of structures or all structures of the following embodiments; namely, the fixing structure for automatic negative pressure adsorption of the chip and the chip processing system comprise part of or all of the following technical features. In one embodiment of the application, the fixing structure for automatic negative pressure adsorption of the chip comprises a chip pressing mechanism, an XY linear motion module and a chip fixing platform; the chip fixing platform is arranged on the XY linear motion module in a sliding manner, so that the chip fixing platform has a bearing position and a fixing position relative to the chip pressing mechanism; the chip fixing platform is used for placing a chip at the receiving position, applying force to the chip compressing mechanism at the fixing position, pushing the chip compressing mechanism to generate parallel displacement in the direction parallel to the movement plane of the XY linear movement module, and enabling the chip compressing mechanism to form vertical displacement perpendicular to the movement plane through the parallel displacement so as to position and compress the chip on the chip fixing platform, and carrying out negative pressure adsorption on the chip by the chip fixing platform; the chip pressing mechanism is also used for resetting in a state that the chip fixing platform is away from the fixing position. The fixing structure for the automatic negative pressure adsorption of the chip is beneficial to realizing the automatic positioning of the chip and the automatic negative pressure adsorption fixing of the accurate position, and avoids the influence of uncertain factors of manual operation; on the other hand, the efficiency and the consistency of the chip loading operation are improved; on the other hand, the manual positioning and manual negative pressure adsorption fixation of the compatible chip are facilitated, so that the debugging scene requirement is met; on the other hand, the device has the advantages of simple structure, high space utilization rate and high cost performance.

In one embodiment, a fixing structure for automatic negative pressure adsorption of a chip is shown in fig. 1, and includes a chip pressing mechanism 100, an XY linear motion module 200, and a chip fixing platform 300; in this embodiment, the fixing structure for automatic negative pressure adsorption of the chip further includes a frame 400, and the chip pressing mechanism 100 and the XY linear motion module 200 are both fixed on the frame 400.

The chip fixing platform 300 is slidably disposed on the XY linear motion module 200, so that the chip fixing platform 300 has a receiving position relative to the chip pressing mechanism 100, and in each embodiment, the XY linear motion module 200 has at least one linear sliding track to implement a linear sliding function in at least one direction, for example, the XY linear motion module 200 has a linear sliding track in a Y axis direction; alternatively, the XY linear motion module 200 has a first linear sliding rail in the Y-axis direction and a second linear sliding rail in the X-axis direction, the second linear sliding rail is fixed on the frame 400, and the first linear sliding rail is slidably disposed on the second linear sliding rail.

Referring to fig. 4, the chip fixing stage 300 is used for placing the chip 2 at the receiving position; as shown in fig. 1, in this embodiment, the chip fixing platform 300 extends out of the frame 400, and a chip to be sucked by negative pressure may be placed.

And, the chip fixing stage 300 has a fixed position with respect to the chip pressing mechanism 100; as shown in fig. 2, in this embodiment, the die-holding platform 300 is retracted into the frame 400 and comes into contact with the die-holding mechanism 100, and in combination with fig. 3, the die-holding platform 300 is configured to apply a force to the die-holding mechanism 100 at the fixed position, push the die-holding mechanism 100 to perform a parallel displacement in a direction parallel to the movement plane of the XY linear motion module 200, and make the die-holding mechanism 100 form a vertical displacement perpendicular to the movement plane by the parallel displacement, so as to position and hold the die on the die-holding platform 300, and then perform negative pressure suction on the die 2 by the die-holding platform 300. It can be understood that, when the XY linear motion module 200 has a linear sliding track in the Y-axis direction, the motion plane of the XY linear motion module 200 is parallel to the carrying plane of the chip fixing platform 300 for the chip 2; alternatively, when the XY linear motion module 200 has a first linear sliding track in the Y-axis direction and a second linear sliding track in the X-axis direction, the motion plane of the XY linear motion module 200 is defined by the X-axis linear motion and the Y-axis linear motion, but is also parallel to the carrying plane of the die-holding platform 300 for the die 2. Thus, in various embodiments, the plane of motion is parallel to the plane of the chip-holding platform 300 carrying the chip 2, and thus the plane of motion is also parallel to the surface of the chip 2, since the surface of the chip 2 is generally planar. In each embodiment, the direction parallel to the movement plane of the XY linear movement module 200, i.e., the linear direction parallel to the movement plane; a vertical displacement is formed perpendicular to the plane of motion, i.e. the line in which the displacement is located is perpendicular to the plane of motion.

With reference to fig. 1, the chip pressing mechanism 100 is further configured to reset the chip fixing platform 300 in a state of being away from the fixing position, so as to implement repeated automatic operations, and a specific reset structure is described below.

As shown in fig. 3 and 4, in one embodiment, the chip fixing platform 300 is provided with a negative pressure adsorption base 19, a chip pressing push rod 17 and a spring plunger fixing plate 4; the negative pressure adsorption base 19 is fixed on the XY linear motion module 200 and is movable relative to the chip pressing mechanism 100 by the XY linear motion module 200, and the negative pressure adsorption base 19 is used for placing the chip 2 at the receiving position; specifically, the negative pressure adsorption base 19 is fixed on a mounting seat, such as a top plate, of the XY linear motion module 200, and the negative pressure adsorption base 19 is slidably disposed on the XY linear motion module 200 through the mounting seat, so that the negative pressure adsorption base 19 is parallel displaced in a direction parallel to a motion plane of the XY linear motion module 200, that is, is movable relative to the chip pressing mechanism 100. The chip pressing push rod 17 and the spring plunger fixing plate 4 are both fixed on the negative pressure adsorption base 19, and the chip pressing push rod 17 is arranged adjacent to the chip pressing mechanism 100 or the chip pressing push rod stop 7 of the chip pressing mechanism 100; the chip pressing push rod 17 is used for applying force to the chip pressing mechanism 100 in the fixed position, for example, applying force to the chip pressing push rod stopper 7 of the chip pressing mechanism 100. The fixing structure for automatic negative pressure adsorption of the chip further comprises a frame 400, the XY linear motion module 200 is fixed on the frame 400, the second spring plunger fixing seat 6 and the linear guide rail 8 of the chip pressing mechanism 100 are also fixed on the frame 400, and the rest of the embodiments are not repeated.

The spring plunger fixing plate 4 is provided with a limit groove 18, the limit groove 18 is used for accommodating the chip 2, and the outline of the limit groove 18 is larger than that of the chip 2, namely, the chip 2 can be placed in the limit groove 18 in an unobstructed manner and taken out of the limit groove 18 in an unobstructed manner, so that the chip 2 is accommodated in the limit groove 18. The design is not only favorable for placing the chip steadily, but also favorable for realizing preliminary positioning so as to complete integral accurate positioning in a matching way, and then realizes negative pressure adsorption fixation.

Referring to fig. 5, the negative pressure adsorption base 19 performs negative pressure adsorption on the chip 2 in the limit groove 18 in the state that the chip is positioned and pressed; the design is beneficial to realizing very accurate negative pressure adsorption, ensures that the chip 2 is automatically adsorbed by negative pressure to a fine degree, and can be accurate to a micrometer level or even a nanometer level in practical application, which cannot be achieved by traditional manual placement; on the other hand, the chip 2 is protected by uniformly applying pressure, so that the chip is prevented from being damaged due to uneven application of force.

The chip fixing platform 300 is provided with at least three first spring plungers 1 around the limiting groove 18 on the spring plunger fixing plate 4 or the negative pressure adsorption base 19, where each first spring plunger 1 abuts against the chip 2 to fix the chip 2 by abutting against the spring plunger fixing plate 4, for example, each first spring plunger 1 abuts against the chip 2 to fix the chip 2 by abutting against the spring plunger fixing plate 4. The first spring plungers 1 may be uniformly disposed around the limiting groove 18, or may be divided into two or three groups, and cooperate to support the chip 2 against the edge of the spring plunger fixing plate 4 in the limiting groove 18, so as to ensure accurate positioning of the chip 2 in the XY plane. In this embodiment, the chip fixing platform 300 is provided with four first spring plungers 1 around the limiting groove 18 on the spring plunger fixing plate 4, and the four first spring plungers 1 are divided into two groups.

In one embodiment, the chip fixing platform 300 is provided with at least two chip positioning pins 3 protruding from the negative pressure adsorption base 19, each chip positioning pin 3 is protruding from the limiting groove 18, and each first spring plunger 1 supports the chip 2 against each chip positioning pin 3 to fix the chip 2; or each first spring plunger 1 respectively supports the chip 2 against the spring plunger fixing plate 4 and each chip locating pin 3 so as to fix the chip 2. In this embodiment, as shown in fig. 4, the chip fixing platform 300 is provided with two chip positioning pins 3 protruding above the negative pressure suction base 19. In each embodiment, the position of the chip positioning pin 3 is set in conformity with the shape of the chip 2.

As shown in fig. 6, in one embodiment, the chip pressing mechanism 100 includes a second spring plunger 5, a second spring plunger fixing seat 6, a chip pressing push rod stop 7, a linear guide 8, and a movement direction changing mechanism; in one embodiment, the movement direction changing mechanism comprises an elastic inclined top mechanism, a lever mechanism and an axle mechanism.

Referring to fig. 7, the chip pressing push rod stopper 7 is slidably disposed under the linear guide rail 8 and has a state of being in inclined contact with the movement direction changing mechanism; the linear guide rail 8 is parallel to the movement plane, so that the sliding direction of the chip pressing push rod stop 7 is parallel to the movement plane; the second spring plunger 5 is fixed on the second spring plunger fixing seat 6 and abuts against the chip pressing push rod stop 7; the chip pressing push rod stop 7 is abutted against and compresses the second spring plunger 5 under the action force of the chip fixing platform 300 and drives the movement direction changing mechanism to form vertical displacement perpendicular to the movement plane so as to position and press the chip on the chip fixing platform 300; the chip pressing push rod stop 7 is pushed by the second spring plunger 5 to slide along the linear guide rail 8 to reset in a state of no longer receiving the acting force of the chip fixing platform 300, and the movement direction changing mechanism elastically resets. In this embodiment, the chip pressing push rod stop 7 is in a state of being under the acting force of the chip pressing push rod 17 of the chip fixing platform 300, and is in contact with and compresses the second spring plunger 5 and drives the movement direction changing mechanism to form a vertical displacement perpendicular to the movement plane, so as to position and press the chip on the chip fixing platform 300; the chip pressing push rod stop 7 is pushed by the second spring plunger 5 to slide along the linear guide rail 8 to reset in a state of no longer receiving the acting force of the chip pressing push rod 17 of the chip fixing platform 300, and the movement direction changing mechanism elastically resets.

In the following, an elastic tilt-jack mechanism is taken as an example, and it is understood that the movement direction changing mechanism may be any one as long as the movement direction changing mechanism can be realized, for example, the movement changing in the vertical direction or the movement changing in the arc direction.

In one embodiment, the movement direction changing mechanism is an elastic oblique ejection mechanism, as shown in fig. 8, the chip pressing push rod block 7 includes a contact portion 71, a sliding portion 72, and an oblique pushing portion 73; the sliding part 72 is slidably disposed under the linear guide rail 8, and both ends of the sliding part 72 are respectively connected to the contact part 71 and the inclined pushing part 73; the contact portion 71 abuts the second spring plunger 5 and is used for abutting the die-holding platform 300 or the die-pressing push rod 17 of the die-holding platform 300 at the fixed position; the inclined pushing portion 73 is formed with an inclined pushing position 74, and referring to fig. 10, the inclined pushing portion 73 drives the elastic inclined pushing mechanism or the inclined pushing roller 13 or the driving lever 14 of the elastic inclined pushing mechanism at the inclined pushing position 74 to form a vertical displacement perpendicular to the movement plane. In this embodiment, the inclined pushing portion 74 is an inclined surface, and its cross section is inclined.

In other embodiments, as shown in fig. 9, the inclined pushing position 74 is a curved surface, for example, an arc surface, and the section of the inclined pushing position is an arc surface, and only needs to cooperate to drive the elastic inclined pushing mechanism or the inclined pushing roller 13 or the driving lever 14 of the elastic inclined pushing mechanism to form a vertical displacement perpendicular to the movement plane.

As shown in fig. 7 and 10, in one embodiment, the elastic tilt-top mechanism includes a tilt-top mechanism support 9, a chip pressing wheel 11, a shift lever 14 and a shift lever return spring 16; referring to fig. 11, the chip pressing push rod stopper 7 is in a state of being inclined against the shift lever 14; the deflector rod reset spring 16 is arranged in the inclined jacking mechanism support 9 and sleeved outside the deflector rod 14, the deflector rod 14 is at least partially arranged in the inclined jacking mechanism support 9 and is abutted to the inclined jacking mechanism support 9 through the deflector rod reset spring 16, and one end, far away from the chip pressing push rod stop 7, of the deflector rod 14 is connected with the chip pressing wheel 11. In this embodiment, the shift lever 14 is slidably connected to the tilt-up mechanism support 9 inside the tilt-up mechanism support 9, so as to reduce sliding resistance, and the elastic tilt-up mechanism further includes an oil-free bushing 15 sleeved outside the shift lever 14, where the shift lever 14 is slidably connected to the tilt-up mechanism support 9 through the oil-free bushing, so as to ensure the validity and service life of vertical displacement of the shift lever 14 perpendicular to the movement plane.

The chip pressing push rod stop 7 drives the deflector rod 14 to overcome the elastic force of the deflector rod return spring 16 to move under the condition of being acted by the chip fixing platform 300, so that the chip pressing wheel 11 forms vertical displacement perpendicular to the movement plane, and the chip is positioned and pressed on the chip fixing platform 300. In the state that the chip is no longer acted by the acting force of pressing the push rod stop block 7, the deflector rod return spring 16 drives the deflector rod 14 to return relative to the inclined pushing mechanism support 9, so that the chip pinch roller 11 is reset.

In one embodiment, the movement direction changing mechanism is an elastic oblique ejection mechanism, and the elastic oblique ejection mechanism further comprises a chip pressing plate 10, the chip pressing plate 10 is located under the oblique ejection mechanism support 9, and the deflector rod 14 is connected with the chip pressing wheel 11 through the chip pressing plate 10; in one embodiment, the elastic pitched roof mechanism further comprises a limiting pin 12, wherein the limiting pin 12 is fixed in the pitched roof mechanism support 9 and is in limiting connection with the deflector rod 14, so as to limit the limiting position of the deflector rod 14 relative to the pitched roof mechanism support 9; in one embodiment, the elastic pitched roof mechanism further includes a pitched push roller 13, the driving lever 14 is pivotally connected to the pitched push roller 13, the chip pressing push rod block 7 has a state of being obliquely abutted against the pitched push roller 13, and the chip pressing push rod block 7 drives the pitched push roller 13 to rotate and moves the driving lever 14 in a direction perpendicular to the movement plane against the elastic force of the driving lever return spring 16 under the state of being acted by the chip fixing platform 300.

Specifically, referring to fig. 1 to 11, the die attach table 300 slides along the XY linear motion module 200 toward the attachment position or the direction in which the attachment position is located, and contacts the die attach mechanism 100 when sliding to the position adjacent to the attachment position, at this time, the die attach pusher 17 of the die attach table 300 contacts the die attach pusher stop 7 of the die attach mechanism 100, and the spring plunger fixing plate 4 of the die attach table 300 and the die 2 on the die attach table 300 do not contact any structure of the die attach mechanism 100.

Then, the die-holding platform 300 continues to slide along the XY linear motion module 200 toward the die-pressing push rod block 7, which can also be understood as that the die-holding platform 300 and the die 2 carried by the die-holding platform slide along the XY linear motion module 200 toward the fixed position, and at this time, the die-pressing push rod 17 applies a force F1 to the die-pressing push rod block 7 to push the die-pressing push rod block 7 of the die-pressing mechanism 100 to perform parallel displacement in a direction parallel to the movement plane of the XY linear motion module 200, and the die-pressing push rod block 7 generates a force F2 on the second spring plunger 5 of the die-pressing mechanism 100, so that the second spring plunger 5 is compressed under force. The chip pressing push rod stop 7 also generates acting force to a movement direction changing mechanism, such as an elastic inclined pushing mechanism, forms acting force perpendicular to the movement plane to the inclined pushing roller 13 or the deflector rod 14 of the elastic inclined pushing mechanism, drives the chip pressing plate 10 and/or the chip pressing wheel 11 of the elastic inclined pushing mechanism to form acting force F3 perpendicular to the movement plane, so as to position and press the chip 2 on the chip fixing platform 300, and the negative pressure adsorption base 19 of the chip fixing platform 300 is used for carrying out negative pressure adsorption on the chip 2.

After negative pressure adsorption is completed, the chip fixing platform 300 slides along the XY linear motion module 200 towards the receiving position or the direction in which the receiving position is located, and the chip pressing push rod stop 7 is loosened, that is, the chip pressing push rod 17 does not apply force F1 to the chip pressing push rod stop 7 any more, the second spring plunger 5 resets and pushes the chip pressing push rod stop 7 to generate parallel displacement along the direction parallel to the motion plane of the XY linear motion module 200, so that the chip pressing push rod stop 7 is driven to generate no acting force on a motion direction conversion mechanism, such as an elastic oblique ejection mechanism, and the motion direction conversion mechanism, such as the elastic oblique ejection mechanism, realizes elastic reset. Since the chip pinch roller 11 forms a vertical displacement perpendicular to the movement plane, the chip is positioned and pressed on the chip fixing platform 300, and the chip pinch roller 11 is in a rolling upward movement state relative to the chip 2 during resetting, so that the chip 2 is not damaged.

It is understood that, between the receiving position and the fixing position, the die-holding platform 300 may slide only along one direction of the XY linear motion module 200, for example, along the Y-axis direction of the XY linear motion module 200, and after the negative pressure is completed to adsorb the die 2, it may slide along another direction of the XY linear motion module 200, for example, the X-axis direction, to enter other stations, so as to achieve other functions, including but not limited to optical inspection, power-up test, and die transfer.

Continuing to refer to fig. 1-11, the fixing structure of the automatic negative pressure adsorption of the chip is further described.

As shown in fig. 1, the automatic negative pressure adsorption fixing device for chips includes a chip pressing mechanism 100, an XY linear motion module 200, and a chip fixing stage 300. The chip fixing platform 300 mainly realizes chip positioning and fixing; the XY linear motion module 200 mainly realizes horizontal linear motion in the X direction and the Y direction of the chip 2; the chip pressing mechanism 100 mainly realizes a pressing down motion for pressing the chip.

As shown in fig. 1, the chip fixing stage 300 is in an extended state, facilitating chip loading; as shown in fig. 2, the die attach table 300 is retracted to a position just below the die holding mechanism 100, and the automatic negative pressure suction attachment operation is ready to be performed; as shown in fig. 3, for the completion of the negative pressure suction establishment of the chip, the chip 2 is firmly suction-fixed to the chip fixing stage 300.

As shown in fig. 4, the chip 2 is automatically positioned against the chip positioning pins 3 by the first spring plungers 1 in the chip holding platform 300.

As shown in fig. 6, 7 and 10, the chip pressing mechanism 100 is disposed above the chip fixing platform 300, and converts the Y-direction linear motion of the XY linear motion module 200 into the vertical pressing motion of the chip pressing wheel 11 through the inclined plane mechanism, so as to press the chip 2 to establish negative pressure adsorption.

In implementation, the XY linear motion module 200 is driven to extend outwards in the Y-axis direction, so as to drive the chip fixing platform 300 to extend to the state shown in fig. 1, and the chip 2 is automatically or manually loaded onto the chip fixing platform 300.

Then, the XY linear motion module 200 is driven to retract in the Y-axis direction, and the die holding platform 300 is driven to retract to the state shown in fig. 2, and at this time, the die holding platform 300 is located right below the die platen 10 and the die press 11 of the die pressing mechanism 100. The chip pressing push rod 17 pushes the chip pressing push rod stop 7, and the chip pressing push rod stop 7 is converted into vertical pressing movement of the chip pressing plate 10 and the chip pressing wheel 11 through a bevel mechanism in the chip pressing mechanism 100. The chip pinch roller 11 compresses the chip 2 while establishing negative pressure to adsorb the chip 2 on the chip fixing stage 300. In this embodiment, the chip pressing mechanism 100 converts a horizontal linear motion into a vertical pressing linear motion using a bevel mechanism, and in other embodiments, the chip pressing mechanism may be implemented by a lever mechanism.

In the process of pressing down the chip by the chip pressing mechanism 100 to establish negative pressure, the chip 2 abuts against the chip positioning pin 3 under the action of 2 total 4 first spring plungers 1 in the X and Y directions, so that the automatic positioning of the chip 2 is realized.

After the negative pressure adsorption of the chip 2 is completed and the chip is firmly fixed on the chip fixing platform 300, the chip fixing platform 300 extends forwards to move for a section, and the chip pressing mechanism 100 resets under the action of the second spring plunger 5 and the deflector rod reset spring 16.

By means of the structural design, automatic positioning and automatic negative pressure adsorption fixation of the chip are achieved, influence of uncertain factors of manual operation is avoided, and user experience of chip loading operation is improved. Meanwhile, the chip manual positioning and manual negative pressure adsorption fixing are compatible, so that the debugging scene requirement is met.

In one embodiment, a chip handling system includes a chip transfer mechanism and a fixing structure for automatic negative pressure adsorption of chips according to any of the embodiments, where the chip transfer mechanism places a chip 2 on a chip fixing platform 300 of the fixing structure for automatic negative pressure adsorption of chips at a receiving position. In one embodiment, the chip handling system may perform visual optical inspection, power-up testing, chip transfer, and the like, as previously described. It will be appreciated that the chip processing system may also be referred to as a chip processing apparatus or a chip processing device. The design is beneficial to realizing automatic positioning of the chip and automatic negative pressure adsorption fixation of the accurate position, and avoids the influence of uncertain factors of manual operation; on the other hand, the efficiency and the consistency of the chip loading operation are improved; on the other hand, the manual positioning and manual negative pressure adsorption fixation of the compatible chip are facilitated, so that the debugging scene requirement is met; on the other hand, the device has the advantages of simple structure, high space utilization rate and high cost performance.

It should be noted that other embodiments of the present application further include a fixing structure and a chip processing system that are formed by combining the technical features of the foregoing embodiments and capable of implementing automatic negative pressure adsorption of chips.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples only represent a few embodiments of the present application, which are described in more detail and are not to be construed as limiting the scope of the claims. It should be noted that it would be apparent to those skilled in the art that various modifications and improvements could be made without departing from the spirit of the present application, which would be within the scope of the present application. Accordingly, the scope of the present application is to be determined by the following claims.

Claims (10)

1. The fixing structure for automatic negative pressure adsorption of the chip is characterized by comprising a chip pressing mechanism (100), an XY linear motion module (200) and a chip fixing platform (300);

The chip fixing platform (300) is arranged on the XY linear motion module (200) in a sliding manner, so that the chip fixing platform (300) has a bearing position and a fixing position relative to the chip pressing mechanism (100);

the chip fixing platform (300) is used for placing the chip (2) at the receiving position, applying force to the chip compressing mechanism (100) at the fixing position, pushing the chip compressing mechanism (100) to generate parallel displacement in a direction parallel to a motion plane of the XY linear motion module (200), and enabling the chip compressing mechanism (100) to form vertical displacement perpendicular to the motion plane through the parallel displacement so as to position and compress the chip on the chip fixing platform (300), and carrying out negative pressure adsorption on the chip (2) by the chip fixing platform (300);

the chip hold-down mechanism (100) is also configured to reset in a state in which the chip holding platform (300) is away from the holding position.

2. The automatic negative pressure adsorption fixing structure of the chip according to claim 1, wherein the chip fixing platform (300) is provided with a negative pressure adsorption base (19), a chip compression push rod (17) and a spring plunger fixing plate (4);

the negative pressure adsorption base (19) is fixed on the XY linear motion module (200) and can move relative to the chip pressing mechanism (100) through the XY linear motion module (200), and the negative pressure adsorption base (19) is used for placing the chip (2) at the receiving position;

The chip pressing push rod (17) is fixed on the negative pressure adsorption base (19) or the XY linear motion module (200), the spring plunger fixing plate (4) is fixed on the negative pressure adsorption base (19), and the chip pressing push rod (17) is adjacent to the chip pressing mechanism (100) or a chip pressing push rod stop block (7) of the chip pressing mechanism (100);

the chip pressing push rod (17) is used for applying force to the chip pressing mechanism (100) at the fixed position;

the spring plunger fixing plate (4) is provided with a limit groove (18), the outline of the limit groove (18) is larger than that of the chip (2), the limit groove (18) is used for accommodating the chip (2), and the negative pressure adsorption base (19) is used for carrying out negative pressure adsorption on the chip (2) in the limit groove (18) in a state that the chip is positioned and compressed;

the chip fixing platform (300) is provided with at least three first spring plungers (1) around the limiting groove (18) on the spring plunger fixing plate (4) or the negative pressure adsorption base (19), and each first spring plunger (1) is respectively abutted against the chip (2) to fix the chip (2).

3. The automatic negative pressure adsorption fixing structure of chips according to claim 2, wherein the chip fixing platform (300) is provided with at least two chip positioning pins (3) protruding on the negative pressure adsorption base (19), each chip positioning pin (3) is protruding on the negative pressure adsorption base (19) and is located in the limit groove (18), and each first spring plunger (1) supports the chip (2) against the spring plunger fixing plate (4) and/or each chip positioning pin (3) to fix the chip (2).

4. The automatic negative pressure adsorption fixing structure of the chip according to claim 1, wherein the chip compressing mechanism (100) is provided with a second spring plunger (5), a second spring plunger fixing seat (6), a chip compressing push rod stop block (7), a linear guide rail (8) and a movement direction changing mechanism;

the chip pressing push rod stop block (7) is arranged under the linear guide rail (8) in a sliding manner and is in inclined contact with the movement direction changing mechanism;

the linear guide rail (8) is parallel to the movement plane, so that the sliding direction of the chip pressing push rod stop block (7) is parallel to the movement plane;

the second spring plunger (5) is fixed on the second spring plunger fixing seat (6) and abuts against the chip compression push rod stop block (7);

the chip pressing push rod stop block (7) is abutted to compress the second spring plunger (5) and drives the movement direction conversion mechanism to form vertical displacement perpendicular to the movement plane under the condition of being acted by the chip fixing platform (300), so that the chip is positioned and pressed on the chip fixing platform (300);

the chip pressing push rod stop block (7) is pushed by the second spring plunger (5) to slide along the linear guide rail (8) to reset in a state of no longer receiving the acting force of the chip fixing platform (300), and the movement direction changing mechanism elastically resets.

5. The structure for automatically absorbing negative pressure on a chip according to claim 4, wherein the movement direction changing mechanism comprises an elastic oblique pushing mechanism, a lever mechanism and an axle mechanism.

6. The fixing structure for automatic negative pressure adsorption of chips according to claim 4, wherein the movement direction changing mechanism is an elastic oblique pushing mechanism, and the chip pressing push rod stop block (7) comprises a contact part (71), a sliding part (72) and an oblique pushing part (73);

the sliding part (72) is arranged under the linear guide rail (8) in a sliding way, and two ends of the sliding part (72) are respectively connected with the contact part (71) and the inclined pushing part (73);

the contact part (71) is abutted against the second spring plunger (5) and is used for being abutted against the chip fixing platform (300) or a chip pressing push rod (17) of the chip fixing platform (300) at the fixing position;

the inclined pushing part (73) is provided with an inclined pushing position (74), and the inclined pushing part (73) drives the elastic inclined pushing mechanism or the inclined pushing roller (13) or the deflector rod (14) of the elastic inclined pushing mechanism to form vertical displacement perpendicular to the movement plane at the inclined pushing position (74).

7. The automatic negative pressure adsorption fixing structure of the chip according to claim 4, wherein the movement direction changing mechanism is an elastic inclined ejection mechanism, and the elastic inclined ejection mechanism comprises an inclined ejection mechanism support (9), a chip pinch roller (11), a deflector rod (14) and a deflector rod return spring (16);

The chip pressing push rod stop block (7) is in a state of being obliquely abutted against the deflector rod (14);

the deflector rod reset spring (16) is arranged in the inclined ejection mechanism support (9) and sleeved outside the deflector rod (14), the deflector rod (14) is at least partially arranged in the inclined ejection mechanism support (9) and is abutted to the inclined ejection mechanism support (9) through the deflector rod reset spring (16), and one end, far away from the chip compression push rod stop block (7), of the deflector rod (14) is connected with the chip pinch roller (11);

the chip pressing push rod stop block (7) drives the deflector rod (14) to overcome the elastic force of the deflector rod reset spring (16) to move under the condition of being acted by the chip fixing platform (300), so that the chip pressing wheel (11) forms vertical displacement perpendicular to the movement plane, and the chip is positioned and pressed on the chip fixing platform (300);

under the condition that the chip is not pressed against the acting force of the push rod stop block (7), the deflector rod reset spring (16) drives the deflector rod (14) to reset relative to the inclined jacking mechanism support (9), so that the chip pinch roller (11) is reset.

8. The automatic negative pressure adsorption fixing structure of chips according to claim 7, wherein the elastic pitched roof mechanism further comprises a chip pressing plate (10), the chip pressing plate (10) is positioned under the pitched roof mechanism support (9), and the deflector rod (14) is connected with the chip pressing wheel (11) through the chip pressing plate (10); and/or the number of the groups of groups,

The elastic pitched roof mechanism further comprises a limiting pin (12), wherein the limiting pin (12) is fixed in the pitched roof mechanism support (9) and is in limiting connection with the deflector rod (14) so as to limit the limiting position of the deflector rod (14) relative to the pitched roof mechanism support (9); and/or the number of the groups of groups,

the elastic oblique ejection mechanism further comprises an oblique pushing roller (13), the deflector rod (14) is connected with the oblique pushing roller (13) in a shaft mode, the chip pressing push rod stop block (7) is in inclined butt connection with the oblique pushing roller (13), the chip pressing push rod stop block (7) is driven to rotate under the action force of the chip fixing platform (300) and enables the deflector rod (14) to overcome the elastic force of the deflector rod reset spring (16) to move along the direction perpendicular to the movement plane.

9. The automatic negative pressure adsorption fixing structure for chips according to any one of claims 1 to 8, further comprising a frame (400), wherein the XY linear motion module (200) is fixed on the frame (400), and the chip pressing mechanism (100) or the second spring plunger fixing seat (6) and the linear guide rail (8) of the chip pressing mechanism (100) are also fixed on the frame (400).

10. A chip handling system, comprising a chip transfer mechanism and the fixing structure for automatic negative pressure adsorption of chips according to any one of claims 1 to 9, wherein the chip transfer mechanism places a chip (2) on a chip fixing platform (300) of the fixing structure for automatic negative pressure adsorption of chips at a receiving position.

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